CMP Pad Conditioners
3M CMP pad conditioners are optimized for extended pad and disk life
3M diamond, soft-brush, and micro replicated chemical mechanical planarization (CMP) pad conditioners are engineered to meet the most demanding process requirements. Using precisely engineered, micro replicated, diamond-coated ceramic structures, 3M Trizact™ pad conditioners provide excellent, highly consistent disk-to-disk performance for the most demanding advanced node processes. The diamond pad conditioners use a 3M exclusive sintered abrasive technology to provide a powerful chemical and mechanical bond between diamonds and substrate, helping keep diamonds intact and in place for consistent long-term conditioning performance.
- Used for a broad range of CMP processes and process steps
- Optimized for extended pad and disk life
- Broad range of solutions for different pad hardnesses, slurries, and process requirements
- Long pad and disk life can help reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
- Customizable conditioning aggressiveness
- CMP
- Chemical mechanical polishing
- Wafer manufacturing
- Advanced node (memory and logic)
- Hard disk drive manufacturing

