TMS320F2806x Datasheet by Texas Instruments

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U Ordering & Technical Design a 3 Support 5 o . quahly documentation development (raming ' TEXAS INSTRUMENTS

TMS320F2806x Real-Time Microcontrollers

1 Features

• High-efficiency 32-bit CPU (TMS320C28x)

– 90 MHz (11.11-ns cycle time)

– 16 × 16 and 32 × 32 Multiply and Accumulate

(MAC) operations

– 16 × 16 dual MAC

– Harvard bus architecture

– Atomic operations

– Fast interrupt response and processing

– Unified memory programming model

– Code-efficient (in C/C++ and Assembly)

• Floating-Point Unit (FPU)

– Native single-precision floating-point operations

• Programmable Control Law Accelerator (CLA)

– 32-bit floating-point math accelerator

– Executes code independently of the main CPU

• Viterbi, Complex Math, CRC Unit (VCU)

– Extends C28x instruction set to support

complex multiply, Viterbi operations, and Cyclic

Redundency Check (CRC)

• Embedded memory

– Up to 256KB of flash

– Up to 100KB of RAM

– 2KB of One-Time Programmable (OTP) ROM

• 6-channel Direct Memory Access (DMA)

• Low device and system cost

– Single 3.3-V supply

– No power sequencing requirement

– Integrated power-on reset and brownout reset

– Low-power operating modes

– No analog support pin

• Endianness: Little endian

• JTAG boundary scan support

– IEEE Standard 1149.1-1990 Standard Test

Access Port and Boundary Scan Architecture

• Clocking

– Two internal zero-pin oscillators

– On-chip crystal oscillator/external clock input

– Watchdog timer module

– Missing clock detection circuitry

• Peripheral Interrupt Expansion (PIE) block that

supports all peripheral interrupts

• Three 32-bit CPU timers

• Advanced control peripherals

• Up to 8 Enhanced Pulse-Width Modulator (ePWM)

modules

– 16 PWM channels total (8 HRPWM-capable)

– Independent 16-bit timer in each module

• Three input Enhanced Capture (eCAP) modules

• Up to 4 High-Resolution Capture (HRCAP)

modules

• Up to 2 Enhanced Quadrature Encoder Pulse

(eQEP) modules

• 12-bit Analog-to-Digital Converter (ADC), dual

Sample-and-Hold (S/H)

– Up to 3.46 MSPS

– Up to 16 channels

• On-chip temperature sensor

• 128-bit security key and lock

– Protects secure memory blocks

– Prevents reverse-engineering of firmware

• Serial port peripherals

– Two Serial Communications Interface (SCI)

[UART] modules

– Two Serial Peripheral Interface (SPI) modules

– One Inter-Integrated-Circuit (I2C) bus

– One Multichannel Buffered Serial Port (McBSP)

bus

– One Enhanced Controller Area Network

(eCAN)

– Universal Serial Bus (USB) 2.0

(see Device Comparison for availability)

• Full-speed device mode

• Full-speed or low-speed host mode

• Up to 54 individually programmable, multiplexed

General-Purpose Input/Output (GPIO) pins with

input filtering

• Advanced debug features

– Analysis and breakpoint functions

– Real-time debug through hardware

• Package options

– 80-pin PFP and 100-pin PZP PowerPAD™

Thermally Enhanced Thin Quad Flatpacks

(HTQFPs)

– 80-pin PN and 100-pin PZ Low-Profile Quad

Flatpacks (LQFPs)

• Temperature options

– T: –40°C to 105°C

– S: –40°C to 125°C

– Q: –40°C to 125°C (AEC Q100 qualification for

automotive applications)

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

I TEXAS INSTRUMENTS

2 Applications

•Air conditioner outdoor unit

•Door operator drive control

•Inverter & motor control

•On-board (OBC) & wireless charger

•Automated sorting equipment

•CNC control

•Textile machine

•Welding machine

•EV charging station power module

•Wireless vehicle charging module

•Energy storage power conversion system (PCS)

•Central inverter

•Micro inverter

•Solar power optimizer

•String inverter

•AC drive control module

•AC drive power stage module

•Linear motor power stage

•Servo drive control module

•Servo drive power stage module

•AC-input BLDC motor drive

•DC-input BLDC motor drive

•Industrial AC-DC

•Three phase UPS

3 Description

C2000™ 32-bit microcontrollers are optimized for processing, sensing, and actuation to improve closed-loop

performance in real-time control applications such as industrial motor drives; solar inverters and digital power;

electrical vehicles and transportation; motor control; and sensing and signal processing. The C2000 line includes

the Premium performance MCUs and the Entry performance MCUs.

The F2806x family of microcontrollers (MCUs) provides the power of the C28x core and CLA coupled with highly

integrated control peripherals in low pin-count devices. This family is code-compatible with previous C28x-based

code, and also provides a high level of analog integration.

An internal voltage regulator allows for single-rail operation. Enhancements have been made to the HRPWM

module to allow for dual-edge control (frequency modulation). Analog comparators with internal 10-bit references

have been added and can be routed directly to control the ePWM outputs. The ADC converts from 0 to

3.3-V fixed full-scale range and supports ratio-metric VREFHI/VREFLO references. The ADC interface has been

optimized for low overhead and latency.

To learn more about the C2000 MCUs, visit the C2000 Overview at www.ti.com/c2000.

Device Information

PART NUMBER(1) PACKAGE BODY SIZE

TMS320F28069PZP HTQFP (100) 14.0 mm × 14.0 mm

TMS320F28069PFP HTQFP (80) 12.0 mm × 12.0 mm

TMS320F28069PZ LQFP (100) 14.0 mm × 14.0 mm

TMS320F28069PN LQFP (80) 12.0 mm × 12.0 mm

(1) For more information on these devices, see Mechanical, Packaging, and Orderable Information.

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS I; \ +++¢ l l lHr V $+ —> —> ’—> g 3 <—mfs +="" 4—mfs="" d—md="" +="" 4_="" ||$="" |¢="" capyngm="" a="" 2017‘="" rexas="" \nslmmems="" lnoorpura‘ed="">

3.1 Functional Block Diagram

Figure 3-1 shows a functional block diagram of the device.

CLA Bus

DMA Bus

16-Bit Peripheral Bus 32-Bit Peripheral

Bus

Memory Bus

A7:0

B7:0

Memory Bus

DMA Bus

CLA Bus

DMA Bus

GPIO Mux

AIO Mux

32-Bit Peripheral Bus

ADC

0-wait

Result

Regs

ADC

COMP

DAC

COMP1OUT

COMP2OUT

COMP3OUT

COMP1A

COMP2A

COMP3A

COMP1B

COMP2B

COMP3B

Boot-ROM

(32K 16)

(0-wait,

Nonsecure)

GPIO

Mux

GPIO

Mux

TRST

TCK, TDI, TMS

TDO

XCLKIN

LPM Wakeup

3 Ext. Interrupts

XRS

M0 SARAM (1K 16)

(0-wait, Nonsecure)

M1 SARAM (1K 16)

(0-wait, Nonsecure)

L5 DPSARAM (8K 16)

(0-wait, Nonsecure)

DMA RAM0

L6 DPSARAM (8K 16)

(0-wait, Nonsecure)

DMA RAM1

L7 DPSARAM (8K 16)

(0-wait, Nonsecure)

DMA RAM2

L8 DPSARAM (8K 16)

(0-wait, Nonsecure)

DMA RAM3

L0 DPSARAM (2K 16)

(0-wait, Secure)

CLA Data RAM2

L1 DPSARAM (1K 16)

(0-wait, Secure)

CLA Data RAM0

L2 DPSARAM (1K 16)

(0-wait, Secure)

CLA Data RAM1

L3 DPSARAM (4K 16)

(0-wait, Secure)

CLA Program RAM

L4 SARAM (8K 16)

(0-wait, Secure)

Code

Security

Module

(CSM)

PSWD

OTP 1K 16

Secure

FLASH

128K 16

8 equal sectors

Secure

64K 16´

PUMP

OTP/Flash

Wrapper

32-Bit Peripheral

Bus

USB-0

GPIO Mux

SCITXDx

SCIRXDx

SPISIMOx

SPISOMIx

SPICLKx

SPISTEx

SDAx

SCLx

MFSRA

MDRA

MCLKRA

MFSXA

MDXA

MCLKXA

ECAPx

EQEPxA

EQEPxB

EQEPxI

EQEPxS

HRCAPx

CANRXx

CANTXx

USB0DP

USB0DM

TZx

EPWMxA

EPWMxB

EPWMSYNCI

EPWMSYNCO

SCI-A

SCI-B

(4L FIFO)

SPI-A

SPI-B

(4L FIFO)

I2C-A

(4L FIFO)

32-Bit Peripheral Bus

(CLA accessible)

ePWM1 to ePWM8

HRPWM (8ch)

McBSP-A

32-Bit

Peripheral Bus

(CLA accessible)

eCAP1

eCAP2

eCAP3

eQEP1

eQEP2

32-Bit Peripheral

Bus

HRCAP1

HRCAP2

HRCAP3

HRCAP4

eCAN-A

(32-mbox)

CLA +

Message

RAMs

DMA

6-ch

C28x 32-bit CPU

FPU

VCU

OSC1, OSC2,

Ext, PLLs,

LPM, WD,

CPU Timer 0,

CPU Timer 1,

CPU Timer 2,

PIE

A. Not all peripheral pins are available at the same time due to multiplexing.

Figure 3-1. Functional Block Diagram

www.ti.com

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

3.2 System Device Diagram

10-Bit

DAC

Analog

Comparators

CMP1-Out

CMP2-Out

CMP3-Out

Trip Zone

Temp

Sensor

ADC

(DMA-

accessible)

12-Bit

3.46-MSPS

Dual

Sample-

and-

Hold

SOC-based

VREF

CLA Core

90-MHz Floating-Point

(Accelerator)

(DMA-accessible)

10-Bit

DAC

10-Bit

DAC

eQEP 2´

HRCAP 4´

eCAP 3´

System

Vreg

Int-Osc-1

POR/BOR

Int-Osc-2

On-chip Osc

PLL

CLKSEL

Timers 32-bit

Timer-0

Timer-1

Timer-2

GPIO

Control

COMMS

VREFLO

VREFHI

C28x

Core

(90-MHz)

FPU

VCU

Flash Memory

RAM

(Dual-Access)

eQEP

HRCAP

eCAP

PWM-1A

PWM-1B

PWM-2A

PWM-2B

PWM-3A

PWM-3B

PWM-4A

PWM-4B

PWM-5A

PWM-5B

PWM-6A

PWM-6B

PWM-7A

PWM-7B

PWM-8A

PWM-8B

TZ1

TZ2

TZ3

CMP1-out

CMP2-out

CMP3-out

PWM1

(DMA-accessible)

PWM5

(DMA-accessible)

PWM8

(DMA-accessible)

PWM7

(DMA-accessible)

PWM6

(DMA-accessible)

PWM4

(DMA-accessible)

PWM3

(DMA-accessible)

PWM2

(DMA-accessible)

UART 2´

SPI 2´

I2C

CAN

McBSP

(DMA-accessible)

USB

(DMA-accessible)

Figure 3-2. Peripheral Blocks

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 2

3 Description.......................................................................2

3.1 Functional Block Diagram........................................... 3

3.2 System Device Diagram............................................. 4

4 Revision History.............................................................. 6

5 Device Comparison......................................................... 7

5.1 Related Products........................................................ 8

6 Terminal Configuration and Functions..........................9

6.1 Pin Diagrams.............................................................. 9

6.2 Signal Descriptions................................................... 12

7 Specifications................................................................ 21

7.1 Absolute Maximum Ratings...................................... 21

7.2 ESD Ratings – Commercial...................................... 22

7.3 ESD Ratings – Automotive....................................... 22

7.4 Recommended Operating Conditions.......................23

7.5 Power Consumption Summary................................. 24

7.6 Electrical Characteristics...........................................28

7.7 Thermal Resistance Characteristics......................... 29

7.8 Thermal Design Considerations................................32

7.9 Debug Probe Connection Without Signal

Buffering for the MCU..................................................32

7.10 Parameter Information............................................ 33

7.11 Test Load Circuit..................................................... 33

7.12 Power Sequencing..................................................34

7.13 Clock Specifications................................................37

7.14 Flash Timing............................................................40

8 Detailed Description......................................................43

8.1 Overview................................................................... 43

8.2 Memory Maps........................................................... 53

8.3 Register Maps...........................................................64

8.4 Device Debug Registers........................................... 66

8.5 VREG, BOR, POR.................................................... 68

8.6 System Control......................................................... 70

8.7 Low-power Modes Block...........................................79

8.8 Interrupts...................................................................80

8.9 Peripherals................................................................85

9 Applications, Implementation, and Layout............... 165

9.1 TI Reference Design............................................... 165

10 Device and Documentation Support........................166

10.1 Device and Development Support Tool

Nomenclature............................................................ 166

10.2 Tools and Software............................................... 167

10.3 Documentation Support........................................ 169

10.4 Support Resources............................................... 170

10.5 Trademarks...........................................................170

10.6 Electrostatic Discharge Caution............................170

10.7 Glossary................................................................170

11 Mechanical, Packaging, and Orderable

Information.................................................................. 171

11.1 Packaging Information.......................................... 171

www.ti.com

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

4 Revision History

Changes from February 1, 2021 to May 30, 2021 (from Revision I (February 2021) to Revision J

(May 2021)) Page

• Global Change: Updated/changed "emulation" to "debug".................................................................................1

• Added Q1 part numbers..................................................................................................................................... 1

• Updated/changed from "SCI" to "SCI/UART"..................................................................................................... 7

• Updated/changed Device Compairson table footnote to show correct part numbers.........................................7

• Updated/changed the definition for VREGENZ................................................................................................ 12

• Updated/changed oscillator footnote................................................................................................................ 38

• Updated/changed Security note....................................................................................................................... 47

• Updated/changed Peripheral Frame information..............................................................................................64

• Added a row for Instaspin feature.....................................................................................................................66

• Updated/changed image, Clock Tree, to remove WDCLK label.......................................................................70

• Updated/changed "CPU Watchdog Module" to remove WDCLK..................................................................... 77

• Added C2000 third-party search tool link........................................................................................................167

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

TEXAS INSTRUMENTS

5 Device Comparison

Table 5-1 lists the features of the TMS320F2806x devices.

Table 5-1. Device Comparison

FEATURE TYPE

(1)

28069

28069-Q1

28069U(2) (5)

28069M (2) (3)

28069M-Q1

28069F (2) (3)

28069F-Q1

(90 MHz)

28068U(2) (5)

28068M (2) (3)

28068F (2) (3)

(90 MHz)

28067

28067-Q1

28067U(2) (5)

(90 MHz)

28066

28066-Q1

28066U(2) (5)

(90 MHz)

28065

28065-Q1

28065U(2) (5)

(90 MHz)

28064

28064U(2) (5)

(90 MHz)

28063

28063U(2) (5)

(90 MHz)

28062

28062-Q1

28062U(2) (5)

28062F (2) (3)

28062F-Q1

(90 MHz)

Package Type

(PFP and PZP are

PowerPAD HTQFPs.

PN and PZ are LQFPs.)

100-

PZP

80-Pin

PFP

100-

PZP

80-Pin

PFP

100-

PZP

80-Pin

PFP

100-

PZP

80-Pin

PFP

100-

PZP

80-Pin

PFP

100-

PZP

80-Pin

PFP

100-

PZP

80-Pin

PFP

100-

PZP

80-Pin

PFP

Instruction cycle – 11.11 ns 11.11 ns 11.11 ns 11.11 ns 11.11 ns 11.11 ns 11.11 ns 11.11 ns

Floating-Point Unit (FPU) Yes Yes Yes Yes Yes Yes Yes Yes

VCU Yes Yes No No Yes Yes No No

CLA 0 Yes No No No Yes No No No

6-Channel DMA 0 Yes Yes Yes Yes Yes Yes Yes Yes

On-chip Flash (16-bit word) – 128K 128K 128K 128K 64K 64K 64K 64K

On-chip SARAM (16-bit word) – 50K 50K 50K 34K 50K 50K 34K 26K

Code security for on-chip

Flash, SARAM, and OTP

blocks

– Yes Yes Yes Yes Yes Yes Yes Yes

Boot ROM (32K × 16) – Yes Yes Yes Yes Yes Yes Yes Yes

One-time programmable

(OTP) ROM

(16-bit word)

– 1K 1K 1K 1K 1K 1K 1K 1K

ePWM channels 1 16 14 16 14 16 14 16 14 16 14 16 14 16 14 16 14

High-resolution ePWM

Channels 188888888

eCAP inputs 0 3 3 3 3 3 3 3 3

HRCAP 0 4 1 4 1 4 1 4 1 4 1 4 1 4 1 4 1

eQEP modules 0 2 1 2 1 2 1 2 1 2 1 2 1 2 1 2 1

Watchdog timer – Yes Yes Yes Yes Yes Yes Yes Yes

12-Bit

ADC

MSPS

3.46 3.46 3.46 3.46 3.46 3.46 3.46 3.46

Conversion Time 289 ns 289 ns 289 ns 289 ns 289 ns 289 ns 289 ns 289 ns

Channels 16 12 16 12 16 12 16 12 16 12 16 12 16 12 16 12

Temperature

Sensor Yes Yes Yes Yes Yes Yes Yes Yes

Dual Sample-

and-Hold Yes Yes Yes Yes Yes Yes Yes Yes

32-Bit CPU timers – 3 3 3 3 3 3 3 3

Comparators with Integrated

DACs 033333333

I2C 0 1 1 1 1 1 1 1 1

McBSP 1 1 1 1 1 1 1 1 1

eCAN 0 1 1 1 1 1 1 1 1

SPI 1 2 2 2 2 2 2 2 2

SCI/UART 0 2 2 2 2 2 2 2 2

USB 0 1(2) 1(2) 1(2) 1(2) 1(2) 1(2) 1(2) 1(2)

2-pin Oscillator 1 1 1 1 1 1 1 1

0-pin Oscillator 2 2 2 2 2 2 2 2

I/O pins

(shared)

GPIO – 54 40 54 40 54 40 54 40 54 40 54 40 54 40 54 40

AIO – 6 6 6 6 6 6 6 6

External interrupts – 3 3 3 3 3 3 3 3

Supply voltage (nominal) – 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V

www.ti.com

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

TEXAS INSTRUMENTS

Table 5-1. Device Comparison (continued)

FEATURE TYPE

(1)

28069

28069-Q1

28069U(2) (5)

28069M (2) (3)

28069M-Q1

28069F (2) (3)

28069F-Q1

(90 MHz)

28068U(2) (5)

28068M (2) (3)

28068F (2) (3)

(90 MHz)

28067

28067-Q1

28067U(2) (5)

(90 MHz)

28066

28066-Q1

28066U(2) (5)

(90 MHz)

28065

28065-Q1

28065U(2) (5)

(90 MHz)

28064

28064U(2) (5)

(90 MHz)

28063

28063U(2) (5)

(90 MHz)

28062

28062-Q1

28062U(2) (5)

28062F (2) (3)

28062F-Q1

(90 MHz)

Package Type

(PFP and PZP are

PowerPAD HTQFPs.

PN and PZ are LQFPs.)

100-

PZP

80-Pin

PFP

100-

PZP

80-Pin

PFP

100-

PZP

80-Pin

PFP

100-

PZP

80-Pin

PFP

100-

PZP

80-Pin

PFP

100-

PZP

80-Pin

PFP

100-

PZP

80-Pin

PFP

100-

PZP

80-Pin

PFP

Temperatu

re options

T: –40°C to

105°C – PZ PN PZ PN PZ PN PZ PN PZ PN PZ PN PZ PN PZ PN

S: –40°C to

125°C – PZP PFP PZP PFP PZP PFP PZP PFP PZP PFP PZP PFP PZP PFP PZP PFP

Q: –40°C to

125°C(5) (4) – PZP PFP PZP PFP PZP PFP PZP PFP PZP PFP PZP PFP PZP PFP PZP PFP

(1) A type change represents a major functional feature difference in a peripheral module. Within a peripheral type, there may be minor

differences between devices that do not affect the basic functionality of the module. These device-specific differences are listed in the

C2000 Real-Time Control Peripherals Reference Guide and in the peripheral reference guides.

(2) USB is present on TMS320F2806xU, TMS320F2806xM, and TMS320F2806xF devices.

(3) TMS320F2806xF devices are InstaSPIN-FOC™-enabled MCUs. TMS320F2806xM devices are InstaSPIN-MOTION™-enabled MCUs.

But instaSPIN-MOTION is no longer recommended for new designs and will not have application support. For more information, see

Section 10.3 for a list of InstaSPIN Technical Reference Manuals.

(4) The letter Q refers to AEC Q100 qualification for automotive applications.

(5) The Q temperature option is not available on the TMS320F2806xU devices.

5.1 Related Products

For information about similar products, see the following links:

TMS320F2802x Microcontrollers

The F2802x series offers the lowest pin-count and Flash memory size options. InstaSPIN-FOC™ versions are

available.

TMS320F2803x Microcontrollers

The F2803x series increases the pin-count and memory size options. The F2803x series also introduces the

parallel control law accelerator (CLA) option.

TMS320F2805x Microcontrollers

The F2805x series is similar to the F2803x series but adds on-chip programmable gain amplifiers (PGAs).

InstaSPIN-FOC and InstaSPIN-MOTION™ versions are available.

TMS320F2806x Microcontrollers

The F2806x series is the first to include a floating-point unit (FPU). The F2806x series also increases the

pin-count, memory size options, and the quantity of peripherals. InstaSPIN-FOC™ and InstaSPIN-MOTION™

versions are available.

TMS320F2807x Microcontrollers

The F2807x series offers the most performance, largest pin counts, flash memory sizes, and peripheral options.

The F2807x series includes the latest generation of accelerators, ePWM peripherals, and analog technology.

TMS320F28004x Microcontrollers

The F28004x series is a reduced version of the F2807x series with the latest generational enhancements. The

F28004x series is the best roadmap option for those using the F2806x series. InstaSPIN-FOC and configurable

logic block (CLB) versions are available.

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

6 Terminal Configuration and Functions

6.1 Pin Diagrams

Figure 6-1 shows the pin assignments on the 80-pin PN and PFP packages. Figure 6-2 shows the pin

assignments on the 100-pin PZ and PZP packages.

GPIO23/EQEP1I/MFSXA/SCIRXDB

VDD

VSS

VDDIO

GPIO20/EQEP1A/MDXA/COMP1OUT

GPIO21/EQEP1B/MDRA/COMP2OUT

GPIO4/EPWM3A

GPIO5/EPWM3B/SPISIMOA/ECAP1

XRS

TRST

VSS

VDDIO

ADCINA6/COMP3A/AIO6

ADCINA5

ADCINA4/COMP2A/AIO4

ADCINA2/COMP1A/AIO2

ADCINA1

ADCINA0, VREFHI

VDDA

GPIO10/EPWM6A/ADCSOCBO

GPIO11/EPWM6B/SCIRXDB/ECAP1

GPIO36/TMS

GPIO35/TDI

GPIO37/TDO

GPIO34/COMP2OUT/COMP3OUT

GPIO38/XCLKIN/TCK

GPIO39

GPIO19/XCLKIN/ /SCIRXDB/ECAP1SPISTEA

VDD

VSS

VDDIO

GPIO6/EPWM4A/EPWMSYNCI/EPWMSYNCO

GPIO7/EPWM4B/SCIRXDA/ECAP2

GPIO16/SPISIMOA/TZ2

GPIO8/EPWM5A/ADCSOCAO

GPIO17/SPISOMIA/TZ3

GPIO18/SPICLKA/SCITXDB/XCLKOUT

GPIO26/ECAP3/SPICLKB/USB0DP

GPIO27/HRCAP2/SPISTEB/USB0DM

VDDIO

VSS

VDD

GPIO3/EPWM2B/SPISOMIA/COMP2OUT

GPIO2/EPWM2A

GPIO1/EPWM1B/COMP1OUT

GPIO0/EPWM1A

GPIO15/ECAP2/SCIRXDB/SPISTEB

VREGENZ

VDD

VSS

VDDIO

GPIO13/ /SPISOMIBTZ2

GPIO14/ /SCITXDB/SPICLKBTZ3

GPIO24/ECAP1/SPISIMOB

GPIO22/EQEP1S/MCLKXA/SCITXDB

GPIO32/SDAA/EPWMSYNCI/ADCSOCAO

GPIO33/SCLA/EPWMSYNCO/ADCSOCBO

GPIO29/SCITXDA/SCLA/TZ3

GPIO12/ /SCITXDA/SPISIMOBTZ1

TEST2

VDD3VFL

VSS

GPIO9/EPWM5B/SCITXDB/ECAP3

GPIO28/SCIRXDA/SDAA/TZ2

GPIO30/CANRXA/EPWM7A

GPIO31/CANTXA/EPWM8A

GPIO25/ECAP2/SPISOMIB

VDD

VSS

VDDIO

ADCINB6/COMP3B/AIO14

ADCINB5

ADCINB4/COMP2B/AIO12

ADCINB2/COMP1B/AIO10

ADCINB1

ADCINB0

V , V

REFLO SSA

A. Pin 19: VREFHI and ADCINA0 share the same pin on the 80-pin PN and PFP devices and their use is mutually exclusive to one another.

Pin 21: VREFLO is always connected to VSSA on the 80-pin PN and PFP devices.

B. The PowerPAD is not connected to the ground on the die. To facilitate effective heat dissipation, the PowerPAD must be connected to

the ground plane of the PCB. It should not be left unconnected. For more details, see PowerPAD™ Thermally Enhanced Package.

Figure 6-1. 80-Pin PN and PFP Packages (Top View)

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TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

100

VDD

VSS

VDDIO

VREFHI

VDDIO

VDD3VFL

VSSA

TEST2

ADCINB7

ADCINB3

VREGENZ

VREFLO

ADCINB6/COMP3B/AIO14

ADCINB5

ADCINB4/COMP2B/AIO12

ADCINB2/COMP1B/AIO10

ADCINB1

ADCINB0

GPIO0/EPWM1A

GPIO1/EPWM1B/COMP1OUT

GPIO2/EPWM2A

GPIO56/SPICLKA/EQEP2I/HRCAP3

GPIO57/ /EQEP2S/HRCAP4SPISTEA

GPIO58/MCLKRA/SCITXDB/EPWM7A

GPIO40/EPWM7A/SCITXDB

GPIO41/EPWM7B/SCIRXDB

GPIO3/EPWM2B/SPISOMIA/COMP2OUT

GPIO6/EPWM4A/EPWMSYNCI/EPWMSYNCO

GPIO44/MFSRA/SCIRXDB/EPWM7B

GPIO7/EPWM4B/SCIRXDA/ECAP2

GPIO8/EPWM5A/ADCSOCAO

GPIO9/EPWM5B/SCITXDB/ECAP3

GPIO10/EPWM6A/ADCSOCBO

GPIO11/EPWM6B/SCIRXDB/ECAP1

GPIO12/ /SCITXDA/SPISIMOBTZ1

GPIO13/ /SPISOMIBTZ2

GPIO14/ /SCITXDB/SPICLKBTZ3

GPIO15/ECAP2/SCIRXDB/SPISTEB

GPIO16/SPISIMOA/TZ2

GPIO17/SPISOMIA/TZ3

GPIO42/EPWM8A/ /COMP1OUTTZ1

GPIO43/EPWM8B/ /COMP2OUTTZ2

GPIO18/SPICLKA/SCITXDB/XCLKOUT

GPIO19/XCLKIN/ /SCIRXDB/ECAP1SPISTEA

GPIO22/EQEP1S/MCLKXA/SCITXDB

GPIO24/ECAP1/EQEP2A/SPISIMOB

GPIO25/ECAP2/EQEP2B/SPISOMIB

GPIO26/ECAP3/EQEP2I/SPICLKB/USB0DP

GPIO27/HRCAP2/EQEP2S/SPISTEB/USB0DM

GPIO28/SCIRXDA/SDAA/TZ2

GPIO29/SCITXDA/SCLA/TZ3

GPIO30/CANRXA/EQEP2I/EPWM7A

GPIO50/EQEP1A/MDXA/TZ1

GPIO51/EQEP1B/MDRA/TZ2

GPIO52/EQEP1S/MCLKXA/TZ3

GPIO53/EQEP1I/MFSXA

GPIO54/SPISIMOA/EQEP2A/HRCAP1

GPIO55/SPISOMIA/EQEP2B/HRCAP2

GPIO31/CANTXA/EQEP2S/EPWM8A

GPIO32/SDAA/EPWMSYNCI/ADCSOCAO

GPIO33/SCLA/EPWMSYNCO/ADCSOCBO

GPIO34/COMP2OUT/COMP3OUT

GPIO35/TDI

GPIO36/TMS

GPIO37/TDO

GPIO38/XCLKIN/TCK

GPIO39

GPIO23/EQEP1I/MFSXA/SCIRXDB

GPIO20/EQEP1A/MDXA/COMP1OUT

GPIO21/EQEP1B/MDRA/COMP2OUT

GPIO4/EPWM3A

GPIO5/EPWM3B/SPISIMOA/ECAP1

ADCINA7

ADCINA3

XRS

TRST

ADCINA6/COMP3A/AIO6

ADCINA5

ADCINA4/COMP2A/AIO4

ADCINA2/COMP1A/AIO2

ADCINA1

ADCINA0

VDDA

A. The PowerPAD is not connected to the ground on the die. To facilitate effective heat dissipation, the PowerPAD must be connected to

the ground plane of the PCB. It should not be left unconnected. For more details, see PowerPAD™ Thermally Enhanced Package.

Figure 6-2. 100-Pin PZ and PZP Packages (Top View)

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

Note

The PowerPAD™ should be soldered to the ground (GND) plane of the PCB because this will provide

the best thermal conduction path. For this device, the PowerPAD is not electrically shorted to the

internal die VSS; therefore, the PowerPAD does not provide an electrical connection to the PCB

ground. To make optimum use of the thermal efficiencies designed into the PowerPAD package, the

PCB must be designed with this technology in mind. A thermal land is required on the surface of

the PCB directly underneath the body of the PowerPAD. The thermal land should be soldered to the

exposed lead frame die pad of the PowerPad package; the thermal land should be as large as needed

to dissipate the required heat. An array of thermal vias should be used to connect the thermal pad to

the internal GND plane of the board. See PowerPAD™ Thermally Enhanced Package for more details

on using the PowerPAD package.

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TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

6.2 Signal Descriptions

Section 6.2.1 describes the signals. With the exception of the JTAG pins, the GPIO function is the default at

reset, unless otherwise mentioned. The peripheral signals that are listed under them are alternate functions.

Some peripheral functions may not be available in all devices. See Table 5-1 for details. Inputs are not 5-V

tolerant. All GPIO pins are I/O/Z and have an internal pullup (PU), which can be selectively enabled or disabled

on a per-pin basis. This feature only applies to the GPIO pins. The pullups on the PWM pins are not enabled at

reset. The pullups on other GPIO pins are enabled upon reset. The AIO pins do not have an internal pullup.

Note

When the on-chip voltage regulator (VREG) is used, the GPIO19, GPIO26–27, and GPIO34–38 pins

could glitch during power up. This potential glitch will finish before the boot mode pins are read and

will not affect boot behavior. If glitching is unacceptable in an application, 1.8 V could be supplied

externally. Alternatively, adding a current-limiting resistor (for example, 470 Ω) in series with these pins

and any external driver could be considered to limit the potential for degradation to the pin and/or

external circuitry. There is no power-sequencing requirement when using an external 1.8-V supply.

However, if the 3.3-V transistors in the level-shifting output buffers of the I/O pins are powered before

the 1.8-V transistors, it is possible for the output buffers to turn on, causing a glitch to occur on the pin

during power up. To avoid this behavior, power the VDD pins before or simultaneously with the VDDIO

pins, ensuring that the VDD pins have reached 0.7 V before the VDDIO pins reach 0.7 V.

6.2.1 Signal Descriptions

PIN NAME

PIN NO.

I/O/Z(1) DESCRIPTION

PZP

PFP

JTAG

TRST 12 10 I

JTAG test reset with internal pulldown (PD). TRST, when driven high, gives the scan

system control of the operations of the device. If this signal is not connected or driven

low, the device operates in its functional mode, and the test reset signals are ignored.

NOTE: TRST is an active-high test pin and must be maintained low at all times during

normal device operation. An external pulldown resistor is required on this pin. The

value of this resistor should be based on drive strength of the debugger pods applicable

to the design. A 2.2-kΩ resistor generally offers adequate protection. Because this is

application-specific, TI recommends validating each target board for proper operation of

the debugger and the application. (↓)

TCK See GPIO38 I See GPIO38. JTAG test clock with internal pullup. (↑)

TMS See GPIO36 I See GPIO36. JTAG test-mode select (TMS) with internal pullup. This serial control input

is clocked into the TAP controller on the rising edge of TCK. (↑)

TDI See GPIO35 I See GPIO35. JTAG test data input (TDI) with internal pullup. TDI is clocked into the

selected register (instruction or data) on a rising edge of TCK. (↑)

TDO See GPIO37 O/Z

See GPIO37. JTAG scan out, test data output (TDO). The contents of the selected

(8-mA drive)

FLASH

VDD3VFL 46 37 3.3-V Flash Core Power Pin. This pin should be connected to 3.3 V at all times.

TEST2 45 36 I/O Test Pin. Reserved for TI. Must be left unconnected.

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

TEXAS INSTRUMENTS

PIN NAME

PIN NO.

I/O/Z(1) DESCRIPTION

PZP

PFP

CLOCK

XCLKOUT See GPIO18 O/Z

See GPIO18. Output clock derived from SYSCLKOUT. XCLKOUT is either the same

frequency, one-half the frequency, or one-fourth the frequency of SYSCLKOUT. This

is controlled by bits 1:0 (XCLKOUTDIV) in the XCLK register. At reset, XCLKOUT =

SYSCLKOUT/4. The XCLKOUT signal can be turned off by setting XCLKOUTDIV to 3.

The mux control for GPIO18 must also be set to XCLKOUT for this signal to propogate

to the pin.

XCLKIN See GPIO19 and

GPIO38 I

See GPIO19 and GPIO38. External oscillator input. Pin source for the clock is

controlled by the XCLKINSEL bit in the XCLK register, GPIO38 is the default selection.

This pin feeds a clock from an external 3.3-V oscillator. In this case, the X1 pin, if

available, must be tied to GND and the on-chip crystal oscillator must be disabled

through bit 14 in the CLKCTL register. If a crystal or resonator is used, the XCLKIN

path must be disabled by bit 13 in the CLKCTL register.

NOTE: Designs that use the GPIO38/XCLKIN/TCK pin to supply an external clock

for normal device operation may need to incorporate some hooks to disable this path

during debug using the JTAG connector. This is to prevent contention with the TCK

signal, which is active during JTAG debug sessions. The zero-pin internal oscillators

may be used during this time to clock the device.

X1 60 48 I

On-chip 1.8-V crystal-oscillator input. To use this oscillator, a quartz crystal or a ceramic

resonator must be connected across X1 and X2. In this case, the XCLKIN path must be

disabled by bit 13 in the CLKCTL register. If this pin is not used, it must be tied to GND.

X2 59 47 O On-chip crystal-oscillator output. A quartz crystal or a ceramic resonator must be

connected across X1 and X2. If X2 is not used, it must be left unconnected.

RESET

XRS 11 9 I/OD

Device Reset (in) and Watchdog Reset (out). These devices have a built-in power-

on reset (POR) and brownout reset (BOR) circuitry. During a power-on or brownout

condition, this pin is driven low by the device. An external circuit may also drive this

pin to assert a device reset. This pin is also driven low by the MCU when a watchdog

reset occurs. During watchdog reset, the XRS pin is driven low for the watchdog

reset duration of 512 OSCCLK cycles. A resistor with a value from 2.2 kΩ to 10 kΩ

should be placed between XRS and VDDIO. If a capacitor is placed between XRS

and VSS for noise filtering, it should be 100 nF or smaller. These values will allow

the watchdog to properly drive the XRS pin to VOL within 512 OSCCLK cycles when

the watchdog reset is asserted. Regardless of the source, a device reset causes the

device to terminate execution. The program counter points to the address contained at

the location 0x3F FFC0. When reset is deactivated, execution begins at the location

designated by the program counter. The output buffer of this pin is an open-drain

device with an internal pullup. (↑) If this pin is driven by an external device, it should be

done using an open-drain device.

ADC, COMPARATOR, ANALOG I/O

ADCINA7 16 – I ADC Group A, Channel 7 input

ADCINA6

17 14

I ADC Group A, Channel 6 input

COMP3A I Comparator Input 3A

AIO6 I/O Digital AIO 6

ADCINA5 18 15 I ADC Group A, Channel 5 input

ADCINA4

19 16

I ADC Group A, Channel 4 input

COMP2A I Comparator Input 2A

AIO4 I/O Digital AIO 4

ADCINA3 20 – I ADC Group A, Channel 3 input

ADCINA2

21 17

I ADC Group A, Channel 2 input

COMP1A I Comparator Input 1A

AIO2 I/O Digital AIO 2

ADCINA1 22 18 I ADC Group A, Channel 1 input

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TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

TEXAS INSTRUMENTS

PIN NAME

PIN NO.

I/O/Z(1) DESCRIPTION

PZP

PFP

ADCINA0 23 19 I

ADC Group A, Channel 0 input.

NOTE: VREFHI and ADCINA0 share the same pin on the 80-pin PN and PFP devices

and their use is mutually exclusive to one another.

VREFHI 24 19

ADC External Reference High – only used when in ADC external reference mode. See

Section 8.9.2.1.

NOTE: VREFHI and ADCINA0 share the same pin on the 80-pin PN and PFP devices

and their use is mutually exclusive to one another.

ADCINB7 35 – I ADC Group B, Channel 7 input

ADCINB6

34 27

I ADC Group B, Channel 6 input

COMP3B I Comparator Input 3B

AIO14 I/O Digital AIO 14

ADCINB5 33 26 I ADC Group B, Channel 5 input

ADCINB4

32 25

I ADC Group B, Channel 4 input

COMP2B I Comparator Input 2B

AIO12 I/O Digital AIO12

ADCINB3 31 – I ADC Group B, Channel 3 input

ADCINB2

30 24

I ADC Group B, Channel 2 input

COMP1B I Comparator Input 1B

AIO10 I/O Digital AIO 10

ADCINB1 29 23 I ADC Group B, Channel 1 input

ADCINB0 28 22 I ADC Group B, Channel 0 input

VREFLO 27 21 ADC External Reference Low.

NOTE: VREFLO is always connected to VSSA on the 80-pin PN and PFP devices.

CPU AND I/O POWER

VDDA 25 20 Analog Power Pin. Tie with a 2.2-μF capacitor (typical) close to the pin.

VSSA 26 21 Analog Ground Pin.

NOTE: VREFLO is always connected to VSSA on the 80-pin PN and PFP devices.

VDD

3 2

CPU and Logic Digital Power Pins. When using internal VREG, place one 1.2-µF

capacitor between each VDD pin and ground. Higher value capacitors may be used.

14 12

37 29

63 51

81 65

91 72

VDDIO

5 4

Digital I/O Buffers Power Pin. Single supply source when VREG is enabled. Place a

decoupling capacitor on each pin. The exact value should be determined by the system

voltage regulation solution.

13 11

38 30

61 49

79 63

93 74

VSS

4 3

Digital Ground Pins

15 13

36 28

47 38

62 50

80 64

92 73

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

TEXAS INSTRUMENTS

PIN NAME

PIN NO.

I/O/Z(1) DESCRIPTION

PZP

PFP

VOLTAGE REGULATOR CONTROL SIGNAL

VREGENZ 90 71 I

Internal voltage regulator (VREG) enable with internal pulldown. Tie directly to VSS

(low) to enable the internal 1.8-V VREG. Tie directly to VDDIO (high) to disable the

VREG and use an external 1.8-V supply.

GPIO AND PERIPHERAL SIGNALS (2)

GPIO0

87 69

I/O/Z General-purpose input/output 0

EPWM1A O Enhanced PWM1 Output A and HRPWM channel

Reserved – Reserved

GPIO1

86 68

I/O/Z General-purpose input/output 1

EPWM1B O Enhanced PWM1 Output B

Reserved – Reserved

COMP1OUT O Direct output of Comparator 1

GPIO2

84 67

I/O/Z General-purpose input/output 2

EPWM2A O Enhanced PWM2 Output A and HRPWM channel

Reserved – Reserved

GPIO3

83 66

I/O/Z General-purpose input/output 3

EPWM2B O Enhanced PWM2 Output B

SPISOMIA I/O SPI-A slave out, master in

COMP2OUT O Direct output of Comparator 2

GPIO4

9 7

I/O/Z General-purpose input/output 4

EPWM3A O Enhanced PWM3 output A and HRPWM channel

Reserved – Reserved

GPIO5

10 8

I/O/Z General-purpose input/output 5

EPWM3B O Enhanced PWM3 output B

SPISIMOA I/O SPI-A slave in, master out

ECAP1 I/O Enhanced Capture input/output 1

GPIO6

58 46

I/O/Z General-purpose input/output 6

EPWM4A O Enhanced PWM4 output A and HRPWM channel

EPWMSYNCI I External ePWM sync pulse input

EPWMSYNCO O External ePWM sync pulse output

GPIO7

57 45

I/O/Z General-purpose input/output 7

EPWM4B O Enhanced PWM4 output B

SCIRXDA I SCI-A receive data

ECAP2 I/O Enhanced Capture input/output 2

GPIO8

54 43

I/O/Z General-purpose input/output 8

EPWM5A O Enhanced PWM5 output A and HRPWM channel

Reserved – Reserved

ADCSOCAO O ADC start-of-conversion A

GPIO9

49 39

I/O/Z General-purpose input/output 9

EPWM5B O Enhanced PWM5 output B

SCITXDB O SCI-B transmit data

ECAP3 I/O Enhanced Capture input/output 3

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TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

PIN NAME

PIN NO.

I/O/Z(1) DESCRIPTION

PZP

PFP

GPIO10

74 60

I/O/Z General-purpose input/output 10

EPWM6A O Enhanced PWM6 output A and HRPWM channel

Reserved – Reserved

ADCSOCBO O ADC start-of-conversion B

GPIO11

73 59

I/O/Z General-purpose input/output 11

EPWM6B O Enhanced PWM6 output B

SCIRXDB I SCI-B receive data

ECAP1 I/O Enhanced Capture input/output 1

GPIO12

44 35

I/O/Z General-purpose input/output 12

TZ1 I Trip Zone input 1

SCITXDA O SCI-A transmit data

SPISIMOB I/O SPI-B slave in, master out

GPIO13

95 75

I/O/Z General-purpose input/output 13

TZ2 I Trip Zone input 2

Reserved – Reserved

SPISOMIB I/O SPI-B slave out, master in

GPIO14

96 76

I/O/Z General-purpose input/output 14

TZ3 I Trip zone input 3

SCITXDB O SCI-B transmit data

SPICLKB I/O SPI-B clock input/output

GPIO15

88 70

I/O/Z General-purpose input/output 15

ECAP2 I/O Enhanced Capture input/output 2

SCIRXDB I SCI-B receive data

SPISTEB I/O SPI-B slave transmit enable input/output

GPIO16

55 44

I/O/Z General-purpose input/output 16

SPISIMOA I/O SPI-A slave in, master out

Reserved – Reserved

TZ2 I Trip Zone input 2

GPIO17

52 42

I/O/Z General-purpose input/output 17

SPISOMIA I/O SPI-A slave out, master in

Reserved – Reserved

TZ3 I Trip zone input 3

GPIO18

51 41

I/O/Z General-purpose input/output 18

SPICLKA I/O SPI-A clock input/output

SCITXDB O SCI-B transmit data

XCLKOUT O/Z

Output clock derived from SYSCLKOUT. XCLKOUT is either the same frequency, one-

half the frequency, or one-fourth the frequency of SYSCLKOUT. This is controlled by

bits 1:0 (XCLKOUTDIV) in the XCLK register. At reset, XCLKOUT = SYSCLKOUT/4.

The XCLKOUT signal can be turned off by setting XCLKOUTDIV to 3. The mux control

for GPIO18 must also be set to XCLKOUT for this signal to propogate to the pin.

GPIO19

64 52

I/O/Z General-purpose input/output 19

XCLKIN I

External Oscillator Input. The path from this pin to the clock block is not gated by the

mux function of this pin. Care must be taken not to enable this path for clocking if it is

being used for the other peripheral functions.

SPISTEA I/O SPI-A slave transmit enable input/output

SCIRXDB I SCI-B receive data

ECAP1 I/O Enhanced Capture input/output 1

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

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TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

PIN NAME

PIN NO.

I/O/Z(1) DESCRIPTION

PZP

PFP

GPIO20

6 5

I/O/Z General-purpose input/output 20

EQEP1A I Enhanced QEP1 input A

MDXA O McBSP transmit serial data

COMP1OUT O Direct output of Comparator 1

GPIO21

7 6

I/O/Z General-purpose input/output 21

EQEP1B I Enhanced QEP1 input B

MDRA I McBSP receive serial data

COMP2OUT O Direct output of Comparator 2

GPIO22

98 78

I/O/Z General-purpose input/output 22

EQEP1S I/O Enhanced QEP1 strobe

MCLKXA I/O McBSP transmit clock

SCITXDB O SCI-B transmit data

GPIO23

2 1

I/O/Z General-purpose input/output 23

EQEP1I I/O Enhanced QEP1 index

MFSXA I/O McBSP transmit frame synch

SCIRXDB I SCI-B receive data

GPIO24

97 77

I/O/Z General-purpose input/output 24

ECAP1 I/O Enhanced Capture input/output 1

EQEP2A I Enhanced QEP2 input A.

NOTE: eQEP2 is available only in the PZ and PZP packages.

SPISIMOB I/O SPI-B slave in, master out

GPIO25

39 31

I/O/Z General-purpose input/output 25

ECAP2 I/O Enhanced Capture input/output 2

EQEP2B I Enhanced QEP2 input B.

NOTE: eQEP2 is available only in the PZ and PZP packages.

SPISOMIB I/O SPI-B slave out, master in

GPIO26

78 62

I/O/Z General-purpose input/output 26

ECAP3 I/O Enhanced Capture input/output 3

EQEP2I I/O Enhanced QEP2 index.

NOTE: eQEP2 is available only in the PZ and PZP packages.

SPICLKB I/O SPI-B clock input/output

USB0DP(3) I/O Positive Differential half of USB signal. To enable USB functionality on this pin, set the

USBIOEN bit in the GPACTRL2 register.

GPIO27

77 61

I/O/Z General-purpose input/output 27

HRCAP2 I High-Resolution Input Capture 2

EQEP2S I/O Enhanced QEP2 strobe.

NOTE: eQEP2 is available only in the PZ and PZP packages.

SPISTEB I/O SPI-B slave transmit enable input/output

USB0DM(3) I/O Negative Differential half of USB signal. To enable USB functionality on this pin, set the

USBIOEN bit in the GPACTRL2 register.

GPIO28

50 40

I/O/Z General-purpose input/output 28

SCIRXDA I SCI-A receive data

SDAA I/OD I2C data open-drain bidirectional port

TZ2 I Trip zone input 2

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TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

PIN NAME

PIN NO.

I/O/Z(1) DESCRIPTION

PZP

PFP

GPIO29

43 34

I/O/Z General-purpose input/output 29

SCITXDA O SCI-A transmit data

SCLA I/OD I2C clock open-drain bidirectional port

TZ3 I Trip zone input 3

GPIO30

41 33

I/O/Z General-purpose input/output 30

CANRXA I CAN receive

EQEP2I I/O Enhanced QEP2 index.

NOTE: eQEP2 is available only in the PZ and PZP packages.

EPWM7A O Enhanced PWM7 Output A and HRPWM channel

GPIO31

40 32

I/O/Z General-purpose input/output 31

CANTXA O CAN transmit

EQEP2S I/O Enhanced QEP2 strobe.

NOTE: eQEP2 is available only in the PZ and PZP packages.

EPWM8A O Enhanced PWM8 Output A and HRPWM channel

GPIO32

99 79

I/O/Z General-purpose input/output 32

SDAA I/OD I2C data open-drain bidirectional port

EPWMSYNCI I Enhanced PWM external sync pulse input

ADCSOCAO O ADC start-of-conversion A

GPIO33

100 80

I/O/Z General-purpose input/output 33

SCLA I/OD I2C clock open-drain bidirectional port

EPWMSYNCO O Enhanced PWM external synch pulse output

ADCSOCBO O ADC start-of-conversion B

GPIO34

68 55

I/O/Z General-purpose input/output 34

COMP2OUT O Direct output of Comparator 2

Reserved – Reserved

COMP3OUT O Direct output of Comparator 3

GPIO35

71 57

I/O/Z General-purpose input/output 35

TDI I JTAG test data input (TDI) with internal pullup. TDI is clocked into the selected register

(instruction or data) on a rising edge of TCK.

Reserved – Reserved

GPIO36

72 58

I/O/Z General-purpose input/output 36

TMS I JTAG test-mode select (TMS) with internal pullup. This serial control input is clocked

into the TAP controller on the rising edge of TCK.

Reserved – Reserved

GPIO37

70 56

I/O/Z General-purpose input/output 37

TDO O/Z JTAG scan out, test data output (TDO). The contents of the selected register

(instruction or data) are shifted out of TDO on the falling edge of TCK (8 mA drive).

Reserved – Reserved

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

PIN NAME

PIN NO.

I/O/Z(1) DESCRIPTION

PZP

PFP

GPIO38

67 54

I/O/Z General-purpose input/output 38

XCLKIN I

External Oscillator Input. The path from this pin to the clock block is not gated by the

mux function of this pin. Care must be taken to not enable this path for clocking if it is

being used for the other functions.

TCK I JTAG test clock with internal pullup

Reserved – Reserved

GPIO39

66 53

I/O/Z General-purpose input/output 39

Reserved – Reserved

GPIO40

82 –

I/O/Z General-purpose input/output 40

EPWM7A O Enhanced PWM7 output A and HRPWM channel

SCITXDB O SCI-B transmit data

Reserved – Reserved

GPIO41

76 –

I/O/Z General-purpose input/output 41

EPWM7B O Enhanced PWM7 output B

SCIRXDB I SCI-B receive data

Reserved – Reserved

GPIO42

1 –

I/O/Z General-purpose input/output 42

EPWM8A O Enhanced PWM8 output A and HRPWM channel

TZ1 I Trip zone input 1

COMP1OUT O Direct output of Comparator 1

GPIO43

8 –

I/O/Z General-purpose input/output 43

EPWM8B O Enhanced PWM8 output B

TZ2 I Trip zone input 2

COMP2OUT O Direct output of Comparator 2

GPIO44

56 –

I/O/Z General-purpose input/output 44

MFSRA I/O McBSP receive frame synch

SCIRXDB I SCI-B receive data

EPWM7B O Enhanced PWM7 output B

GPIO50

42 –

I/O/Z General-purpose input/output 50

EQEP1A I Enhanced QEP1 input A

MDXA O McBSP transmit serial data

TZ1 I Trip zone input 1

GPIO51

48 –

I/O/Z General-purpose input/output 51

EQEP1B I Enhanced QEP1 input B

MDRA I McBSP receive serial data

TZ2 I Trip zone input 2

GPIO52

53 –

I/O/Z General-purpose input/output 52

EQEP1S I/O Enhanced QEP1 strobe

MCLKXA I/O McBSP transmit clock

TZ3 I Trip zone input 3

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TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

PIN NAME

PIN NO.

I/O/Z(1) DESCRIPTION

PZP

PFP

GPIO53

65 –

I/O/Z General-purpose input/output 53

EQEP1I I/O Enhanced QEP1 index

MFSXA I/O McBSP transmit frame synch

Reserved – Reserved

GPIO54

69 –

I/O/Z General-purpose input/output 54

SPISIMOA I/O SPI-A slave in, master out

EQEP2A I Enhanced QEP2 input A

HRCAP1 I High-Resolution Input Capture 1

GPIO55

75 –

I/O/Z General-purpose input/output 55

SPISOMIA I/O SPI-A slave out, master in

EQEP2B I Enhanced QEP2 input B

HRCAP2 I High-Resolution Input Capture 2

GPIO56

85 –

I/O/Z General-purpose input/output 56

SPICLKA I/O SPI-A clock input/output

EQEP2I I/O Enhanced QEP2 index

HRCAP3 I High-Resolution Input Capture 3

GPIO57

89 –

I/O/Z General-purpose input/output 57

SPISTEA I/O SPI-A slave transmit enable input/output

EQEP2S I/O Enhanced QEP2 strobe

HRCAP4 I High-Resolution Input Capture 4

GPIO58

94 –

I/O/Z General-purpose input/output 58

MCLKRA I/O McBSP receive clock

SCITXDB O SCI-B transmit data

EPWM7A O Enhanced PWM7 output A and HRPWM channel

(1) I = Input, O = Output, Z = High Impedance, OD = Open Drain, ↑ = Pullup, ↓ = Pulldown

(2) The GPIO function (shown in bold italics) is the default at reset. The peripheral signals that are listed under them are alternate

functions. For JTAG pins that have the GPIO functionality multiplexed, the input path to the GPIO block is always valid. The output

path from the GPIO block and the path to the JTAG block from a pin is enabled or disabled based on the condition of the TRST signal.

See the Systems Control and Interrupts chapter of the TMS320x2806x Technical Reference Manual .

(3) Depending on your USB application, additional pins may be required to maintain compliance with the USB 2.0 Specification. For more

information, see the Universal Serial Bus (USB) Controller chapter of the TMS320x2806x Technical Reference Manual .

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

7 Specifications

7.1 Absolute Maximum Ratings

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.

These are stress ratings only, and functional operation of the device at these or any other conditions

beyond those indicated under the Recommended Operating Conditions is not implied. Exposure to absolute-

maximumrated conditions for extended periods may affect device reliability. All voltage values are with respect to

VSS, unless otherwise noted.

over operating free-air temperature range (unless otherwise noted)

MIN MAX UNIT

Supply voltage VDDIO (I/O and Flash) with respect to VSS –0.3 4.6 V

VDD with respect to VSS –0.3 2.5

Analog voltage VDDA with respect to VSSA –0.3 4.6 V

Input voltage VIN (3.3 V) –0.3 4.6 V

VIN (X1) –0.3 2.5

Output voltage VO–0.3 4.6 V

Input clamp current

Digital input (per pin), IIK (VIN < VSS or VIN > VDDIO)(1) –20 20

Analog input (per pin), IIKANALOG

(VIN < VSSA or VIN > VDDA)–20 20

Total for all inputs, IIKTOTAL

(VIN < VSS/VSSA or VIN > VDDIO/VDDA)–20 20

Output clamp current IOK (VO < 0 or VO > VDDIO) –20 20 mA

Junction temperature(2) TJ–40 150 °C

Storage temperature(2) Tstg –65 150 °C

(1) Continuous clamp current per pin is ±2 mA.

(2) Long-term high-temperature storage or extended use at maximum temperature conditions may result in a reduction of overall device

life. For additional information, see Semiconductor and IC Package Thermal Metrics.

www.ti.com

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

7.2 ESD Ratings – Commercial

VALUE UNIT

TMS320F2806x, TMS320F2806xM, TMS320F2806xF, and TMS320F2806xU in 100-pin PZ package

V(ESD) Electrostatic discharge (ESD)

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000

Charged-device model (CDM), per JEDEC specification JESD22-

C101 or ANSI/ESDA/JEDEC JS-002(2)

±500

TMS320F2806x, TMS320F2806xM, TMS320F2806xF, and TMS320F2806xU in 80-pin PN package

V(ESD) Electrostatic discharge (ESD)

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000

Charged-device model (CDM), per JEDEC specification JESD22-

C101 or ANSI/ESDA/JEDEC JS-002(2)

±500

TMS320F2806x and TMS320F2806xU in 100-pin PZP package

V(ESD) Electrostatic discharge (ESD)

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000

Charged-device model (CDM), per JEDEC specification JESD22-

C101 or ANSI/ESDA/JEDEC JS-002(2)

±500

TMS320F2806x and TMS320F2806xU in 80-pin PFP package

V(ESD) Electrostatic discharge (ESD)

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000

Charged-device model (CDM), per JEDEC specification JESD22-

C101 or ANSI/ESDA/JEDEC JS-002(2)

±500

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 ESD Ratings – Automotive

VALUE UNIT

TMS320F2806x-Q1, TMS320F2806xM-Q1, TMS320F2806xF-Q1 in 100-pin PZP package

V(ESD) Electrostatic discharge

Human body model (HBM), per

AEC Q100-002(1)

All pins ±2000

VCharged device model (CDM),

per AEC Q100-011

All pins ±500

Corner pins on 100-pin PZP:

1, 25, 26, 50, 51, 75, 76, 100

±750

TMS320F2806x-Q1, TMS320F2806xM-Q1, TMS320F2806xF-Q1 in 80-pin PFP packages

V(ESD) Electrostatic discharge

Human body model (HBM), per

AEC Q100-002(1)

All pins ±2000

VCharged device model (CDM),

per AEC Q100-011

All pins ±500

Corner pins on 80-pin PFP:

1, 20, 21, 40, 41, 60, 61, 80

±750

(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

7.4 Recommended Operating Conditions

MIN NOM MAX UNIT

Device supply voltage, I/O, VDDIO 2.97 3.3 3.63 V

Device supply voltage CPU, VDD (When internal VREG is

disabled and 1.8 V is supplied externally)

1.71 1.8 1.995 V

Supply ground, VSS 0 V

Analog supply voltage, VDDA 2.97 3.3 3.63 V

Analog ground, VSSA 0 V

Device clock frequency (system clock) 2 90 MHz

High-level input voltage, VIH (3.3 V) 2 VDDIO + 0.3 V

Low-level input voltage, VIL (3.3 V) VSS – 0.3 0.8 V

High-level output source current, VOH = VOH(MIN) , IOH All GPIO/AIO pins –4 mA

Group 2(1) –8

Low-level output sink current, VOL = VOL(MAX), IOL All GPIO/AIO pins 4 mA

Group 2(1) 8

Junction temperature, TJT version –40 105 °C

S version –40 125

Ambient temperature, TAQ version(2)

(AEC Q100 qualification)

–40 125 °C

(1) Group 2 pins are as follows: GPIO16, GPIO17, GPIO18, GPIO19, GPIO28, GPIO29, GPIO36, GPIO37.

(2) The Q temperature option is not available on the 2806xU devices.

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TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

7.5 Power Consumption Summary

7.5.1 TMS320F2806x Current Consumption at 90-MHz SYSCLKOUT

MODE TEST CONDITIONS

VREG ENABLED VREG DISABLED

IDDIO (1) IDDA (2) IDD3VFL IDD IDDIO (1) IDDA (2) IDD3VFL

TYP(3) MAX TYP(3) MAX TYP(3) MAX TYP(3) MAX TYP(3) MAX TYP(3) MAX TYP(3) MAX

Operational

(Flash)

The following

peripheral clocks are

enabled:

• ePWM1, ePWM2,

ePWM3, ePWM4,

ePWM5, ePWM6,

ePWM7, ePWM8

• eCAP1, eCAP2,

eCAP3

• eQEP1, eQEP2

• eCAN

• CLA

• HRPWM

• SCI-A, SCI-B

• SPI-A, SPI-B

• ADC

• I2C

• COMP1, COMP2,

COMP3

• CPU-TIMER0,

CPU-TIMER1,

CPU-TIMER2

• McBSP

• USB

All PWM pins are

toggled at 90 kHz.

All I/O pins are left

unconnected.(4) (6)

Code is running out of

flash with 3 wait states.

XCLKOUT is turned off.

185 mA(7) 245 mA(7) 16 mA 22 mA 35 mA 40 mA 165 mA(7) 220 mA(7) 15 mA 20 mA 16 mA 22 mA 35 mA 40 mA

IDLE

Flash is powered down.

XCLKOUT is turned off.

All peripheral clocks

are turned off.

22 mA 27 mA 15 µA 25 µA 5 µA 10 µA 21 mA 26 mA 120 µA 400 µA 15 µA 25 µA 5 µA 10 µA

STANDBY

Flash is powered down.

Peripheral clocks are

off.

9 mA 11 mA 15 µA 25 µA 5 µA 10 µA 8 mA 10 mA 120 µA 400 µA 15 µA 25 µA 5 µA 10 µA

HALT

Flash is powered down.

Peripheral clocks are

off.

Input clock is disabled.

(5)

75 µA 15 µA 25 µA 5 µA 10 µA 25 µA(8) 40 µA 15 µA 25 µA 5 µA 10 µA

(1) IDDIO current is dependent on the electrical loading on the I/O pins.

(2) To realize the IDDA currents shown for IDLE, STANDBY, and HALT, clock to the ADC module must be turned off explicitly by writing to

the PCLKCR0 register.

(3) The TYP numbers are applicable over room temperature and nominal voltage.

(4) The following is done in a loop:

• Data is continuously transmitted out of SPI-A, SPI-B, SCI-A, eCAN-A, McBSP-A, and I2C ports.

• The hardware multiplier is exercised.

• Watchdog is reset.

• ADC is performing continuous conversion.

• COMP1 and COMP2 are continuously switching voltages.

• GPIO17 is toggled.

(5) If a quartz crystal or ceramic resonator is used as the clock source, the HALT mode shuts down the on-chip crystal oscillator.

(6) CLA is continuously performing polynomial calculations.

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

(7) For F2806x devices that do not have CLA, subtract the IDD current number for CLA (see Table 7-1) from the IDD (VREG disabled)/IDDIO

(VREG enabled) current numbers listed in Section 7.5.1 for operational mode.

(8) To realize the IDD number shown for HALT mode, the following must be done:

• PLL2 must be shut down by clearing bit 2 of the PLLCTL register.

• A value of 0x00FF must be written to the HRCAL register at address 0x6822.

Note

The peripheral - I/O multiplexing implemented in the device prevents all available peripherals from

being used at the same time. This is because more than one peripheral function may share an I/O

pin. It is, however, possible to turn on the clocks to all the peripherals at the same time, although such

a configuration is not useful. If this is done, the current drawn by the device will be more than the

numbers specified in the current consumption tables.

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TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

7.5.2 Reducing Current Consumption

The 2806x devices incorporate a method to reduce the device current consumption. Because each peripheral

unit has an individual clock-enable bit, significant reduction in current consumption can be achieved by turning

off the clock to any peripheral module that is not used in a given application. Furthermore, any one of the

three low-power modes could be taken advantage of to reduce the current consumption even further. Table 7-1

indicates the typical reduction in current consumption achieved by turning off the clocks.

Table 7-1. Typical Current Consumption by Various

Peripherals (at 90 MHz)

PERIPHERAL

MODULE(1) (3)

IDD CURRENT

REDUCTION (mA)

ADC 2(2)

I2C 3

ePWM 2

eCAP 2

eQEP 2

SCI 2

SPI 2

COMP/DAC 1

HRPWM 3

HRCAP 3

USB 12

CPU-TIMER 1

Internal zero-pin oscillator 0.5

CAN 2.5

CLA 20

McBSP 6

(1) All peripheral clocks (except CPU Timer clock) are disabled

upon reset. Writing to or reading from peripheral registers is

possible only after the peripheral clocks are turned on.

(2) This number represents the current drawn by the digital portion

of the ADC module. Turning off the clock to the ADC module

results in the elimination of the current drawn by the analog

portion of the ADC (IDDA) as well.

(3) For peripherals with multiple instances, the current quoted is per

module. For example, the 2 mA value quoted for ePWM is for

one ePWM module.

Note

IDDIO current consumption is reduced by 15 mA (typical) when XCLKOUT is turned off.

Note

The baseline IDD current (current when the core is executing a dummy loop with no peripherals

enabled) is 40 mA, typical. To arrive at the IDD current for a given application, the current-drawn by the

peripherals (enabled by that application) must be added to the baseline IDD current.

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

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TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

l TEXAS INSTRUMENTS 250 5 svscu

Following are other methods to reduce power consumption further:

• The flash module may be powered down if code is run off SARAM. This results in a current reduction of 18

mA (typical) in the VDD rail and 13 mA (typical) in the VDDIO rail.

• Savings in IDDIO may be realized by disabling the pullups on pins that assume an output function.

• To realize the lowest VDDA current consumption in a low-power mode, see the respective analog chapter of

the TMS320x2806x Technical Reference Manual to ensure each module is powered down as well.

• Power savings can be achieved by powering down the flash. This must be done by code running off RAM

(not flash).

7.5.3 Current Consumption Graphs (VREG Enabled)

100

150

200

250

10 20 30 40 50 60 70 80 90

Operational Current (mA)

SYSCLKOUT (MHz)

IDDIO

IDDA

IDD3VFL

Total

Figure 7-1. Typical Operational Current (Flash) Versus Frequency (Internal VREG)

100

200

300

400

500

600

700

800

900

10 20 30 40 50 60 70 80 90

Operational Power (mW)

SYSCLKOUT (MHz)

Figure 7-2. Typical Operational Power Versus Frequency (Internal VREG)

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TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

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I TEXAS INSTRUMENTS

7.6 Electrical Characteristics

over recommended operating conditions (unless otherwise noted)(1)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

VOH High-level output voltage IOH = IOH MAX 2.4 V

IOH = 50 μA VDDIO – 0.2

VOL Low-level output voltage IOL = IOL MAX 0.4 V

IIL

Input current

(low level)

Pin with pullup

enabled VDDIO = 3.3 V, VIN = 0 V All GPIO –80 –140 –205

μA

XRS pin –230 –300 –375

Pin with pulldown

enabled VDDIO = 3.3 V, VIN = 0 V ±2

IIH

Input current

(high level)

Pin with pullup

enabled VDDIO = 3.3 V, VIN = VDDIO ±2

μA

Pin with pulldown

enabled VDDIO = 3.3 V, VIN = VDDIO 28 50 80

IOZ

Output current, pullup or pulldown

disabled VO = VDDIO or 0 V ±2 μA

CIInput capacitance 2 pF

VDDIO BOR trip point Falling VDDIO 2.50 2.78 2.96 V

VDDIO BOR hysteresis 35 mV

Supervisor reset release delay

time

Time after BOR/POR/OVR event is removed to XRS

release 400 800 μs

VREG VDD output Internal VREG on 1.9 V

(1) When the on-chip VREG is used, its output is monitored by the POR/BOR circuit, which will reset the device should the core voltage

(VDD) go out of range.

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

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TMS320F28062 TMS320F28062F

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7.7 Thermal Resistance Characteristics

7.7.1 PFP PowerPAD Package

°C/W(1) AIR FLOW (lfm)(2)

RΘJC Junction-to-case thermal resistance 9.4 0

RΘJB Junction-to-board thermal resistance 4.6 0

RΘJA

(High k PCB) Junction-to-free air thermal resistance

25.8 0

16.3 150

15.2 250

13.6 500

PsiJT Junction-to-package top

0.3 0

0.4 150

0.4 250

0.5 500

PsiJB Junction-to-board

4.6 0

4.4 150

4.3 250

4.3 500

(1) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on

a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these

EIA/JEDEC standards:

• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)

• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

(2) lfm = linear feet per minute

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TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

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TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

7.7.2 PZP PowerPAD Package

°C/W(1) AIR FLOW (lfm)(2)

RΘJC Junction-to-case thermal resistance 9.4 0

RΘJB Junction-to-board thermal resistance 4.4 0

RΘJA

(High k PCB) Junction-to-free air thermal resistance

24.4 0

15.1 150

13.9 250

12.4 500

PsiJT Junction-to-package top

0.3 0

0.4 150

0.4 250

0.5 500

PsiJB Junction-to-board

4.5 0

4.2 150

4.2 250

4.2 500

(1) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on

a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these

EIA/JEDEC standards:

• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)

• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

(2) lfm = linear feet per minute

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

7.7.3 PN Package

°C/W(1) AIR FLOW (lfm)(2)

RΘJC Junction-to-case thermal resistance 7.9 0

RΘJB Junction-to-board thermal resistance 15.6 0

RΘJA

(High k PCB) Junction-to-free air thermal resistance

41.1 0

31.2 150

29.7 250

27.5 500

PsiJT Junction-to-package top

0.4 0

0.6 150

0.7 250

0.9 500

PsiJB Junction-to-board

15.3 0

14.6 150

14.4 250

14.1 500

(1) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on

a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these

EIA/JEDEC standards:

• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)

• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

(2) lfm = linear feet per minute

7.7.4 PZ Package

°C/W(1) AIR FLOW (lfm)(2)

RΘJC Junction-to-case thermal resistance 7.2 0

RΘJB Junction-to-board thermal resistance 19.6 0

RΘJA

(High k PCB) Junction-to-free air thermal resistance

42.2 0

32.4 150

30.9 250

28.7 500

PsiJT Junction-to-package top

0.4 0

0.6 150

0.7 250

0.9 500

PsiJB Junction-to-board

19.1 0

18.2 150

17.9 250

14.1 500

(1) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on

a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these

EIA/JEDEC standards:

• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)

• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

(2) lfm = linear feet per minute

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TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

w TEXAS INSTRUMENTS

7.8 Thermal Design Considerations

Based on the end application design and operational profile, the IDD and IDDIO currents could vary. Systems

that exceed the recommended maximum power dissipation in the end product may require additional thermal

enhancements. Ambient temperature (TA) varies with the end application and product design. The critical factor

that affects reliability and functionality is TJ, the junction temperature, not the ambient temperature. Hence, care

should be taken to keep TJ within the specified limits. Tcase should be measured to estimate the operating

junction temperature TJ. Tcase is normally measured at the center of the package top-side surface. The thermal

application report Semiconductor and IC Package Thermal Metrics helps to understand the thermal metrics and

definitions.

7.9 Debug Probe Connection Without Signal Buffering for the MCU

Figure 7-3 shows the connection between the MCU and JTAG header for a single-processor configuration. If the

distance between the JTAG header and the MCU is greater than 6 inches, the debug signals must be buffered.

If the distance is less than 6 inches, buffering is typically not needed. Figure 7-3 shows the simpler, no-buffering

situation. For the pullup and pulldown resistor values, see Section 6.2.

TRST

TMS

TDI

TDO

TCK

VDDIO

MCU

EMU0

EMU1

TRST

TMS

TDI

TDO

TCK

TCK_RET

6 inches or less

GND

JTAG Header

VDDIO

A. See Figure 8-54 for JTAG/GPIO multiplexing.

Figure 7-3. Debug Probe Connection Without Signal Buffering for the MCU

Note

The 2806x devices do not have EMU0/EMU1 pins. For designs that have a JTAG Header onboard,

the EMU0/EMU1 pins on the header must be tied to VDDIO through a 4.7-kΩ (typical) resistor.

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

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TMS320F28062 TMS320F28062F

{5‘ TEXAS INSTRUMENTS II

7.10 Parameter Information

7.10.1 Timing Parameter Symbology

Timing parameter symbols used are created in accordance with JEDEC Standard 100. To shorten the symbols,

some of the pin names and other related terminology have been abbreviated as follows:

LOWERCASE SUBSCRIPTS AND THEIR MEANINGS: LETTERS AND SYMBOLS AND THEIR MEANINGS:

a access time H High

c cycle time (period) L Low

d delay time V Valid

f fall time X Unknown, changing, or don't care level

h hold time Z High impedance

r rise time

su setup time

t transition time

v valid time

w pulse duration (width)

7.10.2 General Notes on Timing Parameters

All output signals from the 28x devices (including XCLKOUT) are derived from an internal clock such that all

output transitions for a given half-cycle occur with a minimum of skewing relative to each other.

The signal combinations shown in the following timing diagrams may not necessarily represent actual cycles. For

actual cycle examples, see the appropriate cycle description section of this document.

7.11 Test Load Circuit

This test load circuit is used to measure all switching characteristics provided in this document.

Transmission Line

4.0 pF 1.85 pF

Z0 = 50 W(A)

Tester Pin Electronics Data Sheet Timing Reference Point

Output

Under

Test

42 W3.5 nH

Device Pin(B)

A. Input requirements in this data sheet are tested with an input slew rate of < 4 Volts per nanosecond (4 V/ns) at the device pin.

B. The data sheet provides timing at the device pin. For output timing analysis, the tester pin electronics and its transmission line effects

must be taken into account. A transmission line with a delay of 2 ns or longer can be used to produce the desired transmission line

effect. The transmission line is intended as a load only. It is not necessary to add or subtract the transmission line delay (2 ns or longer)

from the data sheet timing.

Figure 7-4. 3.3-V Test Load Circuit

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TMS320F28062, TMS320F28062F

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TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS eeeeeeeeeeeeeeeeee

7.12 Power Sequencing

There is no power sequencing requirement needed to ensure the device is in the proper state after reset or to

prevent the I/Os from glitching during power up or power down (GPIO19, GPIO26–27, GPIO34–38 do not have

glitch-free I/Os). No voltage larger than a diode drop (0.7 V) above VDDIO should be applied to any digital pin

(for analog pins, this value is 0.7 V above VDDA) before powering up the device. Voltages applied to pins on an

unpowered device can bias internal p-n junctions in unintended ways and produce unpredictable results.

tw(RSL1)

th(boot-mode)(C)

V V

(3.3 V)

DDIO DDA

INTOSC1

X1/X2

XRS(D)

Boot-Mode

Pins

V (1.8 V)

XCLKOUT

User-code dependent

Boot-ROM execution starts Peripheral/GPIO function

Based on boot code

GPIO pins as input

tOSCST

Address/Data/

Control

(Internal)

Address/data valid, internal boot-ROM code execution phase

User-code execution phase

td(EX)

tINTOSCST

(A)

(B)

I/O Pins GPIO pins as input [state depends on internal pullup/pulldown (PU/PD)]

User-code dependent

(E)

A. Upon power up, SYSCLKOUT is OSCCLK/4. Because the XCLKOUTDIV bits in the XCLK register come up with a reset state of 0,

SYSCLKOUT is further divided by 4 before it appears at XCLKOUT. XCLKOUT = OSCCLK/16 during this phase.

B. Boot ROM configures the DIVSEL bits for /1 operation. XCLKOUT = OSCCLK/4 during this phase. XCLKOUT will not be visible at the

pin until explicitly configured by user code.

C. After reset, the boot ROM code samples Boot Mode pins. Based on the status of the Boot Mode pin, the boot code branches to

destination memory or boot code function. If boot ROM code executes after power-on conditions (in debugger environment), the boot

code execution time is based on the current SYSCLKOUT speed. The SYSCLKOUT will be based on user environment and could be

with or without PLL enabled.

D. Using the XRS pin is optional due to the on-chip POR circuitry.

E. The internal pullup or pulldown will take effect when BOR is driven high.

Figure 7-5. Power-on Reset

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

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Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

7.12.1 Reset ( XRS) Timing Requirements

MIN MAX UNIT

th(boot-mode) Hold time for boot-mode pins 1000tc(SCO) cycles

tw(RSL2) Pulse duration, XRS low on warm reset 32tc(OSCCLK) cycles

7.12.2 Reset ( XRS) Switching Characteristics

over recommended operating conditions (unless otherwise noted)

PARAMETER MIN TYP MAX UNIT

tw(RSL1) Pulse duration, XRS driven by device 600 μs

tw(WDRS) Pulse duration, reset pulse generated by watchdog 512tc(OSCCLK) cycles

td(EX) Delay time, address/data valid after XRS high 32tc(OSCCLK) cycles

tINTOSCST Start-up time, internal zero-pin oscillator 3 μs

tOSCST (1) On-chip crystal-oscillator start-up time 1 10 ms

(1) Dependent on crystal/resonator and board design.

th(boot-mode)(A)

tw(RSL2)

INTOSC1

X1/X2

XRS

Boot-Mode

Pins

XCLKOUT

I/O Pins

Address/Data/

Control

(Internal)

Boot-ROM Execution Starts

User-Code Execution Starts

User-Code Dependent

User-Code Execution Phase

User-Code Dependent

User-Code Execution

Peripheral/GPIO Function

User-Code Dependent

GPIO Pins as Input (State Depends on Internal PU/PD)

GPIO Pins as Input Peripheral/GPIO Function

td(EX)

A. After reset, the Boot ROM code samples BOOT Mode pins. Based on the status of the Boot Mode pin, the boot code branches to

destination memory or boot code function. If Boot ROM code executes after power-on conditions (in debugger environment), the Boot

code execution time is based on the current SYSCLKOUT speed. The SYSCLKOUT will be based on user environment and could be

with or without PLL enabled.

Figure 7-6. Warm Reset

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TMS320F28062, TMS320F28062F

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l TEXAS INSTRUMENTS T T

Figure 7-7 shows an example for the effect of writing into PLLCR register. In the first phase, PLLCR = 0x0004

and SYSCLKOUT = OSCCLK × 2. The PLLCR is then written with 0x0008. Right after the PLLCR register is

written, the PLL lock-up phase begins. During this phase, SYSCLKOUT = OSCCLK/2. After the PLL lock-up is

complete, SYSCLKOUT reflects the new operating frequency, OSCCLK × 4.

OSCCLK

SYSCLKOUT

Write to PLLCR

OSCCLK * 2

(Current CPU

Frequency)

OSCCLK/2

(CPU frequency while PLL is stabilizing

with the desired frequency. This period

(PLL lock-up time t ) is 1 ms long.)

OSCCLK * 4

(Changed CPU frequency)

Figure 7-7. Example of Effect of Writing Into PLLCR Register

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

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7.13 Clock Specifications

7.13.1 Device Clock Table

This section provides the timing requirements and switching characteristics for the various clock options

available on the 2806x MCUs. Section 7.13.1.1 lists the cycle times of various clocks.

7.13.1.1 2806x Clock Table and Nomenclature (90-MHz Devices)

MIN NOM MAX UNIT

SYSCLKOUT tc(SCO), Cycle time 11.11 500 ns

Frequency 2 90 MHz

LSPCLK(1) tc(LCO), Cycle time 11.11 44.4(2) ns

Frequency 22.5(2) 90 MHz

ADC clock tc(ADCCLK), Cycle time 22.22 ns

Frequency 45 MHz

(1) Lower LSPCLK will reduce device power consumption.

(2) This is the default reset value if SYSCLKOUT = 90 MHz.

7.13.1.2 Device Clocking Requirements/Characteristics

MIN NOM MAX UNIT

On-chip oscillator (X1/X2 pins)

(Crystal/Resonator)

tc(OSC), Cycle time 50 200 ns

Frequency 5 20 MHz

External oscillator/clock source

(XCLKIN pin) — PLL Enabled

tc(CI), Cycle time (C8) 33.3 200 ns

Frequency 5 30 MHz

External oscillator/clock source

(XCLKIN pin) — PLL Disabled

tc(CI), Cycle time (C8) 11.11 250 ns

Frequency 4 90 MHz

Limp mode SYSCLKOUT

(with /2 enabled) Frequency range 1 to 5 MHz

XCLKOUT tc(XCO), Cycle time (C1) 44.44 2000 ns

Frequency 0.5 22.5 MHz

PLL lock time(1) tp1 ms

(1) The PLLLOCKPRD register must be updated based on the number of OSCCLK cycles. If the zero-pin internal oscillators (10 MHz) are

used as the clock source, then the PLLLOCKPRD register must be written with a value of 10,000 (minimum).

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TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

le‘rRUMEms

7.13.1.3 Internal Zero-Pin Oscillator (INTOSC1/INTOSC2) Characteristics

PARAMETER MIN TYP MAX UNIT

Internal zero-pin oscillator 1 (INTOSC1) at 30°C(1) (2) Frequency 10.000 MHz

Internal zero-pin oscillator 2 (INTOSC2) at 30°C(1) (2) Frequency 10.000 MHz

Step size (coarse trim) 55 kHz

Step size (fine trim) 14 kHz

Temperature drift(3) 3.03 4.85 kHz/°C

Voltage (VDD) drift(3) 175 Hz/mV

(1) Oscillator frequency will vary over temperature, see Figure 7-8. To compensate for oscillator temperature drift, see the Oscillator

Compensation Guide and C2000Ware. .

(2) Frequency range ensured only when VREG is enabled, VREGENZ = VSS.

(3) Output frequency of the internal oscillators follows the direction of both the temperature gradient and voltage (VDD) gradient. For

example:

• Increase in temperature will cause the output frequency to increase per the temperature coefficient.

• Decrease in voltage (VDD) will cause the output frequency to decrease per the voltage coefficient.

9.6

9.7

9.8

9.9

10.1

10.2

10.3

10.4

10.5

10.6

–40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90 100 110 120

Temperature (°C)

Output Frequency (MHz)

Typical

Max

Figure 7-8. Zero-Pin Oscillator Frequency Movement With Temperature

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7.13.2 Clock Requirements and Characteristics

7.13.2.1 XCLKIN Timing Requirements – PLL Enabled

NO. MIN MAX UNIT

C9 tf(CI) Fall time, XCLKIN 6 ns

C10 tr(CI) Rise time, XCLKIN 6 ns

C11 tw(CIL) Pulse duration, XCLKIN low as a percentage of tc(OSCCLK) 45% 55%

C12 tw(CIH) Pulse duration, XCLKIN high as a percentage of tc(OSCCLK) 45% 55%

7.13.2.2 XCLKIN Timing Requirements – PLL Disabled

NO. MIN MAX UNIT

C9 tf(CI) Fall time, XCLKIN Up to 20 MHz 6 ns

20 MHz to 90 MHz 2

C10 tr(CI) Rise time, XCLKIN Up to 20 MHz 6 ns

20 MHz to 90 MHz 2

C11 tw(CIL) Pulse duration, XCLKIN low as a percentage of tc(OSCCLK) 45% 55%

C12 tw(CIH) Pulse duration, XCLKIN high as a percentage of tc(OSCCLK) 45% 55%

The possible configuration modes are shown in Table 8-15.

7.13.2.3 XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)

over recommended operating conditions (unless otherwise noted)(1) (2)

NO. PARAMETER MIN MAX UNIT

C3 tf(XCO) Fall time, XCLKOUT 5 ns

C4 tr(XCO) Rise time, XCLKOUT 5 ns

C5 tw(XCOL) Pulse duration, XCLKOUT low H – 2 H + 2 ns

C6 tw(XCOH) Pulse duration, XCLKOUT high H – 2 H + 2 ns

(1) A load of 40 pF is assumed for these parameters.

(2) H = 0.5tc(XCO)

XCLKOUT(B)

XCLKIN(A)

C10

A. The relationship of XCLKIN to XCLKOUT depends on the divide factor chosen. The waveform relationship shown is intended to

illustrate the timing parameters only and may differ based on actual configuration.

B. XCLKOUT configured to reflect SYSCLKOUT.

Figure 7-9. Clock Timing

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7.14 Flash Timing

7.14.1 Flash/OTP Endurance for T Temperature Material

ERASE/PROGRAM

TEMPERATURE(1) MIN TYP MAX UNIT

NfFlash endurance for the array (write/erase cycles) 0°C to 105°C (ambient) 20000 50000 cycles

NOTP OTP endurance for the array (write cycles) 0°C to 30°C (ambient) 1 write

(1) Write/erase operations outside of the temperature ranges indicated are not specified and may affect the endurance numbers.

7.14.2 Flash/OTP Endurance for S Temperature Material

ERASE/PROGRAM

TEMPERATURE(1) MIN TYP MAX UNIT

NfFlash endurance for the array (write/erase cycles) 0°C to 125°C (ambient) 20000 50000 cycles

NOTP OTP endurance for the array (write cycles) 0°C to 30°C (ambient) 1 write

(1) Write/erase operations outside of the temperature ranges indicated are not specified and may affect the endurance numbers.

7.14.3 Flash/OTP Endurance for Q Temperature Material

ERASE/PROGRAM

TEMPERATURE(1) (2) MIN TYP MAX UNIT

NfFlash endurance for the array (write/erase cycles) –40°C to 125°C (ambient) 20000 50000 cycles

NOTP OTP endurance for the array (write cycles) –40°C to 30°C (ambient) 1 write

(1) Write/erase operations outside of the temperature ranges indicated are not specified and may affect the endurance numbers.

(2) The "Q" temperature option is not available on the 2806xU devices.

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7.14.4 Flash Parameters at 90-MHz SYSCLKOUT

PARAMETER TEST

CONDITIONS MIN TYP MAX UNIT

Program Time(1)

16-Bit Word 50 μs

16K Sector 500 2000(2) ms

8K Sector 250 2000(2) ms

4K Sector 125 2000(2) ms

Erase Time(3)

16K Sector 2 15(2)

s8K Sector 2 15(2)

4K Sector 2 15(2)

IDDP (4) VDD current consumption during Erase/Program cycle VREG disabled 80 mA

IDDIOP (4) VDDIO current consumption during Erase/Program cycle 60

IDDIOP (4) VDDIO current consumption during Erase/Program cycle VREG enabled 120 mA

(1) Program time is at the maximum device frequency. The programming time indicated in this table is applicable only when all the

required code/data is available in the device RAM, ready for programming. Program time includes overhead of the flash state machine

but does not include the time to transfer the following into RAM:

• the code that uses flash API to program the flash

• the Flash API itself

• Flash data to be programmed

(2) The parameters mentioned in the MAX column are for the first 100 Erase/Program cycles.

(3) The on-chip flash memory is in an erased state when the device is shipped from TI. As such, erasing the flash memory is not required

before programming, when programming the device for the first time. However, the erase operation is needed on all subsequent

programming operations.

(4) Typical parameters as seen at room temperature including function call overhead, with all peripherals off. It is important to maintain

a stable power supply during the entire flash programming process. It is conceivable that device current consumption during flash

programming could be higher than normal operating conditions. The power supply used should ensure VMIN on the supply rails at all

times, as specified in the Recommended Operating Conditions of the data sheet. Any brownout or interruption to power during erasing/

programming could potentially corrupt the password locations and lock the device permanently. Powering a target board (during flash

programming) through the USB port is not recommended, as the port may be unable to respond to the power demands placed during

the programming process.

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7.14.5 Flash/OTP Access Timing

PARAMETER MIN MAX UNIT

ta(fp) Paged Flash access time 36 ns

ta(fr) Random Flash access time 36 ns

ta(OTP) OTP access time 60 ns

7.14.6 Flash Data Retention Duration

PARAMETER TEST CONDITIONS MIN MAX UNIT

tretention Data retention duration TJ = 55°C 15 years

Table 7-2. Minimum Required Flash/OTP Wait States at Different Frequencies

SYSCLKOUT

(MHz)

SYSCLKOUT

(ns)

PAGE

WAIT STATE(1)

RANDOM

WAIT STATE(1)

OTP

WAIT STATE

90 11.11 3 3 5

80 12.5 2 2 4

70 14.29 2 2 4

60 16.67 2 2 3

55 18.18 1 1 3

50 20 1 1 2

45 22.22 1 1 2

40 25 1 1 2

35 28.57 1 1 2

30 33.33 1 1 1

(1) Page and random wait state must be ≥ 1.

The equations to compute the Flash page wait state and random wait state in Table 7-2 are as follows:

largeriswhichever1,orinteger,highestnextthetoupround1StateWaitPageFlash ú

é-

=×

c(SCO)

p)a(f

largeriswhichever1,orinteger,highestnextthetoupround1StateWaitRandomFlash ú

é-

=×

c(SCO)

r)a(f

The equation to compute the OTP wait state in Table 7-2 is as follows:

largeriswhichever1,orinteger,highestnextthetoupround1StateWaitOTP ú

é-

c(SCO)

a(OTP)

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8 Detailed Description

8.1 Overview

8.1.1 CPU

The 2806x (C28x) family is a member of the TMS320C2000™ microcontroller (MCU) platform. The C28x-based

controllers have the same 32-bit fixed-point architecture as existing C28x MCUs. Each C28x-based controller,

including the 2806x device, is a very efficient C/C++ engine, enabling users to develop not only their system

control software in a high-level language, but also enabling development of math algorithms using C/C++.

The device is as efficient at MCU math tasks as it is at system control tasks that typically are handled by

microcontroller devices. This efficiency removes the need for a second processor in many systems. The 32 ×

32-bit MAC 64-bit processing capabilities enable the controller to handle higher numerical resolution problems

efficiently. Add to this the fast interrupt response with automatic context save of critical registers, resulting

in a device that is capable of servicing many asynchronous events with minimal latency. The device has an

8-level-deep protected pipeline with pipelined memory accesses. This pipelining enables it to execute at high

speeds without resorting to expensive high-speed memories. Special branch-look-ahead hardware minimizes

the latency for conditional discontinuities. Special store conditional operations further improve performance.

8.1.2 Control Law Accelerator (CLA)

The C28x CLA is a single-precision (32-bit) floating-point unit that extends the capabilities of the C28x CPU by

adding parallel processing. The CLA is an independent processor with its own bus structure, fetch mechanism,

and pipeline. Eight individual CLA tasks, or routines, can be specified. Each task is started by software or

a peripheral such as the ADC, ePWM, eCAP, eQEP, or CPU Timer 0. The CLA executes one task at a

time to completion. When a task completes, the main CPU is notified by an interrupt to the PIE and the

CLA automatically begins the next highest-priority pending task. The CLA can directly access the ADC Result

registers, ePWM+HRPWM, eCAP, and eQEP registers. Dedicated message RAMs provide a method to pass

additional data between the main CPU and the CLA.

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8.1.3 Viterbi, Complex Math, CRC Unit (VCU)

The C28x VCU enhances the processing power of C2000™ devices by adding additional assembly instructions

to target complex math, Viterbi decode, and CRC calculations. The VCU instructions accelerate many

applications, including the following:

• Orthogonal frequency-division multiplex (OFDM) used in the PRIME and G3 standards for power line

communications

• Short-range radar complex math calculations

• Power calculations

• Memory and data communication packet checks (CRC)

The VCU features include:

• Instructions to support Cyclic Redundancy Checks (CRCs), which is a polynomial code checksum.

– CRC8

– CRC16

– CRC32

• Instructions to support a flexible software implementation of a Viterbi decoder

– Branch metric calculations for a code rate of 1/2 or 1/3

– Add-Compare Select or Viterbi Butterfly in five cycles per butterfly

– Traceback in three cycles per stage

– Easily supports a constraint length of K = 7 used in PRIME and G3 standards

• Complex math arithmetic unit

– Single-cycle Add or Subtract

– 2-cycle multiply

– 2-cycle multiply and accumulate (MAC)

– Single-cycle repeat MAC

• Independent register space

8.1.4 Memory Bus (Harvard Bus Architecture)

As with many MCU-type devices, multiple buses are used to move data between the memories and peripherals

and the CPU. The memory bus architecture contains a program read bus, data read bus, and data write bus.

The program read bus consists of 22 address lines and 32 data lines. The data read and write buses consist

of 32 address lines and 32 data lines each. The 32-bit-wide data buses enable single cycle 32-bit operations.

The multiple bus architecture, commonly termed Harvard Bus, enables the C28x to fetch an instruction, read a

data value and write a data value in a single cycle. All peripherals and memories attached to the memory bus

prioritize memory accesses. Generally, the priority of memory bus accesses can be summarized as follows:

Highest: Data Writes (Simultaneous data and program writes cannot occur on the memory bus.)

Program Writes (Simultaneous data and program writes cannot occur on the memory bus.)

Data Reads

Program Reads (Simultaneous program reads and fetches cannot occur on the

memory bus.)

Lowest: Fetches (Simultaneous program reads and fetches cannot occur on the

memory bus.)

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8.1.5 Peripheral Bus

To enable migration of peripherals between various Texas Instruments (TI) MCU family of devices, the devices

adopt a peripheral bus standard for peripheral interconnect. The peripheral bus bridge multiplexes the various

buses that make up the processor Memory Bus into a single bus consisting of 16 address lines and 16

or 32 data lines and associated control signals. Three versions of the peripheral bus are supported. One

version supports only 16-bit accesses (called peripheral frame 2). Another version supports both 16- and 32-bit

accesses (called peripheral frame 1).

8.1.6 Real-Time JTAG and Analysis

The devices implement the standard IEEE 1149.1 (IEEE Standard 1149.1-1990 Standard Test Access Port

and Boundary Scan Architecture) JTAG interface for in-circuit based debug. interface for in-circuit based

debug. Additionally, the devices support real-time mode of operation allowing modification of the contents of

memory, peripheral, and register locations while the processor is running and executing code and servicing

interrupts. The user can also single step through non-time-critical code while enabling time-critical interrupts to

be serviced without interference. The device implements the real-time mode in hardware within the CPU. This

is a feature unique to the 28x family of devices, requiring no software monitor. Additionally, special analysis

hardware is provided that allows setting of hardware breakpoint or data/address watch-points and generating

various user-selectable break events when a match occurs.

8.1.7 Flash

The F28069, F28069F, F28069M, F28068F, F28068M, F28067, and F28066 devices contain 128K × 16 of

embedded flash memory, segregated into eight 16K × 16 sectors. The F28065, F28064, F28063, F28062, and

F28062F devices contain 64K × 16 of embedded flash memory, segregated into eight 8K × 16 sectors. All

devices also contain a single 1K × 16 of OTP memory at address range 0x3D 7800 to 0x3D 7BF9. The user

can individually erase, program, and validate a flash sector while leaving other sectors untouched. However, it is

not possible to use one sector of the flash or the OTP to execute flash algorithms that erase or program other

sectors. Special memory pipelining is provided to enable the flash module to achieve higher performance. The

flash/OTP is mapped to both program and data space; therefore, it can be used to execute code or store data

information. Addresses 0x3F 7FF0 to 0x3F 7FF5 are reserved for data variables and should not contain program

code.

Note

The Flash and OTP wait states can be configured by the application. This allows applications running

at slower frequencies to configure the flash to use fewer wait states.

Flash effective performance can be improved by enabling the flash pipeline mode in the Flash options

than the raw performance indicated by the wait-state configuration alone. The exact performance gain

when using the Flash pipeline mode is application-dependent.

For more information on the Flash options, Flash wait state, and OTP wait-state registers, see the

Systems Control and Interrupts chapter of the TMS320x2806x Technical Reference Manual .

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8.1.8 M0, M1 SARAMs

All devices contain these two blocks of single-access memory, each 1K × 16 in size. The stack pointer points

to the beginning of block M1 on reset. The M0 and M1 blocks, like all other memory blocks on C28x devices,

are mapped to both program and data space. Hence, the user can use M0 and M1 to execute code or for data

variables. The partitioning is performed within the linker. The C28x device presents a unified memory map to the

programmer. This makes for easier programming in high-level languages.

8.1.9 L4 SARAM, and L0, L1, L2, L3, L5, L6, L7, and L8 DPSARAMs

The device contains up to 48K × 16 of single-access RAM. To ascertain the exact size for a given device, see

the device-specific memory map figures in Section 8.2. This block is mapped to both program and data space.

L0 is 2K in size. L1 and L2 are each 1K in size. L3 is 4K in size. L4, L5, L6, L7, and L8 are each 8K in size.

L0, L1, and L2 are shared with the CLA, which can use these blocks for its data space. L3 is shared with the

CLA, which can use this block for its program space. L5, L6, L7, and L8 are shared with the DMA, which can use

these blocks for its data space. DPSARAM refers to the dual-port configuration of these blocks.

8.1.10 Boot ROM

The Boot ROM is factory-programmed with boot-loading software. Boot-mode signals are provided to tell the

bootloader software what boot mode to use on power up. The user can select to boot normally or to download

new software from an external connection or to select boot software that is programmed in the internal Flash/

ROM. The Boot ROM also contains standard tables, such as SIN/COS waveforms, for use in math-related

algorithms.

Table 8-1. Boot Mode Selection

MODE GPIO37/TDO GPIO34/COMP2OUT/

COMP3OUT TRST MODE

3 1 1 0 GetMode

2 1 0 0 Wait (see Section 8.1.11 for description)

1 0 1 0 SCI

0 0 0 0 Parallel IO

EMU x x 1 Debug Boot

8.1.10.1 Debug Boot

When the debug probe is connected, the GPIO37/TDO pin cannot be used for boot mode selection. In this case,

the boot ROM detects that a debug probe is connected and uses the contents of two reserved SARAM locations

in the PIE vector table to determine the boot mode. If the content of either location is invalid, then the Wait boot

option is used. All boot mode options can be accessed in debug boot.

8.1.10.2 GetMode

The default behavior of the GetMode option is to boot to flash. This behavior can be changed to another boot

option by programming two locations in the OTP. If the content of either OTP location is invalid, then boot to flash

is used. One of the following loaders can be specified: SCI, SPI, I2C, CAN, or OTP.

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8.1.10.3 Peripheral Pins Used by the Bootloader

Table 8-2 shows which GPIO pins are used by each peripheral bootloader. Refer to the GPIO mux table to see if

these conflict with any of the peripherals you would like to use in your application.

Table 8-2. Peripheral Bootload Pins

BOOTLOADER PERIPHERAL LOADER PINS

SCI SCIRXDA (GPIO28)

SCITXDA (GPIO29)

Parallel Boot Data (GPIO31,30,5:0)

28x Control (AIO6)

Host Control (AIO12)

SPI SPISIMOA (GPIO16)

SPISOMIA (GPIO17)

SPICLKA (GPIO18)

SPISTEA (GPIO19)

I2C SDAA (GPIO28)

SCLA (GPIO29)

CAN CANRXA (GPIO30)

CANTXA (GPIO31)

8.1.11 Security

The devices support high levels of security to protect the user firmware from being reverse-engineered. The

security features a 128-bit password (hardcoded for 16 wait states), which the user programs into the flash.

One code security module (CSM) is used to protect the flash/OTP and the L0/L1 SARAM blocks. The security

feature prevents unauthorized users from examining the memory contents through the JTAG port, or trying to

boot-load some undesirable software that would export the secure memory contents. To enable access to the

secure blocks, the user must write the correct 128-bit KEY value that matches the value stored in the password

locations within the Flash.

In addition to the CSM, the debug code security logic (ECSL) has been implemented to prevent unauthorized

users from stepping through secure code. Any code or data access to CSM secure memory while the debug

probe is connected will trip the ECSL and break the debug probe connection. To allow debug of secure code,

while maintaining the CSM protection against secure memory reads, the user must write the correct value into

the lower 64 bits of the KEY register (KEY0 – KEY3), which matches the value stored in the lower 64 bits of

the password locations within the flash. Dummy reads of all 128 bits of the password in the flash must still be

performed. If the lower 64 bits of the password locations (PWL0 – PWL3) are all ones (unprogrammed), then

the KEY value does not need to match. During debug of secure code, operations like single-stepping is possible.

However, the actual contents of the secure memory cannot be seen in the CCS window.

When power is applied to a secure device that is connected to a JTAG debug probe, the CPU will start executing

and may execute an instruction that performs an access to a protected area. If this happens, the ECSL will trip

and cause the JTAG circuitry to be deactivated. Under this condition, a host (such as a computer running CCS or

flash programming software) would not be able to establish connection with the device.

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The solution is to use the Wait boot option. In this mode, the device loops around a software breakpoint to allow

a debug probe to be connected without tripping security. These devices do not support a hardware wait-in-reset

mode.

Note

• When the code-security passwords are programmed, all addresses from 0x3F 7F80 to 0x3F 7FF5

cannot be used as program code or data. These locations must be programmed to 0x0000.

• If reprogramming of a secure device via JTAG may be needed in future, it is important to design

the board in such a way that the device could be put in Wait boot mode upon power-up (when

reprogramming is warranted). Otherwise, ECSL may deactivate the JTAG circuitry and prevent

connection to the device, as mentioned earlier. If reconfiguring the device for Wait boot mode in

the field is not practical, some mechanism must be implemented in the firmware to detect when a

firmware update is warranted. Code could then branch to the desired bootloader in the bootROM. It

could also branch to the Wait bootmode, at which point the JTAG debug probe could be connected,

device unsecured and programming accomplished through JTAG itself.

• If the code security feature is not used, addresses 0x3F 7F80 to 0x3F 7FEF may be used for code

or data. Addresses 0x3F 7FF0 to 0x3F 7FF5 are reserved for data and should not contain program

code.

• The 128-bit password (at 0x3F 7FF8 to 0x3F 7FFF) must not be programmed to zeros. Doing so

would permanently lock the device.

Code Security Module Disclaimer

THE CODE SECURITY MODULE (CSM) INCLUDED ON THIS DEVICE WAS DESIGNED TO

PASSWORD PROTECT THE DATA STORED IN THE ASSOCIATED MEMORY (EITHER ROM

OR FLASH) AND IS WARRANTED BY TEXAS INSTRUMENTS (TI), IN ACCORDANCE WITH ITS

STANDARD TERMS AND CONDITIONS, TO CONFORM TO TI'S PUBLISHED SPECIFICATIONS

FOR THE WARRANTY PERIOD APPLICABLE FOR THIS DEVICE.

TI DOES NOT, HOWEVER, WARRANT OR REPRESENT THAT THE CSM CANNOT BE

COMPROMISED OR BREACHED OR THAT THE DATA STORED IN THE ASSOCIATED MEMORY

CANNOT BE ACCESSED THROUGH OTHER MEANS. MOREOVER, EXCEPT AS SET FORTH

ABOVE, TI MAKES NO WARRANTIES OR REPRESENTATIONS CONCERNING THE CSM OR

OPERATION OF THIS DEVICE, INCLUDING ANY IMPLIED WARRANTIES OF MERCHANTABILITY

OR FITNESS FOR A PARTICULAR PURPOSE.

IN NO EVENT SHALL TI BE LIABLE FOR ANY CONSEQUENTIAL, SPECIAL, INDIRECT,

INCIDENTAL, OR PUNITIVE DAMAGES, HOWEVER CAUSED, ARISING IN ANY WAY OUT OF

YOUR USE OF THE CSM OR THIS DEVICE, WHETHER OR NOT TI HAS BEEN ADVISED OF THE

POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED

TO LOSS OF DATA, LOSS OF GOODWILL, LOSS OF USE OR INTERRUPTION OF BUSINESS OR

OTHER ECONOMIC LOSS.

8.1.12 Peripheral Interrupt Expansion (PIE) Block

The PIE block serves to multiplex numerous interrupt sources into a smaller set of interrupt inputs. The PIE

block can support up to 96 peripheral interrupts. On the F2806x, 72 of the possible 96 interrupts are used by

peripherals. The 96 interrupts are grouped into blocks of 8 and each group is fed into 1 of 12 CPU interrupt lines

(INT1 to INT12). Each of the 96 interrupts is supported by its own vector stored in a dedicated RAM block that

can be overwritten by the user. The vector is automatically fetched by the CPU on servicing the interrupt. Eight

CPU clock cycles are needed to fetch the vector and save critical CPU registers. Hence the CPU can quickly

respond to interrupt events. Prioritization of interrupts is controlled in hardware and software. Each individual

interrupt can be enabled or disabled within the PIE block.

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

8.1.13 External Interrupts (XINT1 to XINT3)

The devices support three masked external interrupts (XINT1–XINT3). Each of the interrupts can be selected

for negative, positive, or both negative and positive edge triggering and can also be enabled or disabled. These

interrupts also contain a 16-bit free-running up counter, which is reset to zero when a valid interrupt edge is

detected. This counter can be used to accurately time-stamp the interrupt. There are no dedicated pins for the

external interrupts. XINT1, XINT2, and XINT3 interrupts can accept inputs from GPIO0–GPIO31 pins.

8.1.14 Internal Zero Pin Oscillators, Oscillator, and PLL

The device can be clocked by either of the two internal zero-pin oscillators, an external oscillator, or by a crystal

attached to the on-chip oscillator circuit. A PLL is provided supporting up to 16 input-clock-scaling ratios. The

PLL ratios can be changed on-the-fly in software, enabling the user to scale back on operating frequency if lower

power operation is desired. Refer to Section 7, Specifications, for timing details. The PLL block can be set in

bypass mode. A second PLL (PLL2) feeds the HRCAP module.

8.1.15 Watchdog

Each device contains two watchdogs: CPU-watchdog that monitors the core and NMI-watchdog that is a missing

clock-detect circuit. The user software must regularly reset the CPU-watchdog counter within a certain time

frame; otherwise, the CPU-watchdog generates a reset to the processor. The CPU-watchdog can be disabled if

necessary. The NMI-watchdog engages only in case of a clock failure and can either generate an interrupt or a

device reset.

8.1.16 Peripheral Clocking

The clocks to each individual peripheral can be enabled or disabled to reduce power consumption when a

peripheral is not in use. Additionally, the system clock to the serial ports (except I2C) can be scaled relative to

the CPU clock.

8.1.17 Low-power Modes

The devices are full static CMOS devices. Three low-power modes are provided:

IDLE: Places CPU in low-power mode. Peripheral clocks may be turned off selectively and only

those peripherals that must function during IDLE are left operating. An enabled interrupt

from an active peripheral or the watchdog timer will wake the processor from IDLE mode.

STANDBY: Turns off clock to CPU and peripherals. This mode leaves the oscillator and PLL functional.

An external interrupt event will wake the processor and the peripherals. Execution begins

on the next valid cycle after detection of the interrupt event

HALT: This mode basically shuts down the device and places it in the lowest possible power-

consumption mode. If the internal zero-pin oscillators are used as the clock source, the

HALT mode turns them off, by default. To keep these oscillators from shutting down, the

INTOSCnHALTI bits in CLKCTL register may be used. The zero-pin oscillators may thus

be used to clock the CPU-watchdog in this mode. If the on-chip crystal oscillator is used

as the clock source, it is shut down in this mode. A reset or an external signal (through a

GPIO pin) or the CPU-watchdog can wake the device from this mode.

The CPU clock (OSCCLK) and the watchdog clock source should be from the same clock source before

attempting to put the device into HALT or STANDBY.

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TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

8.1.18 Peripheral Frames 0, 1, 2, 3 (PFn)

The device segregates peripherals into four sections. The mapping of peripherals is as follows:

PF0: PIE: PIE Interrupt Enable and Control Registers Plus PIE Vector Table

Flash: Flash Waitstate Registers

Timers: CPU-Timers 0, 1, 2 Registers

CSM: Code Security Module KEY Registers

ADC: ADC Result Registers

CLA: Control Law Accelrator Registers and Message RAMs

PF1: GPIO: GPIO MUX Configuration and Control Registers

eCAN: Enhanced Control Area Network Configuration and Control Registers

PF2: SYS: System Control Registers

SCI: Serial Communications Interface (SCI) Control and RX/TX Registers

SPI: Serial Port Interface (SPI) Control and RX/TX Registers

ADC: ADC Status, Control, and Configuration Registers

I2C: Inter-Integrated Circuit Module and Registers

XINT: External Interrupt Registers

PF3: McBSP: Multichannel Buffered Serial Port Registers

ePWM: Enhanced Pulse Width Modulator Module and Registers

eCAP: Enhanced Capture Module and Registers

eQEP: Enhanced Quadrature Encoder Pulse Module and Registers

Comparators: Comparator Modules

USB: Universal Serial Bus Module and Registers

8.1.19 General-Purpose Input/Output (GPIO) Multiplexer

Most of the peripheral signals are multiplexed with general-purpose input/output (GPIO) signals. This enables

the user to use a pin as GPIO if the peripheral signal or function is not used. On reset, GPIO pins are configured

as inputs. The user can individually program each pin for GPIO mode or peripheral signal mode. For specific

inputs, the user can also select the number of input qualification cycles. This is to filter unwanted noise glitches.

The GPIO signals can also be used to bring the device out of specific low-power modes.

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

8.1.20 32-Bit CPU-Timers (0, 1, 2)

CPU-Timers 0, 1, and 2 are identical 32-bit timers with presettable periods and with 16-bit clock prescaling.

The timers have a 32-bit count-down register, which generates an interrupt when the counter reaches zero. The

counter is decremented at the CPU clock speed divided by the prescale value setting. When the counter reaches

zero, it is automatically reloaded with a 32-bit period value.

CPU-Timer 0 is for general use and is connected to the PIE block. CPU-Timer 1 is also for general use and can

be connected to INT13 of the CPU. CPU-Timer 2 is reserved for SYS/BIOS. CPU-Timer 2 is connected to INT14

of the CPU. If SYS/BIOS is not being used, CPU-Timer 2 is available for general use.

CPU-Timer 2 can be clocked by any one of the following:

• SYSCLKOUT (default)

• Internal zero-pin oscillator 1 (INTOSC1)

• Internal zero-pin oscillator 2 (INTSOC2)

• External clock source

8.1.21 Control Peripherals

The devices support the following peripherals that are used for embedded control and communication:

ePWM: The enhanced PWM peripheral supports independent/complementary PWM generation,

adjustable dead-band generation for leading/trailing edges, latched/cycle-by-cycle trip

mechanism. Some of the PWM pins support the HRPWM high-resolution duty and

period features. The type 1 module found on 2806x devices also supports increased

dead-band resolution, enhanced SOC and interrupt generation, and advanced

triggering including trip functions based on comparator outputs.

eCAP: The enhanced capture peripheral uses a 32-bit time base and registers up to four

programmable events in continuous/one-shot capture modes.

This peripheral can also be configured to generate an auxiliary PWM signal.

eQEP: The enhanced QEP peripheral uses a 32-bit position counter, supports low-speed

measurement using capture unit and high-speed measurement using a 32-bit unit timer.

This peripheral has a watchdog timer to detect motor stall and input error detection logic

to identify simultaneous edge transition in QEP signals.

ADC: The ADC block is a 12-bit converter. The ADC has up to 16 single-ended channels

pinned out, depending on the device. The ADC also contains two sample-and-hold units

for simultaneous sampling.

Comparator: Each comparator block consists of one analog comparator along with an internal 10-bit

reference for supplying one input of the comparator.

HRCAP: The high-resolution capture peripheral operates in normal capture mode through a

16-bit counter clocked off of the HCCAPCLK or in high-resolution capture mode by

using built-in calibration logic in conjunction with a TI-supplied calibration library.

www.ti.com

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

8.1.22 Serial Port Peripherals

The devices support the following serial communication peripherals:

SPI: The SPI is a high-speed, synchronous serial I/O port that allows a serial bit stream

of programmed length (1 to 16 bits) to be shifted into and out of the device at a

programmable bit-transfer rate. Normally, the SPI is used for communications between

the MCU and external peripherals or another processor. Typical applications include

external I/O or peripheral expansion through devices such as shift registers, display

drivers, and ADCs. Multidevice communications are supported by the master/slave

operation of the SPI. The SPI contains a 4-level receive and transmit FIFO for reducing

interrupt servicing overhead.

SCI: The serial communications interface is a 2-wire asynchronous serial port, commonly

known as UART. The SCI contains a 4-level receive and transmit FIFO for reducing

interrupt servicing overhead.

I2C: The inter-integrated circuit (I2C) module provides an interface between an MCU

and other devices compliant with Philips Semiconductors Inter-IC bus ( I2C-bus®)

specification version 2.1 and connected by way of an I2C-bus. External components

attached to this 2-wire serial bus can transmit/receive up to 8-bit data to or from the

MCU through the I2C module. The I2C contains a 4-level receive-and-transmit FIFO for

reducing interrupt servicing overhead.

eCAN: This is the enhanced version of the CAN peripheral. The eCAN supports 32 mailboxes,

time-stamping of messages, and is compliant with ISO 11898-1 (CAN 2.0B).

McBSP: The multichannel buffered serial port (McBSP) connects to E1/T1 lines, phone-quality

codecs for modem applications or high-quality stereo audio DAC devices. The McBSP

receive and transmit registers are supported by the DMA to significantly reduce the

overhead for servicing this peripheral. Each McBSP module can be configured as an

SPI as required.

USB: The USB peripheral, which conforms to the USB 2.0 specification, may be used as

either a full-speed (12-Mbps) device controller, or a full-speed (12-Mbps) or low-speed

(1.5-Mbps) host controller. The controller supports a total of six user-configurable

endpoints—all of which can be accessed through DMA, in addition to a dedicated

control endpoint for endpoint zero. All packets transmitted or received are buffered in

4KB of dedicated endpoint memory. The USB peripheral supports all three transfer

types: Control, Interrupt, and Bulk. Because of the complexity of the USB peripheral and

the associated protocol overhead, a full software library with application examples is

provided within C2000Ware.

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

8.2 Memory Maps

In Figure 8-1 through Figure 8-8, the following apply:

• Memory blocks are not to scale.

• Peripheral Frame 0, Peripheral Frame 1, Peripheral Frame 2, and Peripheral Frame 3 memory maps are

restricted to data memory only. A user program cannot access these memory maps in program space.

•Protected means the order of Write-followed-by-Read operations is preserved rather than the pipeline order.

• Certain memory ranges are EALLOW protected against spurious writes after configuration.

• Locations 0x3D 7C80–0x3D 7CC0 contain the internal oscillator and ADC calibration routines. These

locations are not programmable by the user.

• All devices with USB have the USB control registers mapped from 0x4000 to 0x4FFF and 2K ×16 RAM from

0x40000 to 0x40800. When the clock to the USB module is enabled, this RAM is connected to the USB

controller and acts as the FIFO RAM. When the clock to the USB module is disabled, this RAM is remapped

to the CPU-accessible address space and can be used as general-purpose RAM.

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TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS DMAACusmhl:

M0 Vector RAM (Enabled if VMAP = 0)

M0 SARAM (1K 16, 0-Wait)´

0x00 0000

0x00 0040

M1 SARAM (1K 16, 0-Wait)´

0x00 0400

Data Space Prog Space

0x00 2000 Reserved

Peripheral Frame 0

0x00 0800

0x00 1580

0x00 0D00 PIE Vector - RAM

(256 16)

(Enabled if

VMAP = 1,

ENPIE = 1)

0x00 1400

0x00 0E00

0x00 1500

0x00 1480

CPU-to-CLA Message RAM

CLA-to-CPU Message RAM

CLA Registers

Peripheral Frame 0

Peripheral Frame 3

(4K 16, Protected)

DMA-Accessible

0x00 5000

0x00 4000

Peripheral Frame 2

(4K 16, Protected)´

0x00 7000

0x00 8000 L0 DPSARAM (2K 16)

(0-Wait, Secure Zone + ECSL, CLA Data RAM2)

0x00 8800 L1 DPSARAM (1K 16)

(0-Wait, Secure Zone + ECSL, CLA Data RAM 0)

0x00 8C00 L2 DPSARAM (1K 16)

(0-Wait, Secure Zone + ECSL, CLA Data RAM 1)

0x00 9000 L3 DPSARAM (4K 16)

(0-Wait, Secure Zone + ECSL, CLA Program RAM)

0x00 A000 L4 SARAM (8K 16)

(0-Wait, Secure Zone + ECSL)

0x00 C000 L5 DPSARAM (8K 16)

(0-Wait, DMA RAM 0)

L8 DPSARAM (8K 16)

(0-Wait, DMA RAM 3)

L7 DPSARAM (8K 16)

(0-Wait, DMA RAM 2)

L6 DPSARAM (8K 16)

(0-Wait, DMA RAM 1)

0x00 E000

0x01 0000

0x01 2000

Peripheral Frame 1

(4K 16, Protected)´

USB Control Registers(A)

0x00 6000

0x3D 7800 User OTP (1K 16, Secure Zone + ECSL)´

0x3D 7C80 Calibration Data

0x01 4000 Reserved

0x3D 7BFA Reserved

FLASH

(128K 16, 8 Sectors, Secure Zone + ECSL)´

FAST, SpinTAC, and IQmath Libraries

(16K 16, 0-Wait State)

(B)(C)

128-Bit Password

0x3D 8000

0x3F 7FF8

0x3F 8000

0x3F F3B0 Boot ROM (16K 16, 0-Wait State)´

CPU Vector Table (32 Vectors, Enabled if VMAP = 1)

0x3F FFC0

0x3D 7CC0 Get_mode function

0x3D 7CD0

0x3D 7E82

0x3D 7E80 PARTID

Reserved

0x3D 7EB0

Reserved

Calibration Data

A. On non-USB devices, 0x00 4000–0x00 4FFF is Reserved.

B. FAST™ and SpinTAC™ libraries exist only on F2806xM and F2806xF devices.

C. The ROM contents from 0x3F 8000–0x3F F3AF differ between F2806x parts and F2806xM/F2806xF parts. See the respective memory

map figures in the Boot ROM chapter of the TMS320x2806x Technical Reference Manual .

Figure 8-1. 28069, 28069F, 28069M Memory Map

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS DMA-Acwum‘e

M0 Vector RAM (Enabled if VMAP = 0)

M0 SARAM (1K 16, 0-Wait)´

0x00 0000

0x00 0040

M1 SARAM (1K 16, 0-Wait)´

0x00 0400

Data Space Prog Space

Reserved

Peripheral Frame 0

0x00 0800

0x00 0D00 PIE Vector - RAM

(256 16)

(Enabled if

VMAP = 1,

ENPIE = 1)

0x00 0E00 Peripheral Frame 0

0x00 1400 Reserved

0x00 8000 L0 DPSARAM (2K 16)

(0-Wait, Secure Zone + ECSL)

0x00 8800 L1 DPSARAM (1K 16)

(0-Wait, Secure Zone + ECSL)

0x00 8C00 L2 DPSARAM (1K 16)

(0-Wait, Secure Zone + ECSL)

0x00 9000 L3 DPSARAM (4K 16)

(0-Wait, Secure Zone + ECSL)

0x00 A000 L4 SARAM (8K 16)

(0-Wait, Secure Zone + ECSL)

0x00 C000 L5 DPSARAM (8K 16)

(0-Wait, DMA RAM 0)

L8 DPSARAM (8K 16)

(0-Wait, DMA RAM 3)

L7 DPSARAM (8K 16)

(0-Wait, DMA RAM 2)

L6 DPSARAM (8K 16)

(0-Wait, DMA RAM 1)

0x00 E000

0x01 0000

0x01 2000

Reserved

0x01 4000 Reserved

0x3D 7800 User OTP (1K 16, Secure Zone + ECSL)´

0x3D 7C80 Calibration Data

0x3D 7BFA Reserved

FLASH

(128K 16, 8 Sectors, Secure Zone + ECSL)´

128-Bit Password

0x3D 8000

0x3F 7FF8

0x3D 7CC0 Get_mode function

0x3D 7CD0

0x3D 7E82

Reserved

0x3D 7E80 PARTID

Calibration Data

Reserved

0x3D 7EB0

Peripheral Frame 3

(4K 16, Protected)

DMA-Accessible

0x00 5000

0x00 4000

Peripheral Frame 2

(4K 16, Protected)´

0x00 7000

Peripheral Frame 1

(4K 16, Protected)´

USB Control Registers(A)

0x00 6000

FAST, SpinTAC, and IQmath Libraries

(16K 16, 0-Wait State)

(B)(C)

0x3F 8000

0x3F F3B0 Boot ROM (16K 16, 0-Wait State)´

CPU Vector Table (32 Vectors, Enabled if VMAP = 1)

0x3F FFC0

A. On non-USB devices, 0x00 4000–0x00 4FFF is Reserved.

B. FAST™ and SpinTAC™ libraries exist only on F2806xM and F2806xF devices.

C. The ROM contents from 0x3F 8000–0x3F F3AF differ between F2806x parts and F2806xM/F2806xF parts. See the respective memory

map figures in the Boot ROM chapter of the TMS320x2806x Technical Reference Manual .

Figure 8-2. 28068F, 28068M Memory Map

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TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS DMA-Acwum‘e

M0 Vector RAM (Enabled if VMAP = 0)

M0 SARAM (1K 16, 0-Wait)´

0x00 0000

0x00 0040

M1 SARAM (1K 16, 0-Wait)´

0x00 0400

Data Space Prog Space

Reserved

Peripheral Frame 0

0x00 0800

0x00 0D00 PIE Vector - RAM

(256 16)

(Enabled if

VMAP = 1,

ENPIE = 1)

0x00 0E00 Peripheral Frame 0

0x00 1400 Reserved

0x00 8000 L0 DPSARAM (2K 16)

(0-Wait, Secure Zone + ECSL)

0x00 8800 L1 DPSARAM (1K 16)

(0-Wait, Secure Zone + ECSL)

0x00 8C00 L2 DPSARAM (1K 16)

(0-Wait, Secure Zone + ECSL)

0x00 9000 L3 DPSARAM (4K 16)

(0-Wait, Secure Zone + ECSL)

0x00 A000 L4 SARAM (8K 16)

(0-Wait, Secure Zone + ECSL)

0x00 C000 L5 DPSARAM (8K 16)

(0-Wait, DMA RAM 0)

L8 DPSARAM (8K 16)

(0-Wait, DMA RAM 3)

L7 DPSARAM (8K 16)

(0-Wait, DMA RAM 2)

L6 DPSARAM (8K 16)

(0-Wait, DMA RAM 1)

0x00 E000

0x01 0000

0x01 2000

Reserved

0x01 4000 Reserved

0x3D 7800 User OTP (1K 16, Secure Zone + ECSL)´

0x3D 7C80 Calibration Data

0x3D 7BFA Reserved

FLASH

(128K 16, 8 Sectors, Secure Zone + ECSL)´

128-Bit Password

0x3D 8000

0x3F 7FF8

0x3D 7CC0 Get_mode function

0x3D 7CD0

0x3D 7E82

Reserved

0x3D 7E80 PARTID

Calibration Data

Reserved

0x3D 7EB0

Peripheral Frame 3

(4K 16, Protected)

DMA-Accessible

0x00 5000

0x00 4000

Peripheral Frame 2

(4K 16, Protected)´

0x00 7000

Peripheral Frame 1

(4K 16, Protected)´

USB Control Registers(A)

0x00 6000

IQmath Libraries

(16K 16, 0-Wait State)´

0x3F 8000

0x3F F3B0 Boot ROM (16K 16, 0-Wait State)´

CPU Vector Table (32 Vectors, Enabled if VMAP = 1)

0x3F FFC0

A. On non-USB devices, 0x00 4000–0x00 4FFF is Reserved.

Figure 8-3. 28067 Memory Map

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS DMA-Accesslme

M0 Vector RAM (Enabled if VMAP = 0)

M0 SARAM (1K 16, 0-Wait)´

0x00 0000

0x00 0040

M1 SARAM (1K 16, 0-Wait)´

0x00 0400

Data Space Prog Space

Reserved

Peripheral Frame 0

0x00 0800

0x00 0D00 PIE Vector - RAM

(256 16)

(Enabled if

VMAP = 1,

ENPIE = 1)

0x00 0E00 Peripheral Frame 0

0x00 1400 Reserved

0x00 8000 L0 DPSARAM (2K 16)

(0-Wait, Secure Zone + ECSL)

0x00 8800 L1 DPSARAM (1K 16)

(0-Wait, Secure Zone + ECSL)

0x00 8C00 L2 DPSARAM (1K 16)

(0-Wait, Secure Zone + ECSL)

0x00 9000 L3 DPSARAM (4K 16)

(0-Wait, Secure Zone + ECSL)

0x00 A000 L4 SARAM (8K 16)

(0-Wait, Secure Zone + ECSL)

0x00 C000 L5 DPSARAM (8K 16)

(0-Wait, DMA RAM 0)

L6 DPSARAM (8K 16)

(0-Wait, DMA RAM 1)

0x00 E000

Reserved

0x01 0000 Reserved

0x3D 7800 User OTP (1K 16, Secure Zone + ECSL)´

0x3D 7C80 Calibration Data

0x3D 7BFA Reserved

FLASH

(128K 16, 8 Sectors, Secure Zone + ECSL)´

128-Bit Password

0x3D 8000

0x3F 7FF8

0x3D 7CC0 Get_mode function

0x3D 7CD0

0x3D 7E82

Reserved

0x3D 7E80 PARTID

Calibration Data

Reserved

0x3D 7EB0

Peripheral Frame 3

(4K 16, Protected)

DMA-Accessible

0x00 5000

0x00 4000

Peripheral Frame 2

(4K 16, Protected)´

0x00 7000

Peripheral Frame 1

(4K 16, Protected)´

USB Control Registers(A)

0x00 6000

IQmath Libraries

(16K 16, 0-Wait State)´

0x3F 8000

0x3F F3B0 Boot ROM (16K 16, 0-Wait State)´

CPU Vector Table (32 Vectors, Enabled if VMAP = 1)

0x3F FFC0

A. On non-USB devices, 0x00 4000–0x00 4FFF is Reserved.

Figure 8-4. 28066 Memory Map

www.ti.com

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS DMA-Acwulme

M0 Vector RAM (Enabled if VMAP = 0)

M0 SARAM (1K 16, 0-Wait)´

0x00 0000

0x00 0040

M1 SARAM (1K 16, 0-Wait)´

0x00 0400

Data Space Prog Space

Reserved

0x00 2000 Reserved

Peripheral Frame 0

0x00 0800

0x00 1580

0x00 0D00 PIE Vector - RAM

(256 16)

(Enabled if

VMAP = 1,

ENPIE = 1)

0x00 1400

0x00 0E00

0x00 1500

0x00 1480

CPU-to-CLA Message RAM

CLA-to-CPU Message RAM

CLA Registers

Peripheral Frame 0

0x00 8000 L0 DPSARAM (2K 16)

(0-Wait, Secure Zone + ECSL, CLA Data RAM2)

0x00 8800 L1 DPSARAM (1K 16)

(0-Wait, Secure Zone + ECSL, CLA Data RAM 0)

0x00 8C00 L2 DPSARAM (1K 16)

(0-Wait, Secure Zone + ECSL, CLA Data RAM 1)

0x00 9000 L3 DPSARAM (4K 16)

(0-Wait, Secure Zone + ECSL, CLA Program RAM)

0x00 A000 L4 SARAM (8K 16)

(0-Wait, Secure Zone + ECSL)

0x00 C000 L5 DPSARAM (8K 16)

(0-Wait, DMA RAM 0)

L8 DPSARAM (8K 16)

(0-Wait, DMA RAM 3)

L7 DPSARAM (8K 16)

(0-Wait, DMA RAM 2)

L6 DPSARAM (8K 16)

(0-Wait, DMA RAM 1)

0x00 E000

0x01 0000

0x01 2000

Reserved

0x01 4000 Reserved

Reserved

0x3D 7800 User OTP (1K 16, Secure Zone + ECSL)´

0x3D 7C80 Calibration Data

0x3D 7BFA Reserved

FLASH

(64K 16, 8 Sectors, Secure Zone + ECSL)´

128-Bit Password

0x3E 8000

0x3F 7FF8

0x3D 7CC0 Get_mode function

0x3D 7CD0

0x3D 7E82

Reserved

0x3D 7E80 PARTID

Calibration Data

Reserved

0x3D 7EB0

Peripheral Frame 3

(4K 16, Protected)

DMA-Accessible

0x00 5000

0x00 4000

Peripheral Frame 2

(4K 16, Protected)´

0x00 7000

Peripheral Frame 1

(4K 16, Protected)´

USB Control Registers(A)

0x00 6000

IQmath Libraries

(16K 16, 0-Wait State)´

0x3F 8000

0x3F F3B0 Boot ROM (16K 16, 0-Wait State)´

CPU Vector Table (32 Vectors, Enabled if VMAP = 1)

0x3F FFC0

A. On non-USB devices, 0x00 4000–0x00 4FFF is Reserved.

Figure 8-5. 28065 Memory Map

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS DMA-Accexslme

M0 Vector RAM (Enabled if VMAP = 0)

M0 SARAM (1K 16, 0-Wait)´

0x00 0000

0x00 0040

M1 SARAM (1K 16, 0-Wait)´

0x00 0400

Data Space Prog Space

Reserved

Peripheral Frame 0

0x00 0800

0x00 0D00 PIE Vector - RAM

(256 16)

(Enabled if

VMAP = 1,

ENPIE = 1)

0x00 0E00 Peripheral Frame 0

0x00 1400 Reserved

L0 DPSARAM (2K 16)

(0-Wait, Secure Zone + ECSL)

0x00 8800 L1 DPSARAM (1K 16)

(0-Wait, Secure Zone + ECSL)

0x00 8C00 L2 DPSARAM (1K 16)

(0-Wait, Secure Zone + ECSL)

0x00 9000 L3 DPSARAM (4K 16)

(0-Wait, Secure Zone + ECSL)

0x00 A000 L4 SARAM (8K 16)

(0-Wait, Secure Zone + ECSL)

0x00 C000 L5 DPSARAM (8K 16)

(0-Wait, DMA RAM 0)

L8 DPSARAM (8K 16)

(0-Wait, DMA RAM 3)

L7 DPSARAM (8K 16)

(0-Wait, DMA RAM 2)

L6 DPSARAM (8K 16)

(0-Wait, DMA RAM 1)

0x00 E000

0x01 0000

0x01 2000

Reserved

0x01 4000 Reserved

0x3D 7800 User OTP (1K 16, Secure Zone + ECSL)´

0x3D 7C80 Calibration Data

0x3D 7BFA Reserved

FLASH

(64K 16, 8 Sectors, Secure Zone + ECSL)´

128-Bit Password

0x3E 8000

0x3F 7FF8

0x3D 7CC0 Get_mode function

0x3D 7CD0

0x3D 7E82

Reserved

0x3D 7E80 PARTID

Calibration Data

Reserved

0x3D 7EB0

Peripheral Frame 3

(4K 16, Protected)

DMA-Accessible

0x00 5000

0x00 4000

Peripheral Frame 2

(4K 16, Protected)´

0x00 7000

Peripheral Frame 1

(4K 16, Protected)´

USB Control Registers(A)

0x00 6000

IQmath Libraries

(16K 16, 0-Wait State)´

0x3F 8000

0x3F F3B0 Boot ROM (16K 16, 0-Wait State)´

CPU Vector Table (32 Vectors, Enabled if VMAP = 1)

0x3F FFC0

A. On non-USB devices, 0x00 4000–0x00 4FFF is Reserved.

Figure 8-6. 28064 Memory Map

www.ti.com

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS DMA-Acwulme

M0 Vector RAM (Enabled if VMAP = 0)

M0 SARAM (1K 16, 0-Wait)´

0x00 0000

0x00 0040

M1 SARAM (1K 16, 0-Wait)´

0x00 0400

Data Space Prog Space

Reserved

Peripheral Frame 0

0x00 0800

0x00 0D00 PIE Vector - RAM

(256 16)

(Enabled if

VMAP = 1,

ENPIE = 1)

0x00 0E00 Peripheral Frame 0

0x00 1400 Reserved

0x00 8000 L0 DPSARAM (2K 16)

(0-Wait, Secure Zone + ECSL)

0x00 8800 L1 DPSARAM (1K 16)

(0-Wait, Secure Zone + ECSL)

0x00 8C00 L2 DPSARAM (1K 16)

(0-Wait, Secure Zone + ECSL)

0x00 9000 L3 DPSARAM (4K 16)

(0-Wait, Secure Zone + ECSL)

0x00 A000 L4 SARAM (8K 16)

(0-Wait, Secure Zone + ECSL)

0x00 C000 L5 DPSARAM (8K 16)

(0-Wait, DMA RAM 0)

L6 DPSARAM (8K 16)

(0-Wait, DMA RAM 1)

0x00 E000

Reserved

0x01 0000 Reserved

0x3D 7800 User OTP (1K 16, Secure Zone + ECSL)´

0x3D 7C80 Calibration Data

0x3D 7BFA Reserved

FLASH

(64K 16, 8 Sectors, Secure Zone + ECSL)´

128-Bit Password

0x3E 8000

0x3F 7FF8

0x3D 7CC0 Get_mode function

0x3D 7CD0

0x3D 7E82

Reserved

0x3D 7E80 PARTID

Calibration Data

Reserved

0x3D 7EB0

Peripheral Frame 3

(4K 16, Protected)

DMA-Accessible

0x00 5000

0x00 4000

Peripheral Frame 2

(4K 16, Protected)´

0x00 7000

Peripheral Frame 1

(4K 16, Protected)´

USB Control Registers(A)

0x00 6000

IQmath Libraries

(16K 16, 0-Wait State)´

0x3F 8000

0x3F F3B0 Boot ROM (16K 16, 0-Wait State)´

CPU Vector Table (32 Vectors, Enabled if VMAP = 1)

0x3F FFC0

A. On non-USB devices, 0x00 4000–0x00 4FFF is Reserved.

Figure 8-7. 28063 Memory Map

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS DMA-Accessmln

M0 Vector RAM (Enabled if VMAP = 0)

M0 SARAM (1K 16, 0-Wait)´

0x00 0000

0x00 0040

M1 SARAM (1K 16, 0-Wait)´

0x00 0400

Data Space Prog Space

Reserved

Peripheral Frame 0

0x00 0800

0x00 0D00 PIE Vector - RAM

(256 16)

(Enabled if

VMAP = 1,

ENPIE = 1)

0x00 0E00 Peripheral Frame 0

0x00 1400 Reserved

0x00 8000 L0 DPSARAM (2K 16)

(0-Wait, Secure Zone + ECSL)

0x00 8800 L1 DPSARAM (1K 16)

(0-Wait, Secure Zone + ECSL)

0x00 8C00 L2 DPSARAM (1K 16)

(0-Wait, Secure Zone + ECSL)

0x00 9000 L3 DPSARAM (4K 16)

(0-Wait, Secure Zone + ECSL)

0x00 A000 L4 SARAM (8K 16)

(0-Wait, Secure Zone + ECSL)

0x00 C000 L5 DPSARAM (8K 16)

(0-Wait, DMA RAM 0)

Reserved

0x00 E000 Reserved

0x3D 7800 User OTP (1K 16, Secure Zone + ECSL)´

0x3D 7C80 Calibration Data

0x3D 7BFA Reserved

FLASH

(64K 16, 8 Sectors, Secure Zone + ECSL)´

128-Bit Password

0x3E 8000

0x3F 7FF8

0x3D 7CC0 Get_mode function

0x3D 7CD0

0x3D 7E82

Reserved

0x3D 7E80 PARTID

Calibration Data

Reserved

0x3D 7EB0

Peripheral Frame 3

(4K 16, Protected)

DMA-Accessible

0x00 5000

0x00 4000

Peripheral Frame 2

(4K 16, Protected)´

0x00 7000

Peripheral Frame 1

(4K 16, Protected)´

USB Control Registers(A)

0x00 6000

FAST, SpinTAC, and IQmath Libraries

(16K 16, 0-Wait State)

(B)(C)

0x3F 8000

0x3F F3B0 Boot ROM (16K 16, 0-Wait State)´

CPU Vector Table (32 Vectors, Enabled if VMAP = 1)

0x3F FFC0

A. On non-USB devices, 0x00 4000–0x00 4FFF is Reserved.

B. FAST™ and SpinTAC™ libraries exist only on F2806xM and F2806xF devices.

C. The ROM contents from 0x3F 8000–0x3F F3AF differ between F2806x parts and F2806xM/F2806xF parts. See the respective memory

map figures in the Boot ROM chapter of the TMS320x2806x Technical Reference Manual .

Figure 8-8. 28062, 28062F Memory Map

www.ti.com

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

Table 8-3. Addresses of Flash Sectors in 28069, 28069F, 28069M,

28068F, 28068M, F28067, F28066

ADDRESS RANGE PROGRAM AND DATA SPACE

0x3D 8000 to 0x3D BFFF Sector H (16K × 16)

0x3D C000 to 0x3D FFFF Sector G (16K × 16)

0x3E 0000 to 0x3E 3FFF Sector F (16K × 16)

0x3E 4000 to 0x3E 7FFF Sector E (16K × 16)

0x3E 8000 to 0x3E BFFF Sector D (16K × 16)

0x3E C000 to 0x3E FFFF Sector C (16K × 16)

0x3F 0000 to 0x3F 3FFF Sector B (16K × 16)

0x3F 4000 to 0x3F 7FF5 Sector A (16K × 16)

0x3F 7FF6 to 0x3F 7FF7 Boot-to-Flash Entry Point

(program branch instruction here)

0x3F 7FF8 to 0x3F 7FFF Security Password (128-Bit)

(Do not program to all zeros)

Table 8-4. Addresses of Flash Sectors in F28065, F28064, F28063, 28062,

28062F

ADDRESS RANGE PROGRAM AND DATA SPACE

0x3E 8000 to 0x3E 9FFF Sector H (8K × 16)

0x3E A000 to 0x3E BFFF Sector G (8K × 16)

0x3E C000 to 0x3E DFFF Sector F (8K × 16)

0x3E E000 to 0x3E FFFF Sector E (8K × 16)

0x3F 0000 to 0x3F 1FFF Sector D (8K × 16)

0x3F 2000 to 0x3F 3FFF Sector C (8K × 16)

0x3F 4000 to 0x3F 5FFF Sector B (8K × 16)

0x3F 6000 to 0x3F 7FF5 Sector A (8K × 16)

0x3F 7FF6 to 0x3F 7FF7 Boot-to-Flash Entry Point

(program branch instruction here)

0x3F 7FF8 to 0x3F 7FFF Security Password (128-Bit)

(Do not program to all zeros)

Note

Addresses 0x3F 7FF0 to 0x3F 7FF5 are reserved for data and should not contain program code.

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

Peripheral Frame 1 and Peripheral Frame 2 are grouped together to enable these blocks to be write/read

peripheral block protected. The protected mode makes sure that all accesses to these blocks happen as written.

Because of the pipeline, a write immediately followed by a read to different memory locations, will appear in

reverse order on the memory bus of the CPU. This can cause problems in certain peripheral applications where

the user expected the write to occur first (as written). The CPU supports a block protection mode where a region

of memory can be protected so that operations occur as written (the penalty is extra cycles are added to align

the operations). This mode is programmable and by default, it protects the selected zones.

The wait states for the various spaces in the memory map area are listed in Table 8-5.

Table 8-5. Wait States

AREA WAIT STATES (CPU) COMMENTS

M0 and M1 SARAMs 0-wait Fixed

Peripheral Frame 0 0-wait

Peripheral Frame 1 0-wait (writes) Cycles can be extended by peripheral-generated ready.

2-wait (reads) Back-to-back write operations to Peripheral Frame 1 registers will incur

a 1-cycle stall (1-cycle delay).

Peripheral Frame 2 0-wait (writes) Fixed. Cycles cannot be extended by the peripheral.

2-wait (reads)

Peripheral Frame 3 0-wait (writes) Assumes no conflict between CPU and CLA/DMA cycles. The wait

states can be extended by peripheral-generated ready.

2-wait (reads)

L0–L8 SARAM 0-wait data and program Assumes no CPU conflicts

OTP Programmable Programmed through the Flash registers.

1-wait minimum 1-wait is minimum number of wait states allowed.

FLASH Programmable Programmed through the Flash registers.

0-wait Paged min

1-wait Random min

Random ≥ Paged

FLASH Password 16-wait fixed Wait states of password locations are fixed.

Boot-ROM 0-wait

www.ti.com

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

8.3 Register Maps

The devices contain four peripheral register spaces. The spaces are categorized as follows:

Peripheral Frame 0: These are peripherals that are mapped directly to the CPU memory bus, which

supports 16-bit and 32-bit accesses. See Table 8-6.

Peripheral Frame 1: These are peripherals that are mapped to the 32-bit peripheral bus. See Table

8-7.

Peripheral Frame 2: These are peripherals that are mapped to the 16-bit peripheral bus. See Table

8-8.

Peripheral Frame 3: These are peripherals that are mapped to the 32-bit peripheral bus. See Table

8-9.

Table 8-6. Peripheral Frame 0 Registers

NAME(1) ADDRESS RANGE SIZE (×16) EALLOW PROTECTED(2)

Device Debug registers 0x00 0880 to 0x00 0984 261 Yes

System Power Control registers 0x00 0985 to 0x00 0987 3 Yes

FLASH registers(3) 0x00 0A80 to 0x00 0ADF 96 Yes

Code Security Module registers 0x00 0AE0 to 0x00 0AEF 16 Yes

ADC registers (0 wait read only) 0x00 0B00 to 0x00 0B0F 16 No

CPU-TIMER0, CPU-TIMER1, CPU-TIMER2

registers 0x00 0C00 to 0x00 0C3F 64 No

PIE registers 0x00 0CE0 to 0x00 0CFF 32 No

PIE Vector Table 0x00 0D00 to 0x00 0DFF 256 Yes

DMA registers 0x00 1000 to 0x00 11FF 512 Yes

CLA registers 0x00 1400 to 0x00 147F 128 Yes

CLA to CPU Message RAM (CPU writes ignored) 0x00 1480 to 0x00 14FF 128 NA

CPU to CLA Message RAM (CLA writes ignored) 0x00 1500 to 0x00 157F 128 NA

(1) Registers in Frame 0 support 16-bit and 32-bit accesses.

(2) If registers are EALLOW protected, then writes cannot be performed until the EALLOW instruction is executed. The EDIS instruction

disables writes to prevent stray code or pointers from corrupting register contents.

(3) The Flash Registers are also protected by the Code Security Module (CSM).

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

TEXAS INSTRUMENTS

Table 8-7. Peripheral Frame 1 Registers

NAME ADDRESS RANGE SIZE (×16) EALLOW PROTECTED

eCAN-A registers 0x00 6000 to 0x00 61FF 512 (1)

HRCAP1 registers 0x00 6AC0 to 0x00 6ADF 32 (1)

HRCAP2 registers 0x00 6AE0 to 0x00 6AFF 32 (1)

HRCAP3 registers 0x00 6C80 to 0x00 6C9F 32 (1)

HRCAP4 registers 0x00 6CA0 to 0x00 6CBF 32 (1)

GPIO registers 0x00 6F80 to 0x00 6FFF 128 (1)

(1) Some registers are EALLOW protected. See the module reference guide for more information.

Table 8-8. Peripheral Frame 2 Registers

NAME ADDRESS RANGE SIZE (×16) EALLOW PROTECTED

System Control registers 0x00 7010 to 0x00 702F 32 Yes

SPI-A registers 0x00 7040 to 0x00 704F 16 No

SCI-A registers 0x00 7050 to 0x00 705F 16 No

NMI Watchdog Interrupt registers 0x00 7060 to 0x00 706F 16 Yes

External Interrupt registers 0x00 7070 to 0x00 707F 16 Yes

ADC registers 0x00 7100 to 0x00 717F 128 (1)

SPI-B registers 0x00 7740 to 0x00 774F 16 No

SCI-B registers 0x00 7750 to 0x00 775F 16 No

I2C-A registers 0x00 7900 to 0x00 793F 64 (1)

(1) Some registers are EALLOW protected. See the module reference guide for more information.

Table 8-9. Peripheral Frame 3 Registers

NAME ADDRESS RANGE SIZE (×16) EALLOW PROTECTED

USB0 registers 0x00 4000 to 0x00 4FFF 4096 No

McBSP-A registers 0x00 5000 to 0x00 503F 64 No

Comparator 1 registers 0x00 6400 to 0x00 641F 32 (1)

Comparator 2 registers 0x00 6420 to 0x00 643F 32 (1)

Comparator 3 registers 0x00 6440 to 0x00 645F 32 (1)

ePWM1 + HRPWM1 registers 0x00 6800 to 0x00 683F 64 (1)

ePWM2 + HRPWM2 registers 0x00 6840 to 0x00 687F 64 (1)

ePWM3 + HRPWM3 registers 0x00 6880 to 0x00 68BF 64 (1)

ePWM4 + HRPWM4 registers 0x00 68C0 to 0x00 68FF 64 (1)

ePWM5 + HRPWM5 registers 0x00 6900 to 0x00 693F 64 (1)

ePWM6 + HRPWM6 registers 0x00 6940 to 0x00 697F 64 (1)

ePWM7 + HRPWM7 registers 0x00 6980 to 0x00 69BF 64 (1)

ePWM8 + HRPWM8 registers 0x00 69C0 to 0x00 69FF 64 (1)

eCAP1 registers 0x00 6A00 to 0x00 6A1F 32 No

eCAP2 registers 0x00 6A20 to 0x00 6A3F 32 No

eCAP3 registers 0x00 6A40 to 0x00 6A57 32 No

eQEP1 registers 0x00 6B00 to 0x00 6B3F 64 (1)

eQEP2 registers 0x00 6B40 to 0x00 6B7F 64 (1)

(1) Some registers are EALLOW protected. See the module reference guide for more information.

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TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

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Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

8.4 Device Debug Registers

These registers are used to control the protection mode of the C28x CPU and to monitor some critical device

signals. The registers are defined in Table 8-10.

Table 8-10. Device Debug Registers

NAME ADDRESS RANGE SIZE (×16) DESCRIPTION EALLOW

PROTECTED

DEVICECNF 0x0880–

0x0881 2 Device Configuration Register Yes

PARTID 0x3D 7E80 1 Part ID Register TMS320F28069PZP/PZ 0x009E

TMS320F28069UPZP/PZ 0x009F

TMS320F28069MPZP/PZ 0x009E

TMS320F28069FPZP/PZ 0x009E

TMS320F28069PFP/PN 0x009C

TMS320F28069UPFP/PN 0x009D

TMS320F28069MPFP/PN 0x009C

TMS320F28069FPFP/PN 0x009C

TMS320F28068UPZP/PZ 0x008F

TMS320F28068MPZP/PZ 0x008E

TMS320F28068FPZP/PZ 0x008E

TMS320F28068UPFP/PN 0x008D

TMS320F28068MPFP/PN 0x008C

TMS320F28068FPFP/PN 0x008C

TMS320F28067PZP/PZ 0x008A

TMS320F28067UPZP/PZ 0x008B

TMS320F28067PFP/PN 0x0088

TMS320F28067UPFP/PN 0x0089

TMS320F28066PZP/PZ 0x0086

TMS320F28066UPZP/PZ 0x0087

TMS320F28066PFP/PN 0x0084

TMS320F28066UPFP/PN 0x0085

TMS320F28065PZP/PZ 0x007E

TMS320F28065UPZP/PZ 0x007F

TMS320F28065PFP/PN 0x007C

TMS320F28065UPFP/PN 0x007D

TMS320F28064PZP/PZ 0x006E

TMS320F28064UPZP/PZ 0x006F

TMS320F28064PFP/PN 0x006C

TMS320F28064UPFP/PN 0x006D

TMS320F28063PZP/PZ 0x006A

TMS320F28063UPZP/PZ 0x006B

TMS320F28063PFP/PN 0x0068

TMS320F28063UPFP/PN 0x0069

TMS320F28062PZP/PZ 0x0066

TMS320F28062UPZP/PZ 0x0067

TMS320F28062FPZP/PZ 0x0066

TMS320F28062PFP/PN 0x0064

TMS320F28062UPFP/PN 0x0065

TMS320F28062FPFP/PN 0x0064

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

Table 8-10. Device Debug Registers (continued)

NAME ADDRESS RANGE SIZE (×16) DESCRIPTION EALLOW

PROTECTED

CLASSID 0x0882 1 Class ID Register TMS320F28069 0x009F

TMS320F28069U0x009F

TMS320F28069M0x009F

TMS320F28069F0x009F

TMS320F28068U0x008F

TMS320F28068M0x008F

TMS320F28068F0x008F

TMS320F28067 0x008F

TMS320F28067U0x008F

TMS320F28066 0x008F

TMS320F28066U0x008F

TMS320F28065 0x007F

TMS320F28065U0x007F

TMS320F28064 0x006F

TMS320F28064U0x006F

TMS320F28063 0x006F

TMS320F28063U0x006F

TMS320F28062 0x006F

TMS320F28062U0x006F

TMS320F28062F0x006F

REVID 0x0883 1 Revision ID Register 0x0000 - Silicon Rev. 0 - TMX

No0x0001 - Silicon Rev. A - TMS

0x0002 - Silicon Rev. B - TMS

Instaspin feature 0x3D7FBE 1 0xFFFF = Normal part

No0xFF7F = Fast only (F part)

0xFF3F = Fast + Sping (M part)

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TMS320F28062, TMS320F28062F

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Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

8.5 VREG, BOR, POR

Although the core and I/O circuitry operate on two different voltages, these devices have an on-chip VREG

to generate the VDD voltage from the VDDIO supply. This eliminates the cost and space of a second external

regulator on an application board. Additionally, internal power-on reset (POR) and brownout reset (BOR) circuits

monitor both the VDD and VDDIO rails during power-up and run mode.

8.5.1 On-chip VREG

A linear regulator generates the core voltage (VDD) from the VDDIO supply. Therefore, although capacitors are

required on each VDD pin to stabilize the generated voltage, power need not be supplied to these pins to operate

the device. Conversely, the VREG can be disabled, should power or redundancy be the primary concern of the

application.

8.5.1.1 Using the On-chip VREG

To use the on-chip VREG, the VREGENZ pin should be tied low and the appropriate recommended operating

voltage should be supplied to the VDDIO and VDDA pins. In this case, the VDD voltage needed by the core logic

will be generated by the VREG. Each VDD pin requires on the order of 1.2 μF (minimum) capacitance for proper

regulation of the VREG. These capacitors should be located as close as possible to the VDD pins. Driving an

external load with the internal VREG is not supported.

8.5.1.2 Disabling the On-chip VREG

To conserve power, it is also possible to disable the on-chip VREG and supply the core logic voltage to the VDD

pins with a more efficient external regulator. To enable this option, the VREGENZ pin must be tied high.

8.5.2 On-chip Power-On Reset (POR) and Brownout Reset (BOR) Circuit

Two on-chip supervisory circuits, the power-on reset (POR) and the brownout reset (BOR) remove the burden

of monitoring the VDD and VDDIO supply rails from the application board. The purpose of the POR is to create

a clean reset throughout the device during the entire power-up procedure. The trip point is a looser, lower trip

point than the BOR, which watches for dips in the VDD or VDDIO rail during device operation. The POR function

is present on both VDD and VDDIO rails at all times. After initial device power-up, the BOR function is present on

VDDIO at all times, and on VDD when the internal VREG is enabled ( VREGENZ pin is tied low). Both functions

tie the XRS pin low when one of the voltages is below their respective trip point. VDD BOR and overvoltage

trip points are outside of the recommended operating voltages. Proper device operation cannot be ensured. If

overvoltage or undervoltage conditions affecting the system is a concern for an application, an external voltage

supervisor should be added. Figure 8-9 shows the VREG, POR, and BOR. To disable both the VDD and VDDIO

BOR functions, a bit is provided in the BORCFG register. For details, see the Systems Control and Interrupts

chapter of the TMS320x2806x Technical Reference Manual .

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS U

I/O Pin

Out

DIR (0 = Input, 1 = Output)

(Force Hi-Z When High)

SYSRS

C28

Core

Sync RS

PLL

Clocking

Logic

MCLKRS

VREGHALT

Deglitch

Filter

On-Chip

Voltage

Regulator

(VREG)

VREGENZ

POR/BOR

Generating

Module

XRS

WDRST

SYSCLKOUT

WDRST(A)

JTAG

TCK

Detect

Logic

PBRS(B)

Internal

Weak PU

A. WDRST is the reset signal from the CPU-watchdog.

B. PBRS is the reset signal from the POR/BOR module.

Figure 8-9. VREG + POR + BOR + Reset Signal Connectivity

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TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

8.6 System Control

This section describes the oscillator and clocking mechanisms, the watchdog function and the low-power modes.

Table 8-11. PLL, Clocking, Watchdog, and Low-Power Mode Registers

NAME ADDRESS SIZE (×16) DESCRIPTION(1)

BORCFG 0x00 0985 1 BOR Configuration Register

XCLK 0x00 7010 1 XCLKOUT Control

PLLSTS 0x00 7011 1 PLL Status Register

CLKCTL 0x00 7012 1 Clock Control Register

PLLLOCKPRD 0x00 7013 1 PLL Lock Period

INTOSC1TRIM 0x00 7014 1 Internal Oscillator 1 Trim Register

INTOSC2TRIM 0x00 7016 1 Internal Oscillator 2 Trim Register

PCLKCR2 0x00 7019 1 Peripheral Clock Control Register 2

LOSPCP 0x00 701B 1 Low-Speed Peripheral Clock Prescaler Register

PCLKCR0 0x00 701C 1 Peripheral Clock Control Register 0

PCLKCR1 0x00 701D 1 Peripheral Clock Control Register 1

LPMCR0 0x00 701E 1 Low-Power Mode Control Register 0

PCLKCR3 0x00 7020 1 Peripheral Clock Control Register 3

PLLCR 0x00 7021 1 PLL Control Register

SCSR 0x00 7022 1 System Control and Status Register

WDCNTR 0x00 7023 1 Watchdog Counter Register

WDKEY 0x00 7025 1 Watchdog Reset Key Register

WDCR 0x00 7029 1 Watchdog Control Register

JTAGDEBUG 0x00 702A 1 JTAG Port Debug Register

PLL2CTL 0x00 7030 1 PLL2 Configuration Register

PLL2MULT 0x00 7032 1 PLL2 Multiplier Register

PLL2STS 0x00 7034 1 PLL2 Lock Status Register

SYSCLK2CNTR 0x00 7036 1 SYSCLK2 Clock Counter Register

EPWMCFG 0x00 703A 1 ePWM DMA/CLA Configuration Register

(1) All registers in this table are EALLOW protected.

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

Figure 8-10 shows the various clock domains that are discussed. Figure 8-11 shows the various clock sources

(both internal and external) that can provide a clock for device operation.

LOSPCP

(System Ctrl Regs)

Peripheral

Registers

SPI-A, SPI-B, SCI-A, SCI-B PF2

LSPCLK

SYSCLKOUT

C28x Core CLKIN

Peripheral

Registers

USB PF3

GPIO

Mux

LOSPCP

(System Ctrl Regs)

Peripheral

Registers

McBSP PF3

LSPCLK

Peripheral

Registers

eCAN-A PF1

Peripheral

Registers

eCAP1, eCAP2, eCAP3

eQEP1, eQEP2 PF3

Peripheral

Registers

ePWM1, ePWM2,

ePWM3, ePWM4, ePWM5,

ePWM6, ePWM7, ePWM8 PF3

Peripheral

Registers

I2C-A

PF2

Peripheral

Registers

HRCAP1, HRCAP2,

HRCAP3, HRCAP4 PF1

ADC

Registers

12-Bit ADC16 Ch PF2

PF0

COMP

Registers

COMP1, COMP2, COMP3

PF3

Analog

GPIO

Mux

PCLKCR0/1/2/3

(System Ctrl Regs)

Clock Enables

PLL2

I/O

A. CLKIN is the clock into the CPU. CLKIN is passed out of the CPU as SYSCLKOUT (that is, CLKIN is the same frequency as

SYSCLKOUT).

Figure 8-10. Clock and Reset Domains

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TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

INTOSC1TRIM Reg(A)

Internal

OSC 1

(10 MHz)

OSCE

CLKCTL[INTOSC1OFF]

WAKEOSC

CLKCTL[INTOSC1HALT]

INTOSC2TRIM Reg(A) Internal

OSC 2

(10 MHz)

OSCE

CLKCTL[INTOSC2OFF]

CLKCTL[INTOSC2HALT]

1 = Turn OSC Off

1 = Ignore HALT

1 = Turn OSC Off

1 = Ignore HALT

XCLK[XCLKINSEL] 0 = GPIO38

1 = GPIO19

GPIO19

GPIO38

CLKCTL[XCLKINOFF]

(Crystal)

OSC

XCLKIN

CLKCTL[XTALOSCOFF] 0 = OSC on (default on reset)

1 = Turn OSC off

OSC1CLK

OSCCLKSRC1

OSC2CLK 0

CLKCTL[WDCLKSRCSEL]

(OSC1CLK on reset)XRS

CLKCTL[OSCCLKSRCSEL]

SYSCLKOUT

CLKCTL[TMR2CLKSRCSEL]

OSCCLKSRC2

Prescale

/1, /2, /4,

/8, /16

CLKCTL[TRM2CLKPRESCALE]

DEVICECNF[SYSCLK2DIV2DIS]

01, 10, 11

CPUTMR2CLK

SYNC

Edge

Detect

CLKCTL[OSCCLKSRC2SEL]

SYSCLKOUT

WAKEOSC

(Oscillators enabled when this signal is high)

EXTCLK

XTAL

XCLKIN

(OSC1CLK on reset)XRS

OSCCLK PLL

Missing-Clock-Detect Circuit(B)

CPU-Watchdog

PLL2CTL.PLL2CLKSRCSEL

PLL2CTL.PLL2EN

SYSCLK2 to USB

PLL2CLK HRCAP

PLL2

A. Register loaded from TI OTP-based calibration function.

B. See Section 8.6.5 for details on missing clock detection.

Figure 8-11. Clock Tree

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

8.6.1 Internal Zero Pin Oscillators

The F2806x devices contain two independent internal zero pin oscillators. By default both oscillators are turned

on at power up, and internal oscillator 1 is the default clock source at this time. For power savings, unused

oscillators may be powered down by the user. The center frequency of these oscillators is determined by their

respective oscillator trim registers, written to in the calibration routine as part of the boot ROM execution. See

Section 8.9 for more information on these oscillators.

8.6.2 Crystal Oscillator Option

The on-chip crystal oscillator X1 and X2 pins are 1.8-V level signals and must never have 3.3-V level signals

applied to them. If a system 3.3-V external oscillator is to be used as a clock source, it should be connected to

the XCLKIN pin only. The X1 pin is not intended to be used as a single-ended clock input, it should be used with

X2 and a crystal.

The typical specifications for the external quartz crystal (fundamental mode, parallel resonant) are listed in Table

8-12. Furthermore, ESR range = 30 to 150 Ω. For Table 8-12, Cshunt should be less than or equal to 5 pF.

Table 8-12. Typical Specifications for External Quartz Crystal

FREQUENCY (MHz) Rd (Ω) CL1 (pF) CL2 (pF)

5 2200 18 18

10 470 15 15

15 0 15 15

20 0 12 12

X2X1

Crystal

XCLKIN/GPIO19/38

Turn off

XCLKIN path

in CLKCTL

CL1 CL2

Figure 8-12. Using the On-chip Crystal Oscillator

Note

1. CL1 and CL2 are the total capacitance of the circuit board and components excluding the IC and

crystal. The value is usually approximately twice the value of the load capacitance of the crystal.

2. The load capacitance of the crystal is described in the crystal specifications of the manufacturers.

3. TI recommends that customers have the resonator/crystal vendor characterize the operation of

their device with the MCU chip. The resonator/crystal vendor has the equipment and expertise

to tune the tank circuit. The vendor can also advise the customer regarding the proper tank

component values that will produce proper start-up and stability over the entire operating range.

External Clock Signal

(Toggling 0−VDDIO)

XCLKIN/GPIO19/38 X2

Figure 8-13. Using a 3.3-V External Oscillator

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SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

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TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

TEXAS INSTRUMENTS

8.6.3 PLL-Based Clock Module

The devices have an on-chip, PLL-based clock module. This module provides all the necessary clocking signals

for the device, as well as control for low-power mode entry. The PLL has a 5-bit ratio control PLLCR[DIV] to

select different CPU clock rates. The watchdog module should be disabled before writing to the PLLCR register.

The watchdog module can be re-enabled (if need be) after the PLL module has stabilized, which takes 1 ms.

The input clock and PLLCR[DIV] bits should be chosen in such a way that the output frequency of the PLL

(VCOCLK) is at least 50 MHz.

Table 8-13. PLL Settings

PLLCR[DIV] VALUE(2) (3) SYSCLKOUT (CLKIN)

PLLSTS[DIVSEL] = 0 or 1(1) PLLSTS[DIVSEL] = 2 PLLSTS[DIVSEL] = 3

00000 (PLL bypass) OSCCLK/4 (Default)(2) OSCCLK/2 OSCCLK

00001 (OSCCLK * 1)/4 (OSCCLK * 1)/2 (OSCCLK * 1)/1

00010 (OSCCLK * 2)/4 (OSCCLK * 2)/2 (OSCCLK * 2)/1

00011 (OSCCLK * 3)/4 (OSCCLK * 3)/2 (OSCCLK * 3)/1

00100 (OSCCLK * 4)/4 (OSCCLK * 4)/2 (OSCCLK * 4)/1

00101 (OSCCLK * 5)/4 (OSCCLK * 5)/2 (OSCCLK * 5)/1

00110 (OSCCLK * 6)/4 (OSCCLK * 6)/2 (OSCCLK * 6)/1

00111 (OSCCLK * 7)/4 (OSCCLK * 7)/2 (OSCCLK * 7)/1

01000 (OSCCLK * 8)/4 (OSCCLK * 8)/2 (OSCCLK * 8)/1

01001 (OSCCLK * 9)/4 (OSCCLK * 9)/2 (OSCCLK * 9)/1

01010 (OSCCLK * 10)/4 (OSCCLK * 10)/2 (OSCCLK * 10)/1

01011 (OSCCLK * 11)/4 (OSCCLK * 11)/2 (OSCCLK * 11)/1

01100 (OSCCLK * 12)/4 (OSCCLK * 12)/2 (OSCCLK * 12)/1

01101 (OSCCLK * 13)/4 (OSCCLK * 13)/2 (OSCCLK * 13)/1

01110 (OSCCLK * 14)/4 (OSCCLK * 14)/2 (OSCCLK * 14)/1

01111 (OSCCLK * 15)/4 (OSCCLK * 15)/2 (OSCCLK * 15)/1

10000 (OSCCLK * 16)/4 (OSCCLK * 16)/2 (OSCCLK * 16)/1

10001 (OSCCLK * 17)/4 (OSCCLK * 17)/2 (OSCCLK * 17)/1

10010 (OSCCLK * 18)/4 (OSCCLK * 18)/2 (OSCCLK * 18)/1

(1) By default, PLLSTS[DIVSEL] is configured for /4. (The boot ROM changes this to /1.) PLLSTS[DIVSEL] must be 0 before writing to the

PLLCR and should be changed only after PLLSTS[PLLLOCKS] = 1.

(2) The PLL control register (PLLCR) and PLL Status Register (PLLSTS) are reset to their default state by the XRS signal or a watchdog

reset only. A reset issued by the debugger or the missing clock detect logic has no effect.

(3) This register is EALLOW protected. See the Systems Control and Interrupts chapter of the TMS320x2806x Technical Reference

Manual for more information.

Table 8-14. CLKIN Divide Options

PLLSTS [DIVSEL] CLKIN DIVIDE

0 /4

1 /4

2 /2

3 /1

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

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TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

The PLL-based clock module provides four modes of operation:

• INTOSC1 (Internal Zero-pin Oscillator 1): This is the on-chip internal oscillator 1. This can provide the clock

for the Watchdog block, core and CPU-Timer 2

•INTOSC2 (Internal Zero-pin Oscillator 2): This is the on-chip internal oscillator 2. This can provide the clock

for the Watchdog block, core and CPU-Timer 2. Both INTOSC1 and INTOSC2 can be independently chosen

for the Watchdog block, core and CPU-Timer 2.

•Crystal/Resonator Operation: The on-chip (crystal) oscillator enables the use of an external crystal/

resonator attached to the device to provide the time base. The crystal/resonator is connected to the X1/X2

pins. Some devices may not have the X1/X2 pins. See Section 6.2.1 for details.

•External Clock Source Operation: If the on-chip (crystal) oscillator is not used, this mode allows it to be

bypassed. The device clocks are generated from an external clock source input on the XCLKIN pin. The

XCLKIN is multiplexed with GPIO19 or GPIO38 pin. The XCLKIN input can be selected as GPIO19 or

GPIO38 through the XCLKINSEL bit in XCLK register. The CLKCTL[XCLKINOFF] bit disables this clock input

(forced low). If the clock source is not used or the respective pins are used as GPIOs, the user should disable

at boot time.

Before changing clock sources, ensure that the target clock is present. If a clock is not present, then that clock

source must be disabled (using the CLKCTL register) before switching clocks.

Table 8-15. Possible PLL Configuration Modes

PLL MODE REMARKS PLLSTS[DIVSEL] CLKIN AND SYSCLKOUT

PLL Off Invoked by the user setting the PLLOFF bit in the PLLSTS register. The

PLL block is disabled in this mode. This can be useful to reduce system

noise and for low-power operation. The PLLCR register must first be

set to 0x0000 (PLL Bypass) before entering this mode. The CPU clock

(CLKIN) is derived directly from the input clock on either X1/X2, X1 or

XCLKIN.

0, 1 OSCCLK/4

2 OSCCLK/2

3 OSCCLK/1

PLL Bypass PLL Bypass is the default PLL configuration upon power-up or after an

external reset ( XRS). This mode is selected when the PLLCR register is

set to 0x0000 or while the PLL locks to a new frequency after the PLLCR

PLL is not turned off.

0, 1 OSCCLK/4

2 OSCCLK/2

3 OSCCLK/1

PLL Enable Achieved by writing a non-zero value n into the PLLCR register. Upon

writing to the PLLCR the device will switch to PLL Bypass mode until the

PLL locks.

0, 1 OSCCLK * n/4

2 OSCCLK * n/2

3 OSCCLK * n/1

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8.6.4 USB and HRCAP PLL Module (PLL2)

In addition to the main system PLL, these devices also contain a second PLL (PLL2) which can be used to clock

the USB and HRCAP peripherals. The PLL supports multipliers of 1 to 15 and has a fixed divide-by-two on its

output.

PLL2 may be clocked from the following three sources by modifying the PLL2CLKSRCSEL bits appropriately in

the PLL2CTL register:

• INTOSC1 (Internal Zero-pin Oscillator 1): This is the on-chip internal oscillator 1 and provides a 10-MHz

clock. If used as a clock source for HRCAP, the oscillator compensation routine should be called frequently.

Because of accuracy requirements, INTOSC1 cannot be used as a clock source for the USB.

• Crystal/Resonator Operation: The (crystal) oscillator enables the use of an external crystal or resonator

attached to the device to provide the time base. The crystal or resonator is connected to the X1/X2 pins.

• External Clock Source Operation: This mode allows the reference clock to be derived from an external

single-ended clock source connected to either GPIO19 or GPIO38. The XCLKINSEL bit in the XCLK register

should be set appropriately to enable the selected GPIO to drive XCLKIN.

Note

For proper operation of the USB module, PLL2 should be configured to generate a 120-MHz clock.

This will be divided by two to yield the desired 60 MHz for the USB peripheral.

HRCAP supports a maximum clock input frequency of 120 MHz.

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I TEXAS INSTRUMENTS

8.6.5 Loss of Input Clock (NMI Watchdog Function)

The 2806x devices may be clocked from either one of the internal zero-pin oscillators (INTOSC1/INTOSC2), the

on-chip crystal oscillator, or from an external clock input. Regardless of the clock source, in PLL-enabled and

PLL-bypass mode, if the input clock to the PLL vanishes, the PLL will issue a limp-mode clock at its output. This

limp-mode clock continues to clock the CPU and peripherals at a typical frequency of 1–5 MHz.

When the limp mode is activated, a CLOCKFAIL signal is generated that is latched as an NMI interrupt.

Depending on how the NMIRESETSEL bit has been configured, a reset to the device can be fired immediately

or the NMI watchdog counter can issue a reset when it overflows. In addition to this, the Missing Clock Status

(MCLKSTS) bit is set. The NMI interrupt could be used by the application to detect the input clock failure and

initiate necessary corrective action such as switching over to an alternative clock source (if available) or initiate a

shut-down procedure for the system.

If the software does not respond to the clock-fail condition, the NMI watchdog triggers a reset after a

preprogrammed time interval. Figure 8-14 shows the interrupt mechanisms involved.

NMIFLG[NMINT]

Generate

Interrupt

Pulse

When

Input = 1

NMINT

Latch

Clear

Set Clear

NMIFLGCLR[NMINT]

XRS

NMICFG[CLOCKFAIL]

Latch

Clear

Set

Clear

XRS

NMIFLG[CLOCKFAIL]

NMI Watchdog

SYSCLKOUT

SYSRS

NMIRS

NMIWDPRD[15:0]

NMIWDCNT[15:0]

NMIFLGCLR[CLOCKFAIL]

SYNC?

NMIFLGFRC[CLOCKFAIL]

SYSCLKOUT

See System

Control Section

CLOCKFAIL

Figure 8-14. NMI-Watchdog

8.6.6 CPU Watchdog Module

The CPU watchdog module on the 2806x device is similar to the one used on the 281x/280x/283xx devices.

This module generates an output pulse, 512 oscillator clocks wide (OSCCLK), whenever the 8-bit watchdog up

counter has reached its maximum value. To prevent this, the user must disable the counter or the software must

periodically write a 0x55 + 0xAA sequence into the watchdog key register that resets the watchdog counter.

Figure 8-15 shows the various functional blocks within the watchdog module.

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TMS320F28062, TMS320F28062F

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TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS lfl l—I / - —+ D 4»

Normally, when the input clocks are present, the CPU-watchdog counter decrements to initiate a CPU-watchdog

reset or WDINT interrupt. However, when the external input clock fails, the CPU-watchdog counter stops

decrementing (that is, the watchdog counter does not change with the limp-mode clock).

Note

The CPU-watchdog is different from the NMI watchdog. The CPU-watchdog is the legacy watchdog

that is present in all 28x devices.

Note

Applications in which the correct CPU operating frequency is absolutely critical should implement a

mechanism by which the MCU will be held in reset, should the input clocks ever fail. For example,

an R-C circuit may be used to trigger the XRS pin of the MCU, should the capacitor ever get fully

charged. An I/O pin may be used to discharge the capacitor on a periodic basis to prevent it from

getting fully charged. Such a circuit would also help in detecting failure of the flash memory.

/512

OSCCLKSRC1 or 2

WDCR (WDPS[2:0])

WDCLK

WDCNTR(7:0)

WDKEY(7:0)

Good Key

101

WDCR (WDCHK[2:0])

Bad

WDCHK

Key

WDCR (WDDIS)

Clear Counter

SCSR (WDENINT)

Watchdog

Prescaler

Generate

Output Pulse

(512 OSCCLKs)

8-Bit

Watchdog

Counter

CLR

WDRST

WDINT

Watchdog

55 + AA

Key Detector

XRS

Core-reset

WDRST(A)

Internal

Pullup

SCSR(WDOVERRIDE)

A. The WDRST signal is driven low for 512 OSCCLK cycles.

Figure 8-15. CPU Watchdog Module

The WDINT signal enables the watchdog to be used as a wakeup from IDLE/STANDBY mode.

In STANDBY mode, all peripherals are turned off on the device. The only peripheral that remains functional is

the CPU-watchdog. This module will run off OSCCLK. The WDINT signal is fed to the LPM block so that it can

wake the device from STANDBY (if enabled). See Section 8.7 for more details.

In IDLE mode, the WDINT signal can generate an interrupt to the CPU, through the PIE, to take the CPU out of

IDLE mode.

In HALT mode, the CPU-watchdog can be used to wake up the device through a device reset.

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

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I TEXAS INSTRUMENTS

8.7 Low-power Modes Block

Table 8-16 summarizes the various modes.

Table 8-16. Low-power Modes

MODE LPMCR0(1:0

)OSCCLK CLKIN SYSCLKOU

TEXIT(1)

IDLE 00 On On On XRS, CPU-watchdog interrupt,

any enabled interrupt

STANDB

Y01

(CPU-watchdog still

running)

Off Off XRS, CPU-watchdog interrupt,

GPIO Port A signal, debugger(2)

HALT(3) 1X

Off

(on-chip crystal oscillator

and PLL turned off, zero-

pin oscillator and CPU-

watchdog state dependent

on user code.)

Off Off XRS, GPIO Port A signal,

debugger(2), CPU-watchdog

(1) The EXIT column lists which signals or under what conditions the low-power mode is exited. A low signal, on any of the signals, exits

the low-power condition. This signal must be kept low long enough for an interrupt to be recognized by the device. Otherwise, the

low-power mode will not be exited and the device will go back into the indicated low-power mode.

(2) The JTAG port can still function even if the CPU clock (CLKIN) is turned off.

(3) The WDCLK must be active for the device to go into HALT mode.

The various low-power modes operate as follows:

IDLE Mode: This mode is exited by any enabled interrupt that is recognized by the processor. The LPM block

performs no tasks during this mode as long as the LPMCR0(LPM) bits are set to 0,0.

STANDBY Mode: Any GPIO port A signal (GPIO[31:0]) can wake the device from STANDBY mode. The user must

select which signals will wake the device in the GPIOLPMSEL register. The selected signals are also

qualified by the OSCCLK before waking the device. The number of OSCCLKs is specified in the

LPMCR0 register.

HALT Mode: CPU-watchdog, XRS, and any GPIO port A signal (GPIO[31:0]) can wake the device from HALT

mode. The user selects the signal in the GPIOLPMSEL register.

Note

The low-power modes do not affect the state of the output pins (PWM pins included). They will be

in whatever state the code left them in when the IDLE instruction was executed. See the Systems

Control and Interrupts chapter of the TMS320x2806x Technical Reference Manual for more details.

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TMS320F28062, TMS320F28062F

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Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

8.8 Interrupts

Figure 8-16 shows how the various interrupt sources are multiplexed.

Watchdog

XINT1

XINT2

GPIO

MUX

WDINT

INT1

INT12

NMI

Low-Power Modes

LPMINT

WAKEINT Sync

SYSCLKOUT

XINT2 M

XINT3

ADC XINT2SOC

GPIOXINT1SEL[4:0]

GPIOXINT2SEL[4:0]

XINT3

System Control

(See the System Control section.)

INT14

INT13

GPIO0.int

GPIO31.int

DMA clear

DMA

PIE

Up to 96 Interrupts

DMA

TOUT1

TINT0

TINT2

TINT1 Flash Wrapper

GPIOXINT3SEL[4:0]

NMI Interrupt With Watchdog Function

(See the NMI Watchdog section.) NMIRS

GPIO0.int

GPIO31.int

CLOCKFAIL

CPUTMR2CLK

DMA

C28x

Core

Peripherals

(USB, McBSP, ePWM, ADC)

Peripherals

(SPI, SCI, I C, eCAN, eCAP, eQEP,

HRCAP, CLA)

Interrupt Control

XINT1CR[15:0]

XINT1CTR[15:0]

XINT2CTR[15:0]

Interrupt Control

XINT2CR[15:0]

Interrupt Control

XINT3CR[15:0]

XINT3CTR[15:0]

CPU TIMER 0

CPU TIMER 1

CPU TIMER 2

Figure 8-16. External and PIE Interrupt Sources

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TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

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TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS |NT1 V L ; INTZ L L _ I I I I I I I I —D I I I I |NT11 V V # |NT12 _ L V / 4 07A : INTx.1 ‘ C 4 4 INTX.2 : : INTX.3 7 ‘ C 4 4 INDIA 4 4 4 INTx.5 ‘ ‘ INTx.6 4 : |NTx.7 ‘ INTX.8

Eight PIE block interrupts are grouped into one CPU interrupt. In total, 12 CPU interrupt groups, with 8 interrupts

per group equals 96 possible interrupts. Table 8-17 shows the interrupts used by 2806x devices.

The TRAP #VectorNumber instruction transfers program control to the interrupt service routine (ISR)

corresponding to the vector specified. The TRAP #0 instruction attempts to transfer program control to the

address pointed to by the reset vector. The PIE vector table does not, however, include a reset vector. Therefore,

the TRAP #0 instruction should not be used when the PIE is enabled. Doing so will result in undefined behavior.

When the PIE is enabled, the TRAP #1 to TRAP #12 instructions will transfer program control to the ISR

corresponding to the first vector within the PIE group. For example: the TRAP #1 instruction fetches the vector

from INT1.1, the TRAP #2 instruction fetches the vector from INT2.1, and so forth.

INT12

MUX

INT11

INT2

INT1

CPU

(Enable)(Flag)

INTx

INTx.8

PIEIERx[8:1] PIEIFRx[8:1]

MUX

INTx.7

INTx.6

INTx.5

INTx.4

INTx.3

INTx.2

INTx.1

From

Peripherals

External

Interrupts

(Enable) (Flag)

IER[12:1]IFR[12:1]

Global

Enable

INTM

PIEACKx

(Enable/Flag)

Figure 8-17. Multiplexing of Interrupts Using the PIE Block

Out of 96 possible interrupts, some interrupts are not used. These interrupts are reserved for future devices.

These interrupts can be used as software interrupts if they are enabled at the PIEIFRx level, provided none of

the interrupts within the group is being used by a peripheral. Otherwise, interrupts coming in from peripherals

may be lost by accidentally clearing their flag while modifying the PIEIFR. To summarize, there are two safe

cases when the reserved interrupts could be used as software interrupts:

1. No peripheral within the group is asserting interrupts.

2. No peripheral interrupts are assigned to the group (for example, PIE group 7).

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Table 8-17. PIE MUXed Peripheral Interrupt Vector Table

INTx.8 INTx.7 INTx.6 INTx.5 INTx.4 INTx.3 INTx.2 INTx.1

INT1.y WAKEINT TINT0 ADCINT9 XINT2 XINT1 Reserved ADCINT2 ADCINT1

(LPM/WD) (TIMER 0) (ADC) Ext. int. 2 Ext. int. 1 – (ADC) (ADC)

0xD4E 0xD4C 0xD4A 0xD48 0xD46 0xD44 0xD42 0xD40

INT2.y EPWM8_TZINT EPWM7_TZINT EPWM6_TZINT EPWM5_TZINT EPWM4_TZINT EPWM3_TZINT EPWM2_TZINT EPWM1_TZINT

(ePWM8) (ePWM7) (ePWM6) (ePWM5) (ePWM4) (ePWM3) (ePWM2) (ePWM1)

0xD5E 0xD5C 0xD5A 0xD58 0xD56 0xD54 0xD52 0xD50

INT3.y EPWM8_INT EPWM7_INT EPWM6_INT EPWM5_INT EPWM4_INT EPWM3_INT EPWM2_INT EPWM1_INT

(ePWM8) (ePWM7) (ePWM6) (ePWM5) (ePWM4) (ePWM3) (ePWM2) (ePWM1)

0xD6E 0xD6C 0xD6A 0xD68 0xD66 0xD64 0xD62 0xD60

INT4.y HRCAP2_INT HRCAP1_INT Reserved Reserved Reserved ECAP3_INT ECAP2_INT ECAP1_INT

(HRCAP2) (HRCAP1) – – – (eCAP3) (eCAP2) (eCAP1)

0xD7E 0xD7C 0xD7A 0xD78 0xD76 0xD74 0xD72 0xD70

INT5.y USB0_INT Reserved Reserved HRCAP4_INT HRCAP3_INT Reserved EQEP2_INT EQEP1_INT

(USB0) – – (HRCAP4) (HRCAP3) – (eQEP2) (eQEP1)

0xD8E 0xD8C 0xD8A 0xD88 0xD86 0xD84 0xD82 0xD80

INT6.y Reserved Reserved MXINTA MRINTA SPITXINTB SPIRXINTB SPITXINTA SPIRXINTA

– – (McBSP-A) (McBSP-A) (SPI-B) (SPI-B) (SPI-A) (SPI-A)

0xD9E 0xD9C 0xD9A 0xD98 0xD96 0xD94 0xD92 0xD90

INT7.y Reserved Reserved DINTCH6 DINTCH5 DINTCH4 DINTCH3 DINTCH2 DINTCH1

– – (DMA) (DMA) (DMA) (DMA) (DMA) (DMA)

0xDAE 0xDAC 0xDAA 0xDA8 0xDA6 0xDA4 0xDA2 0xDA0

INT8.y Reserved Reserved Reserved Reserved Reserved Reserved I2CINT2A I2CINT1A

– – – – – – (I2C-A) (I2C-A)

0xDBE 0xDBC 0xDBA 0xDB8 0xDB6 0xDB4 0xDB2 0xDB0

INT9.y Reserved Reserved ECAN1_INTA ECAN0_INTA SCITXINTB SCIRXINTB SCITXINTA SCIRXINTA

– – (CAN-A) (CAN-A) (SCI-B) (SCI-B) (SCI-A) (SCI-A)

0xDCE 0xDCC 0xDCA 0xDC8 0xDC6 0xDC4 0xDC2 0xDC0

INT10.y ADCINT8 ADCINT7 ADCINT6 ADCINT5 ADCINT4 ADCINT3 ADCINT2 ADCINT1

(ADC) (ADC) (ADC) (ADC) (ADC) (ADC) (ADC) (ADC)

0xDDE 0xDDC 0xDDA 0xDD8 0xDD6 0xDD4 0xDD2 0xDD0

INT11.y CLA1_INT8 CLA1_INT7 CLA1_INT6 CLA1_INT5 CLA1_INT4 CLA1_INT3 CLA1_INT2 CLA1_INT1

(CLA) (CLA) (CLA) (CLA) (CLA) (CLA) (CLA) (CLA)

0xDEE 0xDEC 0xDEA 0xDE8 0xDE6 0xDE4 0xDE2 0xDE0

INT12.y LUF LVF Reserved Reserved Reserved Reserved Reserved XINT3

(CLA) (CLA) – – – – – Ext. Int. 3

0xDFE 0xDFC 0xDFA 0xDF8 0xDF6 0xDF4 0xDF2 0xDF0

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Table 8-18. PIE Configuration and Control Registers

NAME ADDRESS SIZE (×16) DESCRIPTION(1)

PIECTRL 0x0CE0 1 PIE, Control Register

PIEACK 0x0CE1 1 PIE, Acknowledge Register

PIEIER1 0x0CE2 1 PIE, INT1 Group Enable Register

PIEIFR1 0x0CE3 1 PIE, INT1 Group Flag Register

PIEIER2 0x0CE4 1 PIE, INT2 Group Enable Register

PIEIFR2 0x0CE5 1 PIE, INT2 Group Flag Register

PIEIER3 0x0CE6 1 PIE, INT3 Group Enable Register

PIEIFR3 0x0CE7 1 PIE, INT3 Group Flag Register

PIEIER4 0x0CE8 1 PIE, INT4 Group Enable Register

PIEIFR4 0x0CE9 1 PIE, INT4 Group Flag Register

PIEIER5 0x0CEA 1 PIE, INT5 Group Enable Register

PIEIFR5 0x0CEB 1 PIE, INT5 Group Flag Register

PIEIER6 0x0CEC 1 PIE, INT6 Group Enable Register

PIEIFR6 0x0CED 1 PIE, INT6 Group Flag Register

PIEIER7 0x0CEE 1 PIE, INT7 Group Enable Register

PIEIFR7 0x0CEF 1 PIE, INT7 Group Flag Register

PIEIER8 0x0CF0 1 PIE, INT8 Group Enable Register

PIEIFR8 0x0CF1 1 PIE, INT8 Group Flag Register

PIEIER9 0x0CF2 1 PIE, INT9 Group Enable Register

PIEIFR9 0x0CF3 1 PIE, INT9 Group Flag Register

PIEIER10 0x0CF4 1 PIE, INT10 Group Enable Register

PIEIFR10 0x0CF5 1 PIE, INT10 Group Flag Register

PIEIER11 0x0CF6 1 PIE, INT11 Group Enable Register

PIEIFR11 0x0CF7 1 PIE, INT11 Group Flag Register

PIEIER12 0x0CF8 1 PIE, INT12 Group Enable Register

PIEIFR12 0x0CF9 1 PIE, INT12 Group Flag Register

Reserved 0x0CFA –

0x0CFF

6 Reserved

(1) The PIE configuration and control registers are not protected by EALLOW mode. The PIE vector

table is protected.

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TMS320F28062, TMS320F28062F

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TMS320F28062 TMS320F28062F

W TEXAS INSTRUMENTS $ b Vvvvovv' tdohﬁtﬁtof‘

8.8.1 External Interrupts

Table 8-19. External Interrupt Registers

NAME ADDRESS SIZE (×16) DESCRIPTION

XINT1CR 0x00 7070 1 XINT1 configuration register

XINT2CR 0x00 7071 1 XINT2 configuration register

XINT3CR 0x00 7072 1 XINT3 configuration register

XINT1CTR 0x00 7078 1 XINT1 counter register

XINT2CTR 0x00 7079 1 XINT2 counter register

XINT3CTR 0x00 707A 1 XINT3 counter register

Each external interrupt can be enabled or disabled or qualified using positive, negative, or both positive and

negative edge. For more information, see the Systems Control and Interrupts chapter of the TMS320x2806x

Technical Reference Manual .

8.8.1.1 External Interrupt Electrical Data/Timing

8.8.1.1.1 External Interrupt Timing Requirements

MIN(1) MAX UNIT

tw(INT) (2) Pulse duration, INT input low/high Synchronous 1tc(SCO) cycles

With qualifier 1tc(SCO) + tw(IQSW) cycles

(1) For an explanation of the input qualifier parameters, see Section 8.9.15.1.2.1.

(2) This timing is applicable to any GPIO pin configured for ADCSOC functionality.

8.8.1.1.2 External Interrupt Switching Characteristics

over recommended operating conditions (unless otherwise noted)(1)

PARAMETER MIN MAX UNIT

td(INT) Delay time, INT low/high to interrupt-vector fetch tw(IQSW) + 12tc(SCO) cycles

(1) For an explanation of the input qualifier parameters, see Section 8.9.15.1.2.1.

XINT1, XINT2, XINT3

tw(INT)

Interrupt Vector

td(INT)

Address bus

(internal)

Figure 8-18. External Interrupt Timing

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

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8.9 Peripherals

8.9.1 CLA Overview

The CLA extends the capabilities of the C28x CPU by adding parallel processing. Time-critical control loops

serviced by the CLA can achieve low ADC sample to output delay. Thus, the CLA enables faster system

response and higher frequency control loops. Using the CLA for time-critical tasks frees the main CPU to

perform other system and communication functions concurently. A list of major features of the CLA follows.

• Clocked at the same rate as the main CPU (SYSCLKOUT)

• An independent architecture allowing CLA algorithm execution independent of the main C28x CPU

– Complete bus architecture:

• Program address bus and program data bus

• Data address bus, data read bus, and data write bus

– Independent eight-stage pipeline

– 12-bit program counter (MPC)

– Four 32-bit result registers (MR0 to MR3)

– Two 16-bit auxillary registers (MAR0, MAR1)

– Status register (MSTF)

• Instruction set includes:

– IEEE single-precision (32-bit) floating-point math operations

– Floating-point math with parallel load or store

– Floating-point multiply with parallel add or subtract

– 1/X and 1/sqrt(X) estimations

– Data type conversions

– Conditional branch and call

– Data load and store operations

• The CLA program code can consist of up to eight tasks or ISRs.

– The start address of each task is specified by the MVECT registers.

– No limit on task size as long as the tasks fit within the CLA program memory space.

– One task at a time is serviced to completion. Tasks are not nested.

– Upon task completion, a task-specific interrupt is flagged within the PIE.

– When a task finishes, the next highest-priority pending task is automatically started.

• Task trigger mechanisms:

– C28x CPU through the IACK instruction

– Task1 to Task7: the corresponding ADC, ePWM, eQEP, or eCAP module interrupt. For example:

• Task1: ADCINT1 or EPWM1_INT

• Task2: ADCINT2 or EPWM2_INT

• Task4: ADCINT4 or EPWM4_INT or EQEPx_INT or ECAPx_INT

• Task7: ADCINT7 or EPWM7_INT or EQEPx_INT or ECAPx_INT

– Task8: ADCINT8 or by CPU Timer 0 or EQEPx_INT or ECAPx_INT.

• Memory and Shared Peripherals:

– Two dedicated message RAMs for communication between the CLA and the main CPU

– The C28x CPU can map CLA program and data memory to the main CPU space or CLA space.

– The CLA has direct access to the ADC Result registers, comparator registers, and the eCAP, eQEP, and

ePWM+HRPWM registers.

Figure 8-19 shows the CLA block diagram. Table 8-20 lists the CLA control registers.

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TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

gv isvscmoufgb 7 CLAENCLK 4» 4»

CLA_INT1 to CLA_INT8

MVECT1

MVECT2

MPERINT1

MPERINT8

PIE

Main

28x

CPU

CLA

Program

Memory

MMEMCFG

MCTL

MIFR

MIER

MIFRC

MIRUN

MIOVF

MICLR

MICLROVF

MPISRCSEL1

MVECT3

MVECT4

MVECT5

MVECT6

MVECT7

MVECT8

ain CPU BUS

INT11

INT12

Peripheral Interrupts

ADCINT1 to ADCINT8

ECAP1_INT to ECAP3_INT

EQEP1_INT and EQEP2_INT

EPWM1_INT to EPWM8_INT

CPU Timer 0

Map to CLA or

CPU Space

CLA

Data

Memory

Comparator

Registers

eCAP

Registers

eQEP

Registers

ePWM

and

HRPWM

Registers

ADC

Result

Registers

CLA

Shared

Message

RAMs

Main CPU Read/Write Data Bus

CLA Program Address Bus

CLA Program Data Bus

Map to CLA or

CPU Space

CLA Data Bus

Main CPU Bus

MR0(32)

MPC(12)

MR1(32)

MR3(32)

MAR0(32)

MSTF(32)

MR2(32)

MAR1(32)

CLA Data Read Address Bus

CLA Data Write Data Bus

CLA Data Write Address Bus

CLA Data Read Data Bus

MEALLOW

Main CPU Read Data Bus

CLA Execution

Registers

CLA Control

Registers

SYSCLKOUT

CLAENCLK

SYSRS

LVF

LUF

IACK

Figure 8-19. CLA Block Diagram

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

TEXAS INSTRUMENTS

Table 8-20. CLA Control Registers

ADDRESS SIZE (×16) EALLOW

PROTECTED DESCRIPTION(1)

MVECT1 0x1400 1 Yes CLA Interrupt/Task 1 Start Address

MVECT2 0x1401 1 Yes CLA Interrupt/Task 2 Start Address

MVECT3 0x1402 1 Yes CLA Interrupt/Task 3 Start Address

MVECT4 0x1403 1 Yes CLA Interrupt/Task 4 Start Address

MVECT5 0x1404 1 Yes CLA Interrupt/Task 5 Start Address

MVECT6 0x1405 1 Yes CLA Interrupt/Task 6 Start Address

MVECT7 0x1406 1 Yes CLA Interrupt/Task 7 Start Address

MVECT8 0x1407 1 Yes CLA Interrupt/Task 8 Start Address

MCTL 0x1410 1 Yes CLA Control Register

MMEMCFG 0x1411 1 Yes CLA Memory Configure Register

MPISRCSEL1 0x1414 2 Yes Peripheral Interrupt Source Select Register 1

MIFR 0x1420 1 Yes Interrupt Flag Register

MIOVF 0x1421 1 Yes Interrupt Overflow Register

MIFRC 0x1422 1 Yes Interrupt Force Register

MICLR 0x1423 1 Yes Interrupt Clear Register

MICLROVF 0x1424 1 Yes Interrupt Overflow Clear Register

MIER 0x1425 1 Yes Interrupt Enable Register

MIRUN 0x1426 1 Yes Interrupt RUN Register

MIPCTL 0x1427 1 Yes Interrupt Priority Control Register

MPC(2) 0x1428 1 – CLA Program Counter

MAR0(2) 0x142A 1 – CLA Aux Register 0

MAR1(2) 0x142B 1 – CLA Aux Register 1

MSTF(2) 0x142E 2 – CLA STF Register

MR0(2) 0x1430 2 – CLA R0H Register

MR1(2) 0x1434 2 – CLA R1H Register

MR2(2) 0x1438 2 – CLA R2H Register

MR3(2) 0x143C 2 – CLA R3H Register

(1) All registers in this table are CSM-protected.

(2) The main C28x CPU has read-only access to this register for debug purposes. The main CPU cannot perform CPU or debugger writes

to this register.

Table 8-21. CLA Message RAM

ADDRESS RANGE SIZE (×16) DESCRIPTION

0x1480 – 0x14FF 128 CLA to CPU Message RAM

0x1500 – 0x157F 128 CPU to CLA Message RAM

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TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS m m V—H—‘

8.9.2 Analog Block

A 12-bit ADC core is implemented that has different timings than the 12-bit ADC used on the F280x and F2833x

devices. The ADC wrapper is modified to incorporate the new timings and also other enhancements to improve

the timing control of start of conversions. Figure 8-20 shows the interaction of the analog module with the rest of

the F2806x system.

100-Pin

80-Pin

VDDA VDDA

VREFLO

Tied To

VSSA

VREFLO

VREFHI

Tied To

A4 A4

A6 A6

B0 B0

B2 B2

B4 B4

B6 B6

(3.3 V) VDDA

(Agnd) VSSA

VREFLO

Diff

Interface Reference

Comp1

VREFHI

AIO2

AIO10

10-Bit

DAC

COMP1OUT

AIO4

AIO12

Comp2

10-Bit

DAC

COMP2OUT

Comp3

10-Bit

DAC

COMP3OUT

ADC

AIO6

AIO14

Simultaneous Sampling Channels

Signal Pinout

Temperature Sensor

Figure 8-20. Analog Pin Configurations

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS D REFHI

8.9.2.1 Analog-to-Digital Converter (ADC)

8.9.2.1.1 Features

The core of the ADC contains a single 12-bit converter fed by two sample-and-hold circuits. The sample-

and-hold circuits can be sampled simultaneously or sequentially. These, in turn, are fed by a total of up to

16 analog input channels. The converter can be configured to run with an internal band-gap reference to

create true-voltage based conversions or with a pair of external voltage references (VREFHI/VREFLO) to create

ratiometric-based conversions.

Contrary to previous ADC types, this ADC is not sequencer-based. The user can easily create a series of

conversions from a single trigger. However, the basic principle of operation is centered around the configurations

of individual conversions, called SOCs, or Start-Of-Conversions.

Functions of the ADC module include:

• 12-bit ADC core with built-in dual sample-and-hold (S/H)

• Simultaneous sampling or sequential sampling modes

• Full range analog input: 0 V to 3.3 V fixed, or VREFHI/VREFLO ratiometric. The digital value of the input analog

voltage is derived by:

– Internal Reference (VREFLO = VSSA. VREFHI must not exceed VDDA when using either internal or external

reference modes.)

0,ValueDigital =

V0inputwhen £

3.3

VoltageAnalogInput

4096ValueDigital REFLO

´=

V3.3inputV0when <<

4095,ValueDigital =

V3.3inputwhen ³

– External Reference (VREFHI/VREFLO connected to external references. VREFHI must not exceed VDDA when

using either internal or external reference modes.)

0,ValueDigital =

V0inputwhen £

VoltageAnalogInput

4096ValueDigital

REFLOREFHI

REFLO

´=

inputV0when REFHI

4095,ValueDigital =

inputwhen REFHI

• Up to 16-channel, multiplexed inputs

• 16 SOCs, configurable for trigger, sample window, and channel

• 16 result registers (individually addressable) to store conversion values

• Multiple trigger sources

– S/W – software immediate start

– ePWM 1–8

– GPIO XINT2

– CPU Timer 0, CPU Timer 1, CPU Timer 2

– ADCINT1, ADCINT2

• 9 flexible PIE interrupts, can configure interrupt request after any conversion

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TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

TEXAS INSTRUMENTS

Table 8-22. ADC Configuration and Control Registers

(×16)

EALLOW

PROTECTE

DESCRIPTION

ADCCTL1 0x7100 1 Yes Control 1 Register

ADCCTL2 0x7101 1 Yes Control 2 Register

ADCINTFLG 0x7104 1 No Interrupt Flag Register

ADCINTFLGCLR 0x7105 1 No Interrupt Flag Clear Register

ADCINTOVF 0x7106 1 No Interrupt Overflow Register

ADCINTOVFCLR 0x7107 1 No Interrupt Overflow Clear Register

INTSEL1N2 0x7108 1 Yes Interrupt 1 and 2 Selection Register

INTSEL3N4 0x7109 1 Yes Interrupt 3 and 4 Selection Register

INTSEL5N6 0x710A 1 Yes Interrupt 5 and 6 Selection Register

INTSEL7N8 0x710B 1 Yes Interrupt 7 and 8 Selection Register

INTSEL9N10 0x710C 1 Yes Interrupt 9 Selection Register (reserved Interrupt 10 Selection)

SOCPRICTL 0x7110 1 Yes SOC Priority Control Register

ADCSAMPLEMODE 0x7112 1 Yes Sampling Mode Register

ADCINTSOCSEL1 0x7114 1 Yes Interrupt SOC Selection 1 Register (for 8 channels)

ADCINTSOCSEL2 0x7115 1 Yes Interrupt SOC Selection 2 Register (for 8 channels)

ADCSOCFLG1 0x7118 1 No SOC Flag 1 Register (for 16 channels)

ADCSOCFRC1 0x711A 1 No SOC Force 1 Register (for 16 channels)

ADCSOCOVF1 0x711C 1 No SOC Overflow 1 Register (for 16 channels)

ADCSOCOVFCLR1 0x711E 1 No SOC Overflow Clear 1 Register (for 16 channels)

ADCSOC0CTL to

ADCSOC15CTL

0x7120 –

0x712F 1 Yes SOC0 Control Register to SOC15 Control Register

ADCREFTRIM 0x7140 1 Yes Reference Trim Register

ADCOFFTRIM 0x7141 1 Yes Offset Trim Register

COMPHYSTCTL 0x714C 1 Yes Comparator Hysteresis Control Register

ADCREV 0x714F 1 No Revision Register

Table 8-23. ADC Result Registers (Mapped to PF0)

(×16)

EALLOW

PROTECTED DESCRIPTION

ADCRESULT0 to ADCRESULT15 0xB00 to

0xB0F 1 No ADC Result 0 Register to ADC Result 15 Register

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

PF0 (CPU)

PF2 (CPU)

SYSCLKOUT

ADCENCLK

AIO

MUX

ADC

Channels

ADC

Core

12-Bit

0-Wait

Result

Registers

ADCINT 1

ADCINT 9

ADCTRIG 1 TINT 0

PIE

CPUTIMER 0

ADCTRIG 2 TINT 1 CPUTIMER 1

ADCTRIG 3 TINT 2 CPUTIMER 2

ADCTRIG 4 XINT 2SOC XINT 2

ADCTRIG 5 SOCA 1

EPWM 1

ADCTRIG 6 SOCB 1

ADCTRIG 7 SOCA 2

EPWM 2

ADCTRIG 8 SOCB 2

ADCTRIG 9 SOCA 3

EPWM 3

ADCTRIG 10 SOCB 3

ADCTRIG 11 SOCA 4

EPWM 4

ADCTRIG 12 SOCB 4

ADCTRIG 13 SOCA 5

EPWM 5

ADCTRIG 14 SOCB 5

ADCTRIG 15 SOCA 6

EPWM 6

ADCTRIG 16 SOCB 6

ADCTRIG 17 SOCA 7

EPWM 7

ADCTRIG 18 SOCB 7

ADCTRIG 19 SOCA 8

EPWM 8

ADCTRIG 20 SOCB 8

Figure 8-21. ADC Connections

ADC Connections if the ADC is Not Used

TI recommends keeping the connections for the analog power pins, even if the ADC is not used. Following is a

summary of how the ADC pins should be connected, if the ADC is not used in an application:

• VDDA – Connect to VDDIO

• VSSA – Connect to VSS

• VREFLO – Connect to VSS

• ADCINAn, ADCINBn, VREFHI – Connect to VSSA

When the ADC module is used in an application, unused ADC input pins should be connected to analog ground

(VSSA).

Note

TI recommends that unused ADCIN pins which are multiplexed with AIO function be grounded through

a 1-kΩ resistor. This recommendation is intended to prevent any inadvertent software activation of the

AIO output logic-high driving directly to ground; this condition can cause permanent device damage by

exceeding IOH Absolute Maximum.

When the ADC is not used, be sure that the clock to the ADC module is not turned on to realize power savings.

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TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

TEXAS INSTRUMENTS AD 5 \—/

8.9.2.1.2 ADC Start-of-Conversion Electrical Data/Timing

8.9.2.1.2.1 External ADC Start-of-Conversion Switching Characteristics

over recommended operating conditions (unless otherwise noted)

PARAMETER MIN MAX UNIT

tw(ADCSOCL) Pulse duration, ADCSOCxO low 32tc(HCO) cycles

ADCSOCAO

ADCSOCBO

tw(ADCSOCL)

Figure 8-22. ADCSOCAO or ADCSOCBO Timing

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS Produd quer Lmks. TMS320F25059 TMSSZDFZBOSQM TMS320F25069F TMS320F25068M TM8320F28058F TM8320F28057 TM8320F25066 TMS320F25065 TMS320F25064 TMS320F25055 TMS320F25062 TMS320F25052F

8.9.2.1.3 On-Chip Analog-to-Digital Converter (ADC) Electrical Data/Timing

8.9.2.1.3.1 ADC Electrical Characteristics

PARAMETER MIN TYP MAX UNIT

DC SPECIFICATIONS

Resolution 12 Bits

ADC clock 90-MHz device 0.001 45 MHz

Sample Window 7 64 ADC

Clocks

ACCURACY

INL (Integral nonlinearity)(1) –4 4 LSB

DNL (Differential nonlinearity), no missing codes –1 1.5 LSB

Offset error (2)

Executing a single self-

recalibration(3) –20 20

LSB

Executing periodic self-

recalibration(4) –4 4

Overall gain error with internal reference –60 60 LSB

Overall gain error with external reference –40 40 LSB

Channel-to-channel offset variation –4 4 LSB

Channel-to-channel gain variation –4 4 LSB

ADC temperature coefficient with internal reference –50 ppm/°C

ADC temperature coefficient with external reference –20 ppm/°C

VREFLO –100 µA

VREFHI 100 µA

ANALOG INPUT

Analog input voltage with internal reference 0 3.3 V

Analog input voltage with external reference VREFLO VREFHI V

VREFLO input voltage(5) VSSA 0.66 V

VREFHI input voltage(6) 2.64 VDDA V

with VREFLO = VSSA 1.98 VDDA

Input capacitance 5 pF

Input leakage current ±2 μA

(1) INL will degrade when the ADC input voltage goes above VDDA.

(2) 1 LSB has the weighted value of full-scale range (FSR)/4096. FSR is 3.3 V with internal reference and VREFHI - VREFLO for external

reference.

(3) For more details, see the TMS320F2806x MCUs Silicon Errata.

(4) Periodic self-recalibration will remove system-level and temperature dependencies on the ADC zero offset error.

(5) VREFLO is always connected to VSSA on the 80-pin PN and PFP devices.

(6) VREFHI must not exceed VDDA when using either internal or external reference modes. Because VREFHI is tied to ADCINA0 on the

80-pin PN and PFP devices, the input signal on ADCINA0 must not exceed VDDA.

8.9.2.1.3.2 ADC Power Modes

ADC OPERATING MODE CONDITIONS IDDA UNIT

Mode A – Operating Mode

ADC Clock Enabled

Band gap On (ADCBGPWD = 1)

Reference On (ADCREFPWD = 1)

ADC Powered Up (ADCPWDN = 1)

16 mA

Mode B – Quick Wake Mode

ADC Clock Enabled

Band gap On (ADCBGPWD = 1)

Reference On (ADCREFPWD = 1)

ADC Powered Up (ADCPWDN = 0)

4 mA

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TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

TEXAS INSTRUMENTS \ com/emu" —‘—y—

ADC OPERATING MODE CONDITIONS IDDA UNIT

Mode C – Comparator-Only Mode

ADC Clock Enabled

Band gap On (ADCBGPWD = 1)

Reference On (ADCREFPWD = 0)

ADC Powered Up (ADCPWDN = 0)

1.5 mA

Mode D – Off Mode

ADC Clock Enabled

Band gap On (ADCBGPWD = 0)

Reference On (ADCREFPWD = 0)

ADC Powered Up (ADCPWDN = 0)

0.075 mA

8.9.2.1.3.3 Internal Temperature Sensor

8.9.2.1.3.3.1 Temperature Sensor Coefficient

PARAMETER(1) MIN TYP MAX UNIT

TSLOPE

Degrees C of temperature movement per measured ADC LSB change of

the temperature sensor 0.18(3) (2) °C/LSB

TOFFSET ADC output at 0°C of the temperature sensor 1750 LSB

(1) The temperature sensor slope and offset are given in terms of ADC LSBs using the internal reference of the ADC. Values must be

adjusted accordingly in external reference mode to the external reference voltage.

(2) Output of the temperature sensor (in terms of LSBs) is sign-consistent with the direction of the temperature movement. Increasing

temperatures will give increasing ADC values relative to an initial value; decreasing temperatures will give decreasing ADC values

relative to an initial value.

(3) ADC temperature coeffieicient is accounted for in this specification

8.9.2.1.3.4 ADC Power-Up Control Bit Timing

8.9.2.1.3.4.1 ADC Power-Up Delays

PARAMETER(1) MIN MAX UNIT

td(PWD) Delay time for the ADC to be stable after power up 1 ms

(1) Timings maintain compatibility to the ADC module. The 2806x ADC supports driving all 3 bits at the same time td(PWD) ms before first

conversion.

ADCPWDN/

ADCBGPWD/

ADCREFPWD/

ADCENABLE

Request for ADC

Conversion

td(PWD)

Figure 8-23. ADC Conversion Timing

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

RsADCIN

5 pF

1.6 pF

Switch

Typical Values of the Input Circuit Components:

Switch Resistance (R ): 3.4 k

on W

Sampling Capacitor (C ): 1.6 pF

Parasitic Capacitance (C ): 5 pF

Source Resistance (R ): 50

28x DSP

Source

Signal

3.4 kW

Ron

Figure 8-24. ADC Input Impedance Model

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TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

ﬂ TEXAS INSTRUMENTS 1mm . ﬂ F in / kt EL

8.9.2.1.3.5 ADC Sequential and Simultaneous Timings

SOC0

ADCCLK

ADCRESULT 0

S/H Window Pulse to Core

ADCCTL 1.INTPULSEPOS

ADCSOCFLG 1.SOC0

ADCINTFLG.ADCINTx

SOC1 SOC2

9 15 22 24 3720

Result 0 Latched

ADCSOCFLG 1.SOC1

ADCSOCFLG 1.SOC2

ADCRESULT 1

EOC0 Pulse

EOC1 Pulse

Conversion 0

13 ADC Clocks

Minimum

7 ADCCLKs

ADCCLKs

Conversion 1

13 ADC Clocks

Minimum

7 ADCCLKs

2 ADCCLKs

1 ADCCLK

Analog Input

SOC1 Sample

Window

SOC0 Sample

Window

SOC2 Sample

Window

Figure 8-25. Timing Example for Sequential Mode / Late Interrupt Pulse

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

{5‘ TEXAS INSTRUMENTS ---m...................+-.. aw ..... g. -- WW...

Conversion 0

13 ADC Clocks

Minimum

7 ADCCLKs

SOC0

ADCCLK

ADCRESULT 0

S/H Window Pulse to Core

ADCCTL1.INTPULSEPOS

ADCSOCFLG 1.SOC0

ADCINTFLG.ADCINTx

SOC1 SOC2

9 15 22 24 37

ADCCLKs

Result 0 Latched

Conversion 1

13 ADC Clocks

Minimum

7 ADCCLKs

ADCSOCFLG 1.SOC1

ADCSOCFLG 1.SOC2

ADCRESULT 1

EOC0 Pulse

EOC1 Pulse

EOC2 Pulse

2 ADCCLKs

Analog Input

SOC1 Sample

Window

SOC0 Sample

Window

SOC2 Sample

Window

Figure 8-26. Timing Example for Sequential Mode / Early Interrupt Pulse

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TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

ﬂ TEXAS INSTRUMENTS Bl:

Conversion 0 (A)

13 ADC Clocks

Minimum

7 ADCCLKs

SOC0 (A/B)

ADCCLK

ADCRESULT 0

S/H Window Pulse to Core

ADCCTL1.INTPULSEPOS

ADCSOCFLG 1.SOC0

ADCINTFLG .ADCINTx

SOC2 (A/B)

9 22 24 37

ADCCLKs

Result 0 (A) Latched

Conversion 0 (B)

13 ADC Clocks

Minimum

7 ADCCLKs

ADCSOCFLG 1.SOC1

ADCSOCFLG 1.SOC2

ADCRESULT 1 Result 0 (B) Latched

Conversion 1 (A)

13 ADC Clocks

ADCRESULT 2

EOC0 Pulse

EOC1 Pulse

EOC2 Pulse

1 ADCCLK

2 ADCCLKs

Analog Input B

SOC0 Sample

B Window

SOC2 Sample

B Window

Analog Input A

SOC0 Sample

A Window

SOC2 Sample

A Window

Figure 8-27. Timing Example for Simultaneous Mode / Late Interrupt Pulse

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

{5‘ TEXAS INSTRUMENTS S71 J ,‘ 13ADC mocks W ADCCLKS ADCCLKs

ADCCLK

0 9

SOC0 Sample

B Window

Analog Input B

Analog Input A

SOC0 Sample

A Window

37 50

SOC2 Sample

B Window

SOC2 Sample

A Window

2422

ADCCTL1.INTPULSEPOS

ADCSOCFLG1.SOC0

ADCSOCFLG1.SOC1

ADCSOCFLG1.SOC2

S/H Window Pulse to Core SOC0 (A/B) SOC2 (A/B)

ADCRESULT 0 Result 0 (A) Latched

2 ADCCLKs

Result 0 (B) Latched

ADCRESULT 1

ADCRESULT 2

EOC0 Pulse

EOC1 Pulse

EOC2 Pulse

Minimum

7 ADCCLKs

Conversion 0 (A)

13 ADC Clocks 2 ADCCLKs

Minimum

7 ADCCLKs

Conversion 1 (A)

13 ADC Clocks

Conversion 0 (B)

13 ADC Clocks

ADCINTFLG.ADCINTx

ADCCLKs

Figure 8-28. Timing Example for Simultaneous Mode / Early Interrupt Pulse

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TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

TEXAS INSTRUMENTS AIOXDIR

8.9.2.2 ADC MUX

To COMPy A or B input

To ADC Channel X

AIOx Pin

AIOxIN

AIOxINE

SYNC

SYSCLK

Logic implemented in GPIO MUX block

AIODAT Reg

(Read)

AIODAT Reg

(Latch)

AIOSET,

AIOCLEAR,

AIOTOGGLE

Regs

AIOMUX 1 Reg

AIOxDIR

(1 = Input,

0 = Output)

(0 = Input, 1 = Output)

AIODIR Reg

(Latch)

Figure 8-29. AIOx Pin Multiplexing

The ADC channel and Comparator functions are always available. The digital I/O function is available only when

the respective bit in the AIOMUX1 register is 0. In this mode, reading the AIODAT register reflects the actual pin

state.

The digital I/O function is disabled when the respective bit in the AIOMUX1 register is 1. In this mode, reading

the AIODAT register reflects the output latch of the AIODAT register and the input digital I/O buffer is disabled to

prevent analog signals from generating noise.

On reset, the digital function is disabled. If the pin is used as an analog input, users should keep the AIO function

disabled for that pin.

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

8.9.2.3 Comparator Block

Figure 8-30 shows the interaction of the Comparator modules with the rest of the system.

AIO

MUX

COMP x A

COMP x B

COMP x

DAC x

Wrapper

DAC

Core

10-Bit

COMP

COMPxOUT

GPIO

MUX

TZ1/2/3

ePWM

Figure 8-30. Comparator Block Diagram

Table 8-24. Comparator Control Registers

NAME

COMP1

ADDRESS

COMP2

ADDRESS

COMP3

ADDRESS

SIZE

(×16)

EALLOW

PROTECTED DESCRIPTION

COMPCTL 0x6400 0x6420 0x6440 1 Yes Comparator Control Register

COMPSTS 0x6402 0x6422 0x6442 1 No Comparator Status Register

DACCTL 0x6404 0x6424 0x6444 1 Yes DAC Control Register

DACVAL 0x6406 0x6426 0x6446 1 No DAC Value Register

RAMPMAXREF_

ACTIVE 0x6408 0x6428 0x6448 1 No Ramp Generator Maximum Reference

(Active) Register

RAMPMAXREF_

SHDW 0x640A 0x642A 0x644A 1 No Ramp Generator Maximum Reference

(Shadow) Register

RAMPDECVAL_

ACTIVE 0x640C 0x642C 0x644C 1 No Ramp Generator Decrement Value

(Active) Register

RAMPDECVAL_

SHDW 0x640E 0x642E 0x644E 1 No Ramp Generator Decrement Value

(Shadow) Register

RAMPSTS 0x6410 0x6430 0x6450 1 No Ramp Generator Status Register

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TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

INSTRUMENTS 11uu

8.9.2.3.1 On-Chip Comparator/DAC Electrical Data/Timing

8.9.2.3.1.1 Electrical Characteristics of the Comparator/DAC

CHARACTERISTIC MIN TYP MAX UNIT

Comparator

Comparator Input Range VSSA – VDDA V

Comparator response time to PWM Trip Zone (Async) 30 ns

Input Offset ±5 mV

Input Hysteresis(1) 35 mV

DAC

DAC Output Range VSSA – VDDA V

DAC resolution 10 bits

DAC settling time See Figure 8-31.

DAC Gain –1.5%

DAC Offset 10 mV

Monotonic Yes

INL ±3 LSB

(1) Hysteresis on the comparator inputs is achieved with a Schmidt trigger configuration. This results in an effective 100-kΩ feedback

resistance between the output of the comparator and the non-inverting input of the comparator.

Settling Time (ns)

100

200

300

400

500

600

700

800

900

1000

1100

0 50 100 150 200 250 300 350 400 450 500

DAC Step Size (Codes)

15 Codes 7 Codes 3 Codes 1 Code

DAC Accuracy

Figure 8-31. DAC Settling Time

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS 6.02

8.9.3 Detailed Descriptions

Integral Nonlinearity

Integral nonlinearity refers to the deviation of each individual code from a line drawn from zero to full scale. The

point used as zero occurs one-half LSB before the first code transition. The full-scale point is defined as level

one-half LSB beyond the last code transition. The deviation is measured from the center of each particular code

to the true straight line between these two points.

Differential Nonlinearity

An ideal ADC exhibits code transitions that are exactly 1 LSB apart. DNL is the deviation from this ideal value. A

differential nonlinearity error of less than ±1 LSB ensures no missing codes.

Zero Offset

The major carry transition should occur when the analog input is at zero volts. Zero error is defined as the

deviation of the actual transition from that point.

Gain Error

The first code transition should occur at an analog value one-half LSB above negative full scale. The last

transition should occur at an analog value one and one-half LSB below the nominal full scale. Gain error is the

deviation of the actual difference between first and last code transitions and the ideal difference between first

and last code transitions.

Signal-to-Noise Ratio + Distortion (SINAD)

SINAD is the ratio of the rms value of the measured input signal to the rms sum of all other spectral components

below the Nyquist frequency, including harmonics but excluding DC. The value for SINAD is expressed in

decibels.

Effective Number of Bits (ENOB)

For a sine wave, SINAD can be expressed in terms of the number of bits. Using the following formula,

6.02

1.76)(SINAD

it is possible to get a measure of performance expressed as N, the effective number of

bits. Thus, effective number of bits for a device for sine wave inputs at a given input frequency can be calculated

directly from its measured SINAD.

Total Harmonic Distortion (THD)

THD is the ratio of the rms sum of the first nine harmonic components to the rms value of the measured input

signal and is expressed as a percentage or in decibels.

Spurious Free Dynamic Range (SFDR)

SFDR is the difference in dB between the rms amplitude of the input signal and the peak spurious signal.

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TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

8.9.4 Serial Peripheral Interface (SPI) Module

The device includes the 4-pin serial peripheral interface (SPI) module. Up to two SPI modules are available.

The SPI is a high-speed, synchronous serial I/O port that allows a serial bit stream of programmed length

(1 to 16 bits) to be shifted into and out of the device at a programmable bit-transfer rate. Normally, the SPI is

used for communications between the MCU and external peripherals or another processor. Typical applications

include external I/O or peripheral expansion through devices such as shift registers, display drivers, and ADCs.

Multidevice communications are supported by the master/slave operation of the SPI.

The SPI module features include:

• Four external pins:

– SPISOMI: SPI slave-output/master-input pin

– SPISIMO: SPI slave-input/master-output pin

– SPISTE: SPI slave transmit-enable pin

– SPICLK: SPI serial-clock pin

Note

All four pins can be used as GPIO if the SPI module is not used.

• Two operational modes: master and slave

Baud rate: 125 different programmable rates.

1)(SPIBRR

LSPCLK

rateBaud

127to3SPIBRRwhen =

LSPCLK

rateBaud =

21,0,SPIBRRwhen =

• Data word length: 1 to 16 data bits

• Four clocking schemes (controlled by clock polarity and clock phase bits) include:

– Falling edge without phase delay: SPICLK active-high. SPI transmits data on the falling edge of the

SPICLK signal and receives data on the rising edge of the SPICLK signal.

– Falling edge with phase delay: SPICLK active-high. SPI transmits data one half-cycle ahead of the falling

edge of the SPICLK signal and receives data on the falling edge of the SPICLK signal.

– Rising edge without phase delay: SPICLK inactive-low. SPI transmits data on the rising edge of the

SPICLK signal and receives data on the falling edge of the SPICLK signal.

– Rising edge with phase delay: SPICLK inactive-low. SPI transmits data one half-cycle ahead of the rising

edge of the SPICLK signal and receives data on the rising edge of the SPICLK signal.

• Simultaneous receive and transmit operation (transmit function can be disabled in software)

• Transmitter and receiver operations are accomplished through either interrupt-driven or polled algorithms.

• Nine SPI module control registers: In control register frame beginning at address 7040h.

Note

All registers in this module are 16-bit registers that are connected to Peripheral Frame 2. When a

as zeros. Writing to the upper byte has no effect.

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

TEXAS INSTRUMENTS

Enhanced feature:

• 4-level transmit/receive FIFO

• Delayed transmit control

• Bidirectional 3 wire SPI mode support

• Audio data receive support through SPISTE inversion

The SPI port operation is configured and controlled by the registers listed in Table 8-25 and Table 8-26.

Table 8-25. SPI-A Registers

NAME ADDRESS SIZE (×16) EALLOW PROTECTED DESCRIPTION(1)

SPICCR 0x7040 1 No SPI-A Configuration Control Register

SPICTL 0x7041 1 No SPI-A Operation Control Register

SPISTS 0x7042 1 No SPI-A Status Register

SPIBRR 0x7044 1 No SPI-A Baud Rate Register

SPIRXEMU 0x7046 1 No SPI-A Receive Debug Buffer Register

SPIRXBUF 0x7047 1 No SPI-A Serial Input Buffer Register

SPITXBUF 0x7048 1 No SPI-A Serial Output Buffer Register

SPIDAT 0x7049 1 No SPI-A Serial Data Register

SPIFFTX 0x704A 1 No SPI-A FIFO Transmit Register

SPIFFRX 0x704B 1 No SPI-A FIFO Receive Register

SPIFFCT 0x704C 1 No SPI-A FIFO Control Register

SPIPRI 0x704F 1 No SPI-A Priority Control Register

(1) Registers in this table are mapped to Peripheral Frame 2. This space only allows 16-bit accesses. 32-bit accesses produce undefined

results.

Table 8-26. SPI-B Registers

NAME ADDRESS SIZE (×16) EALLOW PROTECTED DESCRIPTION(1)

SPICCR 0x7740 1 No SPI-B Configuration Control Register

SPICTL 0x7741 1 No SPI-B Operation Control Register

SPISTS 0x7742 1 No SPI-B Status Register

SPIBRR 0x7744 1 No SPI-B Baud Rate Register

SPIRXEMU 0x7746 1 No SPI-B Receive Debug Buffer Register

SPIRXBUF 0x7747 1 No SPI-B Serial Input Buffer Register

SPITXBUF 0x7748 1 No SPI-B Serial Output Buffer Register

SPIDAT 0x7749 1 No SPI-B Serial Data Register

SPIFFTX 0x774A 1 No SPI-B FIFO Transmit Register

SPIFFRX 0x774B 1 No SPI-B FIFO Receive Register

SPIFFCT 0x774C 1 No SPI-B FIFO Control Register

SPIPRI 0x774F 1 No SPI-B Priority Control Register

(1) Registers in this table are mapped to Peripheral Frame 2. This space only allows 16-bit accesses. 32-bit accesses produce undefined

results.

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TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

Figure 8-32 is a block diagram of the SPI in slave mode.

SPICTL.0

SPI INT FLAG

SPI INT

ENA

SPISTS.6

Clock

Polarity

Talk

LSPCLK

SPI Bit Rate

State Control

Clock

Phase

Receiver

Overrun Flag

SPICTL.4

Overrun

INT ENA

SPICCR.3 - 0

SPIBRR.6 - 0 SPICCR.6 SPICTL.3

SPIDAT.15 - 0

SPICTL.1

Master/Slave

SPISTS.7

SPIDAT

Data Register

SPICTL.2

SPI Char

SPISIMO

SPISOMI

SPICLK

SW2

SW3

To CPU

SW1

RX FIFO _0

RX FIFO _1

-----

RX FIFO _3

TX FIFO Registers

TX FIFO _0

TX FIFO _1

-----

TX FIFO _3

RX FIFO Registers

TX Interrupt

Logic

RX Interrupt

Logic

SPIINT

SPITX

SPIFFOVF

FLAG

SPIFFRX.15

TX FIFO Interrupt

RX FIFO Interrupt

SPIRXBUF

SPITXBUF

SPIFFTX.14

SPIFFENA

SPISTE

SPIPRI.0

TRIWIRE

SPIPRI.1

STEINV

SPIRXBUF

Buffer Register

SPITXBUF

Buffer Register

A. SPISTE is driven low by the master for a slave device.

Figure 8-32. SPI Module Block Diagram (Slave Mode)

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS T 1 ¥ \ \ \ :1 b4 \ » \ 'OVO'OV'OVV — “v '6' wow 'OV'O'OVOV '9' v '9'6' '0' fofﬁfofofofo‘ ﬁfofofﬁio'ofototofofoﬁoﬁofofof2&9! " ‘ w a1 3 ‘ \ ‘ w ‘ H—bﬁ , \ v.7vvv.vvvv.v. l€.vvvv.vvvvv vvvvvv.vvvv.v.vvv totototototototototototv' ’6292029292929202929292{2.29292929202929292920202922 4k w‘w *N 1/—

8.9.4.1 SPI Master Mode Electrical Data/Timing

Section 8.9.4.1.1 lists the master mode timing (clock phase = 0) and Section 8.9.4.1.2 lists the master mode

timing (clock phase = 1). Figure 8-33 and Figure 8-34 show the timing waveforms.

8.9.4.1.1 SPI Master Mode External Timing (Clock Phase = 0)

NO. PARAMETER(1) (2) (3) (4) (5) BRR EVEN BRR ODD UNIT

MIN MAX MIN MAX

1 tc(SPC)M Cycle time, SPICLK 4tc(LSPCLK) 128tc(LSPCLK) 5tc(LSPCLK) 127tc(LSPCLK) ns

2 tw(SPC1)M

Pulse duration, SPICLK first

pulse 0.5tc(SPC)M – 10 0.5tc(SPC)M + 10 0.5tc(SPC)M + 0.5tc(LSPCLK)

– 10

0.5tc(SPC)M +

0.5tc(LSPCLK) + 10 ns

3 tw(SPC2)M

Pulse duration, SPICLK second

pulse 0.5tc(SPC)M – 10 0.5tc(SPC)M + 10 0.5tc(SPC)M – 0.5tc(LSPCLK)

– 10

0.5tc(SPC)M –

0.5tc(LSPCLK) + 10 ns

4 td(SIMO)M

Delay time, SPICLK to

SPISIMO valid 10 10 ns

5 tv(SIMO)M

Valid time, SPISIMO valid after

SPICLK 0.5tc(SPC)M – 10 0.5tc(SPC)M – 0.5tc(LSPCLK)

– 10 ns

8 tsu(SOMI)M

Setup time, SPISOMI before

SPICLK 26 26 ns

9 th(SOMI)M

Hold time, SPISOMI valid after

SPICLK 0 0 ns

23 td(SPC)M

Delay time, SPISTE active to

SPICLK

1.5tc(SPC)M –

3tc(SYSCLK) – 10

1.5tc(SPC)M –

3tc(SYSCLK) – 10 ns

24 td(STE)M

Delay time, SPICLK to SPISTE

inactive 0.5tc(SPC)M – 10 0.5tc(SPC)M – 0.5tc(LSPCLK)

– 10 ns

(1) The MASTER / SLAVE bit (SPICTL.2) is set and the CLOCK PHASE bit (SPICTL.3) is cleared.

(2) tc(SPC) = SPI clock cycle time = LSPCLK/4 or LSPCLK/(SPIBRR +1)

(3) tc(LCO) = LSPCLK cycle time

(4) Internal clock prescalers must be adjusted such that the SPI clock speed is limited to the following SPI clock rate:

Master mode transmit 25-MHz MAX, master mode receive 12.5-MHz MAX

Slave mode transmit 12.5-MAX, slave mode receive 12.5-MHz MAX.

(5) The active edge of the SPICLK signal referenced is controlled by the clock polarity bit (SPICCR.6).

SPISOMI

SPISIMO

SPICLK

(clock polarity = 1)

SPICLK

(clock polarity = 0)

Master In Data

Must Be Valid

Master Out Data Is Valid

SPISTE

23 24

Figure 8-33. SPI Master Mode External Timing (Clock Phase = 0)

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TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS m.2.2.2.2.2.2.2.23 \ 4» 1:7 4% Ti /— O 0 to2o2o2¢¢¢2¢2¢2¢t¢¢¢2¢2929292{9292929292929‘9'0‘0‘9’9‘0‘020‘0'o’

8.9.4.1.2 SPI Master Mode External Timing (Clock Phase = 1)

NO. PARAMETER(1) (2) (3) (4) (5) BRR EVEN BRR ODD UNIT

MIN MAX MIN MAX

1 tc(SPC)M Cycle time, SPICLK 4tc(LSPCLK) 128tc(LSPCLK) 5tc(LSPCLK) 127tc(LSPCLK) ns

2 tw(SPC1)M

Pulse duration, SPICLK first

pulse 0.5tc(SPC)M – 10 0.5tc(SPC)M + 10 0.5tc(SPC)M –

0.5tc(LSPCLK) – 10

0.5tc(SPC)M –

0.5tc(LSPCLK) + 10 ns

3 tw(SPC2)M

Pulse duration, SPICLK second

pulse 0.5tc(SPC)M – 10 0.5tc(SPC)M + 10 0.5tc(SPC)M +

0.5tc(LSPCLK) – 10

0.5tc(SPC)M +

0.5tc(LSPCLK) + 10 ns

6 td(SIMO)M

Delay time, SPISIMO valid to

SPICLK 0.5tc(SPC)M – 10 0.5tc(SPC)M +

0.5tc(LSPCLK) – 10 ns

7 tv(SIMO)M

Valid time, SPISIMO valid after

SPICLK 0.5tc(SPC)M – 10 0.5tc(SPC)M –

0.5tc(LSPCLK) – 10 ns

10 tsu(SOMI)M

Setup time, SPISOMI before

SPICLK 26 26 ns

11 th(SOMI)M

Hold time, SPISOMI valid after

SPICLK 0 0 ns

23 td(SPC)M

Delay time, SPISTE active to

SPICLK

2tc(SPC)M –

3tc(SYSCLK) – 10

2tc(SPC)M –

3tc(SYSCLK) – 10 ns

24 td(STE)M

Delay time, SPICLK to SPISTE

inactive 0.5tc(SPC) – 10 0.5tc(SPC) –

0.5tc(LSPCLK) – 10 ns

(1) The MASTER/SLAVE bit (SPICTL.2) is set and the CLOCK PHASE bit (SPICTL.3) is set.

(2) tc(SPC) = SPI clock cycle time = LSPCLK/4 or LSPCLK/(SPIBRR + 1)

(3) Internal clock prescalers must be adjusted such that the SPI clock speed is limited to the following SPI clock rate:

Master mode transmit 25 MHz MAX, master mode receive 12.5 MHz MAX

Slave mode transmit 12.5 MHz MAX, slave mode receive 12.5 MHz MAX.

(4) tc(LCO) = LSPCLK cycle time

(5) The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPICCR.6).

SPISOMI

SPISIMO

SPICLK

(clock polarity = 1)

SPICLK

(clock polarity = 0)

Master In Data Must

Be Valid

Master Out Data Is Valid

23 24

SPISTE

Figure 8-34. SPI Master Mode External Timing (Clock Phase = 1)

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS ( ﬁz— W14f§ WM Xi; ‘ 0” 0” 09 0” ””O'O'WW'W'O'W'W'VVO' «WWW - 'wwwwmmmmz¢2¢¢. 4% A? *N‘ Mir » 4 > 4 F { : 1 >004 F 44 F { I 1 t": ‘0 o o. F ‘ >004 > 4 F { I 1 >004 > 4 F { > 4 > 4 >

8.9.4.2 SPI Slave Mode Electrical Data/Timing

Section 8.9.4.2.1 lists the slave mode timing (clock phase = 0) and Section 8.9.4.2.2 lists the slave mode timing

(clock phase = 1). Figure 8-35 and Figure 8-36 show the timing waveforms.

8.9.4.2.1 SPI Slave Mode External Timing (Clock Phase = 0)

NO. PARAMETER(1) (2) (4) (3) (5) MIN MAX UNIT

12 tc(SPC)S Cycle time, SPICLK 4tc(SYSCLK) ns

13 tw(SPC1)S Pulse duration, SPICLK first pulse 2tc(SYSCLK) – 1 ns

14 tw(SPC2)S Pulse duration, SPICLK second pulse 2tc(SYSCLK) – 1 ns

15 td(SOMI)S Delay time, SPICLK to SPISOMI valid 21 ns

16 tv(SOMI)S Valid time, SPISOMI data valid after SPICLK 0 ns

19 tsu(SIMO)S Setup time, SPISIMO valid before SPICLK 1.5tc(SYSCLK) ns

20 th(SIMO)S Hold time, SPISIMO data valid after SPICLK 1.5tc(SYSCLK) ns

25 tsu(STE)S Setup time, SPISTE active before SPICLK 1.5tc(SYSCLK) ns

26 th(STE)S Hold time, SPISTE inactive after SPICLK 1.5tc(SYSCLK) ns

(1) The MASTER / SLAVE bit (SPICTL.2) is cleared and the CLOCK PHASE bit (SPICTL.3) is cleared.

(2) tc(SPC) = SPI clock cycle time = LSPCLK/4 or LSPCLK/(SPIBRR + 1)

(3) tc(LCO) = LSPCLK cycle time

(4) Internal clock prescalers must be adjusted such that the SPI clock speed is limited to the following SPI clock rate:

Master mode transmit 25-MHz MAX, master mode receive 12.5-MHz MAX

Slave mode transmit 12.5-MHz MAX, slave mode receive 12.5-MHz MAX.

(5) The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPICCR.6).

SPISIMO

SPISOMI

SPICLK

(clock polarity = 1)

SPICLK

(clock polarity = 0)

SPISIMO Data

Must Be Valid

SPISOMI Data Is Valid

SPISTE

Figure 8-35. SPI Slave Mode External Timing (Clock Phase = 0)

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TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

w TEXAS INSTRUMENTS

8.9.4.2.2 SPI Slave Mode External Timing (Clock Phase = 1)

NO. PARAMETER(1) (2) (3) (4) MIN MAX UNIT

12 tc(SPC)S Cycle time, SPICLK 4tc(SYSCLK) ns

13 tw(SPC1)S Pulse duration, SPICLK first pulse 2tc(SYSCLK) – 1 ns

14 tw(SPC2)S Pulse duration, SPICLK second pulse 2tc(SYSCLK) – 1 ns

17 td(SOMI)S Delay time, SPICLK to SPISOMI valid 21 ns

18 tv(SOMI)S Valid time, SPISOMI data valid after SPICLK 0 ns

21 tsu(SIMO)S Setup time, SPISIMO valid before SPICLK 1.5tc(SYSCLK) ns

22 th(SIMO)S Hold time, SPISIMO data valid after SPICLK 1.5tc(SYSCLK) ns

25 tsu(STE)S Setup time, SPISTE active before SPICLK 1.5tc(SYSCLK) ns

26 th(STE)S Hold time, SPISTE inactive after SPICLK 1.5tc(SYSCLK) ns

(1) The MASTER / SLAVE bit (SPICTL.2) is cleared and the CLOCK PHASE bit (SPICTL.3) is cleared.

(2) tc(SPC) = SPI clock cycle time = LSPCLK/4 or LSPCLK/(SPIBRR + 1)

(3) Internal clock prescalers must be adjusted such that the SPI clock speed is limited to the following SPI clock rate:

Master mode transmit 25-MHz MAX, master mode receive 12.5-MHz MAX

Slave mode transmit 12.5-MHz MAX, slave mode receive 12.5-MHz MAX.

(4) The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPICCR.6).

SPISIMO

SPISOMI

SPICLK

(clock polarity = 1)

SPICLK

(clock polarity = 0)

SPISIMO Data

Must Be Valid

SPISOMI Data Is Valid

21 18

SPISTE

Data ValidData Valid

25 26

Figure 8-36. SPI Slave Mode External Timing (Clock Phase = 1)

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

l TEXAS INSTRUMENTS 16

8.9.5 Serial Communications Interface (SCI) Module

The devices include two serial communications interface (SCI) modules (SCI-A, SCI-B). The SCI module

supports digital communications between the CPU and other asynchronous peripherals that use the standard

non-return-to-zero (NRZ) format. The SCI receiver and transmitter are double-buffered, and each has its own

separate enable and interrupt bits. Both can be operated independently or simultaneously in the full-duplex

mode. To ensure data integrity, the SCI checks received data for break detection, parity, overrun, and framing

errors. The bit rate is programmable to over 65000 different speeds through a 16-bit baud-select register.

Features of each SCI module include:

• Two external pins:

– SCITXD: SCI transmit-output pin

– SCIRXD: SCI receive-input pin

Note

Both pins can be used as GPIO if not used for SCI.

– Baud rate programmable to 64K different rates:

8*1)(BRR

LSPCLK

rateBaud

0BRRwhen ¹

LSPCLK

rateBaud =

0BRRwhen =

• Data-word format

– One start bit

– Data-word length programmable from 1 to 8 bits

– Optional even/odd/no parity bit

– One or 2 stop bits

• Four error-detection flags: parity, overrun, framing, and break detection

• Two wake-up multiprocessor modes: idle-line and address bit

• Half- or full-duplex operation

• Double-buffered receive and transmit functions

• Transmitter and receiver operations can be accomplished through interrupt-driven or polled algorithms with

status flags.

– Transmitter: TXRDY flag (transmitter-buffer register is ready to receive another character) and TX EMPTY

flag (transmitter-shift register is empty)

– Receiver: RXRDY flag (receiver-buffer register is ready to receive another character), BRKDT flag (break

condition occurred), and RX ERROR flag (monitoring four interrupt conditions)

• Separate enable bits for transmitter and receiver interrupts (except BRKDT)

• NRZ (non-return-to-zero) format

Note

All registers in this module are 8-bit registers that are connected to Peripheral Frame 2. When a

as zeros. Writing to the upper byte has no effect.

Enhanced features:

• Auto baud-detect hardware logic

• 4-level transmit/receive FIFO

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TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

TEXAS INSTRUMENTS

The SCI port operation is configured and controlled by the registers listed in Table 8-27 and Table 8-28.

Table 8-27. SCI-A Registers

NAME(1) ADDRESS SIZE (×16) EALLOW

PROTECTED DESCRIPTION

SCICCRA 0x7050 1 No SCI-A Communications Control Register

SCICTL1A 0x7051 1 No SCI-A Control Register 1

SCIHBAUDA 0x7052 1 No SCI-A Baud Register, High Bits

SCILBAUDA 0x7053 1 No SCI-A Baud Register, Low Bits

SCICTL2A 0x7054 1 No SCI-A Control Register 2

SCIRXSTA 0x7055 1 No SCI-A Receive Status Register

SCIRXEMUA 0x7056 1 No SCI-A Receive Debug Data Buffer Register

SCIRXBUFA 0x7057 1 No SCI-A Receive Data Buffer Register

SCITXBUFA 0x7059 1 No SCI-A Transmit Data Buffer Register

SCIFFTXA(2) 0x705A 1 No SCI-A FIFO Transmit Register

SCIFFRXA(2) 0x705B 1 No SCI-A FIFO Receive Register

SCIFFCTA(2) 0x705C 1 No SCI-A FIFO Control Register

SCIPRIA 0x705F 1 No SCI-A Priority Control Register

(1) Registers in this table are mapped to Peripheral Frame 2 space. This space only allows 16-bit accesses. 32-bit accesses produce

undefined results.

(2) These registers are new registers for the FIFO mode.

Table 8-28. SCI-B Registers

NAME(1) ADDRESS SIZE (×16) DESCRIPTION

SCICCRB 0x7750 1 SCI-B Communications Control Register

SCICTL1B 0x7751 1 SCI-B Control Register 1

SCIHBAUDB 0x7752 1 SCI-B Baud Register, High Bits

SCILBAUDB 0x7753 1 SCI-B Baud Register, Low Bits

SCICTL2B 0x7754 1 SCI-B Control Register 2

SCIRXSTB 0x7755 1 SCI-B Receive Status Register

SCIRXEMUB 0x7756 1 SCI-B Receive Debug Data Buffer Register

SCIRXBUFB 0x7757 1 SCI-B Receive Data Buffer Register

SCITXBUFB 0x7759 1 SCI-B Transmit Data Buffer Register

SCIFFTXB(2) 0x775A 1 SCI-B FIFO Transmit Register

SCIFFRXB(2) 0x775B 1 SCI-B FIFO Receive Register

SCIFFCTB(2) 0x775C 1 SCI-B FIFO Control Register

SCIPRIB 0x775F 1 SCI-B Priority Control Register

(1) Registers in this table are mapped to Peripheral Frame 2 space. This space only allows 16-bit accesses. 32-bit accesses produce

undefined results.

(2) These registers are new registers for the FIFO mode.

Figure 8-37 shows the SCI module block diagram.

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

{5‘ TEXAS INSTRUMENTS

TXSHF

TX FIFO_0

TX FIFO_1

TX FIFO_N

Transmit Data

Buffer Register

SCITXBUF.7-0

RXSHF

RX FIFO_0

RX FIFO_1

RX FIFO_N

Receive Data

Buffer Register

SCIRXBUF.7-0

RXENA

SCICTL1.0

TX FIFO Interrupts

RX FIFO Interrupts

Baud Rate

MSB/LSB

Registers

SCIHBAUD.15-8

SCILBAUD.7-0

LSPCLK

Frame

Format and Mode

Parity

SCICCR.6

SCICCR.5

Even/Odd

Enable

SCICTL1.3

TXWAKE

WUT

SCICTL1.1

TXENA

RXENA

SCICTL2.6

TXEMPTY

RXFFOVF

SCICTL2.7

TXRDY SCICTL2.0

TXINTENA

SCIRXST.6

RXRDY

SCIRXST.5

BRKDT

SCICTL2.1

RXBKINTENA

TX Interrupt

Logic

RX Interrupt

Logic

SCIRXST.7

RXERROR

SCICTL1.6

RXERRINTENA

SCI RX Interrupt Select Logic

SCIFFENA

SCIFFTX.14

RXWAKE

SCIRXST.1

Auto Baud Detect Logic

TXINT

To CPU

RXINT

To CPU

SCITXD

SCIRXD

BRKDT FE OE PE

SCIRXST.5-2

SCICTL1.0

SCIFFRX.15

SCI TX Interrupt Select Logic

www.ti.com

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

w TEXAS INSTRUMENTS

TXSHF

TX FIFO_0

TX FIFO_1

TX FIFO_N

Transmit Data

Buffer Register

SCITXBUF.7-0

RXSHF

RX FIFO_0

RX FIFO_1

RX FIFO_N

Receive Data

Buffer Register

SCIRXBUF.7-0

RXENA

SCICTL1.0

TX FIFO Interrupts

RX FIFO Interrupts

Baud Rate

MSB/LSB

Registers

SCIHBAUD.15-8

SCILBAUD.7-0

LSPCLK

Frame

Format and Mode

Parity

SCICCR.6

SCICCR.5

Even/Odd

Enable

SCICTL1.3

TXWAKE

WUT

SCICTL1.1

TXENA

RXENA

SCICTL2.6

TXEMPTY

RXFFOVF

SCICTL2.7

TXRDY SCICTL2.0

TXINTENA

SCIRXST.6

RXRDY

SCIRXST.5

BRKDT

SCICTL2.1

RXBKINTENA

TX Interrupt

Logic

RX Interrupt

Logic

SCIRXST.7

RXERROR

SCICTL1.6

RXERRINTENA

SCI RX Interrupt Select Logic

SCIFFENA

SCIFFTX.14

RXWAKE

SCIRXST.1

Auto Baud Detect Logic

TXINT

To CPU

RXINT

To CPU

SCITXD

SCIRXD

BRKDT FE OE PE

SCIRXST.5-2

SCICTL1.0

SCIFFRX.15

SCI TX Interrupt Select Logic

Figure 8-37. Serial Communications Interface (SCI) Module Block Diagram

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

8.9.6 Multichannel Buffered Serial Port (McBSP) Module

The McBSP module has the following features:

• Compatible to McBSP in TMS320C28x/TMS320F28x DSP devices

• Full-duplex communication

• Double-buffered data registers that allow a continuous data stream

• Independent framing and clocking for receive and transmit

• External shift clock generation or an internal programmable frequency shift clock

• A wide selection of data sizes including 8-, 12-, 16-, 20-, 24-, or 32-bits

• 8-bit data transfers with LSB or MSB first

• Programmable polarity for both frame synchronization and data clocks

• Highly programmable internal clock and frame generation

• Direct interface to industry-standard CODECs, Analog Interface Chips (AICs), and other serially connected

analog-to-digital (A/D) and digital-to-analog (D/A) devices

• Works with SPI-compatible devices

• The following application interfaces can be supported on the McBSP:

– T1/E1 framers

– IOM-2 compliant devices

– AC97-compliant devices (the necessary multiphase frame synchronization capability is provided.)

– IIS-compliant devices

– SPI

• McBSP clock rate,

( )

CLKSRG

CLKG =

1 + CLKGDV

where CLKSRG source could be LSPCLK, CLKX, or CLKR. Serial port performance is limited by I/O buffer

switching speed. Internal prescalers must be adjusted such that the peripheral speed is less than the I/O

buffer speed limit.

Note

See Section 8.9 for maximum I/O pin toggling speed.

Note

On the 80-pin package, only the clock-stop mode (SPI) of the McBSP is supported.

www.ti.com

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

Figure 8-38 shows the block diagram of the McBSP module.

McBSP Receive

Interrupt Select Logic

MDXx

MDRx

Expand Logic

DRR1 Receive Buffer

Interrupt

DRR2 Receive Buffer

RBR1 RegisterRBR2 Register

MCLKXx

MFSXx

MCLKRx

MFSRx

Compand Logic

DXR2 Transmit Buffer

RSR1

XSR2 XSR1

Peripheral Read Bus

16 16

RSR2

DXR1 Transmit Buffer

LSPCLK

MRINT

To CPU

RX Interrupt Logic

McBSP Transmit

Interrupt Select Logic

Interrupt

MXINT

To CPU TX Interrupt Logic

16 16

Bridge

DMA Bus

Peripheral Bus

Peripheral Write Bus

CPU

Figure 8-38. McBSP Module

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

TEXAS INSTRUMENTS

Table 8-29 provides a summary of the McBSP registers.

Table 8-29. McBSP Register Summary

NAME McBSP-A

ADDRESS TYPE RESET VALUE DESCRIPTION

Data Registers, Receive, Transmit

DRR2 0x5000 R 0x0000 McBSP Data Receive Register 2

DRR1 0x5001 R 0x0000 McBSP Data Receive Register 1

DXR2 0x5002 W 0x0000 McBSP Data Transmit Register 2

DXR1 0x5003 W 0x0000 McBSP Data Transmit Register 1

McBSP Control Registers

SPCR2 0x5004 R/W 0x0000 McBSP Serial Port Control Register 2

SPCR1 0x5005 R/W 0x0000 McBSP Serial Port Control Register 1

RCR2 0x5006 R/W 0x0000 McBSP Receive Control Register 2

RCR1 0x5007 R/W 0x0000 McBSP Receive Control Register 1

XCR2 0x5008 R/W 0x0000 McBSP Transmit Control Register 2

XCR1 0x5009 R/W 0x0000 McBSP Transmit Control Register 1

SRGR2 0x500A R/W 0x0000 McBSP Sample Rate Generator Register 2

SRGR1 0x500B R/W 0x0000 McBSP Sample Rate Generator Register 1

Multichannel Control Registers

MCR2 0x500C R/W 0x0000 McBSP Multichannel Register 2

MCR1 0x500D R/W 0x0000 McBSP Multichannel Register 1

RCERA 0x500E R/W 0x0000 McBSP Receive Channel Enable Register Partition A

RCERB 0x500F R/W 0x0000 McBSP Receive Channel Enable Register Partition B

XCERA 0x5010 R/W 0x0000 McBSP Transmit Channel Enable Register Partition A

XCERB 0x5011 R/W 0x0000 McBSP Transmit Channel Enable Register Partition B

PCR 0x5012 R/W 0x0000 McBSP Pin Control Register

RCERC 0x5013 R/W 0x0000 McBSP Receive Channel Enable Register Partition C

RCERD 0x5014 R/W 0x0000 McBSP Receive Channel Enable Register Partition D

XCERC 0x5015 R/W 0x0000 McBSP Transmit Channel Enable Register Partition C

XCERD 0x5016 R/W 0x0000 McBSP Transmit Channel Enable Register Partition D

RCERE 0x5017 R/W 0x0000 McBSP Receive Channel Enable Register Partition E

RCERF 0x5018 R/W 0x0000 McBSP Receive Channel Enable Register Partition F

XCERE 0x5019 R/W 0x0000 McBSP Transmit Channel Enable Register Partition E

XCERF 0x501A R/W 0x0000 McBSP Transmit Channel Enable Register Partition F

RCERG 0x501B R/W 0x0000 McBSP Receive Channel Enable Register Partition G

RCERH 0x501C R/W 0x0000 McBSP Receive Channel Enable Register Partition H

XCERG 0x501D R/W 0x0000 McBSP Transmit Channel Enable Register Partition G

XCERH 0x501E R/W 0x0000 McBSP Transmit Channel Enable Register Partition H

MFFINT 0x5023 R/W 0x0000 McBSP Interrupt Enable Register

www.ti.com

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

8.9.6.1 McBSP Electrical Data/Timing

8.9.6.1.1 McBSP Transmit and Receive Timing

8.9.6.1.1.1 McBSP Timing Requirements

NO.(1)

(2) MIN MAX UNIT

McBSP module clock (CLKG, CLKX, CLKR) range 1 kHz

20(3) (4) MHz

McBSP module cycle time (CLKG, CLKX, CLKR) range 50(4) ns

1 ms

M11 tc(CKRX) Cycle time, CLKR/X CLKR/X ext 2P ns

M12 tw(CKRX) Pulse duration, CLKR/X high or CLKR/X low CLKR/X ext P – 7 ns

M13 tr(CKRX) Rise time, CLKR/X CLKR/X ext 7 ns

M14 tf(CKRX) Fall time, CLKR/X CLKR/X ext 7 ns

M15 tsu(FRH-CKRL) Setup time, external FSR high before CLKR low CLKR int 18 ns

CLKR ext 2

M16 th(CKRL-FRH) Hold time, external FSR high after CLKR low CLKR int 0 ns

CLKR ext 6

M17 tsu(DRV-CKRL) Setup time, DR valid before CLKR low CLKR int 18 ns

CLKR ext 2

M18 th(CKRL-DRV) Hold time, DR valid after CLKR low CLKR int 0 ns

CLKR ext 6

M19 tsu(FXH-CKXL) Setup time, external FSX high before CLKX low CLKX int 18 ns

CLKX ext 2

M20 th(CKXL-FXH) Hold time, external FSX high after CLKX low CLKX int 0 ns

CLKX ext 6

(1) Polarity bits CLKRP = CLKXP = FSRP = FSXP = 0. If the polarity of any of the signals is inverted, then the timing references of that

signal are also inverted.

(2) 2P = 1/CLKG in ns. CLKG is the output of sample rate generator mux. CLKG = CLKSRG/(1 + CLKGDV). CLKSRG can be LSPCLK,

CLKX, CLKR as source. CLKSRG ≤ (SYSCLKOUT/2). McBSP performance is limited by I/O buffer switching speed.

(3) Internal clock prescalers must be adjusted such that the McBSP clock (CLKG, CLKX, CLKR) speeds are not greater than the I/O buffer

speed limit (20 MHz).

(4) Maximum McBSP module clock frequency decreases to 10 MHz for internal CLKR.

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

8.9.6.1.1.2 McBSP Switching Characteristics

over recommended operating conditions (unless otherwise noted)

NO. PARAMETER(1) (2) MIN MAX UNIT

M1 tc(CKRX) Cycle time, CLKR/X CLKR/X int 2P ns

M2 tw(CKRXH) Pulse duration, CLKR/X high CLKR/X int D – 5(3) D + 5(3) ns

M3 tw(CKRXL) Pulse duration, CLKR/X low CLKR/X int C – 5(3) C + 5(3) ns

M4 td(CKRH-FRV) Delay time, CLKR high to internal FSR valid CLKR int 0 4 ns

CLKR ext 3 27

M5 td(CKXH-FXV) Delay time, CLKX high to internal FSX valid CLKX int 0 4 ns

CLKX ext 3 27

M6 tdis(CKXH-DXHZ)

Disable time, CLKX high to DX high impedance

following last data bit

CLKX int 8 ns

CLKX ext 14

M7 td(CKXH-DXV)

Delay time, CLKX high to DX valid. CLKX int 9

This applies to all bits except the first bit transmitted. CLKX ext 28

Delay time, CLKX high to DX valid DXENA = 0 CLKX int 8

CLKX ext 14

Only applies to first bit transmitted when

in Data Delay 1 or 2 (XDATDLY=01b or

10b) modes

DXENA = 1

CLKX int P + 8

CLKX ext P + 14

M8 ten(CKXH-DX)

Enable time, CLKX high to DX driven DXENA = 0 CLKX int 0

CLKX ext 6

Only applies to first bit transmitted when

in Data Delay 1 or 2 (XDATDLY=01b or

10b) modes

DXENA = 1

CLKX int P

CLKX ext P + 6

M9 td(FXH-DXV)

Delay time, FSX high to DX valid DXENA = 0 FSX int 8

FSX ext 14

Only applies to first bit transmitted when

in Data Delay 0 (XDATDLY=00b) mode. DXENA = 1 FSX int P + 8

FSX ext P + 14

M10 ten(FXH-DX)

Enable time, FSX high to DX driven DXENA = 0 FSX int 0

FSX ext 6

Only applies to first bit transmitted when

in Data Delay 0 (XDATDLY=00b) mode DXENA = 1 FSX int P

FSX ext P + 6

(1) Polarity bits CLKRP = CLKXP = FSRP = FSXP = 0. If the polarity of any of the signals is inverted, then the timing references of that

signal are also inverted.

(2) 2P = 1/CLKG in ns.

(3) C = CLKRX low pulse width = P

D = CLKRX high pulse width = P

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TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

TEXAS INSTRUMENTS H—w b—q—Lmz MI2 ’ M1: 1 h—I‘r M3. M12 ’1 1* 1 1 1 I \ g \‘R if 1 / “\ 1/ 11 M4<>1 1+ 1 ,4 1 1 M1574—D1 m6 1 1 1 —X—ﬁ 1 1 H 1 1 1 MWH 1 M13 1 1 —1( WM) X

(n−2)Bit (n−1)

(n−3)(n−2)Bit (n−1)

(n−4)(n−3)(n−2)Bit (n−1)

M18

M17

M18

M17

M18

M16

M15

M4 M14

M13

M3, M12

M1, M11

M2, M12

(RDATDLY=10b)

(RDATDLY=01b)

(RDATDLY=00b)

FSR (ext)

FSR (int)

CLKR

Figure 8-39. McBSP Receive Timing

M10

(XDATDLY=10b)

(XDATDLY=01b)

(XDATDLY=00b)

(n−2)Bit (n−1)Bit 0

(n−4)Bit (n−1) (n−3)(n−2)Bit 0

(n−3)(n−2)Bit (n−1)

Bit 0

M20

M14

M13

M3, M12

M1, M11

M2, M12

FSX (ext)

FSX (int)

CLKX

M19

Figure 8-40. McBSP Transmit Timing

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

{5‘ TEXAS INSTRUMENTS

8.9.6.1.2 McBSP as SPI Master or Slave Timing

8.9.6.1.2.1 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0)

NO.(1) MASTER SLAVE UNIT

MIN MAX MIN MAX

M30 tsu(DRV-CKXL) Setup time, DR valid before CLKX low 30 8P – 10 ns

M31 th(CKXL-DRV) Hold time, DR valid after CLKX low 1 8P – 10 ns

M32 tsu(BFXL-CKXH) Setup time, FSX low before CLKX high 8P + 10 ns

M33 tc(CKX) Cycle time, CLKX 2P(2) 16P ns

(1) For all SPI slave modes, CLKX has to be a minimum of 8 CLKG cycles. Furthermore, CLKG should be LSPCLK/2 by setting CLKSM =

CLKGDV = 1.

(2) 2P = 1/CLKG

8.9.6.1.2.2 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 0)

over recommended operating conditions (unless otherwise noted)

NO. PARAMETER MASTER SLAVE UNIT

MIN MAX MIN MAX

M24 th(CKXL-FXL) Hold time, FSX low after CLKX low 2P(1) ns

M25 td(FXL-CKXH) Delay time, FSX low to CLKX high P ns

M26 td(CKXH-DXV) Delay time, CLKX high to DX valid –2 0 3P + 6 5P + 20 ns

M28 tdis(FXH-DXHZ)

Disable time, DX high impedance following

last data bit from FSX high 6 6P + 6 ns

M29 td(FXL-DXV) Delay time, FSX low to DX valid 6 4P + 6 ns

(1) 2P = 1/CLKG

Bit 0 Bit(n-1) (n-2) (n-3) (n-4)

CLKX

FSX

M30 M31

M28

M24

M29

LSB MSB

M32 M33

M25 M26

Figure 8-41. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0

www.ti.com

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

8.9.6.1.2.3 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0)

NO.(1) MASTER SLAVE UNIT

MIN MAX MIN MAX

M39 tsu(DRV-CKXH) Setup time, DR valid before CLKX high 30 8P – 10 ns

M40 th(CKXH-DRV) Hold time, DR valid after CLKX high 1 8P – 10 ns

M41 tsu(FXL-CKXH) Setup time, FSX low before CLKX high 16P + 10 ns

M42 tc(CKX) Cycle time, CLKX 2P(2) 16P ns

(1) For all SPI slave modes, CLKX has to be a minimum of 8 CLKG cycles. Furthermore, CLKG should be LSPCLK/2 by setting CLKSM =

CLKGDV = 1.

(2) 2P = 1/CLKG

8.9.6.1.2.4 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 0)

over recommended operating conditions (unless otherwise noted)

NO. PARAMETER MASTER SLAVE UNIT

MIN MAX MIN MAX

M34 th(CKXL-FXL) Hold time, FSX low after CLKX low P ns

M35 td(FXL-CKXH) Delay time, FSX low to CLKX high 2P(1) ns

M36 td(CKXL-DXV) Delay time, CLKX low to DX valid –2 0 3P + 6 5P + 20 ns

M37 tdis(CKXL-DXHZ)

Disable time, DX high impedance following last data bit

from CLKX low P + 6 7P + 6 ns

M38 td(FXL-DXV) Delay time, FSX low to DX valid 6 4P + 6 ns

(1) 2P = 1/CLKG

Bit 0 Bit(n-1) (n-2) (n-3) (n-4)

CLKX

FSX

M35

M37

M40

M39

M38

LSB MSB

M41 M42

M34 M36

Figure 8-42. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

{5‘ TEXAS INSTRUMENTS m

8.9.6.1.2.5 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1)

NO.(1) MASTER SLAVE UNIT

MIN MAX MIN MAX

M49 tsu(DRV-CKXH) Setup time, DR valid before CLKX high 30 8P – 10 ns

M50 th(CKXH-DRV) Hold time, DR valid after CLKX high 1 8P – 10 ns

M51 tsu(FXL-CKXL) Setup time, FSX low before CLKX low 8P + 10 ns

M52 tc(CKX) Cycle time, CLKX 2P(2) 16P ns

(1) For all SPI slave modes, CLKX has to be a minimum of 8 CLKG cycles. Furthermore, CLKG should be LSPCLK/2 by setting CLKSM =

CLKGDV = 1.

(2) 2P = 1/CLKG

8.9.6.1.2.6 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 1)

over recommended operating conditions (unless otherwise noted)

NO. PARAMETER MASTER SLAVE UNIT

MIN MAX MIN MAX

M43 th(CKXH-FXL) Hold time, FSX low after CLKX high 2P(1) ns

M44 td(FXL-CKXL) Delay time, FSX low to CLKX low P ns

M45 td(CKXL-DXV) Delay time, CLKX low to DX valid –2 0 3P + 6 5P + 20 ns

M47 tdis(FXH-DXHZ)

Disable time, DX high impedance following last data bit from

FSX high 6 6P + 6 ns

M48 td(FXL-DXV) Delay time, FSX low to DX valid 6 4P + 6 ns

(1) 2P = 1/CLKG

M51

M50

M47

Bit 0 Bit(n-1) (n-2) (n-3) (n-4)

CLKX

FSX

M48

M49

M43

LSB MSB M52

M44 M45

Figure 8-43. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1

www.ti.com

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

8.9.6.1.2.7 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1)

NO.(1) MASTER SLAVE UNIT

MIN MAX MIN MAX

M58 tsu(DRV-CKXL) Setup time, DR valid before CLKX low 30 8P – 10 ns

M59 th(CKXL-DRV) Hold time, DR valid after CLKX low 1 8P – 10 ns

M60 tsu(FXL-CKXL) Setup time, FSX low before CLKX low 16P + 10 ns

M61 tc(CKX) Cycle time, CLKX 2P(2) 16P ns

(1) For all SPI slave modes, CLKX has to be a minimum of 8 CLKG cycles. Furthermore, CLKG should be LSPCLK/2 by setting CLKSM =

CLKGDV = 1.

(2) 2P = 1/CLKG

8.9.6.1.2.8 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 1)

over recommended operating conditions (unless otherwise noted)(1)

NO. PARAMETER MASTER SLAVE UNIT

MIN MAX MIN MAX

M53 th(CKXH-FXL) Hold time, FSX low after CLKX high P ns

M54 td(FXL-CKXL) Delay time, FSX low to CLKX low 2P(1) ns

M55 td(CKXH-DXV) Delay time, CLKX high to DX valid –2 0 3P + 6 5P + 20 ns

M56 tdis(CKXH-DXHZ)

Disable time, DX high impedance following last data

bit from CLKX high P + 6 7P + 6 ns

M57 td(FXL-DXV) Delay time, FSX low to DX valid 6 4P + 6 ns

(1) 2P = 1/CLKG

Bit 0 Bit(n-1) (n-2) (n-3) (n-4)

CLKX

FSX

M54

M58

M56

M53

M55

M59

M57

LSB MSB

M60 M61

Figure 8-44. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

8.9.7 Enhanced Controller Area Network (eCAN) Module

The CAN module (eCAN-A) has the following features:

• Fully compliant with CAN protocol, version 2.0B

• Supports data rates up to 1 Mbps

• Thirty-two mailboxes, each with the following properties:

– Configurable as receive or transmit

– Configurable with standard or extended identifier

– Has a programmable receive mask

– Supports data and remote frame

– Composed of 0 to 8 bytes of data

– Uses a 32-bit timestamp on receive and transmit message

– Protects against reception of new message

– Holds the dynamically programmable priority of transmit message

– Employs a programmable interrupt scheme with two interrupt levels

– Employs a programmable alarm on transmission or reception time-out

• Low-power mode

• Programmable wake-up on bus activity

• Automatic reply to a remote request message

• Automatic retransmission of a frame in case of loss of arbitration or error

• 32-bit local network time counter synchronized by a specific message (communication in conjunction with

mailbox 16)

• Self-test mode

– Operates in a loopback mode receiving its own message. A "dummy" acknowledge is provided, thereby

eliminating the need for another node to provide the acknowledge bit.

Note

For a SYSCLKOUT of 90 MHz, the smallest bit rate possible is 6.25 kbps.

The F2806x CAN has passed the conformance test per ISO/DIS 16845. Contact TI for test report and

exceptions.

www.ti.com

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

Mailbox RAM

(512 Bytes)

32-Message Mailbox

of 4 32-Bit Words´

Memory Management

Unit

CPU Interface,

Receive Control Unit,

Timer Management Unit

eCAN Memory

(512 Bytes)

Registers and

Message Objects Control

Message Controller

32 32

eCAN Protocol Kernel

Receive Buffer

Transmit Buffer

Control Buffer

Status Buffer

Enhanced CAN Controller 32

Controls Address Data

eCAN1INTeCAN0INT

SN65HVD23x

3.3-V CAN Transceiver

CAN Bus

Figure 8-45. eCAN Block Diagram and Interface Circuit

Table 8-30. 3.3-V eCAN Transceivers

PART NUMBER SUPPLY

VOLTAGE

LOW-POWER

MODE

SLOPE

CONTROL VREF OTHER TA

SN65HVD230 3.3 V Standby Adjustable Yes – –40°C to 85°C

SN65HVD230Q 3.3 V Standby Adjustable Yes – –40°C to 125°C

SN65HVD231 3.3 V Sleep Adjustable Yes – –40°C to 85°C

SN65HVD231Q 3.3 V Sleep Adjustable Yes – –40°C to 125°C

SN65HVD232 3.3 V None None None – –40°C to 85°C

SN65HVD232Q 3.3 V None None None – –40°C to 125°C

SN65HVD233 3.3 V Standby Adjustable None Diagnostic Loopback –40°C to 125°C

SN65HVD234 3.3 V Standby and Sleep Adjustable None – –40°C to 125°C

SN65HVD235 3.3 V Standby Adjustable None Autobaud Loopback –40°C to 125°C

ISO1050 3–5.5 V None None None

Built-in Isolation

Low Prop Delay

Thermal Shutdown

Fail-safe Operation

Dominant Time-Out

–55°C to 105°C

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

b TEXAS INSTRUMENTS

Mailbox Enable - CANME

Mailbox Direction - CANMD

Transmission Request Set - CANTRS

Transmission Request Reset - CANTRR

Transmission Acknowledge - CANTA

Abort Acknowledge - CANAA

Received Message Pending - CANRMP

Received Message Lost - CANRML

Remote Frame Pending - CANRFP

Global Acceptance Mask - CANGAM

Master Control - CANMC

Bit-Timing Configuration - CANBTC

Error and Status - CANES

Transmit Error Counter - CANTEC

Receive Error Counter - CANREC

Global Interrupt Flag 0 - CANGIF0

Global Interrupt Mask - CANGIM

Mailbox Interrupt Mask - CANMIM

Mailbox Interrupt Level - CANMIL

Overwrite Protection Control - CANOPC

TX I/O Control - CANTIOC

RX I/O Control - CANRIOC

Timestamp Counter - CANTSC

Global Interrupt Flag 1 - CANGIF1

Time-Out Control - CANTOC

Time-Out Status - CANTOS

Reserved

eCAN-A Control and Status Registers

Message Identifier - MSGID

61E8h-61E9h

Message Control - MSGCTRL

Message Data Low - MDL

Message Data High - MDH

Message Mailbox (16 Bytes)

Control and Status Registers

6000h

603Fh

Local Acceptance Masks (LAM)

(32 32-Bit RAM)´

6040h

607Fh

6080h

60BFh

60C0h

60FFh

eCAN-A Memory (512 Bytes)

Message Object Timestamps (MOTS)

(32 32-Bit RAM)´

Message Object Time-Out (MOTO)

(32 32-Bit RAM)´

Mailbox 06100h-6107h

Mailbox 1

6108h-610Fh

Mailbox 2

6110h-6117h

Mailbox 3

6118h-611Fh

eCAN-A Memory RAM (512 Bytes)

Mailbox 4

6120h-6127h

Mailbox 28

61E0h-61E7h

Mailbox 2961E8h-61EFh

Mailbox 3061F0h-61F7h

Mailbox 31

61F8h-61FFh

61EAh-61EBh

61ECh-61EDh

61EEh-61EFh

Figure 8-46. eCAN-A Memory Map

Note

If the eCAN module is not used in an application, the RAM available (LAM, MOTS, MOTO, and

mailbox RAM) can be used as general-purpose RAM. The CAN module clock should be enabled for

this.

www.ti.com

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

TEXAS INSTRUMENTS

The CAN registers listed in Table 8-31 are used by the CPU to configure and control the CAN controller and

the message objects. eCAN control registers only support 32-bit read/write operations. Mailbox RAM can be

accessed as 16 bits or 32 bits. All 32-bit accesses are aligned to an even boundary.

Table 8-31. CAN Registers

ADDRESS SIZE (×32) DESCRIPTION

CANME 0x6000 1 Mailbox enable

CANMD 0x6002 1 Mailbox direction

CANTRS 0x6004 1 Transmit request set

CANTRR 0x6006 1 Transmit request reset

CANTA 0x6008 1 Transmission acknowledge

CANAA 0x600A 1 Abort acknowledge

CANRMP 0x600C 1 Receive message pending

CANRML 0x600E 1 Receive message lost

CANRFP 0x6010 1 Remote frame pending

CANGAM 0x6012 1 Global acceptance mask

CANMC 0x6014 1 Master control

CANBTC 0x6016 1 Bit-timing configuration

CANES 0x6018 1 Error and status

CANTEC 0x601A 1 Transmit error counter

CANREC 0x601C 1 Receive error counter

CANGIF0 0x601E 1 Global interrupt flag 0

CANGIM 0x6020 1 Global interrupt mask

CANGIF1 0x6022 1 Global interrupt flag 1

CANMIM 0x6024 1 Mailbox interrupt mask

CANMIL 0x6026 1 Mailbox interrupt level

CANOPC 0x6028 1 Overwrite protection control

CANTIOC 0x602A 1 TX I/O control

CANRIOC 0x602C 1 RX I/O control

CANTSC 0x602E 1 Timestamp counter (Reserved in SCC mode)

CANTOC 0x6030 1 Time-out control (Reserved in SCC mode)

CANTOS 0x6032 1 Time-out status (Reserved in SCC mode)

(1) These registers are mapped to Peripheral Frame 1.

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

8.9.8 Inter-Integrated Circuit (I2C)

The device contains one I2C Serial Port. Figure 8-47 shows how the I2C peripheral module interfaces within the

device.

The I2C module has the following features:

• Compliance with the Philips Semiconductors I2C-bus specification (version 2.1):

– Support for 1-bit to 8-bit format transfers

– 7-bit and 10-bit addressing modes

– General call

– START byte mode

– Support for multiple master-transmitters and slave-receivers

– Support for multiple slave-transmitters and master-receivers

– Combined master transmit/receive and receive/transmit mode

– Data transfer rate of from 10 kbps up to 400 kbps (I2C Fast-mode rate)

• One 4-word receive FIFO and one 4-word transmit FIFO

• One interrupt that can be used by the CPU. This interrupt can be generated as a result of one of the following

conditions:

– Transmit-data ready

– Receive-data ready

– Register-access ready

– No-acknowledgment received

– Arbitration lost

– Stop condition detected

– Addressed as slave

• An additional interrupt that can be used by the CPU when in FIFO mode

• Module enable/disable capability

• Free data format mode

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TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

I2CXSR I2CDXR

I2CRSR I2CDRR

Clock

Synchronizer

Prescaler

Noise Filters

Arbitrator

I2C INT

Peripheral Bus

Interrupt to

CPU/PIE

SDA

SCL

Control/Status

Registers CPU

I2C Module

TX FIFO

RX FIFO

FIFO Interrupt to

CPU/PIE

A. The I2C registers are accessed at the SYSCLKOUT rate. The internal timing and signal waveforms of the I2C port are also at the

SYSCLKOUT rate.

B. The clock enable bit (I2CAENCLK) in the PCLKCRO register turns off the clock to the I2C port for low-power operation. Upon reset,

I2CAENCLK is clear, which indicates the peripheral internal clocks are off.

Figure 8-47. I2C Peripheral Module Interfaces

The registers in Table 8-32 configure and control the I2C port operation.

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

Table 8-32. I2C-A Registers

NAME ADDRESS EALLOW

PROTECTED DESCRIPTION

I2COAR 0x7900 No I2C own address register

I2CIER 0x7901 No I2C interrupt enable register

I2CSTR 0x7902 No I2C status register

I2CCLKL 0x7903 No I2C clock low-time divider register

I2CCLKH 0x7904 No I2C clock high-time divider register

I2CCNT 0x7905 No I2C data count register

I2CDRR 0x7906 No I2C data receive register

I2CSAR 0x7907 No I2C slave address register

I2CDXR 0x7908 No I2C data transmit register

I2CMDR 0x7909 No I2C mode register

I2CISRC 0x790A No I2C interrupt source register

I2CPSC 0x790C No I2C prescaler register

I2CFFTX 0x7920 No I2C FIFO transmit register

I2CFFRX 0x7921 No I2C FIFO receive register

I2CRSR – No I2C receive shift register (not accessible to the CPU)

I2CXSR – No I2C transmit shift register (not accessible to the CPU)

www.ti.com

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

8.9.8.1 I2C Electrical Data/Timing

Section 8.9.8.1.1 shows the I2C timing requirements. Section 8.9.8.1.2 shows the I2C switching characteristics.

8.9.8.1.1 I2C Timing Requirements

MIN MAX UNIT

th(SDA-SCL)START

Hold time, START condition, SCL fall delay

after SDA fall 0.6 µs

tsu(SCL-SDA)START

Setup time, Repeated START, SCL rise

before SDA fall delay 0.6 µs

th(SCL-DAT) Hold time, data after SCL fall 0 µs

tsu(DAT-SCL) Setup time, data before SCL rise 100 ns

tr(SDA) Rise time, SDA Input tolerance 20 300 ns

tr(SCL) Rise time, SCL Input tolerance 20 300 ns

tf(SDA) Fall time, SDA Input tolerance 11.4 300 ns

tf(SCL) Fall time, SCL Input tolerance 11.4 300 ns

tsu(SCL-SDA)STOP

Setup time, STOP condition, SCL rise before

SDA rise delay 0.6 µs

8.9.8.1.2 I2C Switching Characteristics

over recommended operating conditions (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN MAX UNIT

fSCL SCL clock frequency

I2C clock module frequency is from 7 MHz to

12 MHz and I2C prescaler and clock divider

registers are configured appropriately.

400 kHz

Vil Low level input voltage 0.3 VDDIO V

Vih High level input voltage 0.7 VDDIO V

Vhys Input hysteresis 0.05 VDDIO V

Vol Low level output voltage 3-mA sink current 0 0.4 V

tLOW Low period of SCL clock

I2C clock module frequency is from 7 MHz to

12 MHz and I2C prescaler and clock divider

registers are configured appropriately.

1.3 μs

tHIGH High period of SCL clock

I2C clock module frequency is from 7 MHz to

12 MHz and I2C prescaler and clock divider

registers are configured appropriately.

0.6 μs

Input current with an input voltage from

0.1 VDDIO to 0.9 VDDIO MAX –10 10 μA

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS EPWM1TZINT EPWM 1 INT EPWMZTZINT EPWMZINT EPWMxTZINT EPWMxINT

8.9.9 Enhanced Pulse Width Modulator (ePWM) Modules (ePWM1 to ePWM8)

The devices contain up to eight enhanced PWM (ePWM) modules. Figure 8-48 shows a block diagram of

multiple ePWM modules. Figure 8-49 shows the signal interconnections with the ePWM.

Table 8-33 and Table 8-34 show the complete ePWM register set per module.

EPWM1TZINT

PIE

EPWM1INT

EPWM2TZINT

EPWM2INT

EPWMxTZINT

EPWMxINT

COMPOUT1

COMPOUT2

COMP

SOCA1

ADC SOCB1

SOCA2

SOCB2

SOCAx

SOCBx

EPWM1SYNCI

EPWM2SYNCI

EPWM1SYNCO

EPWM2SYNCO

EPWM1

Module

EPWM2

Module

EPWMxSYNCI

EPWMx

Module

TZ6

TZ1 TZ3to

TZ5 CLOCKFAIL

TZ4 EQEP1ERR(A)

EMUSTOP

TZ5 CLOCKFAIL

TZ4 EQEP1ERR(A)

EMUSTOP

EPWM1ENCLK

TBCLKSYNC

EPWM2ENCLK

TBCLKSYNC

TZ5

TZ6

EPWMxENCLK

TBCLKSYNC

CLOCKFAIL

TZ4 EQEP1ERR(A)

EMUSTOP

EPWM1B

C28x CPU

System Control

eQEP1

TZ1 TZ3to

EPWM1SYNCO

EPWM2B

eCAPI

EPWMxB

EQEP1ERR

MEPWMxA

EPWM2A

EPWM1A

ADCSOCBO

ADCSOCAO

Peripheral Bus

Pulse Stretch

(32 SYSCLKOUT Cycles, Active-Low Output)

SOCA1

SOCA2

SPCAx

Pulse Stretch

(32 SYSCLKOUT Cycles, Active-Low Output)

SOCB1

SOCB2

SPCBx

EPWMSYNCI

A. This signal exists only on devices with an eQEP1 module.

Figure 8-48. ePWM

www.ti.com

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

TEXAS INSTRUMENTS

Table 8-33. ePWM1–ePWM4 Control and Status Registers

NAME ePWM1 ePWM2 ePWM3 ePWM4 SIZE (×16)/

#SHADOW DESCRIPTION

TBCTL 0x6800 0x6840 0x6880 0x68C0 1/0 Time Base Control Register

TBSTS 0x6801 0x6841 0x6881 0x68C1 1/0 Time Base Status Register

TBPHSHR 0x6802 0x6842 0x6882 0x68C2 1/0 Time Base Phase HRPWM Register

TBPHS 0x6803 0x6843 0x6883 0x68C3 1/0 Time Base Phase Register

TBCTR 0x6804 0x6844 0x6884 0x68C4 1/0 Time Base Counter Register

TBPRD 0x6805 0x6845 0x6885 0x68C5 1/1 Time Base Period Register Set

TBPRDHR 0x6806 0x6846 0x6886 0x68C6 1/1 Time Base Period High-Resolution Register(1)

CMPCTL 0x6807 0x6847 0x6887 0x68C7 1/0 Counter Compare Control Register

CMPAHR 0x6808 0x6848 0x6888 0x68C8 1/1 Time Base Compare A HRPWM Register

CMPA 0x6809 0x6849 0x6889 0x68C9 1/1 Counter Compare A Register Set

CMPB 0x680A 0x684A 0x688A 0x68CA 1/1 Counter Compare B Register Set

AQCTLA 0x680B 0x684B 0x688B 0x68CB 1/0 Action Qualifier Control Register For Output A

AQCTLB 0x680C 0x684C 0x688C 0x68CC 1/0 Action Qualifier Control Register For Output B

AQSFRC 0x680D 0x684D 0x688D 0x68CD 1/0 Action Qualifier Software Force Register

AQCSFRC 0x680E 0x684E 0x688E 0x68CE 1/1 Action Qualifier Continuous S/W Force

DBCTL 0x680F 0x684F 0x688F 0x68CF 1/1 Dead-Band Generator Control Register

DBRED 0x6810 0x6850 0x6890 0x68D0 1/0 Dead-Band Generator Rising Edge Delay

Count Register

DBFED 0x6811 0x6851 0x6891 0x68D1 1/0 Dead-Band Generator Falling Edge Delay

Count Register

TZSEL 0x6812 0x6852 0x6892 0x68D2 1/0 Trip Zone Select Register(1)

TZDCSEL 0x6813 0x6853 0x6893 0x68D3 1/0 Trip Zone Digital Compare Register

TZCTL 0x6814 0x6854 0x6894 0x68D4 1/0 Trip Zone Control Register(1)

TZEINT 0x6815 0x6855 0x6895 0x68D5 1/0 Trip Zone Enable Interrupt Register(1)

TZFLG 0x6816 0x6856 0x6896 0x68D6 1/0 Trip Zone Flag Register (1)

TZCLR 0x6817 0x6857 0x6897 0x68D7 1/0 Trip Zone Clear Register(1)

TZFRC 0x6818 0x6858 0x6898 0x68D8 1/0 Trip Zone Force Register(1)

ETSEL 0x6819 0x6859 0x6899 0x68D9 1/0 Event Trigger Selection Register

ETPS 0x681A 0x685A 0x689A 0x68DA 1/0 Event Trigger Prescale Register

ETFLG 0x681B 0x685B 0x689B 0x68DB 1/0 Event Trigger Flag Register

ETCLR 0x681C 0x685C 0x689C 0x68DC 1/0 Event Trigger Clear Register

ETFRC 0x681D 0x685D 0x689D 0x68DD 1/0 Event Trigger Force Register

PCCTL 0x681E 0x685E 0x689E 0x68DE 1/0 PWM Chopper Control Register

HRCNFG 0x6820 0x6860 0x68A0 0x68E0 1/0 HRPWM Configuration Register(1)

HRMSTEP 0x6826 - - - 1/0 HRPWM MEP Step Register

HRPCTL 0x6828 0x6868 0x68A8 0x68E8 1/0 High-resolution Period Control Register(1)

TBPRDHRM 0x682A 0x686A 0x68AA 0x68EA 1/W(2) Time Base Period HRPWM Register Mirror

TBPRDM 0x682B 0x686B 0x68AB 0x68EB 1/W(2) Time Base Period Register Mirror

CMPAHRM 0x682C 0x686C 0x68AC 0x68EC 1/W(2) Compare A HRPWM Register Mirror

CMPAM 0x682D 0x686D 0x68AD 0x68ED 1/W(2) Compare A Register Mirror

DCTRIPSEL 0x6830 0x6870 0x68B0 0x68F0 1/0 Digital Compare Trip Select Register (1)

DCACTL 0x6831 0x6871 0x68B1 0x68F1 1/0 Digital Compare A Control Register(1)

DCBCTL 0x6832 0x6872 0x68B2 0x68F2 1/0 Digital Compare B Control Register(1)

DCFCTL 0x6833 0x6873 0x68B3 0x68F3 1/0 Digital Compare Filter Control Register(1)

DCCAPCT 0x6834 0x6874 0x68B4 0x68F4 1/0 Digital Compare Capture Control Register(1)

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

Table 8-33. ePWM1–ePWM4 Control and Status Registers (continued)

NAME ePWM1 ePWM2 ePWM3 ePWM4 SIZE (×16)/

#SHADOW DESCRIPTION

DCFOFFSET 0x6835 0x6875 0x68B5 0x68F5 1/1 Digital Compare Filter Offset Register

DCFOFFSETCN

T0x6836 0x6876 0x68B6 0x68F6 1/0 Digital Compare Filter Offset Counter Register

DCFWINDOW 0x6837 0x6877 0x68B7 0x68F7 1/0 Digital Compare Filter Window Register

DCFWINDOWCN

T0x6838 0x6878 0x68B8 0x68F8 1/0 Digital Compare Filter Window Counter

DCCAP 0x6839 0x6879 0x68B9 0x68F9 1/1 Digital Compare Counter Capture Register

(1) Registers that are EALLOW protected.

(2) W = Write to shadow register

www.ti.com

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

TEXAS INSTRUMENTS

Table 8-34. ePWM5–ePWM8 Control and Status Registers

NAME ePWM5 ePWM6 ePWM7 ePWM8 SIZE (×16)/

#SHADOW DESCRIPTION

TBCTL 0x6900 0x6940 0x6980 0x69C0 1/0 Time Base Control Register

TBSTS 0x6901 0x6941 0x6981 0x69C1 1/0 Time Base Status Register

TBPHSHR 0x6902 0x6942 0x6982 0x69C2 1/0 Time Base Phase HRPWM Register

TBPHS 0x6903 0x6943 0x6983 0x69C3 1/0 Time Base Phase Register

TBCTR 0x6904 0x6944 0x6984 0x69C4 1/0 Time Base Counter Register

TBPRD 0x6905 0x6945 0x6985 0x69C5 1/1 Time Base Period Register Set

TBPRDHR 0x6906 0x6946 0x6986 0x69C6 1/1 Time Base Period High-Resolution

CMPCTL 0x6907 0x6947 0x6987 0x69C7 1/0 Counter Compare Control Register

CMPAHR 0x6908 0x6948 0x6988 0x69C8 1/1 Time Base Compare A HRPWM Register

CMPA 0x6909 0x6949 0x6989 0x69C9 1/1 Counter Compare A Register Set

CMPB 0x690A 0x694A 0x698A 0x69CA 1/1 Counter Compare B Register Set

AQCTLA 0x690B 0x694B 0x698B 0x69CB 1/0 Action Qualifier Control Register For

Output A

AQCTLB 0x690C 0x694C 0x698C 0x69CC 1/0 Action Qualifier Control Register For

Output B

AQSFRC 0x690D 0x694D 0x698D 0x69CD 1/0 Action Qualifier Software Force Register

AQCSFRC 0x690E 0x694E 0x698E 0x69CE 1/1 Action Qualifier Continuous S/W Force

DBCTL 0x690F 0x694F 0x698F 0x69CF 1/1 Dead-Band Generator Control Register

DBRED 0x6910 0x6950 0x6990 0x69D0 1/0 Dead-Band Generator Rising Edge Delay

Count Register

DBFED 0x6911 0x6951 0x6991 0x69D1 1/0 Dead-Band Generator Falling Edge Delay

Count Register

TZSEL 0x6912 0x6952 0x6992 0x69D2 1/0 Trip Zone Select Register(1)

TZDCSEL 0x6913 0x6953 0x6993 0x69D3 1/0 Trip Zone Digital Compare Register

TZCTL 0x6914 0x6954 0x6994 0x69D4 1/0 Trip Zone Control Register(1)

TZEINT 0x6915 0x6955 0x6995 0x69D5 1/0 Trip Zone Enable Interrupt Register(1)

TZFLG 0x6916 0x6956 0x6996 0x69D6 1/0 Trip Zone Flag Register (1)

TZCLR 0x6917 0x6957 0x6997 0x69D7 1/0 Trip Zone Clear Register(1)

TZFRC 0x6918 0x6958 0x6998 0x69D8 1/0 Trip Zone Force Register(1)

ETSEL 0x6919 0x6959 0x6999 0x69D9 1/0 Event Trigger Selection Register

ETPS 0x691A 0x695A 0x699A 0x69DA 1/0 Event Trigger Prescale Register

ETFLG 0x691B 0x695B 0x699B 0x69DB 1/0 Event Trigger Flag Register

ETCLR 0x691C 0x695C 0x699C 0x69DC 1/0 Event Trigger Clear Register

ETFRC 0x691D 0x695D 0x699D 0x69DD 1/0 Event Trigger Force Register

PCCTL 0x691E 0x695E 0x699E 0x69DE 1/0 PWM Chopper Control Register

HRCNFG 0x6920 0x6960 0x69A0 0x69E0 1/0 HRPWM Configuration Register(1)

HRMSTEP - - - - 1/0 HRPWM MEP Step Register

HRPCTL 0x6928 0x6968 0x69A8 0x69E8 1/0 High-resolution Period Control Register(1)

TBPRDHRM 0x692A 0x696A 0x69AA 0x69EA 1/W(2) Time Base Period HRPWM Register Mirror

TBPRDM 0x692B 0x696B 0x69AB 0x69EB 1/W(2) Time Base Period Register Mirror

CMPAHRM 0x692C 0x696C 0x69AC 0x69EC 1/W(2) Compare A HRPWM Register Mirror

CMPAM 0x692D 0x696D 0x69AD 0x69ED 1/W(2) Compare A Register Mirror

DCTRIPSEL 0x6930 0x6970 0x69B0 0x69F0 1/0 Digital Compare Trip Select Register (1)

DCACTL 0x6931 0x6971 0x69B1 0x69F1 1/0 Digital Compare A Control Register(1)

DCBCTL 0x6932 0x6972 0x69B2 0x69F2 1/0 Digital Compare B Control Register(1)

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

Table 8-34. ePWM5–ePWM8 Control and Status Registers (continued)

NAME ePWM5 ePWM6 ePWM7 ePWM8 SIZE (×16)/

#SHADOW DESCRIPTION

DCFCTL 0x6933 0x6973 0x69B3 0x69F3 1/0 Digital Compare Filter Control Register(1)

DCCAPCT 0x6934 0x6974 0x69B4 0x69F4 1/0 Digital Compare Capture Control

DCFOFFSET 0x6935 0x6975 0x69B5 0x69F5 1/1 Digital Compare Filter Offset Register

DCFOFFSETCNT 0x6936 0x6976 0x69B6 0x69F6 1/0 Digital Compare Filter Offset Counter

DCFWINDOW 0x6937 0x6977 0x69B7 0x69F7 1/0 Digital Compare Filter Window Register

DCFWINDOWCNT 0x6938 0x6978 0x69B8 0x69F8 1/0 Digital Compare Filter Window Counter

DCCAP 0x6939 0x6979 0x69B9 0x69F9 1/1 Digital Compare Counter Capture Register

(1) Registers that are EALLOW protected.

(2) W = Write to shadow register

www.ti.com

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

TBPRD Shadow (24)

TBPRD Active (24)

Counter

Up/Down

(16 Bit)

TCBNT

Active (16)

TBCTL[PHSEN]

CTR=PRD

Phase

Control

CTR=ZERO

CTR_Dir

TBPHSHR (8)

TBPRDHR (8)

CTR=ZERO

CTR=CMPB

Disabled

TBCTL[SYNCOSEL]

EPWMxSYNCO

Time-Base (TB)

TBPHS Active (24)

Sync

In/Out

Select

Mux

CTR=PRD

CTR=ZERO

CTR=CMPA

CTR=CMPB

CTR_Dir

DCAEVT1.soc(A)

DCBEVT1.soc(A)

Event

Trigger

and

Interrupt

(ET)

EPWMxINT

EPWMxSOCA

EPWMxSOCB

EPWMxSOCA

EPWMxSOCB

ADC

Action

Qualifier

(AQ)

EPWMA

Dead

Band

(DB)

EPWMB

PWM

Chopper

(PC)

Trip

Zone

(TZ)

EPWMxA

EPWMxB

CTR=ZERO

EPWMxTZINT

TZ1 TZ3to

EMUSTOP

CLOCKFAIL

EQEP1ERR(B)

DCAEVT1.force(A)

DCAEVT2.force(A)

DCBEVT1.force(A)

DCBEVT2.force(A)

CTR=CMPA

CMPAHR (8)

CTR=CMPB

CMPB Active (16)

CMPB Shadow (16)

High-resolution PWM (HRPWM)

CTR=PRD or ZERO

DCAEVT1.inter

DCBEVT1.inter

DCAEVT2.inter

DCBEVT2.inter

EPWMxSYNCI

TBCTL[SWFSYNC]

(Software Forced

Sync)

DCAEVT1.sync

DCBEVT1.sync

CMPA Active (24)

CMPA Shadow (24)

A. These events are generated by the Type 1 ePWM digital compare (DC) submodule based on the levels of the COMPxOUT and TZ

signals.

B. This signal exists only on devices with an eQEP1 module.

Figure 8-49. ePWM Submodules Showing Critical Internal Signal Interconnections

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

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Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

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8.9.9.1 ePWM Electrical Data/Timing

PWM refers to PWM outputs on ePWM1–8. Section 8.9.9.1.1 shows the PWM timing requirements and Section

8.9.9.1.2, switching characteristics.

8.9.9.1.1 ePWM Timing Requirements

MIN(1) MAX UNIT

tw(SYCIN) Sync input pulse width

Asynchronous 2tc(SCO) cycles

Synchronous 2tc(SCO) cycles

With input qualifier 1tc(SCO) + tw(IQSW) cycles

(1) For an explanation of the input qualifier parameters, see Section 8.9.15.1.2.1.

8.9.9.1.2 ePWM Switching Characteristics

over recommended operating conditions (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN MAX UNIT

tw(PWM) Pulse duration, PWMx output high/low 33.33 ns

tw(SYNCOUT) Sync output pulse width 8tc(SCO) cycles

td(PWM)tza

Delay time, trip input active to PWM forced high

Delay time, trip input active to PWM forced low no pin load 25 ns

td(TZ-PWM)HZ Delay time, trip input active to PWM Hi-Z 20 ns

8.9.9.2 Trip-Zone Input Timing

Section 8.9.9.2.1 lists the trip-zone input timing requirements. Figure 8-50 shows the PWM Hi-Z characteristics.

8.9.9.2.1 Trip-Zone Input Timing Requirements

MIN(1) MAX UNIT

tw(TZ) Pulse duration, TZx input low

Asynchronous 2tc(TBCLK) cycles

Synchronous 2tc(TBCLK) cycles

With input qualifier 2tc(TBCLK) + tw(IQSW) cycles

(1) For an explanation of the input qualifier parameters, see Section 8.9.15.1.2.1.

PWM(B)

TZ(A)

SYSCLK

tw(TZ)

td(TZ-PWM)HZ

A. TZ - TZ1, TZ2, TZ3, TZ4, TZ5, TZ6

B. PWM refers to all the PWM pins in the device. The state of the PWM pins after TZ is taken high depends on the PWM recovery

software.

Figure 8-50. PWM Hi-Z Characteristics

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Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

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8.9.10 High-Resolution PWM (HRPWM)

This module combines multiple delay lines in a single module and a simplified calibration system by using a

dedicated calibration delay line. For each ePWM module there is one HR delay line.

The HRPWM module offers PWM resolution (time granularity) that is significantly better than what can be

achieved using conventionally derived digital PWM methods. The key points for the HRPWM module are:

• Significantly extends the time resolution capabilities of conventionally derived digital PWM

• This capability can be used in both single edge (duty cycle and phase-shift control) as well as dual edge

control for frequency/period modulation.

• Finer time granularity control or edge positioning is controlled through extensions to the Compare A and

Phase registers of the ePWM module.

• HRPWM capabilities, when available on a particular device, are offered only on the A signal path of an

ePWM module (that is, on the EPWMxA output). EPWMxB output has conventional PWM capabilities.

Note

The minimum SYSCLKOUT frequency allowed for HRPWM is 60 MHz.

Note

When dual-edge high-resolution is enabled (high-resolution period mode), the PWMxB channel will

have ±1–2 TBCLK cycles of jitter on the output.

8.9.10.1 HRPWM Electrical Data/Timing

Section 8.9.10.1.1 shows the high-resolution PWM switching characteristics.

8.9.10.1.1 High-Resolution PWM Characteristics

PARAMETER(1) MIN TYP MAX UNIT

Micro Edge Positioning (MEP) step size(2) 150 310 ps

(1) The HRPWM operates at a minimum SYSCLKOUT frequency of 60 MHz.

(2) The MEP step size will be largest at high temperature and minimum voltage on VDD. MEP step size will increase with higher

temperature and lower voltage and decrease with lower temperature and higher voltage.

Applications that use the HRPWM feature should use MEP Scale Factor Optimizer (SFO) estimation software functions. See the TI

software libraries for details of using SFO function in end applications. SFO functions help to estimate the number of MEP steps per

SYSCLKOUT period dynamically while the HRPWM is in operation.

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

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Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

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8.9.11 Enhanced Capture Module (eCAP1)

The device contains an enhanced capture (eCAP) module. Figure 8-51 shows a functional block diagram of a

module.

TSCTR

(counter−32 bit)

RST

CAP1

(APRD active) LD

CAP2

(ACMP active) LD

CAP3

(APRD shadow) LD

CAP4

(ACMP shadow) LD

Continuous /

Oneshot

Capture Control

LD1

LD2

LD3

LD4

PRD [0−31]

CMP [0−31]

CTR [0−31]

eCAPx

Interrupt

Trigger

and

Flag

control

to PIE

CTR=CMP

ACMP

shadow

Event

Pre-scale

CTRPHS

(phase register−32 bit)

SYNCOut

SYNCIn

Event

qualifier

Polarity

select

Polarity

select

Polarity

select

Polarity

select

CTR=PRD

CTR_OVF

PWM

compare

logic

CTR [0−31]

PRD [0−31]

CMP [0−31]

CTR=CMP

CTR=PRD

CTR_OVF

OVF

APWM mode

Delta−mode

SYNC

Capture events

CEVT[1:4]

APRD

shadow

MODE SELECT

Figure 8-51. eCAP Functional Block Diagram

The eCAP module is clocked at the SYSCLKOUT rate.

The clock enable bits (ECAP1 ENCLK) in the PCLKCR1 register turn off the eCAP module individually (for

low-power operation). Upon reset, ECAP1ENCLK is set to low, indicating that the peripheral clock is off.

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TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

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TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

TEXAS INSTRUMENTS

Table 8-35. eCAP Control and Status Registers

NAME eCAP1 eCAP2 eCAP3 SIZE (×16) EALLOW

PROTECTED DESCRIPTION

TSCTR 0x6A00 0x6A20 0x6A40 2 No Timestamp Counter

CTRPHS 0x6A02 0x6A22 0x6A42 2 No Counter Phase Offset Value Register

CAP1 0x6A04 0x6A24 0x6A44 2 No Capture 1 Register

CAP2 0x6A06 0x6A26 0x6A46 2 No Capture 2 Register

CAP3 0x6A08 0x6A28 0x6A48 2 No Capture 3 Register

CAP4 0x6A0A 0x6A2A 0x6A4A 2 No Capture 4 Register

Reserved 0x6A0C to

0x6A12

0x6A2C to

0x6A32

0x6A4C to

0x6A52 8 No Reserved

ECCTL1 0x6A14 0x6A34 0x6A54 1 No Capture Control Register 1

ECCTL2 0x6A15 0x6A35 0x6A55 1 No Capture Control Register 2

ECEINT 0x6A16 0x6A36 0x6A56 1 No Capture Interrupt Enable Register

ECFLG 0x6A17 0x6A37 0x6A57 1 No Capture Interrupt Flag Register

ECCLR 0x6A18 0x6A38 0x6A58 1 No Capture Interrupt Clear Register

ECFRC 0x6A19 0x6A39 0x6A59 1 No Capture Interrupt Force Register

Reserved 0x6A1A to

0x6A1F

0x6A3A to

0x6A3F

0x6A5A to

0x6A5F 6 No Reserved

8.9.11.1 eCAP Electrical Data/Timing

Section 8.9.11.1.1 shows the eCAP timing requirement and Section 8.9.11.1.2 shows the eCAP switching

characteristics.

8.9.11.1.1 Enhanced Capture (eCAP) Timing Requirement

MIN(1) MAX UNIT

tw(CAP) Capture input pulse width

Asynchronous 2tc(SCO)

cyclesSynchronous 2tc(SCO)

With input qualifier 1tc(SCO) + tw(IQSW)

(1) For an explanation of the input qualifier parameters, see Section 8.9.15.1.2.1.

8.9.11.1.2 eCAP Switching Characteristics

over recommended operating conditions (unless otherwise noted)

PARAMETER MIN MAX UNIT

tw(APWM) Pulse duration, APWMx output high/low 20 ns

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

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Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

4????“st

8.9.12 High-Resolution Capture Modules (HRCAP1 to HRCAP4)

The device contains up to four high-resolution capture (HRCAP) modules. The High-Resolution Capture

(HRCAP) module measures the difference between external pulses with a typical resolution of 300 ps.

Uses for the HRCAP include:

• Capacitive touch applications

• High-resolution period and duty cycle measurements of pulse train cycles

• Instantaneous speed measurements

• Instantaneous frequency measurements

• Voltage measurements across an isolation boundary

• Distance measurement (sonar) and scanning

The HRCAP module features include:

• Pulse width capture in either non-high-resolution or high-resolution modes

• Difference (Delta) mode pulse width capture

• Typical high-resolution capture on the order of 300 ps resolution on each edge

• Interrupt on either falling or rising edge

• Continuous mode capture of pulse widths in 2-deep buffer

• Calibration logic for precision high-resolution capture

• All of the above resources are dedicated to a single input pin

• HRCAP calibration software library supplied by TI is used for both calibration and calculating fractional pulse

widths

The HRCAP module includes one capture channel in addition to a high-resolution calibration block, which

connects internally to the last available ePWMxA HRPWM channel when calibrating (that is, if there are eight

ePWMs with HRPWM capability, it will be HRPWM8A).

Each HRCAP channel has the following independent key resources:

• Dedicated input capture pin

• 16-bit HRCAP clock which is either equal to the PLL2 output frequency (asynchronous to SYSCLK2) or

SYSCLKOUT

• High-resolution pulse width capture in a 2-deep buffer

PIE

HRCAPx

SYSCLKOUT

PLL2CLK

HRCAPxENCLK

HRCAPxINTn

HRCAP Calibration Logic

EPWMxAEPWMx HRPWM

HRCAP Calibration Signal (Internal) GPIO

Mux

HRCAPx

Module

Figure 8-52. HRCAP Functional Block Diagram

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TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

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TMS320F28062, TMS320F28062F

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TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

Table 8-36. HRCAP Registers

NAME HRCAP1 HRCAP2 HRCAP3 HRCAP4 SIZE

(×16) DESCRIPTION

HCCTL 0x6AC0 0x6AE0 0x6C80 0x6CA0 1 HRCAP Control Register(1)

HCIFR 0x6AC1 0x6AE1 0x6C81 0x6CA1 1 HRCAP Interrupt Flag Register

HCICLR 0x6AC2 0x6AE2 0x6C82 0x6CA2 1 HRCAP Interrupt Clear Register(1)

HCIFRC 0x6AC3 0x6AE3 0x6C83 0x6CA3 1 HRCAP Interrupt Force Register(1)

HCCOUNTER 0x6AC4 0x6AE4 0x6C84 0x6CA4 1 HRCAP 16-bit Counter Register

HCCAPCNTRISE0 0x6AD0 0x6AF0 0x6C90 0x6CB0 1 HRCAP Capture Counter on Rising Edge

0 Register

HCCAPCNTFALL0 0x6AD2 0x6AF2 0x6C92 0x6CB2 1 HRCAP Capture Counter on

Falling Edge 0 Register

HCCAPCNTRISE1 0x6AD8 0x6AF8 0x6C98 0x6CB8 1 HRCAP Capture Counter on Rising Edge

1 Register

HCCAPCNTFALL1 0x6ADA 0x6AFA 0x6C9A 0x6CBA 1 HRCAP Capture Counter on

Falling Edge 1 Register

(1) Registers that are EALLOW-protected.

8.9.12.1 HRCAP Electrical Data/Timing

8.9.12.1.1 High-Resolution Capture (HRCAP) Timing Requirements

MIN NOM MAX UNIT

tc(HCCAPCLK) Cycle time, HRCAP capture clock 8.333 10.204 ns

tw(HRCAP) Pulse width, HRCAP capture 7tc(HCCAPCLK) (1) ns

HRCAP step size(2) 300 ps

(1) The listed minimum pulse width does not take into account the limitation that all relevant HCCAP registers must be read and RISE/

FALL event flags cleared within the pulse width to ensure valid capture data.

(2) HRCAP step size will increase with low voltage and high temperature and decrease with high voltage and low temperature.

Applications that use the HRCAP in high-resolution mode should use the HRCAP calibration functions to dynamically calibrate for

varying operating conditions.

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

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Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

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8.9.13 Enhanced Quadrature Encoder Modules (eQEP1, eQEP2)

The device contains up to two enhanced quadrature encoder (eQEP) modules. Table 8-37 provides a summary

of the eQEP registers.

Table 8-37. eQEP Control and Status Registers

NAME eQEP1

ADDRESS

eQEP2

ADDRESS

eQEP1

SIZE(×16)/

#SHADOW

QPOSCNT 0x6B00 0x6B40 2/0 eQEP Position Counter

QPOSINIT 0x6B02 0x6B42 2/0 eQEP Initialization Position Count

QPOSMAX 0x6B04 0x6B44 2/0 eQEP Maximum Position Count

QPOSCMP 0x6B06 0x6B46 2/1 eQEP Position-compare

QPOSILAT 0x6B08 0x6B48 2/0 eQEP Index Position Latch

QPOSSLAT 0x6B0A 0x6B4A 2/0 eQEP Strobe Position Latch

QPOSLAT 0x6B0C 0x6B4C 2/0 eQEP Position Latch

QUTMR 0x6B0E 0x6B4E 2/0 eQEP Unit Timer

QUPRD 0x6B10 0x6B50 2/0 eQEP Unit Period Register

QWDTMR 0x6B12 0x6B52 1/0 eQEP Watchdog Timer

QWDPRD 0x6B13 0x6B53 1/0 eQEP Watchdog Period Register

QDECCTL 0x6B14 0x6B54 1/0 eQEP Decoder Control Register

QEPCTL 0x6B15 0x6B55 1/0 eQEP Control Register

QCAPCTL 0x6B16 0x6B56 1/0 eQEP Capture Control Register

QPOSCTL 0x6B17 0x6B57 1/0 eQEP Position-compare Control Register

QEINT 0x6B18 0x6B58 1/0 eQEP Interrupt Enable Register

QFLG 0x6B19 0x6B59 1/0 eQEP Interrupt Flag Register

QCLR 0x6B1A 0x6B5A 1/0 eQEP Interrupt Clear Register

QFRC 0x6B1B 0x6B5B 1/0 eQEP Interrupt Force Register

QEPSTS 0x6B1C 0x6B5C 1/0 eQEP Status Register

QCTMR 0x6B1D 0x6B5D 1/0 eQEP Capture Timer

QCPRD 0x6B1E 0x6B5E 1/0 eQEP Capture Period Register

QCTMRLAT 0x6B1F 0x6B5F 1/0 eQEP Capture Timer Latch

QCPRDLAT 0x6B20 0x6B60 1/0 eQEP Capture Period Latch

Reserved 0x6B21 to

0x6B3F

0x6B61 to

0x6B7F 31/0

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TMS320F28062, TMS320F28062F

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Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS Cupwgm :m 2017 Texas \Hst'umems \mcorpormen

Figure 8-53 shows the block diagram of the eQEP module.

QWDTMR

QWDPRD

QWDOG

UTIME

QUPRD

QUTMR

UTOUT

WDTOUT

Quadrature

Capture

Unit

(QCAP)

QCPRDLAT

QCTMRLAT

QFLG

QEPSTS

QEPCTL

Registers

Used by

Multiple Units

QCLK

QDIR

PHE

PCSOUT

Quadrature

Decoder

(QDU)

QDECCTL

Position Counter/

Control Unit

(PCCU)

QPOSLAT

QPOSSLAT

QPOSILAT

EQEPxAIN

EQEPxBIN

EQEPxIIN

EQEPxIOUT

EQEPxIOE

EQEPxSIN

EQEPxSOUT

EQEPxSOE

GPIO

MUX

EQEPxA/XCLK

EQEPxB/XDIR

EQEPxS

EQEPxI

QPOSCMP QEINT

QFRC

QCLR

QPOSCTL

1632

QPOSCNT

QPOSMAX

QPOSINIT

PIE EQEPxINT

Enhanced QEP (eQEP) Peripheral

System Control

Registers

QCTMR

QCPRD

1616

QCAPCTL

EQEPxENCLK

SYSCLKOUT

To CPU

Data Bus

Figure 8-53. eQEP Functional Block Diagram

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

8.9.13.1 eQEP Electrical Data/Timing

Section 8.9.13.1.1 shows the eQEP timing requirement and Section 8.9.13.1.2 shows the eQEP switching

characteristics.

8.9.13.1.1 Enhanced Quadrature Encoder Pulse (eQEP) Timing Requirements

MIN(1) MAX UNIT

tw(QEPP) QEP input period Asynchronous(2)/Synchronous 2tc(SCO) cycles

With input qualifier 2[1tc(SCO) + tw(IQSW)]

tw(INDEXH) QEP Index Input High time Asynchronous(2)/Synchronous 2tc(SCO) cycles

With input qualifier 2tc(SCO) +tw(IQSW)

tw(INDEXL) QEP Index Input Low time Asynchronous(2)/Synchronous 2tc(SCO) cycles

With input qualifier 2tc(SCO) + tw(IQSW)

tw(STROBH) QEP Strobe High time Asynchronous(2)/Synchronous 2tc(SCO) cycles

With input qualifier 2tc(SCO) + tw(IQSW)

tw(STROBL) QEP Strobe Input Low time Asynchronous(2)/Synchronous 2tc(SCO) cycles

With input qualifier 2tc(SCO) +tw(IQSW)

(1) For an explanation of the input qualifier parameters, see Section 8.9.15.1.2.1.

(2) Refer to the TMS320F2806x MCUs Silicon Errata for limitations in the asynchronous mode.

8.9.13.1.2 eQEP Switching Characteristics

over recommended operating conditions (unless otherwise noted)

PARAMETER MIN MAX UNIT

td(CNTR)xin Delay time, external clock to counter increment 4tc(SCO) cycles

td(PCS-OUT)QEP Delay time, QEP input edge to position compare sync output 6tc(SCO) cycles

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TMS320F28062, TMS320F28062F

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Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

ﬂ TEXAS INSTRUMENTS

8.9.14 JTAG Port

On the 2806x device, the JTAG port is reduced to five pins ( TRST, TCK, TDI, TMS, TDO). TCK, TDI, TMS,

and TDO pins are also GPIO pins. The TRST signal selects either JTAG or GPIO operating mode for the pins

in Figure 8-54. During debug, the GPIO function of these pins are not available. If the GPIO38/TCK/XCLKIN pin

is used to provide an external clock, an alternate clock source should be used to clock the device during debug

because this pin will be needed for the TCK function.

Note

In 2806x devices, the JTAG pins may also be used as GPIO pins. Care should be taken in the board

design to ensure that the circuitry connected to these pins do not affect the debug capabilities of the

JTAG pin function. Any circuitry connected to these pins should not prevent the debug probe from

driving (or being driven by) the JTAG pins for successful debug.

TRST

C28x

Core

TCK/GPIO38

TCK

XCLKIN

GPIO38_in

GPIO38_out

TDO

GPIO37_out

TDO/GPIO37

GPIO37_in

TMS

TMS/GPIO36

GPIO36_out

GPIO36_in

TDI

TDI/GPIO35

GPIO35_out

GPIO35_in

TRST

= 0: JTAG Disabled (GPIO Mode)

= 1: JTAG Mode

TRST

Figure 8-54. JTAG/GPIO Multiplexing

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TMS320F28062, TMS320F28062F

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TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

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8.9.15 General-Purpose Input/Output (GPIO) MUX

The GPIO MUX can multiplex up to three independent peripheral signals on a single GPIO pin in addition to

providing individual pin bit-banging I/O capability.

The device supports 45 GPIO pins. The GPIO control and data registers are mapped to Peripheral Frame 1

to enable 32-bit operations on the registers (along with 16-bit operations). Table 8-38 shows the GPIO register

mapping.

Table 8-38. GPIO Registers

NAME ADDRESS SIZE (×16) DESCRIPTION

GPIO CONTROL REGISTERS (EALLOW PROTECTED)

GPACTRL 0x6F80 2 GPIO A Control Register (GPIO0 to 31)

GPAQSEL1 0x6F82 2 GPIO A Qualifier Select 1 Register (GPIO0 to 15)

GPAQSEL2 0x6F84 2 GPIO A Qualifier Select 2 Register (GPIO16 to 31)

GPAMUX1 0x6F86 2 GPIO A MUX 1 Register (GPIO0 to 15)

GPAMUX2 0x6F88 2 GPIO A MUX 2 Register (GPIO16 to 31)

GPADIR 0x6F8A 2 GPIO A Direction Register (GPIO0 to 31)

GPAPUD 0x6F8C 2 GPIO A Pullup Disable Register (GPIO0 to 31)

GPBCTRL 0x6F90 2 GPIO B Control Register (GPIO32 to 44)

GPBQSEL1 0x6F92 2 GPIO B Qualifier Select 1 Register (GPIO32 to 44)

GPBQSEL2 0x6F94 2 GPIO B Qualifier Select 2 Register

GPBMUX1 0x6F96 2 GPIO B MUX 1 Register (GPIO32 to 44)

GPBMUX2 0x6F98 2 GPIO B MUX 2 Register (GPIO50 to 58)

GPBDIR 0x6F9A 2 GPIO B Direction Register (GPIO32 to 44)

GPBPUD 0x6F9C 2 GPIO B Pullup Disable Register (GPIO32 to 44)

AIOMUX1 0x6FB6 2 Analog, I/O mux 1 register (AIO0 to AIO15)

AIODIR 0x6FBA 2 Analog, I/O Direction Register (AIO0 to AIO15)

GPIO DATA REGISTERS (NOT EALLOW PROTECTED)

GPADAT 0x6FC0 2 GPIO A Data Register (GPIO0 to 31)

GPASET 0x6FC2 2 GPIO A Data Set Register (GPIO0 to 31)

GPACLEAR 0x6FC4 2 GPIO A Data Clear Register (GPIO0 to 31)

GPATOGGLE 0x6FC6 2 GPIO A Data Toggle Register (GPIO0 to 31)

GPBDAT 0x6FC8 2 GPIO B Data Register (GPIO32 to 44)

GPBSET 0x6FCA 2 GPIO B Data Set Register (GPIO32 to 44)

GPBCLEAR 0x6FCC 2 GPIO B Data Clear Register (GPIO32 to 44)

GPBTOGGLE 0x6FCE 2 GPIO B Data Toggle Register (GPIO32 to 44)

AIODAT 0x6FD8 2 Analog I/O Data Register (AIO0 to AIO15)

AIOSET 0x6FDA 2 Analog I/O Data Set Register (AIO0 to AIO15)

AIOCLEAR 0x6FDC 2 Analog I/O Data Clear Register (AIO0 to AIO15)

AIOTOGGLE 0x6FDE 2 Analog I/O Data Toggle Register (AIO0 to AIO15)

GPIO INTERRUPT AND LOW-POWER MODES SELECT REGISTERS (EALLOW PROTECTED)

GPIOXINT1SEL 0x6FE0 1 XINT1 GPIO Input Select Register (GPIO0 to 31)

GPIOXINT2SEL 0x6FE1 1 XINT2 GPIO Input Select Register (GPIO0 to 31)

GPIOXINT3SEL 0x6FE2 1 XINT3 GPIO Input Select Register (GPIO0 to 31)

GPIOLPMSEL 0x6FE8 2 LPM GPIO Select Register (GPIO0 to 31)

Note

There is a two-SYSCLKOUT cycle delay from when the write to the GPxMUXn/AIOMUXn and

GPxQSELn registers occurs to when the action is valid.

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TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

TEXAS INSTRUMENTS

Table 8-39. GPIOA MUX

DEFAULT AT RESET

PRIMARY I/O

FUNCTION(1) (2)

PERIPHERAL

SELECTION 1

PERIPHERAL

SELECTION 2

PERIPHERAL

SELECTION 3

GPAMUX1 REGISTER

BITS (GPAMUX1 BITS = 00) (GPAMUX1 BITS = 01) (GPAMUX1 BITS = 10) (GPAMUX1 BITS = 11)

1-0 GPIO0 EPWM1A (O) Reserved Reserved

3-2 GPIO1 EPWM1B (O) Reserved COMP1OUT (O)

5-4 GPIO2 EPWM2A (O) Reserved Reserved

7-6 GPIO3 EPWM2B (O) SPISOMIA (I/O) COMP2OUT (O)

9-8 GPIO4 EPWM3A (O) Reserved Reserved

11-10 GPIO5 EPWM3B (O) SPISIMOA (I/O) ECAP1 (I/O)

13-12 GPIO6 EPWM4A (O) EPWMSYNCI (I) EPWMSYNCO (O)

15-14 GPIO7 EPWM4B (O) SCIRXDA (I) ECAP2 (I/O)

17-16 GPIO8 EPWM5A (O) Reserved ADCSOCAO (O)

19-18 GPIO9 EPWM5B (O) SCITXDB (O) ECAP3 (I/O)

21-20 GPIO10 EPWM6A (O) Reserved ADCSOCBO (O)

23-22 GPIO11 EPWM6B (O) SCIRXDB (I) ECAP1 (I/O)

25-24 GPIO12 TZ1 (I) SCITXDA (O) SPISIMOB (I/O)

27-26 GPIO13 TZ2 (I) Reserved SPISOMIB (I/O)

29-28 GPIO14 TZ3 (I) SCITXDB (O) SPICLKB (I/O)

31-30 GPIO15 ECAP2 (I/O) SCIRXDB (I) SPISTEB (I/O)

GPAMUX2 REGISTER

BITS (GPAMUX2 BITS = 00) (GPAMUX2 BITS = 01) (GPAMUX2 BITS = 10) (GPAMUX2 BITS = 11)

1-0 GPIO16 SPISIMOA (I/O) Reserved TZ2 (I)

3-2 GPIO17 SPISOMIA (I/O) Reserved TZ3 (I)

5-4 GPIO18 SPICLKA (I/O) SCITXDB (O) XCLKOUT (O)

7-6 GPIO19/XCLKIN SPISTEA (I/O) SCIRXDB (I) ECAP1 (I/O)

9-8 GPIO20 EQEP1A (I) MDXA (O) COMP1OUT (O)

11-10 GPIO21 EQEP1B (I) MDRA (I) COMP2OUT (O)

13-12 GPIO22 EQEP1S (I/O) MCLKXA (I/O) SCITXDB (O)

15-14 GPIO23 EQEP1I (I/O) MFSXA (I/O) SCIRXDB (I)

17-16 GPIO24 ECAP1 (I/O) EQEP2A(3) (I) SPISIMOB (I/O)

19-18 GPIO25 ECAP2 (I/O) EQEP2B(3) (I) SPISOMIB (I/O)

21-20 GPIO26(4) ECAP3 (I/O) EQEP2I(3) (I/O) SPICLKB (I/O)

23-22 GPIO27(4) HRCAP2 (I) EQEP2S(3) (I/O) SPISTEB (I/O)

25-24 GPIO28 SCIRXDA (I) SDAA (I/OD) TZ2 (I)

27-26 GPIO29 SCITXDA (O) SCLA (I/OD) TZ3 (I)

29-28 GPIO30 CANRXA (I) EQEP2I(3) (I/O) EPWM7A (O)

31-30 GPIO31 CANTXA (O) EQEP2S(3) (I/O) EPWM8A (O)

(1) The word "Reserved" means that there is no peripheral assigned to this GPxMUX1/2 register setting. Should it be selected, the state of

the pin will be undefined and the pin may be driven. This selection is a reserved configuration for future expansion.

(2) I = Input, O = Output, OD = Open Drain

(3) The eQEP2 peripheral is not available on the 80-pin PN or PFP package.

(4) To enable the USB functionality on GPIO26 (USB0DP, positive differential half of the USB signal) and GPIO27 (USB0DM, negative

differential half of the USB signal), set the USBIOEN bit in the GPACTRL2 register. Depending on your USB application, additional

pins may be required to maintain compliance with the USB 2.0 Specification. For more information, see the Universal Serial Bus (USB)

Controller chapter of the TMS320x2806x Technical Reference Manual .

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

TEXAS INSTRUMENTS

Table 8-40. GPIOB MUX

DEFAULT AT RESET

PRIMARY I/O

FUNCTION(1) (2)

PERIPHERAL

SELECTION 1

PERIPHERAL

SELECTION 2

PERIPHERAL

SELECTION 3

GPBMUX1 REGISTER

BITS (GPBMUX1 BITS = 00) (GPBMUX1 BITS = 01) (GPBMUX1 BITS = 10) (GPBMUX1 BITS = 11)

1-0 GPIO32 SDAA (I/OD) EPWMSYNCI (I) ADCSOCAO (O)

3-2 GPIO33 SCLA (I/OD) EPWMSYNCO (O) ADCSOCBO (O)

5-4 GPIO34 COMP2OUT (O) Reserved COMP3OUT (O)

7-6 GPIO35 (TDI) Reserved Reserved Reserved

9-8 GPIO36 (TMS) Reserved Reserved Reserved

11-10 GPIO37 (TDO) Reserved Reserved Reserved

13-12 GPIO38/XCLKIN (TCK) Reserved Reserved Reserved

15-14 GPIO39 Reserved Reserved Reserved

17-16 GPIO40(3) EPWM7A (O) SCITXDB (O) Reserved

19-18 GPIO41(3) EPWM7B (O) SCIRXDB (I) Reserved

21-20 GPIO42(3) EPWM8A (O) TZ1 (I) COMP1OUT (O)

23-22 GPIO43(3) EPWM8B (O) TZ2 (I) COMP2OUT (O)

25-24 GPIO44(3) MFSRA (I/O) SCIRXDB (I) EPWM7B (O)

27-26 Reserved Reserved Reserved Reserved

29-28 Reserved Reserved Reserved Reserved

31-30 Reserved Reserved Reserved Reserved

GPBMUX2 REGISTER

BITS (GPBMUX2 BITS = 00) (GPBMUX2 BITS = 01) (GPBMUX2 BITS = 10) (GPBMUX2 BITS = 11)

1-0 Reserved Reserved Reserved Reserved

3-2 Reserved Reserved Reserved Reserved

5-4 GPIO50(3) EQEP1A (I) MDXA (O) TZ1 (I)

7-6 GPIO51(3) EQEP1B (I) MDRA (I) TZ2 (I)

9-8 GPIO52(3) EQEP1S (I/O) MCLKXA (I/O) TZ3 (I)

11-10 GPIO53(3) EQEP1I (I/O) MFSXA (I/O) Reserved

13-12 GPIO54(3) SPISIMOA (I/O) EQEP2A (I) HRCAP1 (I)

15-14 GPIO55(3) SPISOMIA (I/O) EQEP2B (I) HRCAP2 (I)

17-16 GPIO56(3) SPICLKA (I/O) EQEP2I (I/O) HRCAP3 (I)

19-18 GPIO57(3) SPISTEA (I/O) EQEP2S (I/O) HRCAP4 (I)

21-20 GPIO58(3) MCLKRA (I/O) SCITXDB (O) EPWM7A (O)

23-22 Reserved Reserved Reserved Reserved

25-24 Reserved Reserved Reserved Reserved

27-26 Reserved Reserved Reserved Reserved

29-28 Reserved Reserved Reserved Reserved

31-30 Reserved Reserved Reserved Reserved

(1) The word "Reserved" means that there is no peripheral assigned to this GPxMUX1/2 register setting. Should it be selected, the state of

the pin will be undefined and the pin may be driven. This selection is a reserved configuration for future expansion.

(2) I = Input, O = Output, OD = Open Drain

(3) This pin is not available in the 80-pin PN or PFP package.

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TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

TEXAS INSTRUMENTS

Table 8-41. Analog MUX for 100-Pin PZ and 100-Pin PZP Packages

DEFAULT AT RESET

AIOx AND PERIPHERAL SELECTION 1 PERIPHERAL SELECTION 2 AND

PERIPHERAL SELECTION 3

AIOMUX1 REGISTER BITS AIOMUX1 BITS = 0,x AIOMUX1 BITS = 1,x

1-0 ADCINA0 (I) ADCINA0 (I)

3-2 ADCINA1 (I) ADCINA1 (I)

5-4 AIO2 (I/O) ADCINA2 (I), COMP1A (I)

7-6 ADCINA3 (I) ADCINA3 (I)

9-8 AIO4 (I/O) ADCINA4 (I), COMP2A (I)

11-10 ADCINA5 (I) ADCINA5 (I)

13-12 AIO6 (I/O) ADCINA6 (I), COMP3A (I)

15-14 ADCINA7 (I) ADCINA7 (I)

17-16 ADCINB0 (I) ADCINB0 (I)

19-18 ADCINB1 (I) ADCINB1 (I)

21-20 AIO10 (I/O) ADCINB2 (I), COMP1B (I)

23-22 ADCINB3 (I) ADCINB3 (I)

25-24 AIO12 (I/O) ADCINB4 (I), COMP2B (I)

27-26 ADCINB5 (I) ADCINB5 (I)

29-28 AIO14 (I/O) ADCINB6 (I), COMP3B (I)

31-30 ADCINB7 (I) ADCINB7 (I)

Table 8-42. Analog MUX for 80-Pin PN and 80-Pin PFP Packages

DEFAULT AT RESET(1)

AIOx AND PERIPHERAL SELECTION 1 PERIPHERAL SELECTION 2 AND

PERIPHERAL SELECTION 3

AIOMUX1 REGISTER BITS AIOMUX1 BITS = 0,x AIOMUX1 BITS = 1,x

1-0 ADCINA0 (I), VREFHI (I) ADCINA0 (I), VREFHI (I)

3-2 ADCINA1 (I) ADCINA1 (I)

5-4 AIO2 (I/O) ADCINA2 (I), COMP1A (I)

7-6 – –

9-8 AIO4 (I/O) ADCINA4 (I), COMP2A (I)

11-10 ADCINA5 (I) ADCINA5 (I)

13-12 AIO6 (I/O) ADCINA6 (I), COMP3A (I)

15-14 – –

17-16 ADCINB0 (I) ADCINB0 (I)

19-18 ADCINB1 (I) ADCINB1 (I)

21-20 AIO10 (I/O) ADCINB2 (I), COMP1B (I)

23-22 – –

25-24 AIO12 (I/O) ADCINB4 (I), COMP2B (I)

27-26 ADCINB5 (I) ADCINB5 (I)

29-28 AIO14 (I/O) ADCINB6 (I), COMP3B (I)

31-30 – –

(1) I = Input, O = Output

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

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TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

The user can select the type of input qualification for each GPIO pin through the GPxQSEL1/2 registers from

four choices:

• Synchronization To SYSCLKOUT Only (GPxQSEL1/2 = 0, 0): This is the default mode of all GPIO pins at

reset and it simply synchronizes the input signal to the system clock (SYSCLKOUT).

• Qualification Using Sampling Window (GPxQSEL1/2 = 0, 1 and 1, 0): In this mode the input signal, after

synchronization to the system clock (SYSCLKOUT), is qualified by a specified number of cycles before the

input is allowed to change.

• The sampling period is specified by the QUALPRD bits in the GPxCTRL register and is configurable in

groups of 8 signals. The sampling period specifies a multiple of SYSCLKOUT cycles for sampling the input

signal. The sampling window is either 3-samples or 6-samples wide and the output is only changed when

ALL samples are the same (all 0s or all 1s) as shown in Figure 4-18 (for 6 sample mode).

• No Synchronization (GPxQSEL1/2 = 1,1): This mode is used for peripherals where synchronization is not

required (synchronization is performed within the peripheral).

Due to the multilevel multiplexing that is required on the device, there may be cases where a peripheral input

signal can be mapped to more then one GPIO pin. Also, when an input signal is not selected, the input signal will

default to either a 0 or 1 state, depending on the peripheral.

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TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

ITEXAs INSTRUMENTS A A V 4» + a —> a E N 7 GP SET G—l GPXDAT (\atch) .7 ‘7, ‘7

GPxDAT (read)

Input

Qualification

GPxMUX1/2

High Impedance

Output Control

GPIOx pin

XRS

0 = Input, 1 = Output

Low-Power

Modes Block

GPxDIR (latch)

Peripheral 2 Input

Peripheral 3 Input

Peripheral 1 Output

Peripheral 2 Output

Peripheral 3 Output

Peripheral 1 Output Enable

Peripheral 2 Output Enable

Peripheral 3 Output Enable

GPxCTRL

Peripheral 1 Input

N/C

GPxPUD

LPMCR0

Internal

Pullup

GPIOLMPSEL

GPxQSEL1/2

GPxSET

GPxDAT (latch)

GPxCLEAR

GPxTOGGLE

= Default at Reset

PIE

External Interrupt

MUX

Asynchronous

path

Asynchronous path

GPIOXINT1SEL

GPIOXINT2SEL

GPIOXINT3SEL

A. x stands for the port, either A or B. For example, GPxDIR refers to either the GPADIR and GPBDIR register depending on the particular

GPIO pin selected.

B. GPxDAT latch/read are accessed at the same memory location.

C. This is a generic GPIO MUX block diagram. Not all options may be applicable for all GPIO pins. See the Systems Control and Interrupts

chapter of the TMS320x2806x Technical Reference Manual for pin-specific variations.

Figure 8-55. GPIO Multiplexing

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

8.9.15.1 GPIO Electrical Data/Timing

8.9.15.1.1 GPIO Output Timing

8.9.15.1.1.1 General-Purpose Output Switching Characteristics

over recommended operating conditions (unless otherwise noted)

PARAMETER MIN MAX UNIT

tr(GPO) Rise time, GPIO switching low to high All GPIOs 13(1) ns

tf(GPO) Fall time, GPIO switching high to low All GPIOs 13(1) ns

fGPO Toggling frequency 22.5 MHz

(1) Rise time and fall time vary with electrical loading on I/O pins. Values given in Section 8.9.15.1.1.1 are applicable for a 40-pF load on

I/O pins.

GPIO

tr(GPO)

tf(GPO)

Figure 8-56. General-Purpose Output Timing

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TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

w TEXAS INSTRUMENTS MMMMMMMMMMM

8.9.15.1.2 GPIO Input Timing

8.9.15.1.2.1 General-Purpose Input Timing Requirements

MIN MAX UNIT

tw(SP) Sampling period QUALPRD = 0 1tc(SCO) cycles

QUALPRD ≠ 0 2tc(SCO) * QUALPRD

tw(IQSW) Input qualifier sampling window tw(SP) * (n(1) – 1) cycles

tw(GPI) (2) Pulse duration, GPIO low/high Synchronous mode 2tc(SCO) cycles

With input qualifier tw(IQSW) + tw(SP) + 1tc(SCO)

(1) "n" represents the number of qualification samples as defined by GPxQSELn register.

(2) For tw(GPI), pulse width is measured from VIL to VIL for an active-low signal and VIH to VIH for an active-high signal.

GPIO Signal

Sampling Window

Output From

Qualifier

1 1 1111111110000000 000

SYSCLKOUT

QUALPRD = 1

(SYSCLKOUT/2)

(A)

GPxQSELn = 1,0 (6 samples)

[(SYSCLKOUT cycle * 2 * QUALPRD) * 5 ]

(C)

Sampling Period determined

by GPxCTRL[QUALPRD](B)

(D)

tw(SP)

tw(IQSW)

A. This glitch will be ignored by the input qualifier. The QUALPRD bit field specifies the qualification sampling period. The QUALPRD bit

field value can vary from 00 to 0xFF. If QUALPRD = 00, then the sampling period is one SYSCLKOUT cycle. For any other value "n",

the qualification sampling period in 2n SYSCLKOUT cycles (that is, at every 2n SYSCLKOUT cycles, the GPIO pin will be sampled).

B. The qualification period selected through the GPxCTRL register applies to groups of eight GPIO pins.

C. The qualification block can take either three or six samples. The GPxQSELn Register selects which sample mode is used.

D. In the example shown, for the qualifier to detect the change, the input should be stable for 10 SYSCLKOUT cycles or greater. In other

words, the inputs should be stable for (5 × QUALPRD × 2) SYSCLKOUT cycles. This would ensure five sampling periods for detection

to occur. Because external signals are driven asynchronously, an 13-SYSCLKOUT-wide pulse ensures reliable recognition.

Figure 8-57. Sampling Mode

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

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Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

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TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

8.9.15.1.3 Sampling Window Width for Input Signals

The following section summarizes the sampling window width for input signals for various input qualifier

configurations.

Sampling frequency denotes how often a signal is sampled with respect to SYSCLKOUT.

Sampling frequency = SYSCLKOUT/(2 × QUALPRD), if QUALPRD ≠ 0

Sampling frequency = SYSCLKOUT, if QUALPRD = 0

Sampling period = SYSCLKOUT cycle × 2 × QUALPRD, if QUALPRD ≠ 0

In the preceding samples, SYSCLKOUT cycle indicates the time period of SYSCLKOUT.

Sampling period = SYSCLKOUT cycle, if QUALPRD = 0

In a given sampling window, either three or six samples of the input signal are taken to determine the validity of

the signal. This is determined by the value written to GPxQSELn register.

Case 1:

Qualification using three samples

Sampling window width = (SYSCLKOUT cycle × 2 × QUALPRD) × 2, if QUALPRD ≠ 0

Sampling window width = (SYSCLKOUT cycle) × 2, if QUALPRD = 0

Case 2:

Qualification using six samples

Sampling window width = (SYSCLKOUT cycle × 2 × QUALPRD) × 5, if QUALPRD ≠ 0

Sampling window width = (SYSCLKOUT cycle) × 5, if QUALPRD = 0

GPIOxn

SYSCLK

tw(GPI)

Figure 8-58. General-Purpose Input Timing

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TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

l TEXAS INSTRUMENTS

VDDIO

VSS VSS

2 pF

> 1 MS

Figure 8-59. Input Resistance Model for a GPIO Pin With an Internal Pullup

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

8.9.15.1.4 Low-Power Mode Wakeup Timing

Section 8.9.15.1.4.1 shows the timing requirements, Section 8.9.15.1.4.2 shows the switching characteristics,

and Figure 8-60 shows the timing diagram for IDLE mode.

8.9.15.1.4.1 IDLE Mode Timing Requirements

MIN(1) MAX UNIT

tw(WAKE-INT) Pulse duration, external wake-up signal Without input qualifier 2tc(SCO) cycles

With input qualifier 5tc(SCO) + tw(IQSW)

(1) For an explanation of the input qualifier parameters, see Section 8.9.15.1.2.1.

8.9.15.1.4.2 IDLE Mode Switching Characteristics

over recommended operating conditions (unless otherwise noted)(1)

PARAMETER TEST CONDITIONS MIN MAX UNIT

td(WAKE-IDLE)

Delay time, external wake signal to program execution resume (2) cycles

• Wake up from flash

– Flash module in active state

Without input qualifier 20tc(SCO)

cycles

With input qualifier 20tc(SCO) + tw(IQSW)

• Wake up from flash

– Flash module in sleep state

Without input qualifier 1050tc(SCO)

cycles

With input qualifier 1050tc(SCO) + tw(IQSW)

• Wake up from SARAM Without input qualifier 20tc(SCO) cycles

With input qualifier 20tc(SCO) + tw(IQSW)

(1) For an explanation of the input qualifier parameters, see Section 8.9.15.1.2.1.

(2) This is the time taken to begin execution of the instruction that immediately follows the IDLE instruction. Execution of an ISR (triggered

by the wake-up signal) involves additional latency.

WAKE INT(A)(B)

XCLKOUT

Address/Data

(internal)

td(WAKE−IDLE)

tw(WAKE−INT)

A. WAKE INT can be any enabled interrupt, WDINT or XRS. After the IDLE instruction is executed, a delay of five OSCCLK cycles

(minimum) is needed before the wake-up signal could be asserted.

B. From the time the IDLE instruction is executed to place the device into low-power mode (LPM), wakeup should not be initiated until at

least four OSCCLK cycles have elapsed.

Figure 8-60. IDLE Entry and Exit Timing

www.ti.com

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

w TEXAS INSTRUMENTS

8.9.15.1.4.3 STANDBY Mode Timing Requirements

MIN MAX UNIT

tw(WAKE-INT)

Pulse duration, external

wake-up signal

Without input qualification 3tc(OSCCLK)

cycles

With input qualification(1) (2 + QUALSTDBY) *

tc(OSCCLK)

(1) QUALSTDBY is a 6-bit field in the LPMCR0 register.

8.9.15.1.4.4 STANDBY Mode Switching Characteristics

over recommended operating conditions (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN MAX UNIT

td(IDLE-XCOL)

Delay time, IDLE instruction

executed to XCLKOUT low 32tc(SCO) 45tc(SCO) cycles

td(WAKE-STBY)

Delay time, external wake signal to program execution

resume(1) cycles

• Wake up from flash

– Flash module in active state

Without input qualifier 100tc(SCO)

cycles

With input qualifier 100tc(SCO) + tw(WAKE-INT)

• Wake up from flash

– Flash module in sleep state

Without input qualifier 1125tc(SCO)

cycles

With input qualifier 1125tc(SCO) + tw(WAKE-INT)

• Wake up from SARAM Without input qualifier 100tc(SCO) cycles

With input qualifier 100tc(SCO) + tw(WAKE-INT)

(1) This is the time taken to begin execution of the instruction that immediately follows the IDLE instruction. Execution of an ISR (triggered

by the wake-up signal) involves additional latency.

td(IDLE−XCOL)

Wake-up

Signal(H)

X1/X2 or

XCLKIN

XCLKOUT

Flushing Pipeline

(A)

Device

Status STANDBY Normal ExecutionSTANDBY

(G)(B)

(C)

(D)(E)

(F)

tw(WAKE-INT)

td(WAKE-STBY)

A. IDLE instruction is executed to put the device into STANDBY mode.

B. The PLL block responds to the STANDBY signal. SYSCLKOUT is held for the number of cycles indicated below before being turned off:

• 16 cycles, when DIVSEL = 00 or 01

• 32 cycles, when DIVSEL = 10

• 64 cycles, when DIVSEL = 11

This delay enables the CPU pipeline and any other pending operations to flush properly.

C. Clock to the peripherals are turned off. However, the PLL and watchdog are not shut down. The device is now in STANDBY mode. After

the IDLE instruction is executed, a delay of five OSCCLK cycles (minimum) is needed before the wake-up signal could be asserted.

D. The external wake-up signal is driven active.

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

E. The wake-up signal fed to a GPIO pin to wake up the device must meet the minimum pulse width requirement. Furthermore, this signal

must be free of glitches. If a noisy signal is fed to a GPIO pin, the wake-up behavior of the device will not be deterministic and the

device may not exit low-power mode for subsequent wake-up pulses.

F. After a latency period, the STANDBY mode is exited.

G. Normal execution resumes. The device will respond to the interrupt (if enabled).

H. From the time the IDLE instruction is executed to place the device into low-power mode (LPM), wakeup should not be initiated until at

least four OSCCLK cycles have elapsed.

Figure 8-61. STANDBY Entry and Exit Timing Diagram

www.ti.com

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

w TEXAS INSTRUMENTS

8.9.15.1.4.5 HALT Mode Timing Requirements

MIN MAX UNIT

tw(WAKE-GPIO) Pulse duration, GPIO wake-up signal toscst + 2tc(OSCCLK) cycles

tw(WAKE-XRS) Pulse duration, XRS wake-up signal toscst + 8tc(OSCCLK) cycles

8.9.15.1.4.6 HALT Mode Switching Characteristics

over recommended operating conditions (unless otherwise noted)

PARAMETER MIN MAX UNIT

td(IDLE-XCOL) Delay time, IDLE instruction executed to XCLKOUT low 32tc(SCO) 45tc(SCO) cycles

tpPLL lock-up time 1 ms

td(WAKE-HALT)

Delay time, PLL lock to program execution resume

• Wake up from flash

– Flash module in sleep state

1125tc(SCO) cycles

• Wake up from SARAM 35tc(SCO) cycles

td(IDLE−XCOL)

X1/X2 or

XCLKIN

XCLKOUT

HALT HALT

Wake-up Latency

Flushing Pipeline

td(WAKE−HALT

Device

Status

PLL Lock-up Time Normal

Execution

tw(WAKE-GPIO)

GPIOn(I)

Oscillator Start-up Time

(A)

(G)

(C)

(D)(E)

(F)

(B)

(H)

)

A. IDLE instruction is executed to put the device into HALT mode.

B. The PLL block responds to the HALT signal. SYSCLKOUT is held for the number of cycles indicated below before oscillator is turned off

and the CLKIN to the core is stopped:

• 16 cycles, when DIVSEL = 00 or 01

• 32 cycles, when DIVSEL = 10

• 64 cycles, when DIVSEL = 11

This delay enables the CPU pipeline and any other pending operations to flush properly.

C. Clocks to the peripherals are turned off and the PLL is shut down. If a quartz crystal or ceramic resonator is used as the clock source,

the internal oscillator is shut down as well. The device is now in HALT mode and consumes absolute minimum power. It is possible to

keep the zero-pin internal oscillators (INTOSC1 and INTOSC2) and the watchdog alive in HALT mode. This is done by writing to the

appropriate bits in the CLKCTL register. After the IDLE instruction is executed, a delay of five OSCCLK cycles (minimum) is needed

before the wake-up signal could be asserted.

D. When the GPIOn pin (used to bring the device out of HALT) is driven low, the oscillator is turned on and the oscillator wake-up

sequence is initiated. The GPIO pin should be driven high only after the oscillator has stabilized. This enables the provision of a clean

clock signal during the PLL lock sequence. Because the falling edge of the GPIO pin asynchronously begins the wake-up procedure,

care should be taken to maintain a low-noise environment before entering and during HALT mode.

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

E. The wake-up signal fed to a GPIO pin to wake up the device must meet the minimum pulse width requirement. Furthermore, this signal

must be free of glitches. If a noisy signal is fed to a GPIO pin, the wake-up behavior of the device will not be deterministic and the

device may not exit low-power mode for subsequent wake-up pulses.

F. Once the oscillator has stabilized, the PLL lock sequence is initiated, which takes 1 ms.

G. When CLKIN to the core is enabled, the device will respond to the interrupt (if enabled), after a latency. The HALT mode is now exited.

H. Normal operation resumes.

I. From the time the IDLE instruction is executed to place the device into low-power mode (LPM), wakeup should not be initiated until at

least four OSCCLK cycles have elapsed.

Figure 8-62. HALT Mode Wakeup Using GPIOn

www.ti.com

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

8.9.16 Universal Serial Bus (USB)

8.9.16.1 USB Electrical Data/Timing

8.9.16.1.1 USB Input Ports DP and DM Timing Requirements

VCC MIN MAX UNIT

V(CM) Differential input common mode range 0.8 2.5 V

Z(IN) Input impedance 300 kΩ

VCRS Crossover voltage 1.3 2.0 V

VIL Static SE input logic-low level 0.8 V

VIH Static SE input logic-high level 2.0 V

VDI Differential input voltage 0.2 V

8.9.16.1.2 USB Output Ports DP and DM Switching Characteristics

over recommended operating conditions (unless otherwise noted)

PARAMETER TEST CONDITIONS VCC MIN MAX UNIT

VOH D+, D– single-ended USB 2.0 load conditions 2.8 3.6 V

VOL D+, D– single-ended USB 2.0 load conditions 0 0.3 V

Z(DRV) D+, D– impedance 28 50 Ω

trRise time Full speed, differential, CL = 50 pF,

10%/90%, Rpu on D+ 4 20 ns

tfFall time Full speed, differential, CL = 50 pF,

10%/90%, Rpu on D+ 4 20 ns

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

9 Applications, Implementation, and Layout

Note

Information in the following applications sections is not part of the TI component specification,

and TI does not warrant its accuracy or completeness. TI’s customers are responsible for

determining suitability of components for their purposes, as well as validating and testing their design

implementation to confirm system functionality.

9.1 TI Reference Design

The TI Reference Design Library is a robust reference design library spanning analog, embedded processor,

and connectivity. Created by TI experts to help you jump start your system design, all reference designs include

schematic or block diagrams, BOMs, and design files to speed your time to market. Search and download

designs at the Select TI reference designs page.

Digitally Controlled Non-Isolated DC/DC Buck Converter Reference Design

This design implements a non-isolated DC/DC buck converter that is digitally controlled using a C2000

microcontroller. The main purpose of this design is to evaluate the powerSUITE Digital Power Software tools.

The design consists of two separate boards: 1) Digital Power BoosterPack™ Plug-in Module and 2) C2000

F28069M LaunchPad™ Development Kit or C2000 F28377S LaunchPad Development Kit.

672W Highly Integrated Reference Design for Automotive Bidirectional 48V-12V Converter

Today's automotive power consumption is 3KW, which will increase to 10KW in the next 5 years. A 12-V battery

is unable to provide that much power. The 48-12V bidirectional convertor provides a high-power requirement

solution with two phases, each capable of running 28 A. This solution allows bidirectional current control of both

phases using a C2000 control stick and firmware OCP and OVP. The 48-12V bidirectional converter removes

the voltage conditioner need and distributes loads more evenly. The 48-V battery is used to power high-torque

motors and other high-power components, such as A/C compressors and EPS, with no change to 12-V battery

loads.

www.ti.com

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

10 Device and Documentation Support

10.1 Device and Development Support Tool Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all

TMS320™ MCU devices and support tools. Each TMS320 MCU commercial family member has one of three

prefixes: TMX, TMP, or TMS (for example, TMS320F28069). Texas Instruments recommends two of three

possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages

of product development from engineering prototypes (with TMX for devices and TMDX for tools) to fully qualified

production devices/tools (with TMS for devices and TMDS for tools).

Device development evolutionary flow:

TMX Experimental device that is not necessarily representative of the final device's electrical specifications and

may not use production assembly flow.

TMP Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical

specifications.

TMS Production version of the silicon die that is fully qualified.

Support tool development evolutionary flow:

TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing.

TMDS Fully-qualified development-support product.

TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer:

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package

type (for example, PZP) and temperature range (for example, S). Figure 10-1 provides a legend for reading the

complete device name for any family member.

For device part numbers and further ordering information, see the TI website (www.ti.com) or contact your TI

sales representative.

For additional description of the device nomenclature markings on the die, see the TMS320F2806x MCUs

Silicon Errata.

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS Genaric PanNumhar: TMS 320 F zsuss -Q1 OrderableParlNumher'TMS 320 F zsuss PZP s R PREFIX —I I I— SHIPPING OPTIONS TMX xpenmentaI device BIank : Tray mp mmype dewce R = Tape and ReeI ms uahﬂed dewce 7 QUALIFICATION (in Generic Part Number) Blank : NonrAutomoﬁve DEVICE FAMILY -Q1 : m revers ID Automotwe AEC 0100 Grade 1 quahﬂcauon 320 = TMSSZU MCU Fam‘ly 7 TEMPERATURE RANGE (in Orderable Part Number) T - *AODC to 1057C s *40"CI0125“C Q -40"cm125“c PACKAGE TYPE TECHNOLOGV su-Pm PN Law-Proﬁle Quad FIaIpack (LOFP) F = Hash EDrFin PFP PowerFAD Thermauy Enhanced Thm Quad FIalpack (HTOFP) 1007mm PZ Lowerﬁle Quad FIaIpack (LQFP) “JO-Pm PZP PawerPAD ThermaHy Enhanced Thm Quad Flatpack (HTQFP) DEVICE 28069 28069U ZBOSSM ZSDEQF ZSDGBU 28068M 28058F 28067 28067U 28066 ZBDGSU 28065 28065U 26064 2606M] 28063 zanssu 28062 28062U ZEDEZF

A. USB is present on TMS320F2806xU, TMS320F2806xM, and TMS320F2806xF devices.

B. TMS320F2806xM devices are InstaSPIN-MOTION-enabled MCUs. TMS320F2806xF devices are InstaSPIN-FOC-enabled MCUs. For

more information, see Section 10.3 for a list of InstaSPIN Technical Reference Manuals.

C. For more information on peripheral, temperature, and package availability for a specific device, see Table 5-1.

Figure 10-1. Device Nomenclature

10.2 Tools and Software

TI offers an extensive line of development tools. Some of the tools and software to evaluate the performance of

the device, generate code, and develop solutions are listed below. To view all available tools and software for

C2000™ real-time control MCUs, visit the C2000 real-time control MCUs – Design & development page.

Development Tools

C2000 F28069M LaunchPad™ development kit

LAUNCHXL-F28069M is a low cost evaluation and development tool for the F2806x series as well as the

InstaSPIN-FOC and InstaSPIN-MOTION enabled F2806x series in the TI MCU LaunchPad ecosystem which is

compatible with various plug-on BoosterPacks. This extended version of the LaunchPad supports the connection

of two BoosterPacks. The LaunchPad provides a standardized and easy to use platform to use while developing

your next application.

F28069 controlCARD

The C2000 controlCARDs from Texas Instruments are ideal products for OEMs to use for initial software

development and short-run builds for system prototypes, test stands, and many other projects that require

easy access to high-performance controllers. The controlCARDs are complete board-level modules that use

an industry-standard DIMM form factor to provide a low-profile, single-board controller solution. All of the

C2000 controlCARDs use the same 100-pin connector footprint to provide the analog and digital I/Os onboard

controller and are completely interchangeable. The host system must provide only a single 5-V power rail to the

controlCARD for it to function fully.

www.ti.com

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

F28069 Experimenter Kit

The C2000 experimenter kits from Texas Instruments are ideal products for OEMs to use for initial device

exploration and testing. The F28069 Experimenter Kit has a docking station that features onboard USB JTAG

debug, access to all controlCARD signals, breadboard areas, and RS-232 and JTAG connectors. Each kit

contains an F28069 controlCARD. The controlCARD is a complete board-level module that uses an industry-

standard DIMM form factor to provide a low-profile, single-board controller solution. The kit is complete with

Code Composer Studio IDE and USB cable.

Software Tools

C2000 Third-party search tool

TI has partnered with multiple companies to offer a wide range of solutions and services for TI C2000 devices.

These companies can accelerate your path to production using C2000 devices. Download this search tool to

quickly browse third-party details and find the right third-party to meet your needs.

C2000Ware for C2000 MCUs

C2000Ware for C2000™ microcontrollers is a cohesive set of development software and documentation

designed to minimize software development time. From device-specific drivers and libraries to device peripheral

examples, C2000Ware provides a solid foundation to begin development and evaluation of your product.

Code Composer Studio™ (CCS) Integrated Development Environment (IDE) for C2000 Microcontrollers

Code Composer Studio is an integrated development environment (IDE) that supports TI's Microcontroller

and Embedded Processors portfolio. CCS comprises a suite of tools used to develop and debug embedded

applications. It includes an optimizing C/C++ compiler, source code editor, project build environment, debugger,

profiler, and many other features. The intuitive IDE provides a single user interface taking the user through

each step of the application development flow. Familiar tools and interfaces let users get started faster than

ever before. CCS combines the advantages of the Eclipse software framework with advanced embedded debug

capabilities from TI resulting in a compelling feature-rich development environment for embedded developers.

Pin Mux Tool

The Pin Mux Utility is a software tool which provides a Graphical User Interface for configuring pin multiplexing

settings, resolving conflicts and specifying I/O cell characteristics for TI MPUs.

UniFlash Standalone Flash Tool

UniFlash is a standalone tool used to program on-chip flash memory through a GUI, command line, or scripting

interface.

Models

Various models are available for download from the product Tools & Software pages. These include I/O Buffer

Information Specification (IBIS) Models and Boundary-Scan Description Language (BSDL) Models. To view all

available models, visit the Models section of the Tools & Software page for each device.

Training

To help assist design engineers in taking full advantage of the C2000 microcontroller features and performance,

TI has developed a variety of training resources. Utilizing the online training materials and downloadable

hands-on workshops provides an easy means for gaining a complete working knowledge of the C2000

microcontroller family. These training resources have been designed to decrease the learning curve, while

reducing development time, and accelerating product time to market. For more information on the various

training resources, visit the C2000™ real-time control MCUs – Support & training site.

Specific TMS320F2806x hands-on training resources can be found at C2000™ MCU Device Workshops.

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

10.3 Documentation Support

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Subscribe to updates to register and receive a weekly digest of any product information that has changed. For

change details, review the revision history included in any revised document.

The current documentation that describes the processor, related peripherals, and other technical collateral is

listed below.

Errata

TMS320F2806x MCUs Silicon Errata describes known advisories on silicon and provides workarounds.

InstaSPIN Technical Reference Manuals

InstaSPIN-FOC™ and InstaSPIN-MOTION™ User's Guide describes the InstaSPIN-FOC and InstaSPIN-

MOTION devices.

TMS320F28069F, TMS320F28068F, TMS320F28062F InstaSPIN-FOC™ Software Technical Reference Manual

describes the TMS320F28069F, TMS320F28068F, and TMS320F28062F InstaSPIN-FOC™ software.

TMS320F28069M, TMS320F28068M InstaSPIN-MOTION™ Software Technical Reference Manual describes

the TMS320F28069M and TMS320F28068M InstaSPIN-MOTION™ software.

CPU User's Guides

TMS320C28x CPU and Instruction Set Reference Guide describes the central processing unit (CPU) and the

assembly language instructions of the TMS320C28x fixed-point digital signal processors (DSPs). This reference

guide also describes debug features available on these DSPs.

Peripheral Guides and Technical Reference Manuals

C2000 Real-Time Control Peripherals Reference Guide describes the peripheral reference guides of the 28x

digital signal processors (DSPs).

TMS320x2806x Technical Reference Manual details the integration, the environment, the functional description,

and the programming models for each peripheral and subsystem in the device.

Tools Guides

TMS320C28x Assembly Language Tools v20.12.0.STS User's Guide describes the assembly language tools

(assembler and other tools used to develop assembly language code), assembler directives, macros, common

object file format, and symbolic debugging directives for the TMS320C28x device.

TMS320C28x Optimizing C/C++ Compiler v20.12.0.STS User's Guide describes the TMS320C28x C/C++

compiler. This compiler accepts ANSI standard C/C++ source code and produces TMS320 DSP assembly

language source code for the TMS320C28x device.

Application Reports

Semiconductor Packing Methodology describes the packing methodologies employed to prepare semiconductor

devices for shipment to end users.

Calculating Useful Lifetimes of Embedded Processors provides a methodology for calculating the useful lifetime

of TI embedded processors (EPs) under power when used in electronic systems. It is aimed at general

engineers who wish to determine if the reliability of the TI EP meets the end system reliability requirement.

An Introduction to IBIS (I/O Buffer Information Specification) Modeling discusses various aspects of IBIS

including its history, advantages, compatibility, model generation flow, data requirements in modeling the input/

output structures and future trends.

Serial Flash Programming of C2000™ Microcontrollers discusses using a flash kernel and ROM loaders for

serial programming a device.

www.ti.com

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

l TEXAS INSTRUMENTS

10.4 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

10.5 Trademarks

PowerPAD™, InstaSPIN-FOC™, InstaSPIN-MOTION™, TMS320C2000™, C2000™, FAST™, BoosterPack™,

LaunchPad™, TMS320™, Code Composer Studio™, and TI E2E™ are trademarks of Texas Instruments.

SpinTAC™ is a trademark of LineStream Technologies, Inc.

I2C-bus® is a registered trademark of NXP B.V. Corporation.

All trademarks are the property of their respective owners.

10.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

10.7 Glossary

TI Glossary This glossary lists and explains terms, acronyms, and definitions.

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021 www.ti.com

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS

11 Mechanical, Packaging, and Orderable Information

11.1 Packaging Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

For packages with a thermal pad, the MECHANICAL DATA figure shows a generic thermal pad without

dimensions. For the actual thermal pad dimensions that are applicable to this device, see the THERMAL PAD

MECHANICAL DATA figure.

www.ti.com

TMS320F28069, TMS320F28069M, TMS320F28069F, TMS320F28068M, TMS320F28068F

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064, TMS320F28063

TMS320F28062, TMS320F28062F

SPRS698J – NOVEMBER 2010 – REVISED SEPTEMBER 2021

Product Folder Links: TMS320F28069 TMS320F28069M TMS320F28069F TMS320F28068M

TMS320F28068F TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063

TMS320F28062 TMS320F28062F

I TEXAS INSTRUMENTS Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples

PACKAGE OPTION ADDENDUM

www.ti.com 16-Mar-2021

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

TMS320F28062FPFPQ ACTIVE HTQFP PFP 80 96 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 F28062FPFPQ

TMS320

TMS320F28062FPNT ACTIVE LQFP PN 80 119 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 105 F28062FPNT

TMS320

TMS320F28062FPZT ACTIVE LQFP PZ 100 90 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 105 F28062FPZT

TMS320

TMS320F28062PFPQ ACTIVE HTQFP PFP 80 96 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 F28062PFPQ

TMS320

TMS320F28062PFPQR ACTIVE HTQFP PFP 80 1000 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 F28062PFPQ

TMS320

TMS320F28062PFPS ACTIVE HTQFP PFP 80 96 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 F28062PFPS

TMS320

TMS320F28062PNT ACTIVE LQFP PN 80 119 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 105 320F28062PNT

TMS

TMS320F28062PZPQ ACTIVE HTQFP PZP 100 90 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 F28062PZPQ

TMS320

TMS320F28062PZPS ACTIVE HTQFP PZP 100 90 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 F28062PZPS

TMS320

TMS320F28062PZT ACTIVE LQFP PZ 100 90 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 105 320F28062PZT

TMS

TMS320F28062PZTR ACTIVE LQFP PZ 100 1000 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 105 320F28062PZT

TMS

TMS320F28062UPNT ACTIVE LQFP PN 80 119 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 105 320F28062UPNT

TMS

TMS320F28062UPZT ACTIVE LQFP PZ 100 90 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 105 F28062UPZT

TMS320

TMS320F28063PNT ACTIVE LQFP PN 80 119 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 105 320F28063PNT

TMS

TMS320F28063PZT ACTIVE LQFP PZ 100 90 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 105 320F28063PZT

TMS

TMS320F28064PZT ACTIVE LQFP PZ 100 90 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 105 320F28064PZT

TMS

TMS320F28065PFPS ACTIVE HTQFP PFP 80 96 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 F28065PFPS

I TEXAS INSTRUMENTS Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples

PACKAGE OPTION ADDENDUM

www.ti.com 16-Mar-2021

Addendum-Page 2

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

TMS320

TMS320F28065PNT ACTIVE LQFP PN 80 119 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 105 F28065PNT

TMS320

TMS320F28065PZPQ ACTIVE HTQFP PZP 100 90 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 F28065PZPQ

TMS320

TMS320F28065PZPS ACTIVE HTQFP PZP 100 90 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 F28065PZPS

TMS320

TMS320F28065PZT ACTIVE LQFP PZ 100 90 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 105 320F28065PZT

TMS

TMS320F28065UPZPS ACTIVE HTQFP PZP 100 90 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 F28065UPZPS

TMS320

TMS320F28065UPZT ACTIVE LQFP PZ 100 90 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 105 F28065UPZT

TMS320

TMS320F28066PFPQ ACTIVE HTQFP PFP 80 96 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 F28066PFPQ

TMS320

TMS320F28066PFPS ACTIVE HTQFP PFP 80 96 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 F28066PFPS

TMS320

TMS320F28066PNT ACTIVE LQFP PN 80 119 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 105 320F28066PNT

TMS

TMS320F28066PZPQ ACTIVE HTQFP PZP 100 90 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 F28066PZPQ

TMS320

TMS320F28066PZPS ACTIVE HTQFP PZP 100 90 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 F28066PZPS

TMS320

TMS320F28066PZT ACTIVE LQFP PZ 100 90 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 105 320F28066PZT

TMS

TMS320F28067PFPS ACTIVE HTQFP PFP 80 96 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 F28067PFPS

TMS320

TMS320F28067PNT ACTIVE LQFP PN 80 119 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 105 320F28067PNT

TMS

TMS320F28067PZPQ ACTIVE HTQFP PZP 100 90 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 F28067PZPQ

TMS320

TMS320F28067PZPS ACTIVE HTQFP PZP 100 90 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 F28067PZPS

TMS320

TMS320F28067PZT ACTIVE LQFP PZ 100 90 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 105 320F28067PZT

TMS

I TEXAS INSTRUMENTS Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples

PACKAGE OPTION ADDENDUM

www.ti.com 16-Mar-2021

Addendum-Page 3

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

TMS320F28068FPNT ACTIVE LQFP PN 80 119 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 105 F28068FPNT

TMS320

TMS320F28068FPZT ACTIVE LQFP PZ 100 90 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 105 F28068FPZT

TMS320

TMS320F28068MPNT ACTIVE LQFP PN 80 119 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 105 F28068MPNT

TMS320

TMS320F28068MPZT ACTIVE LQFP PZ 100 90 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 105 F28068MPZT

TMS320

TMS320F28069FPFPQ ACTIVE HTQFP PFP 80 96 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 F28069FPFPQ

TMS320

TMS320F28069FPNT ACTIVE LQFP PN 80 119 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 105 F28069FPNT

TMS320

TMS320F28069FPZPQ ACTIVE HTQFP PZP 100 90 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 F28069FPZPQ

TMS320

TMS320F28069FPZT ACTIVE LQFP PZ 100 90 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 105 F28069FPZT

TMS320

TMS320F28069FPZTR ACTIVE LQFP PZ 100 1000 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 105 F28069FPZT

TMS320

TMS320F28069MPFPQ ACTIVE HTQFP PFP 80 96 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 F28069MPFPQ

TMS320

TMS320F28069MPNT ACTIVE LQFP PN 80 119 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 105 F28069MPNT

TMS320

TMS320F28069MPZPQ ACTIVE HTQFP PZP 100 90 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 F28069MPZPQ

TMS320

TMS320F28069MPZT ACTIVE LQFP PZ 100 90 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 105 F28069MPZT

TMS320

TMS320F28069PFPQ ACTIVE HTQFP PFP 80 96 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 F28069PFPQ

TMS320

TMS320F28069PFPS ACTIVE HTQFP PFP 80 96 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 F28069PFPS

TMS320

TMS320F28069PNT ACTIVE LQFP PN 80 119 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 320F28069PNT

TMS

TMS320F28069PZA ACTIVE LQFP PZ 100 90 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 85 320F28069PZA

TMS

TMS320F28069PZPQ ACTIVE HTQFP PZP 100 90 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 F28069PZPQ

I TEXAS INSTRUMENTS Samples Samples Samples Samples Samples Samples

PACKAGE OPTION ADDENDUM

www.ti.com 16-Mar-2021

Addendum-Page 4

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

TMS320

TMS320F28069PZPS ACTIVE HTQFP PZP 100 90 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 F28069PZPS

TMS320

TMS320F28069PZT ACTIVE LQFP PZ 100 90 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 105 320F28069PZT

TMS

TMS320F28069UPFPS ACTIVE HTQFP PFP 80 96 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 F28069UPFPS

TMS320

TMS320F28069UPNT ACTIVE LQFP PN 80 119 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 105 F28069UPNT

TMS320

TMS320F28069UPZPS ACTIVE HTQFP PZP 100 90 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 F28069UPZPS

TMS320

TMS320F28069UPZT ACTIVE LQFP PZ 100 90 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 105 F28069UPZT

TMS320

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

I TEXAS INSTRUMENTS

PACKAGE OPTION ADDENDUM

www.ti.com 16-Mar-2021

Addendum-Page 5

(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF TMS320F28062, TMS320F28062-Q1, TMS320F28062F, TMS320F28062F-Q1, TMS320F28065, TMS320F28065-Q1, TMS320F28066,

TMS320F28066-Q1, TMS320F28067, TMS320F28067-Q1, TMS320F28069, TMS320F28069-Q1, TMS320F28069F, TMS320F28069F-Q1, TMS320F28069M, TMS320F28069M-

Q1 :

•Catalog: TMS320F28062, TMS320F28062F, TMS320F28065, TMS320F28066, TMS320F28067, TMS320F28069, TMS320F28069F, TMS320F28069M

•Automotive: TMS320F28062-Q1, TMS320F28062F-Q1, TMS320F28065-Q1, TMS320F28066-Q1, TMS320F28067-Q1, TMS320F28069-Q1, TMS320F28069F-Q1,

TMS320F28069M-Q1

NOTE: Qualified Version Definitions:

•Catalog - TI's standard catalog product

•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

I TEXAS INSTRUMENTS ‘3‘ V.'

PACKAGE MATERIALS INFORMATION

www.ti.com 2-Sep-2022

TAPE AND REEL INFORMATION

Reel Width (W1)

REEL DIMENSIONS

Dimension designed to accommodate the component length

Dimension designed to accommodate the component thickness

Overall width of the carrier tape

Pitch between successive cavity centers

Dimension designed to accommodate the component width

TAPE DIMENSIONS

K0 P1

B0 W

Cavity

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Pocket Quadrants

Sprocket Holes

Q1 Q1Q2 Q2

Q3 Q3Q4 Q4 User Direction of Feed

Reel

Diameter

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

TMS320F28062PFPQR HTQFP PFP 80 1000 330.0 24.4 15.0 15.0 1.5 20.0 24.0 Q2

TMS320F28069FPZTR LQFP PZ 100 1000 330.0 32.4 16.9 16.9 2.0 24.0 32.0 Q2

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com 2-Sep-2022

TAPE AND REEL BOX DIMENSIONS

Width (mm)

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

TMS320F28062PFPQR HTQFP PFP 80 1000 367.0 367.0 55.0

TMS320F28069FPZTR LQFP PZ 100 1000 367.0 367.0 55.0

Pack Materials-Page 2

{if TEXAS INSTRUMENTS E 1 +++++J;T;L+++++++ +++++++++++++++ +++++++++++++++ +++++++++++++++ +++++++++++++++ +++++++++++++++ t-

PACKAGE MATERIALS INFORMATION

www.ti.com 2-Sep-2022

TRAY

L - Outer tray length without tabs KO -

Outer

tray

height

W -

Outer

tray

width

P1 - Tray unit pocket pitch

CW - Measurement for tray edge (Y direction) to corner pocket center

CL - Measurement for tray edge (X direction) to corner pocket center

Text

Chamfer on Tray corner indicates Pin 1 orientation of packed units.

*All dimensions are nominal

Device Package

Name Package

Type Pins SPQ Unit array

matrix Max

temperature

(°C)

L (mm) W

(mm) K0

(µm) P1

(mm) CL

(mm) CW

(mm)

TMS320F28062FPFPQ PFP HTQFP 80 96 6 x 16 150 315 135.9 7620 18.7 17.25 18.3

TMS320F28062FPNT PN LQFP 80 119 7 X 17 150 315 135.9 7620 17.9 14.3 13.95

TMS320F28062FPZT PZ LQFP 100 90 6 x 15 150 315 135.9 7620 20.3 15.4 15.4

TMS320F28062PFPQ PFP HTQFP 80 96 6 x 16 150 315 135.9 7620 18.7 17.25 18.3

TMS320F28062PNT PN LQFP 80 119 7 X 17 150 315 135.9 7620 17.9 14.3 13.95

TMS320F28062PZPQ PZP HTQFP 100 90 6 X 15 150 315 135.9 7620 15.4 20.3 21

TMS320F28062PZPS PZP HTQFP 100 90 6 X 15 150 315 135.9 7620 15.4 20.3 21

TMS320F28062PZT PZ LQFP 100 90 6 x 15 150 315 135.9 7620 20.3 15.4 15.4

TMS320F28062UPZT PZ LQFP 100 90 6 x 15 150 315 135.9 7620 20.3 15.4 15.4

TMS320F28063PNT PN LQFP 80 119 7 X 17 150 315 135.9 7620 17.9 14.3 13.95

TMS320F28063PZT PZ LQFP 100 90 6 x 15 150 315 135.9 7620 20.3 15.4 15.4

TMS320F28064PZT PZ LQFP 100 90 6 x 15 150 315 135.9 7620 20.3 15.4 15.4

TMS320F28065PFPS PFP HTQFP 80 96 6 x 16 150 315 135.9 7620 18.7 17.25 18.3

TMS320F28065PNT PN LQFP 80 119 7 X 17 150 315 135.9 7620 17.9 14.3 13.95

TMS320F28065PZPS PZP HTQFP 100 90 6 X 15 150 315 135.9 7620 15.4 20.3 21

TMS320F28065PZT PZ LQFP 100 90 6 x 15 150 315 135.9 7620 20.3 15.4 15.4

TMS320F28065UPZT PZ LQFP 100 90 6 x 15 150 315 135.9 7620 20.3 15.4 15.4

Pack Materials-Page 3

I TEXAS INSTRUMENTS

PACKAGE MATERIALS INFORMATION

www.ti.com 2-Sep-2022

Device Package

Name Package

Type Pins SPQ Unit array

matrix Max

temperature

(°C)

L (mm) W

(mm) K0

(µm) P1

(mm) CL

(mm) CW

(mm)

TMS320F28066PNT PN LQFP 80 119 7 X 17 150 315 135.9 7620 17.9 14.3 13.95

TMS320F28066PZPQ PZP HTQFP 100 90 6 X 15 150 315 135.9 7620 15.4 20.3 21

TMS320F28066PZPS PZP HTQFP 100 90 6 X 15 150 315 135.9 7620 15.4 20.3 21

TMS320F28066PZT PZ LQFP 100 90 6 x 15 150 315 135.9 7620 20.3 15.4 15.4

TMS320F28067PFPS PFP HTQFP 80 96 6 x 16 150 315 135.9 7620 18.7 17.25 18.3

TMS320F28067PNT PN LQFP 80 119 7 X 17 150 315 135.9 7620 17.9 14.3 13.95

TMS320F28067PZPQ PZP HTQFP 100 90 6 X 15 150 315 135.9 7620 15.4 20.3 21

TMS320F28067PZPS PZP HTQFP 100 90 6 X 15 150 315 135.9 7620 15.4 20.3 21

TMS320F28067PZT PZ LQFP 100 90 6 x 15 150 315 135.9 7620 20.3 15.4 15.4

TMS320F28068FPNT PN LQFP 80 119 7 X 17 150 315 135.9 7620 17.9 14.3 13.95

TMS320F28068FPZT PZ LQFP 100 90 6 x 15 150 315 135.9 7620 20.3 15.4 15.4

TMS320F28068MPNT PN LQFP 80 119 7 X 17 150 315 135.9 7620 17.9 14.3 13.95

TMS320F28068MPZT PZ LQFP 100 90 6 x 15 150 315 135.9 7620 20.3 15.4 15.4

TMS320F28069FPFPQ PFP HTQFP 80 96 6 x 16 150 315 135.9 7620 18.7 17.25 18.3

TMS320F28069FPNT PN LQFP 80 119 7 X 17 150 315 135.9 7620 17.9 14.3 13.95

TMS320F28069FPZPQ PZP HTQFP 100 90 6 X 15 150 315 135.9 7620 15.4 20.3 21

TMS320F28069FPZT PZ LQFP 100 90 6 x 15 150 315 135.9 7620 20.3 15.4 15.4

TMS320F28069MPFPQ PFP HTQFP 80 96 6 x 16 150 315 135.9 7620 18.7 17.25 18.3

TMS320F28069MPNT PN LQFP 80 119 7 X 17 150 315 135.9 7620 17.9 14.3 13.95

TMS320F28069MPZPQ PZP HTQFP 100 90 6 X 15 150 315 135.9 7620 15.4 20.3 21

TMS320F28069MPZT PZ LQFP 100 90 6 x 15 150 315 135.9 7620 20.3 15.4 15.4

TMS320F28069PFPQ PFP HTQFP 80 96 6 x 16 150 315 135.9 7620 18.7 17.25 18.3

TMS320F28069PFPS PFP HTQFP 80 96 6 x 16 150 315 135.9 7620 18.7 17.25 18.3

TMS320F28069PNT PN LQFP 80 119 7 X 17 150 315 135.9 7620 17.9 14.3 13.95

TMS320F28069PZA PZ LQFP 100 90 6 x 15 150 315 135.9 7620 20.3 15.4 15.4

TMS320F28069PZPQ PZP HTQFP 100 90 6 X 15 150 315 135.9 7620 15.4 20.3 21

TMS320F28069PZPS PZP HTQFP 100 90 6 X 15 150 315 135.9 7620 15.4 20.3 21

TMS320F28069PZT PZ LQFP 100 90 6 x 15 150 315 135.9 7620 20.3 15.4 15.4

TMS320F28069UPFPS PFP HTQFP 80 96 6 x 16 150 315 135.9 7620 18.7 17.25 18.3

TMS320F28069UPNT PN LQFP 80 119 7 X 17 150 315 135.9 7620 17.9 14.3 13.95

TMS320F28069UPZPS PZP HTQFP 100 90 6 X 15 150 315 135.9 7620 15.4 20.3 21

TMS320F28069UPZT PZ LQFP 100 90 6 x 15 150 315 135.9 7620 20.3 15.4 15.4

Pack Materials-Page 4

Hr WW— 76 100 25 P 12,00TVP 44 %:§g so % so , E 1,35 J W Sea 7 1,60 MAX {5‘ TEXAS INSTRUMENTS POST OFFICE BOX 655303 - DALLAS TEXAS

MECHANICAL DATA

MTQF013A – OCTOBER 1994 – REVISED DECEMBER 1996

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

PZ (S-PQFP-G100) PLASTIC QUAD FLATPACK

4040149/B 11/96

26 0,13 NOM

Gage Plane

0,25

0,45

0,75

0,05 MIN

0,27

12,00 TYP

0,17

100

15,80

16,20

13,80

1,35

1,45

1,60 MAX

14,20

0°–7°

Seating Plane

0,08

0,50 M

0,08

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Falls within JEDEC MS-026

LAND PATTERN DATA PZ (SePQFPeGiOO) PLASTlc QUAD FLAT PACK Exampie Board Layout stencil Openings based on a stencil thickness of .127mm (.005inch). HHﬂﬂﬂﬂﬂﬂﬂﬂﬂﬂﬂﬂﬂﬂgiiiﬂiMP- ﬁiiﬁiiiiﬂililﬂiiiﬂiﬂiiiiﬂﬂﬂiH i:i i:i =I * 100X0.25 i=i i:i i:i i=i i=i i:i i:i i=i i=i i:i i:i i=i i=i i:i i:i i=i i=i i:i i:i i=i i=i i:i i:i i=i i=i i:i i:i i=i i=i i:i i:i i=i i=i i:i i:i i=i i=i i:i i:i i=i i=i i:i i:i i=i i=i i:i i:i 15.2 =. =15; i:i i:i i=i i=i i:i i:i i=i i=i i:i i:i i=i i=i i:i i:i i=i i=i i:i i:i i=i i=i i:i i:i i=i i=i i:i i:i i=i i=i i:i i:i i=i i=i i:i i:i i=i i=i i:i i:i i=i i=i i:i i:i i=i i=i l:l = Example Solder Mask Opening (See Note D) Exampie Pad Geometry 4217869/A oa/lz NOTES: Ac Ali iinear dimensions are in miiiimeters. E. This drawing is subject to change without noticed ca Laser cutting apertures with trapezoidal walls and also roundina corners will offer better paste release. Customers should contact their board assembly site for stencil design recommendations. Exampie stencil design based on o 50% volumetric metal load solder paste. Refer to che7525 ior other Stencil recommendations, D. pusllomegs should contact their board fabrication site for solder mask tolerances between and around signa pa s. {I} TEXAS INSTRUMENTS www.li.com

MECHANICAL DATA 3‘ AJ‘C QUAD ﬂ A’EACK >4 >4 NOTES A A‘ New cuncnsmns mu m vaHw'wtcvs B This drawm; is subject to change when ruhce, c Body d’wewsmns do w 'vc‘ude mm ﬂcsh or prams‘mn D 'mm 3:: on We boar: {star to {serum Li'wef, PowerP 1m; package ‘5 deswgned to be sc‘dered k) a :r TwerrvaHy [H‘unced =ackage, Texcs \nstmments awe Nu SLMADOZ (or mfarrruhar regurqu rcconmcndcd buurd mm TMs ducm'wnt m uvuﬂob‘c UL www: com s See me uccmanm mm H the Jroud mm mm ‘cr cams reqardv‘q he emsea warm pad fecmres and mmenmns F m: MM “LDLC M57025 PowerPAD is a tradgmark 0! Texas Instruments. {I} TEXAS INSTRUMENTS www.1i.com

THERMAL PAD MECHANICAL DATA PFP (S—PQFP—GBO) PowerPADw PLASTlC QUAD FLATPACK THERMAL lNFORMATlON This PowerPAprackage incorporates an exposed thermal pad that is designed to be attached to a printed circuit board (PCB), The thermal pad must be soldered directly to the PCB. After soldering, the PCB can be used as a heatsink. In addition. through the use of thermal vias. the thermal pad can be attached directly to the appropriate copper plane shown in the electrical schematic for the device, or alternatively, can be attached to a special heatsink structure designed into the PCB, This design optimizes the heat transfer from the integrated circuit (lC). For additional information on the PowerPAD package and how to take advantage of its heat dissipating abilities, refer to Technical Brief, PawerPAD Thermally Enhanced Package, Texas lnstruments Literature Na. SLMAOOZ and Application Brief, PowerPAD Made Easy, Texas lnstruments Literature Nod SLMAOO4. Both documents are available at wwwtticom. The exposed thermal pad dimensions for this package are shown in the following illustration. 50 M & 0.75 MAX. 4 PLACES 0.47 MAX. 4 PLACES Si 40 Exposed Thermal Pad 6‘90 6J0 2| m 5.90 Tap Wew Exposed Thermal Pad Dimensions 4206327-22/P 05/14 NOTE: All linear dimensions are in millimeters A Tie strap features may not be present PawerPAD is a trademark at Texas Instruments ﬂ; TEXAS INSTRUMENTS www.|i.com

LAND PATTERN DATA PFP (SiPQFPicBO) PowerPADW PLASTUC QUAD FLATPACK Exampte Baurd Layout Stenc'tt Operjtngs Vt'a pattern and cupper area under satder musk Based 0” a sterett‘thtckness may vary depend'tna an tayodt canatrat‘nts of 1253mm (005W) Sctder Musk Over Cepper Reference tubte betow for other sutder stenct't thtcknesses 05 8CXU,5 0,5 UUUUUUUUUUU HHHHHHTUUT—r QUEQUUHJHUUU HUHUHPV g ///////////// g E E g % % g : : |='/ /‘='estoot4 '2' Y :1“ E % % E g a E %/.° ,, e ,, //é E Z X 2 g ,é/////// 7/? :- = g l] F IUI] UHHHHHHH [IIUUIHI] UH (sEz'szJ’adDr '" “A (See Note E) SD‘LEEiQEEESENW S:::::};:::5:“ Sotder 33:0" Opertt'ng7y71 Exampte Pad Geometry AH Around 420854478/6 02/16 NOTES. A” Um, WWW m m ”UH-Ni” PawerPAD Us a trademark at Texas Unstruments rnrs drawtng t5 saaUeat ta cnanae wrtnoat nnttce Customers snaatd ptace a nate an tne etrctttt board taartcatrar druwtnq nat ta atter tne center satder musk dettned pad. Th'ts package Us des'tgrred to be Satdered to a thermat pad on the board Refer tn Teehntmt Er'tef, inerPad Thermutty Ennanced Package, Texas Unstruments Ltteratdre Na, SLMAODZ. SLMAOM. and atsa tne =radact Data sneets for specrrtc tnermat trtforrnaitort, VUO reaatrements, and recommended board tayout rnese documents are avattabte at wwwtrcam Pubtteutton tpcesmenst ts recommended tar at:ernate destqns Laser cutitrtq apertures wrtn trapezardat watts and atsa roundtng earners th atter better paste retease Customers snaatd cuntuct tnerr aaard ussembty stte tar stenat destqr recummenduttuns Exampte stencrt destgn based on a 50% vntumetrtc metut Uuud sotder paste, Rater :0 UFCi7525 for other stenet't reeommendattons Customers shoutd cortiact their board fobr'tcattort stte for sotder mask totemnees between and crowd st'qrat pads *Wm

www.ti.com

F T“ 1 20 L7 9.50 TVP 44 12,20 11,30 5° 14,20 13,30 5° 7 E I 35 I J L 1,60 MAX {5‘ TEXAS INSTRUMENTS POST omca BOX 055303 - DALLAS T

MECHANICAL DATA

MTQF010A – JANUARY 1995 – REVISED DECEMBER 1996

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

PN (S-PQFP-G80) PLASTIC QUAD FLATPACK

4040135 /B 11/96

0,17

0,27

0,13 NOM

0,25

0,45

0,75

0,05 MIN

Seating Plane

Gage Plane

13,80

14,20

12,20

9,50 TYP

11,80

1,45

1,35

1,60 MAX 0,08

0,50 M

0,08

0°–7°

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Falls within JEDEC MS-026

MECHANICAL DATA POWEV’DAD‘ F‘ AS’C QLAT‘ TF‘ACK >4 >4 NO’ES' AH Hnec' dimensmrs c'e m m'\\me(er5 A B Th3 drawer ‘5 same. ,a enanae wdraa: Home, a D Body dimensmns do nut inc‘ude mom ﬂcsh Dr Home: 0" Tm: package ‘5 deswgned to 32 sa‘dered :0 a hernu‘ aaa an We buurc Refer (a Techmcc Enea PawerPud Thermdy [nnanaed Package, Texas \rs\rumen:s ,xteram'e No SLMAOOQ fur \rfcrmchun regc'd'mg recnmmended beard mom. T'Hs document ‘5 amaze at www :1 cam See We uddwhuru‘ ﬁgure m the Produc! Dal: Sheet fur :ekms regurdmg (he expused (herma‘ pad feutnres 21d dwmers'uns FONS whm aEDEC M57026 ﬁr“ PowerPAD is a trademalk olTexas \nstmmenls. {if TEXAS INSTRUMENTS www.ci.com

THERMAL PAD MECHANICAL DATA PZP (S—PQFP—GTOO) F’owerF’ADTM PLASTlC QUAD FLATPACK THERMAL INFORMATION This PowerPAD'”package incorporates an exposed thermal pad that is designed to be attached to a printed circuit board (PCB). The thermal pad must be soldered directly to the PCB. After soldering. the PCB can be used as a heatsink. In addition, through the use of thermal vias, the thermal pad can be attached directly to the appropriate copper plane shown in the electrical schematic for the device, or alternatively. can be attached to a special heatsink structure designed into the PCB. This design optimizes the heat transfer from the integrated circuit (lC). For additional information on the PowerPAD package and how to take advantage of its heat dissipating abilities, refer to Technical Brief, PowerPAD Thermally Enhanced Package, Texas Instruments Literature Not SLMAOOZ and Application Brief, PawerPAD Made Easy, Texas instruments Literature No. SLMAOOA. Eoth documents are available at www.ti.com. The exposed thermal pad dimensions for this package are shown in the following illustration. 75 51 50 osed Thermal Pad 0 75 w. A 100 26 7.70 5,90 Top Wew Exposed Thermal Pad Dimensions 4206333s8/L 05/14 NOTE: A, All lineor dimensions are in millimeters A Tie strap features may not be present. PowerPAD is i trademark 0119an llISIVuﬂIEMS {if TEXAS INSTRUMENTS wwwxi .com

IMPORTANT NOTICE AND DISCLAIMER

TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE

DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”

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IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD

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These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate

TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable

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These resources are subject to change without notice. TI grants you permission to use these resources only for development of an

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TMS320F2806x Datasheet by Texas Instruments

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