Phase Change - Pressure Increase maxiGRIP™

Phase Change - Pressure Increase maxiGRIP™

Advanced Thermal Solutions Inc

The need to consider interfacial resistance is very important. This tutorial will discuss the thermal interface material (TIMs) performance and usage.

maxiGrip,maxiFlow

图片制造商零件编号描述可供货数量价格查看详情
HEAT SINK 27MM X 27MM X 7.5MMATS-50270B-C1-R0HEAT SINK 27MM X 27MM X 7.5MM126 - 立即发货$21.82查看详情
HEAT SINK 31MM X 31MM X 7.5MMATS-50310B-C1-R0HEAT SINK 31MM X 31MM X 7.5MM300 - 立即发货$22.41查看详情
HEAT SINK 17MM X 17MM X 19.5MMATS-51170R-C1-R0HEAT SINK 17MM X 17MM X 19.5MM2559 - 立即发货$24.88查看详情
HEAT SINK T766ATS-50450G-C3-R0HEAT SINK T766657 - 立即发货$15.43查看详情
HEAT SINK 27MM X 27MM X 9.5MMATS-51270D-C1-R0HEAT SINK 27MM X 27MM X 9.5MM237 - 立即发货$22.92查看详情
HEAT SINK 31MM X 31MM X 9.5MMATS-51310D-C1-R0HEAT SINK 31MM X 31MM X 9.5MM107 - 立即发货$23.67查看详情
HEAT SINK 21MM X 21MM X 14.5MMATS-51210K-C1-R0HEAT SINK 21MM X 21MM X 14.5MM978 - 立即发货$23.70查看详情
HEAT SINK 35MM X 35MM X 9.5MMATS-51350D-C1-R0HEAT SINK 35MM X 35MM X 9.5MM183 - 立即发货$24.04查看详情
HEAT SINK 31MM X 31MM X 12.5MMATS-50310G-C1-R0HEAT SINK 31MM X 31MM X 12.5MM109 - 立即发货$24.20查看详情
HEAT SINK 23MM X 23MM X 17.5MMATS-50230P-C1-R0HEAT SINK 23MM X 23MM X 17.5MM600 - 立即发货$24.98查看详情
PTM Published on: 2011-10-13

Related Videos

ATS Explains - Thermal Interface Material
ATS Explains - Thermal Interface Material

发布日期：2018-01-26

Advanced Thermal Solutions - maxiGRIP
Advanced Thermal Solutions - maxiGRIP

发布日期：2012-10-15

Related Product Highlight

散热器附件解决方案 Advanced Thermal Solutions 的散热器附件为工程师提供了多种选择，可以将几乎所有散热器以机械方式安装到 PCB 板上。
maxiFLOW™ with maxiGRIP™ Heatsinks ATS BGA cooling solutions with maxiGRIP attachment come preassembled with phase change thermal interface materials for easy installation/removal.

Related Articles and Blogs

Feasibility Study of an LED-Based Lighting System Using Analytical Modeling A study of the heat loads for an outdoor LED-based lighting system using analytical modeling to determine the feasibility of the design with solar heat load.
Device Thermal Coupling on a PCB A look at how components on a printed circuit board thermally couple and the design considerations that help minimize heat dissipation problems.
Air Flow Measurement in Electronic Systems An analysis of circuit board air flow measurement techniques and the considerations required to obtain an accurate reading in this complex environment.

Related Product Training Modules

Introduction to Heat Sinks This module will review the use of heat sinks, including how a heat sink works, the factors that impact heat sink thermal performance, common heat sink materials, and thermal interface materials.
maxiGRIP™ and Board Rework Costs maxiGrip delivers enhanced cooling and enables the user to avoid any damage to the PCB and the BGA package itself.
maxiGRIP™ Heat Sink Attachment The maxiGRIP system heat sink attachment conforms to standards including Telcordia GR-63-Core, MIL-STD-810, and RoHS compliance.