Microcontrollers, Microprocessor, FPGA Modules

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Module/Board Type	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
OSD3358-512M-BSM IC MODULE CORTEX-A8 1GHZ 512MB Octavo Systems LLC	425 In Stock	1 : $59.63000 Tray	OSD335x	Tray	Active	MPU Core	ARM® Cortex®-A8, AM3358	NEON™ SIMD	1GHz	-	512MB	256-BGA	0.830" L x 0.830" W (21.00mm x 21.00mm)	0°C ~ 85°C
OSD3358-512M-ISM IC MODULE CORTEX-A8 1GHZ 512MB Octavo Systems LLC	0 In Stock Check Lead Time	1 : $63.25000 Tray	OSD335x	Tray	Active	MPU Core	ARM® Cortex®-A8, AM3358	NEON™ SIMD	1GHz	-	512MB	256-BGA	0.830" L x 0.830" W (21.00mm x 21.00mm)	-40°C ~ 85°C
BS2-IC IC MOD PIC16C57C 20MHZ 32B 2KB Parallax Inc.	129 In Stock	1 : $68.27000 Bulk	BASIC Stamp®	Bulk	Active	MCU Core	PIC16C57C	-	20MHz	2KB EEPROM	32B	-	1.200" L x 0.600" W (30.00mm x 15.00mm)	0°C ~ 70°C
OSD32MP157C-512M-BAA SIP ARM CORTEX STM32MP157C Octavo Systems LLC	744 In Stock	1 : $71.26000 Tray	OSD32MP15x	Tray	Active	MPU Core	Arm® Dual Cortex®-A7, Arm® Cortex®-M4	NEON™ SIMD	650MHz, 209MHz	-	512MB	302-BGA	0.709" L x 0.709" W (18.00mm x 18.00mm)	0°C ~ 85°C
XP1001000-05R IC MOD DSTNI-EX 25MHZ 256KB Lantronix, Inc.	8,724 In Stock	1 : $72.59000 Tray	XPort®	Tray	Active	MPU Core	DSTni-EX	XPort AR	25MHz	512KB	256KB	RJ45	1.330" L x 0.640" W (33.90mm x 16.25mm)	-40°C ~ 85°C
OSD32MP157C-512M-IAA SIP ARM CORTEX STM32MP157C Octavo Systems LLC	174 In Stock	1 : $73.56000 Tray	OSD32MP15x	Tray	Active	MPU Core	Arm® Dual Cortex®-A7, Arm® Cortex®-M4	NEON™ SIMD	650MHz, 209MHz	-	512MB	302-BGA	0.709" L x 0.709" W (18.00mm x 18.00mm)	-40°C ~ 85°C
XP1001000M-05R IC MOD DSTNI-EX 25MHZ 256KB Lantronix, Inc.	1,091 In Stock	1 : $74.68000 Tray	XPort®	Tray	Active	MPU Core	DSTni-EX	XPort AR	25MHz	512KB	256KB	RJ45	0.570" L x 0.720" W (14.50mm x 18.30mm)	-40°C ~ 85°C
XP1002000-05R IC MOD DSTNI-EX 25MHZ 256KB Lantronix, Inc.	1,349 In Stock	1 : $75.41000 Tray	XPort®	Tray	Active	MPU Core	DSTni-EX	XPort AR	25MHz	512KB	256KB	RJ45	0.570" L x 0.720" W (14.50mm x 18.30mm)	-40°C ~ 85°C
XP1001000-05R J XPORT XE, EXTENDED TEMPERATURE, Lantronix, Inc.	148 In Stock	1 : $76.54000 Bulk	XPort®	Bulk	Active	-	DSTni-EX	XPort AR	25MHz	512KB	256KB	RJ-45	1.330" L x 0.640" W (33.90mm x 16.25mm)	-40°C ~ 85°C
XPP1004000-02R IC MODULE IPV6 16MB Lantronix, Inc.	373 In Stock	1 : $77.56000 Tray	XPort® Pro	Tray	Not For New Designs	MPU Core	IPv6	XPort® Pro Lx6	-	16MB	16MB	RJ45	0.630" L x 1.330" W (16.00mm x 33.90mm)	-40°C ~ 85°C
XPP1002000-02R IC MODULE IPV6 16MB Lantronix, Inc.	856 In Stock	1 : $87.24000 Tray	XPort® Pro	Tray	Not For New Designs	MPU Core	IPv6	XPort® Pro	-	16MB	16MB	RJ45	0.630" L x 1.330" W (16.00mm x 33.90mm)	-40°C ~ 85°C
XPP1003000-04R IC MODULE IPV6 16MB Lantronix, Inc.	629 In Stock	1 : $87.24000 Tray	XPort® Pro	Tray	Not For New Designs	MPU Core	IPv6	XPort® Pro	-	16MB	16MB	RJ45	0.630" L x 1.330" W (16.00mm x 33.90mm)	-40°C ~ 85°C
OSD3358-512M-BCB IC MOD CORTEX-A8 1GHZ 512MB 4GB Octavo Systems LLC	722 In Stock	1 : $89.65000 Tray	OSD335x	Tray	Active	MPU Core	ARM® Cortex®-A8, AM3358	NEON™ SIMD	1GHz	4GB	512MB	400-BGA	1.060" L x 1.060" W (27.00mm x 27.00mm)	0°C ~ 85°C
OSD3358-1G-ISM IC MODULE CORTEX-A8 1GHZ 1GB Octavo Systems LLC	457 In Stock	1 : $91.95000 Tray	OSD335x	Tray	Active	MPU Core	ARM® Cortex®-A8, AM3358	-	1GHz	-	1GB	256-BGA	0.830" L x 0.830" W (21.00mm x 21.00mm)	-40°C ~ 85°C
OSD3358-512M-ICB IC MOD CORTEX-A8 1GHZ 512MB 4GB Octavo Systems LLC	417 In Stock	1 : $93.11000 Tray	OSD335x	Tray	Active	MPU Core	ARM® Cortex®-A8, AM3358	NEON™ SIMD	1GHz	4GB	512MB	400-BGA	1.060" L x 1.060" W (27.00mm x 27.00mm)	-40°C ~ 85°C
XPP100200S-02R IC MODULE IPV6 16MB Lantronix, Inc.	56 In Stock	1 : $93.47000 Box	XPort® Pro	Box	Not For New Designs	MPU Core	IPv6	XPort® Pro	-	16MB	16MB	RJ45	0.630" L x 1.330" W (16.00mm x 33.90mm)	-40°C ~ 85°C
SCM-20260N-C SITCORE SCM20260N SOM GHI Electronics, LLC	300 In Stock	1 : $96.66000 Tray	-	Tray	Active	MPU Core	SITCore	-	480MHz	16MB	32MB	-	-	-40°C ~ 85°C
SCM-20260E-B SITCORE SCM20260E SOM GHI Electronics, LLC	241 In Stock	1 : $107.58000 Tray	-	Tray	Active	MPU Core	SITCore	-	480MHz	16MB	32MB	-	-	-40°C ~ 85°C
MOD5270-100IR IC MOD COLDFIRE 147.5MHZ 8.064MB NetBurner Inc.	419 In Stock	1 : $107.79000 Bulk	ColdFire®	Bulk	Active	MCU, Ethernet Core	ColdFire 5270	-	147.5MHz	512KB	8.064MB	RJ-45, 2x50 Header	2.600" L x 2.000" W (66.04mm x 50.80mm)	-40°C ~ 85°C
CC-WST-DW69-NM STM32MP157DUAL GPU 512M SLC NAND Digi	138 In Stock	1 : $132.98000 Tray	Digi ConnectCore® MP1	Tray	Active	MPU	STM32MP157C	Arm® Dual Cortex®-A7, ARM® Cortex®-M4	650MHz, 209MHz	512MB (Boot)	512MB	Pin(s)	1.142" L x 1.142" W (29.00mm x 29.00mm)	-40°C ~ 85°C
MOD54415-100IR IC MOD COLDFIRE 250MHZ 64MB NetBurner Inc.	576 In Stock	1 : $173.72000 Bulk	ColdFire®	Bulk	Active	MCU, Ethernet Core	ColdFire 54415	-	250MHz	32MB	64MB	RJ-45, 2x50 Header	2.950" L x 2.000" W (74.90mm x 50.80mm)	-40°C ~ 85°C
TE0714-04-52I-7-B IC MODULE ARTIX-7 Trenz Electronic GmbH	115 In Stock	1 : $192.26000 Bulk	TE0714	Bulk	Not For New Designs	FPGA	Artix-7 A50T	Artix-7	-	16MB	-	-	1.570" L x 1.180" W (40.00mm x 30.00mm)	-40°C ~ 85°C
G120B-SM-373 IC MOD CORTEX-M3 120MHZ 96KB GHI Electronics, LLC	929 In Stock	1 : $224.61000 Tray	G120 .NET	Tray	Not For New Designs	MCU Core	ARM® Cortex®-M3	-	120MHz	512KB (Internal), 4MB (External)	96KB (Internal), 16MB (External)	-	1.500" L x 1.050" W (38.10mm x 26.70mm)	-40°C ~ 85°C (TA)
TE0725-04-72I-1-B IC MOD ARTIX-7 A100T 100MHZ 32MB Trenz Electronic GmbH	29 In Stock	1 : $295.62000 Bulk	-	Bulk	Active	-	-	-	-	-	-	-	-	-
TE0720-04-61C33MA SOC MODULE WITH XILINX ZYNQ 7020 Trenz Electronic GmbH	42 In Stock	1 : $388.70000 Bulk	TE0722	Bulk	Active	MPU Core	Zynq™ XC7Z020-1CLG484C	ARM Cortex-A9	-	32MB	8GB	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C

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Products in the modular embedded processor family integrate a microcontroller, microprocessor, digital signal processor, FPGA, or other such computational device together with support components such as memory, power management, timing, and other items necessary for their operation. They are suitable and intended for integration into an end product, and offer product developers access to modern computational and interface capabilities without necessity of high speed hardware design experience.