This week on Maker Update: making Toy Story your story, four-legged friends, six-legged friends, toxic gremlins, and a cozy light show.

Allegro MicroSystems brief exploring how the ACS37200 and its innovative LX package empower engineers to achieve next-generation performance and power density.

新产品

The Siretta DELTA60-X is a compact, active GNSS antenna designed for direct SMA mounting in space-constrained electronic systems.

Selecting the right patch is essential for efficient cable management, reliable performance, and scalability for future network expansion.

Learn how to manage access to your account using the User Management page.

Allegro MicroSystems application note discussing the effectiveness of using in-pad vias and other additional printed circuit board (PCB) layout techniques to improve heat dissipation for current sensors with integrated conductors.

新产品

Siretta Echo 50 series GNSS antennas deliver wideband multi-constellation coverage with high RHCP gain and low VSWR for industrial and embedded applications.

Learn how to use the Seeeduino XIAO Expansion Board with an ultrasonic range sensor and add a sound warning. Step-by-step guide with Visuino code.

The Taiwan Semiconductor TESDA1L2B17P1Q1 is an automotive bi-directional ESD protection diode designed for a single LIN bus signal line in vehicle electronics.

SICK W12 family is engineered to withstand mechanical stress, temperature changes, and demanding production conditions.

In this blog we will explore the general design that can be used to create a wireless two player game, like Run Along, Jump & Jump. We will start with the basic game design, focusing on how the core game functionality works in both single player and two player versions.

3M IDC connectors make wire-to-wire and wire-to-board connections faster, more secure, more compact, and less error-prone while reducing wire material usage.

3M 的导热界面材料注重整体导热和界面导热能力。产品包括胶带、导热垫和环氧树脂。

Telemecanique ultra-compact cylindrical sensors with enhanced sensing distance and all-stainless steel construction for demanding industrial environments.

Allegro Microsystems application note discussing integrated current sensor package constructions (MA, MC, LA, LZ, EZ and LH) and how they affect thermal metrics and more.