Image of Amphenol Industrial Operations/ATZ TS1 Series Single-Pole Connectors TS1 Series Single-Pole Connectors 发布日期:2026-04-24

Amphenol Industrial Operations/ATZ TS1 series single-pole connectors are designed to handle the high-voltage and high-current demands of modern electrified platform.

Image of HellermannTyton BundleTag Adhesive-Backed Label
新产品 New Product
BundleTag Adhesive-Backed Label 发布日期:2026-04-24

The HellermannTyton BundleTag is a one-piece, adhesive-backed label that displays critical tracking data and bar codes.

Image of Laird - Performance Materials Broadband EMI Split/Snap-On Ferrite Cable Cores Broadband EMI Split/Snap-On Ferrite Cable Cores 发布日期:2026-04-24

Laird - Performance Materials 28A series broadband EMI split and snap‑on ferrite cable cores offer effective common‑mode noise suppression for cables and wire assemblies.

Image of GlobTek NEMA 5-15P to C13 Power Cord Family NEMA 5-15P to C13 Power Cord Family 发布日期:2026-04-24

The GlobTek NEMA 5-15P to C13 power cord family covers multiple SKUs with triple regional approval for North America (cULus), Japan (PSE), and Taiwan (BSMI).

Image of LabVIEW Engineering Software Updated LabVIEW 工程软件 更新日期: 2026-04-24

NI LabVIEW 是一个图形化编程环境,为测试系统开发提供独特的生产力加速器。

Image of HellermannTyton Aerial Support Tie Spacers Aerial Support Tie Spacers 发布日期:2026-04-24

HellermannTyton aerial support tie spacers increase separation between aerial cables, such as where fiber optic cables enter aerial splice enclosures.

4 Series NDIR Hydrocarbon Gas Sensor - Honeywell Sensing and Productivity Solutions 4 Series NDIR Hydrocarbon Gas Sensor 发布日期:2026-04-24

Honeywell Sensing and Productivity Solutions sensors are designed for industrial safety, gas detection, emissions analysis/monitoring, and other relevant gas sensing applications.

Image of Amphenol Communications Solutions PCIe® Gen 6 Mini Cool Edge 0.60 mm Card Edge Connectors PCIe® Gen 6 Mini Cool Edge 0.60 mm Card Edge Connectors 发布日期:2026-04-24

The Amphenol Communications Solutions PCIe® Gen 6 connector meets EDSFF E1/E3, SFF-A-1002, OCP NIC 3.0, GEN Z, and PCIe® enclosure compatible form factor (PECFF) specifications.

Image of Thermal Grizzly Conductonaut 1g Liquid Metal Thermal Compound Conductonaut 1g Liquid Metal Thermal Compound 发布日期:2026-04-24

Conductonaut 1g is a liquid metal thermal compound from Thermal Grizzly that is designed for high-efficiency applications.

Image of MCC 100 V Dual N and P-Channel MOSFET in DFN3333-D Package
新产品 New Product
100 V Dual N- and P-Channel MOSFET in DFN3333-D Package 发布日期:2026-04-24

The Micro Commercial Co 100 V dual N- and P-Channel MOSFET in DFN3333-D package are designed for compact power applications.

Image of MCC SICWT40120G6M 1200 V Silicon Carbide Schottky Diode
新产品 New Product
SICWT40120G6M 1200 V Silicon Carbide Schottky Diode 发布日期:2026-04-23

The MCC SICWT40120G6M SiC Schottky diode is optimized for demanding power systems requiring reliable operation under extreme conditions.

Image of Amphenol Sine Systems' ecomate® Plastic Series Circular Connectors Updated ecomate® 塑料系列圆形连接器 更新日期: 2026-04-23

Amphenol Sine Systems 的 ecomate® 塑料系列圆形连接器具有更小的尺寸和坚固的设计,使其成为工业应用的理想选择。

Rugged Inline USB Type-C Panel-Mount Socket System with Screw-Lock Retention - GlobTek Rugged Inline USB Type-C Panel-Mount Socket System with Screw-Lock Retention 发布日期:2026-04-23

GlobTek inline USB-C socket system with dual-screw retention ensures reliable panel-mounted connectivity for industrial and mobile applications.

Image of 3M™ Extreme Sealing Tape+
新产品 New Product
Updated Extreme Sealing Tape+ 更新日期: 2026-04-23

3M™ Extreme Sealing Tape+ 足够坚韧,可以承受阳光、雨雪和极端温度,并且耐高压冲洗

Image of Vishay Intertechnology IHLL/IHLP Series Power Inductors IHLL Series Commercial and IHLP Series Automotive Power Inductors 发布日期:2026-04-23

Vishay Intertechnology IHLL commercial and IHLP automotive power inductors come in 2.0 mm x 1.6 mm x 1.2 mm 0806 and 3.2 mm x 2.5 mm x 1.2 mm 1210 case sizes.

Image of Thermal Grizzly Duronaut 2g Thermal Paste Duronaut 2g Thermal Paste 发布日期:2026-04-22

Thermal Grizzly Duronaut 2 g thermal paste is safe to use on all electronic components, preventing any risk of short circuits during application.

Image of Same Sky's Microphone Development Kit Updated 麦克风开发套件 更新日期: 2026-04-22

每个 CUI Devices 麦克风开发套件都包含四个可拆卸的评估电路。

HCTSM1x Series Automotive Isolation Power Transformers - Bourns Automotive High Clearance/Creepage Distance Isolation Power Transformer - HCTSM1x Series 发布日期:2026-04-22

Bourns Magnetics Product Line Models HCTSM100308BAL, HCTSM110102HAL, and HCTSM110304HAL are high clearance/creepage distance isolation power transformers.

Image of Murata XRCGB Crystal Units XRCGB Crystal Units 发布日期:2026-04-22

Murata XRCGB series supports wireless communications (Wi-Fi, BLE, NFC, Zigbee), wired interfaces (Ethernet, USB), and a wide array of electronic products.

Image of Texas Instruments TMS320C64 C64x Fixed Point DSP TMS320C64 C64x Fixed Point DSP 发布日期:2026-04-22

Texas Instruments C64x+™ devices are upward code-compatible from previous devices that are part of the C6000™ DSP platform.