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Image of KEMET Comparing Tantalum Polymer and MnO2 Capacitors - Facedown Package

A facedown or leadless frame Tantalum capacitor is a packaging technique that has had the lead-frame reduced and shifted to the underside of the capacitor in order to improve volumetric efficiency and lower ESL ratings than the standard surface mount molded Tantalum capacitor packaging. Facedown packages typically exhibit lower profiles than their standard package counterparts and show improved power handing capabilities by decreasing the thermal resistance of the package allowing for improved heat transfer.

PTM Published on: 2021-08-10