PPTC zeptoSMDC Series DS Prelim~ Datasheet

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POLYSWITCH®
Surface Mount > zeptoSMDC
© 2020 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/04/20
Littelfuse zeptoSMDC Series PPTC is developed for
overcurrent and overtemperature protection at low-cost in
mobile application components. It works as a ‘fail-safe’ to
protect battery management ICs and fuel gauges.
Description
Features
Benefits
Applications
• Maximum electrical
rating: 13 VDC
• Short circuit current:
82~200mA
• Small footprint 0201 size
• RoHS compliant
• ISO/TS 16949 certified
• Resettable
• Save space in PCBs due
to small footprint
• Mobile phone
• Wearable device
• Lithium battery
management
Electrical Characteristics
Part Number
Initial Resistance
Ohms @ 25°C VMAX
2
(Vdc)
IMAX
3
(mA)
Trip
Temperature
°C
TYP
Hold
Current 4
(mA)
@ 25°C
Time to Trip 5Post Process
Resistance 6
Min 1Max Current
(mA)
Time
(ms)
Max
ohms
@ -20°C
Min
ohms
@ 60°C
Max
zeptoSMDC0011F 10 80 13 82 125 11 80 20 68 290
zeptoSMDC0015F 10 60 13 200 125 15 80 20 28 150
PPTC zeptoSMDC Series
Notes:
1. R min = Minimum resistance of device in initial (un-soldered) state
2. Vmax = Maximum voltage device can withstand without damage at rated current (Imax)
3. Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax)
4. Ihold = Hold current: maximum current device will pass without tripping in 25°C still air. Values specified using PCB’s with 0.004” x 1.0 ounce copper traces
5. Time to trip values specified using PCB’s with 0.004” x 1.0 ounce copper traces
6. With LOCTITE ECCOBOND UF 3915, curing condition: 140°C/20mins, resistance is measured 12 hours post coating curing process
PRELIMINARY
POLYSWITCH®
Surface Mount > zeptoSMDC
© 2020 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/04/20
Soldering Parameters
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
P
reheat
Ramp-up
R
amp-up
Ramp-down
R
amp-d
o
• All temperature refer to topside of the package, measured on the package body surface.
• If reflow temperature exceeds the recommended profile, devices may not meet
the performance requirements.
• Recommended reflow methods:IR, vapor phase oven, hot air oven.
• Customer should validate that the solder paste amount and reflow recommendations
to meet its application
• Recommended maximum paste thickness is 0.25 mm (0.010 inch).
• Devices can be cleaned using standard industry methods and aqueous solvents.
• Devices can be reworked using the standard industry practices (avoid contact to
the device).
Environmental Specifications Physical Specifications
Profile Feature Pb-free assembly
Average Ramp-Up Rate (Liquidus Temp (TL)
to peak
1~3ºC/second
max.
Preheat
Temperature Min. (Tsmin)130ºC
Temperature Max. (Tsmax)180ºC
Time Min. to Max. (Ts) 90-110 seconds
Tsmax to TL Ramp-up Rate ≤2ºC/seconds max.
Reflow
Temperature (TL) (Liquidus) 217ºC
Time (tL)60~70 seconds
Peak Temperature (TP)240ºC
Time within 3ºC of actual Peak Temperature (tP)35 seconds
Ramp-Down Rate 2~4ºC/seconds
Time 25ºC to Peak Temperature (TP)300 seconds max.
Operating Temperature -20°C to 60°C
Passive Aging +85°C, 1000 hours
-25% typical resistance change
Humidity Aging +65°C, 90% R.H.,100 hours
-/+15% typical resistance change
Thermal Shock
MIL–STD–202, Method 107G
-33% typical resistance change
-40°C to +85°C (20 Times)
Vibration MIL–STD–202, Method 204,
Condition A No change
Moisture Sensitivity Level Level 2a, J–STD–020
Terminal Materials Solder-Plated Copper
(Solder Material: NiAu)
Lead Solderability Meets EIA Specification RS186-9E,
ANSI/J- STD-002B, Test S
PRELIMINARY
% L' telluse’ Wampum \ Answusmllumd Ma\ Mm Mm Max 040 0,40 0,50 0 10 (0.015) (0.016) (0 020) (0.000 7 0,40 0,40 0,50 010 (0.025) (0.016) (0.016) (0 020) (0.000 Recc m m n ed Pa: Dimension A Dlmen (Nam! 0.45 (0 Tape & Ree‘ ON 5 MIN Mmlmum Drgder Quanmy F50057000 15. 000 15,000 F50067000 15,000 15,000 zepto SMDc 0011 F 0201 SIZE SERIES J SURFACE MOUNT DEVICE 7 HOLD CURRENT 11mA — LEAD-FREE
POLYSWITCH®
Surface Mount > zeptoSMDC
© 2020 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/04/20
Packaging
Solder Pad LayoutPhysical Dimension
A
C
B
D
Part Number A B C D
Min Max Min Max Min Max Min Max
zeptoSMDC0011F 0.55
(0.022)
0.65
(0.026) --- 0.40
(0.016)
0.40
(0.016)
0.50
(0.020)
0.10
(0.004)
0.25
(0.010)
zeptoSMDC0015F 0.55
(0.022)
0.65
(0.026) --- 0.40
(0.016)
0.40
(0.016)
0.50
(0.020)
0.10
(0.004)
0.25
(0.010)
Part Number Ordering Tape & Reel
Quantity
Minimum
Orgder Quantity
Recommneded Pad Layout Figures [mm(in)]
Dimension A
(Nom)
Dimension B
(Nom)
Dimension C
(Nom)
zeptoSMDC0011F RF5005-000 15,000 15,000 0.45
(0.0178)
0.325
(0.013)
0.250
(0.010)
zeptoSMDC0015F RF5006-000 15,000 15,000 0.45
(0.0178)
0.325
(0.013)
0.250
(0.010)
A
BB
C
Part Numbering System Warning
zepto SMDC 0011 F
0201 SIZE SERIES
HOLD CURRENT 11mA
SURFACE MOUNT DEVICE
LEAD-FREE
• Electrical performance of the device can differ according
to installation conditions. Users should independently
evaluate the suitability of the device under the actual
application conditions.
• Operation beyond maximum ratings may result in
device damage.
• Exposure to silicon-based oils, solvents, electrolytes,
acids, or similar materials can adversely affect device
performance.
• The device undergoes thermal expansion during fault
conditions. It should be provided with adequate space
to allow expansion and should be protected against
mechanical stress.
• Consult with Littelfuse if the device will experience
thermal process other than reflow onto PCB board, such
as molding or hand soldering.
PRELIMINARY
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POLYSWITCH®
Surface Mount > zeptoSMDC
© 2020 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/04/20
Tape and Reel Specifications
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the
suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used
in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
2±0.05
(P
1
)
0.53±0.03
(A
0)
8±0.1
(W)
3.5±0.05
(F)
2±0.05
(P2)
4±0.1
(P0)
40±0.1
(10xP0)
0.42±0.03
(T)
Ø1.55±0.05
(D0)
1.75±0.05
(E)
0.70±0.03
(B0)
ØA ØN
W2
Front View ESD Logo
W1
(Measure at Hub)
Standard Pack Quantity: 15,000 pcs
Minimum Order Quantity: 15,000 pcs
All dimensions in mm
W8 ± 0.1
P04 ± 0.1
P12 ± 0.05
P22 ± 0.05
A00.53 ± 0.03
B00.70 ± 0.03
D01.55 ± 0.05
F3.5 ± 0.05
E1.75 ± 0.05
T0.42 ± 0.03
A178.0 ± 1.0
N 54.0 ± 0.5
W19.5 ± 0.5
W2 max 15.0
PRELIMINARY