LQW32FTyyyy0HL Spec Datasheet by Murata Electronics

SgecN JELF243A 9147E 1 eference Only Pan va‘ue TD‘erance resistance Rated currem (mA) lrequency mdudance Amblenl 85“C Ammem 1 05%: Amblenl 125%: Rated Currenl Ramd Eurrent 31890 Rated Current at 105% Rated Current 311257) as —, Dpevatmg Temperalurel'C7 105 125
Spec No.: JELF243A_9147E-01 P1/9
MURATA MFG CO., LTD
CHIP COILS (CHIP INDUCTORS) LQW32FT□□□□0H□
Murata Standard Reference Specification [AEC-Q200]
1. Scope
This reference specification applies to chip coils (chip inductors) LQW32FT_0H series for automotive electronics based on
AEC-Q200.
2. Part Numbering
(Ex.)
LQ W 32 F T 470 M 0 H L
Product
ID
Structure Dimension
(L × W)
Application
and
characteristic
Category Inductance Tolerance Performance Category
(For automotive)
Packaging
L: taping
*B: bulk
*B: Bulk packing is also available (taping condition: however, products without reels are put in plastic bags).
3. Part Number and Rating
Operating temperature range
-40°C to +125°C
Storage temperature range
-40°C to +125°C
Customer
Part
number
Murata
Part number
Inductance
DC
resistance
(Ω) Max.
Self-resonant
frequency
(MHz min.)
Rated current
(mA)
ESD
Rank
≥25 kV
(AD)
Nominal
value
(μH)
(@1 MHz)
Tolerance
(%)
Based on
inductance
change
*1
Based on temperature rise
*2
Ambient
temperature
85°C
Ambient
temperature
105°C
Ambient
temperature
125°C
LQW32FT2R2M0HL
2.2 ±20 0.19 200 1000 1000 880 520 6
LQW32FT2R7M0HL
2.7 ±20 0.22 200 975 975 860 510 6
LQW32FT3R3M0HL
3.3 ±20 0.24 150 950 950 840 500 6
LQW32FT4R7M0HL
4.7 ±20 0.28 100 850 850 720 400 6
LQW32FT100M0HL
10 ±20 0.4 100 500 700 620 360 6
LQW32FT220M0HL
22 ±20 0.62 50 400 550 500 280 6
LQW32FT470M0HL
47 ±20 0.9 30 300 500 300 100 6
*1 When rated current is applied to the products, inductance will be within ±30% of nominal inductance value.
*2 Keep the temperature (ambient temperature plus self-generation of heat) under 125°C.
When rated current is applied to the products, temperature rise caused by self-generated heat shall be limited to 40°C max.
Rated current is derated as shown in the figure below depending on the operating temperature range.
Spec No; JELF243A 9147501 Reference Only 0.25mm 2 5:02 0.58:1“ El: E‘Ecuode {In mm)
Spec No.: JELF243A_9147E-01 P2/9
MURATA MFG CO., LTD
4. Testing Conditions
Unless otherwise specified Temperature: ordinary temperature (15°C to 35°C)
Humidity: ordinary humidity [25% to 85% (RH)]
In case of doubt Temperature: 20°C±2°C
Humidity: 60% to 70% (RH)
Atmospheric pressure: 86 kPa to 106 kPa
5. Appearance and Dimensions
Unit mass (typical value): 0.073 g
6. Marking
No marking.
7. Electrical Performance
No. Item Specification Test method
7.1 Inductance Meet chapter 3 ratings. Measuring equipment: Keysight E4991A or the
equivalent
Measuring frequency: 1 MHz
7.2 DC resistance Meet chapter 3 ratings. Measuring equipment: digital multimeter
7.3 Self-resonant
frequency
Meet chapter 3 ratings. Measuring equipment: Keysight N5230A or the
equivalent
8. AEC-Q200 Requirement
8.1 Performance [based on table 5 for magnetics (inductors/transformer) AEC-Q200 Rev. D issued June 1,
2010]
AEC-Q200 Murata specification/deviation
No. Stress Test m e t hod
3 High
temperature
exposure
1000 h at 125°C
Set for 24 h at room condition, then
measured.
Meet table A after testing.
Table A
Appearance No damage
Inductance change rate (at 1 MHz) Within ±10%
4 Temperature
cycling
1000 cycles
-40°C to +125°C
Set for 24 h at room condition, then
measured.
Meet table A after testing.
7 Biased humidity 1000 h at 85°C, 85% (RH). Unpowered.
Set for 24 h at room condition, then
measured.
Meet table B after testing.
Table B
Appearance No damage
Inductance change rate (at 1 MHz) Within ±20%
Spec No; JELF243A 9147E701 Reference only 4.010.] 4.0101 21.519“ x’ i g _ ‘3 % k- Dwedlon 0! Feed
Spec No.: JELF243A_9147E-01 P3/9
MURATA MFG CO., LTD
AEC-Q200 Murata specification/deviation
No. Stress Test m e t hod
8 Operational life Apply rated current (at 125°C)
125°C 1000 h
Set for 24 h at room condition, then
measured.
Meet table B after testing.
9 External visual Visual inspection No abnormalities
10 Physical
dimension
Meet chapter 5, "Appearance and
Dimensions".
No defects
12 Resistance to
solvents
Per MIL-STD-202
Method 215
Not applicable
13 Mechanical
shock
Per MIL-STD-202
Method 213
Condition C:
100 g’s (0.98 N), 6 ms, half sine, 12.3 ft/s
Meet table A after testing.
14 Vibration 5 g's (0.049 N) for 20 min, 12 cycles each
of 3 orientations
Test from 10 Hz to 2000 Hz
Meet table A after testing.
15 Resistance to
soldering heat
No-heating
Solder temperature
260°C±5°C
Immersion time 10 s
Pre-heating: 150°C to 180°C/90 s±30 s
Meet table A after testing.
17 ESD Per AEC-Q200-002 ESD rank: Refer to chapter 3 ratings.
Meet table A after testing.
18 Solderbility Per J-STD-002 Method b: not applicable
95% of the terminations is to be soldered (except exposed
wire).
19 Electrical
characterization
Measured: inductance No defects
20 Flammability Per UL-94 Not applicable
21 Board flex Epoxy-PCB (1.6 mm)
Deflection 2 mm (min.)
Holding time 60 s
Meet table C after testing.
Table C
Appearance No damage
DC resistance change rate Within ±10%
22 Terminal
strength
Per AEC-Q200-006
A force of 17.7 N for 60 s
No defect
9. Specification of Packaging
9.1 Appearance and dimensions of tape (12 mm width/plastic tape)
A (2.9)
B (3.6)
t (2.7)
t' (0.3)
(in mm)
Spec N ELF243A 9147 1 Reference Only PIE _ Traflev 217105 160mm. :9 o w s . ,_ +| 130,0 , 170:1.4 , msofgo Lnadcv V label V Igomin ‘ 2I0mm Fromm smragepan Emply Tape CovevTape m 10:0 2 Dnecuon of Feed ‘ 1221.0:05 (in mm)
Spec No.: JELF243A_9147E-01 P4/9
MURATA MFG CO., LTD
9.2 Taping specifications
Packing quantity
(Standard quantity)
1500 pcs/reel
Packing method The products are placed in embossed cavities of a plastic tape and sealed by a cover tape.
Feed hole position The feed holes on the plastic tape are on the right side when the cover tape is pulled toward the user.
Joint The plastic tape and the cover tape are seamless.
Number of missing
products
Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
9.3 Break down force of tape
Break down force of cover tape 10 N min.
9.4 Peeling off force of cover tape
Speed of peeling off 300 mm/min
Peeling off force 0.2 N to 0.7 N (The lower limit is for typical value.)
9.5 Dimensions of leader section, trailer section and reel
A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader
section is further provided with an area consisting only of the cover tape. (See the diagram below.)
9.6 Marking for reel
Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.
*1 Expression of inspection No.:
□□ ○○○○ 
(1) (2) (3)
(1) Factory code
(2) Date
First digit: year/last digit of year
Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D
Third, Fourth digit: day
(3) Serial No.
*2 Expression of RoHS marking:
ROHS- Y ()
(1) (2)
(1) RoHS regulation conformity
(2) Murata classification number
9.7 Marking on outer box (corrugated box)
Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.
165 to 180 degree FCover tape
Plastic tape
Sgec No.: JELF243A 9147501 Reference Only Land Solder RSSISK
Spec No.: JELF243A_9147E-01 P5/9
MURATA MFG CO., LTD
9.8 Specification of outer box
Dimensions of outer box
(mm) Standard reel quantity
in outer box (reel)
W D H
186 186 93 4
* Above outer box size is typical. It depends on a
quantity of an order.
10. Caution
10.1 Restricted applications
Please contact us before using our products for the applications listed below which require especially high reliability for the
prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment (6) Disaster/crime prevention equipment
(2) Aerospace equipment (7) Traffic signal equipment
(3) Undersea equipment (8) Transportation equipment (trains, ships, etc.)
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment (10) Applications of similar complexity and/or reliability requirements
to the applications listed in the above
10.2 Precautions on rating
Do not use the products in excess of their rated current. Doing so may cause the product to generate heat, resulting in short
circuit between wires, wire breakage, or melted solder, which may cause dropping of parts.
10.3 Fail-safe
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the
abnormal function or the failure of our product.
11. Precautions for Use
This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other mounting
method, for example, using a conductive adhesive, please consult us beforehand.
11.1 Land dimensions
The following diagram shows the recommended land dimensions for reflow soldering.
The land dimensions are designed in consideration of electrical characteristics and mountability. Use of other land
dimensions may preclude achievement of performance. In some cases, it may result in poor solderability, including positional
shift. If you use other land pattern, consider it adequately.
a 2.2
b 4.0
c 2.5
(in mm)
W
D
Label
H
Spec No; JELF243A 9147E701 Reference Only
Spec No.: JELF243A_9147E-01 P6/9
MURATA MFG CO., LTD
Metal mask open area pattern
Metal mask
thickness
0.10 mm 0.15 mm
a 2.2 2.2
c 2.5 2.0
d 0.9 0.9
(in mm)
11.2 Flux and solder used
Flux • Use a rosin-based flux that includes an activator with a chlorine conversion value of 0.06(wt)% to 0.1(wt)%.
• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).
• Do not use a water-soluble flux.
Solder • Use Sn-3.0Ag-0.5Cu solder.
• Standard thickness of solder paste: 150 μm
If you want to use a flux other than the above, please consult our technical department.
11.3 Soldering conditions (reflow)
• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C
max.
Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 150°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product
quality.
Standard profile Limit profile
Pre-heating 150°C to 180°C/90 s±30 s 150°C to 180°C/90 s±30 s
Heating Above 220°C/30 s to 60 s Above 230°C/60 s max.
Peak temperature 245°C±3°C 260°C/10 s
Number of reflow cycles 2 times 2 times
Limit Profile
Standard Profile
90s±30s
230℃
260℃
245℃±3℃
220℃
30s～60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
Spec No.: JELF243A 9147501 Reference Only Upper Limit JI/y/ \ T 1/3T5lST (T Thwckness of Electrode) \ m R9;qmmen¢able Comenls of measures Stress level /”"\/" "\ , ‘ Penaranon ‘ l \ ‘—\ .0000 (200001: [7 Jr. “3
Spec No.: JELF243A_9147E-01 P7/9
MURATA MFG CO., LTD
11.4 Reworking with soldering iron
The following requirements must be met to rework a soldered product using a soldering iron.
Item Requirement
Pre-heating 150°C/approx. 1 min
Tip temperature of soldering iron 350°C max.
Power consumption of soldering iron 80 W max.
Tip diameter of soldering iron ø3 mm max.
Soldering time 3 s (+1 s, -0 s)
Number of reworking operations 2 times max.
* Avoid a direct contact of the tip of the soldering iron with the product. Such a
direction contact may cause cracks in the ceramic body due to thermal shock.
11.5 Solder volume
Solder shall be used not to increase the volume too much.
An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of
mechanical or electrical performance.
11.6 Product's location
The following shall be considered when designing and laying out PCBs.
(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.
[Products direction]
Products shall be located in the sideways direction (length: a < b) to the mechanical stress.
(2) Components location on PCB separation
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible to reduce
stress.
Contents of measures
Stress level
(1) Turn the mounting direction of the component parallel to the
board separation surface.
A > D
*1
(2) Add slits in the board separation part.
A > B
(3) Keep the mounting position of the component away from the
board separation surface.
A > C
*1 A > D is valid when stress is added vertically to the perforation as with hand separation.
If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
〈
Poor example
〉〈
Good example
〉
b
a
Sgec No.: JELF243A 9147501 Refe re n ce 0 n ly @DZD-[l:l] Recommended Screw Hale
Spec No.: JELF243A_9147E-01 P8/9
MURATA MFG CO., LTD
(3) Mounting components near screw holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the
tightening of the screw.
Mount the component in a position as far away from the screw holes as possible.
11.7 Handling of substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate
when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
11.8 Cleaning
The product shall be cleaned under the following conditions.
(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C
max.
(2) Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken
solder joints. Before starting your production process, test your cleaning equipment / process to insure it does not degrade
this product.
(3) Cleaner
Alcohol-based cleaner: IPA
Aqueous agent: PINE ALPHA ST-100S
(4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water
adequately and completely dry it so that no cleaner is left.
* For other cleaning, consult our technical department.
11.9 Storage and transportation
Storage period Use the product within 12 months after delivery.
If you do not use the product for more than 12 months, check solderability before using it.
Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and humidity.
The recommended temperature range is -10°C to +40°C. The recommended relative humidity
range is 15% to 85%.
Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid, oxidizes the
electrode, resulting in poor solderability or corrosion of the coil wire of the product.
• Do not keep products in bulk packaging. Doing so may cause collision between the products or
between the products and other products, resulting in core chipping or wire breakage.
• Do not place the products directly on the floor; they should be placed on a palette so that they are
not affected by humidity or dust.
• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.
Transportation Excessive vibration and impact reduces the reliability of the products. Exercise caution when
handling the products.
11.10 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products.
A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some
operating condition may cause corrosion of wire of coil, leading to wire breakage.
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your
board.
Spec No.: JELF243A 9147501 Reference Only
Spec No.: JELF243A_9147E-01 P9/9
MURATA MFG CO., LTD
11.11 Handling of product
• Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the
winding portion to prevent the breaking of wire.
• Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.
11.12 Handling with mounting equipment
• With some types of mounting equipment, a support pin pushes up the product from the bottom of the base (paper) tape
when the product is sucked with the pick-up nozzle.
When using this type of equipment, detach the support pin to prevent the breaking of wire on the product.
12. Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to
your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our product
specifications or transact the approval sheet for product specifications before ordering.