CC06FA Datasheet

BUSSMANN SERIES @970“ EEK-N Fuwen'ng Business Wurldwide
Technical Data 11003 Effective November 2019
Product features
• AEC-Q200 qualified
• 0603 (1608 metric) compact design utilizes
less board space
• Rapid interruption of excessive current
• Compatible with reflow and wave solder
• Rugged ceramic and glass construction
• Excellent environmental integrity
• One time positive disconnect
• High breaking capacity up to 63 V
• Moisture sensitivity level (MSL) :1
Applications
Automotive
• Battery management systems (BMS)
• Central body control module
• Doors, window lift and seat control
• Digital instrument cluster
• In-vehicle infotainment (IVI) and navigation
• Electric pumps, motor control and auxiliaries
• Powertrain control module (PCU)/engine
control unit (ECU)
• Transmission control unit (TCU)
Agency information
• UL Recognized File: File E19180
• AEC-Q200 qualifed
Ordering
• Use ordering codes (see page 3 for details)
Packaging sufixes
• -TR (5,000 parts in paper tape on a 178 mm (7”)
reel)
CC06FA
Automotive grade fast-acting chip fuse
Pb
HALOGEN
HF
FREE
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2
Technical Data 110 0 3
Effective November 2019
CC06FA
Automotive grade fast-acting chip fuse
www.eaton.com/electronics
Electrical characteristics
Amp Rating % of Amp Rating Opening Time
500 mA – 1.5 A 100% 4 hours minimum
500 mA – 1.5 A 200% 60 seconds maximum
Product specifications
Part Number5Current rating
(A)
Voltage rating
(Vdc)
Interrupting
rating¹
(A)
Typical DC cold
resistance² (Ω)
Typical pre-arcing³
I²t (A2s) Typical voltage
drop (V) Part
marking
CC06FA500mA 0.5 63 50 1.025 0.0019 0.60 F
CC06FA750mA 0.75 63 50 0.510 0.003 0.50 G
CC06FA1A 1 63 50 0.150 0.007 0.211 H
CC06FA1.25A 1.25 63 50 0.132 0.008 0.201 J
CC06FA1.5A 1.5 63 50 0.086 0.0319 0.138 K
1. DC interrupting rating measured at rated voltage, time constant less than 50 microseconds, battery source
2. DC cold resistance measured at <10% of rated current
3. Typical pre-arcing I²t measured with a battery bank at rated dc voltage, 10x-rated current, not to exceed IR, time constant of calibrated circuit less than 50 microsecond
4. Typical voltage drop measured at rated current after temperature stabilizes
5. Part Number Definition: CC06FAxxx-R
CC06FA = Product code and size
xxx - Ampere rating (mA or A)
Dimensions–mm
in
Recommended pad layout
Fuse to be installed with ceramic side up (white/marking)
14 ‘2 36 36 34 32 ~55 ~35 .15 25 45 as 105 125
3
Technical Data 110 0 3
Effective November 2019
CC06FA
Automotive grade fast-acting chip fuse
www.eaton.com/electronics
Temperature derating curve
Environmental data
Operating temperature: -55 °C to +125 °C (with derating)
Storage temperature (component): -55 °C to +125 °C
Life test: MIL-STD-202, Method 108A, except circulating air environment at +125 °C ±2 °C, apply 60% rated current for 1000 hours
Load humidity test: MIL-STD-202, Method 103B except: environmental chamber 85%+2% relative humidity at +85 °C ±2 °C, 10% of rated dc current,
at any voltage less than or equal to rated voltage for 1000 hours
Terminal strength test: Force of 1.8 kg for 60 seconds
TBoard flex test: Downward force is applied to cause a 2 mm deflection for 1 minute (no physical evidence of mechanical or physical damage, change
in resistance < 5%)
Thermal shock test: MIL-STD-202, Method 107D, -55 °C to +125 °C, 200 cycles
Mechanical shock test: MIL-STD-202, Method 213 condition C, 100 g’s half-sine for 6 seconds
High frequency vibration test: MIL-STD-202, Method 204, 5 g’s for 20 minutes, 12 cycles each of 3 orientations ,10 to 2000 Hz
Resistance to solvents test: MIL-STD-202, Method 215A
High temperature exposure: 1000 hours at +125 °C unpowered
Resistance to solder heat: MIL-STD-202 Method 210 condition B
Solderability: ANSI/J-STD-002,
Dip and look test: Test B
Wetting balance test: Test F
Resistance to dissolution of metalization test: Test D
Ordering codes
The ordering code is the part number replacing the “.” with a “-” plus adding the packaging suffix.
Packaging suffix
-TR (5,000 parts in paper tape on a 178 mm (7”) reel)
Part Number
Ordering code
-TR option
CC06FA500mA CC06FA500mA-TR
CC06FA750mA CC06FA750mA-TR
CC06FA1A CC06FA1A-TR
CC06FA1.25A CC06FA1-25A-TR
CC06FA1.5A CC06FA1-5A-TR
Derating factor
Ambient temperature (°C)
4
Technical Data 110 0 3
Effective November 2019
CC06FA
Automotive grade fast-acting chip fuse
www.eaton.com/electronics
Wave solder profile
Reference EN 61760-1:2006
Profile feature Standard SnPb solder Lead (Pb) free solder
Preheat • Temperature min. (Tsmin)100 °C 100 °C
• Temperature typ. (Tstyp)120 °C 120 °C
• Temperature max. (Tsmax)130 °C 130 °C
• Time (Tsmin to Tsmax) (ts)70 seconds 70 seconds
D preheat to max Temperature 150 °C max. 150 °C max.
Peak temperature (TP)* 235 °C – 260 °C 250 °C – 260 °C
Time at peak temperature (tp)10 seconds max
5 seconds max each wave
10 seconds max
5 seconds max each wave
Ramp-down rate ~ 2 K/s min
~3.5 K/s typ
~5 K/s max
~ 2 K/s min
~3.5 K/s typ
~5 K/s max
Time 25°C to 25°C 4 minutes 4 minutes
Manual solder
+350 °C (4-5 seconds by soldering iron), generally manual/hand soldering is not recommended
Temperature
Time
T
smin
Tsmax
Tstyp
Tp
tp
First Wave Second Wave
Preheat area Cool down area
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Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
Eaton.com/electronics
© 2019 Eaton
All Rights Reserved
Printed in USA
Publication No. 11003 BU-MC19130
November 2019
Technical Data 110 0 3
Effective November 2019
CC06FA
Automotive grade fast-acting chip fuse
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used
in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Solder reflow profile
Table 1 - Standard SnPb solder (Tc)
Package
thickness
Volume
mm3
<350
Volume
mm3
≥350
<2.5 mm) 235 °C 220 °C
≥2.5 mm 220 °C 220 °C
Table 2 - Lead (Pb) free solder (Tc)
Package
thickness
Volume
mm3
<350
Volume
mm3
350 - 2000
Volume
mm3
>2000
<1.6 mm 260 °C 260 °C 260 °C
1.6 – 2.5 mm 260 °C 250 °C 245 °C
>2.5 mm 250 °C 245 °C 245 °C
Temperature
t
tP
ts
TC -5°C
Time 25°C to Peak Time
25
°C
Tsmin
Tsmax
TL
TP
Preheat
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
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Reference J-STD-020
Profile feature Standard SnPb solder Lead (Pb) free solder
Preheat and soak • Temperature min. (Tsmin)100 °C 150 °C
• Temperature max. (Tsmax)150 °C 200 °C
• Time (Tsmin to Tsmax) (ts)60-120 seconds 60-120 seconds
Ramp up rate TL to Tp3 °C/ second max. 3 °C/ second max.
Liquidous temperature (Tl)
Time (tL) maintained above TL
183 °C
60-150 seconds
217 °C
60-150 seconds
Peak package body temperature (TP)* Table 1 Table 2
Time (tp)* within 5 °C of the specified classification temperature (Tc)20 seconds* 30 seconds*
Ramp-down rate (Tp to TL)6 °C/ second max. 6 °C/ second max.
Time 25 °C to peak temperature 6 minutes max. 8 minutes max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.