HSB41-303014P 封装和模型

HSB41-303014P

Same Sky (Formerly CUI Devices)

HEAT SINK, BGA, 30 X 30 X 10 MM,

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HSB41-303014P

Same Sky (Formerly CUI Devices)

HEAT SINK, BGA, 30 X 30 X 10 MM,

因为文件大小的因素，这可能需要几分钟才能完成。

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HSB41-303014P 封装和模型

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