MaxiGrip Board Rework

maxiGRIP™ and Board Rework Costs

Advanced Thermal Solutions Inc

This tutorial discusses use of the latest technology to attach heat sinks to BGA devices that minimizes potential damage to either the component or the PCB itself during the rework process.

Related Parts

图片制造商零件编号描述连接方法形状可供货数量价格查看详情
HEAT SINK 27MM X 27MM X 12.5MMATS-52270G-C1-R0HEAT SINK 27MM X 27MM X 12.5MM散热带，粘合剂（含）方形，有角度的散热片90 - 立即发货$17.64查看详情
HEAT SINK 25MM X 25MM X 14.5MMATS-51250K-C1-R0HEAT SINK 25MM X 25MM X 14.5MM夹，热介面材料方形，有角度的散热片0 - 立即发货$19.35查看详情
HEAT SINK 33MM X 33MM X 7.5MMATS-52330B-C1-R0HEAT SINK 33MM X 33MM X 7.5MM散热带，粘合剂（含）方形，有角度的散热片77 - 立即发货$15.65查看详情
HEAT SINK 27MM X 27MM X 14.5MMATS-53270K-C1-R0HEAT SINK 27MM X 27MM X 14.5MM夹，热介面材料方形，鳍片607 - 立即发货$22.41查看详情
HEAT SINK 25MM X 25MM X 12.5MMATS-50250G-C1-R0HEAT SINK 25MM X 25MM X 12.5MM夹，热介面材料方形，有角度的散热片935 - 立即发货$23.34查看详情
HEAT SINK 23MM X 23MM X 12.5MMATS-50230G-C1-R0HEAT SINK 23MM X 23MM X 12.5MM夹，热介面材料方形，有角度的散热片60 - 立即发货$23.06查看详情
HEAT SINK 19MM X 19MM X 12.5MMATS-50190G-C1-R0HEAT SINK 19MM X 19MM X 12.5MM夹，热介面材料方形，有角度的散热片32 - 立即发货$22.67查看详情
HEAT SINK 21MM X 21MM X 12.5MMATS-50210G-C1-R0HEAT SINK 21MM X 21MM X 12.5MM夹，热介面材料方形，有角度的散热片100 - 立即发货$22.84查看详情
HEAT SINK 19MM X 19MM X 9MMATS-56001-C1-R0HEAT SINK 19MM X 19MM X 9MM散热带，粘合剂（含）方形，有角度的散热片1372 - 立即发货$11.89查看详情
PTM Published on: 2011-10-13

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Related Product Highlight

散热器附件解决方案 Advanced Thermal Solutions 的散热器附件为工程师提供了多种选择，可以将几乎所有散热器以机械方式安装到 PCB 板上。
maxiFLOW™ with maxiGRIP™ Heatsinks ATS BGA cooling solutions with maxiGRIP attachment come preassembled with phase change thermal interface materials for easy installation/removal.

Related Articles and Blogs

Feasibility Study of an LED-Based Lighting System Using Analytical Modeling A study of the heat loads for an outdoor LED-based lighting system using analytical modeling to determine the feasibility of the design with solar heat load.
Device Thermal Coupling on a PCB A look at how components on a printed circuit board thermally couple and the design considerations that help minimize heat dissipation problems.
Air Flow Measurement in Electronic Systems An analysis of circuit board air flow measurement techniques and the considerations required to obtain an accurate reading in this complex environment.

Related Product Training Modules

Introduction to Heat Sinks This module will review the use of heat sinks, including how a heat sink works, the factors that impact heat sink thermal performance, common heat sink materials, and thermal interface materials.
maxiGRIP™ Flip-Chip Overview of the maxiGRIP Flip-Chip and review of importance of selecting the correct TIM.
Phase Change - Pressure Increase maxiGRIP™ ATS maxiGRIP and superGRIP are ideal solutions when used with phase change TIM for increased thermal and mechanical performance.