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Cinch Connectivity Solutions CIN:APSE Solderless, High Density, Custom Interconnects

CIN::APSE solderless, high density, custom interconnects are used for board to board, IC to board, flex to board and component to board applications for Military, Aerospace, Datacom, Satellite and Test Equipment.

12/28/2020 2:12:58 PM

Part List

图片制造商零件编号描述可供货数量价格查看详情
CONN SPRING MOD 25POS SMD3800520001CONN SPRING MOD 25POS SMD41 - 立即发货$134.69查看详情
CONN SPRING MOD 51POS SMD3800520013CONN SPRING MOD 51POS SMD0 - 立即发货$118.63查看详情
CIN::APSE STACKING HARDWRE 25POS3180299353CIN::APSE STACKING HARDWRE 25POS0 - 立即发货See Page for Pricing查看详情
CIN::APSE STACKING HARDWRE 51POS3180299356CIN::APSE STACKING HARDWRE 51POS0 - 立即发货See Page for Pricing查看详情
CABLE FFC/FPC 25POS 0.64MM 3"4631533093CABLE FFC/FPC 25POS 0.64MM 3"6 - 立即发货$114.53查看详情
CABLE FFC/FPC 51POS 0.64MM 3"4631533094CABLE FFC/FPC 51POS 0.64MM 3"0 - 立即发货See Page for Pricing查看详情

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