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Laird Performance Materials Beat the Heat and Lower the Noise

A range of solutions now helping design engineers effectively transfer heat away from hot components, mitigate disruptive electromagnetic interference, or both. Products such as Coolzorb, Tflex, and Eccosorb are noted.

7/21/2025 7:02:43 PM

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Device Modeling and Simulation at Laird
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Publish Date: 2025-07-22

Laird Eccosorb RF-LB EMI Noise Suppression Absorber
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Publish Date: 2025-07-22

Laird Eccosorb RF-LW Light Weight EMI Noise Suppression Absorber
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Related Product Highlight

Tflex™ CR550 Thermal Insulation Material Laird Tflex™ CR550 thermal insulation materials offer low cost, mid-range thermal conductivity, and vertical stability to satisfy designer requirements.
Tflex™ SF Product Portfolio Expansion Laird Tflex™ SF soft, non-silicone gap fillers offer superior thermal performance without overstressing boards and components.
Tflex™ CR607 Dispensable Gap Filler At 6.4 W/m-K thermal conductivity, Laird Performance Materials' Tflex CR607 solves numerous design issues as a two-part, cure-in-place dispensable gap filler.

Related Articles and Blogs

RF Shielding: The Art and Science of Eliminating Interference Explore products and approaches that use shielding and ground planes to prevent spurious signal interference and ultimately minimize RF interference.