CD4099B Types Datasheet by Texas Instruments

{5‘ TEXAS INSTRUMENTS CMOS’: 7 CD40993 Types 8-Bit Addressable Latch High-Voltage Types (20Volt Rating) I $040993 apit addussablu latch Is a seviahnpul. pugllII-oulpul name mix» to: ma! can {Mann a Vlrkly of functions. Data no insult-d m a pinion!" bi: ii: Ille ,Illch whenrthll hi1 is misused (I'w means oI inouls Al), Al, A2) avid‘when WRITE DISABLE is n 1 low level. When WRITE DISABLE is hlgll. data envy is Inhlb‘vted; however, all a ouxpms can be conlimouslv ma independent of WRITE DISABLE and address inputs. A musser RESET input I: alllllablu, Much resets all biutoa Iop'c 'n' ImI whun RESET and WRITE DISABLE m n ahigh ImL when RESET is u - high level, ind WRITE DISABLE Is at . law |evn1,[helnch am as a I-ol-s dImullipluanJM bk Ihlt is ad- dressed In In min «mm which follows me am Ins-ll} Mile III unlddvmd mu ave held to a logic '0' level. U 5".” 'm awn m rum“ n NM It- Features: - sum am Input - Anlve mull-l mum l Swim naktt up. I N I Mum Glut I Can lllnfliuu u dunnluploxu I sundudiud, wmmwiul Imam ehmiflia I 100% mud in quiescent cumntat 20 V - mximum Inga! wmmof 1 IA u 18 v (full puklgI-hmpflmn lanai), 100 IIA ll 18 V alfl 5°C , ’ ‘ I Nola mawln (full mmumwm my): I VnVDo-SVJVRIVDD --10V,2.5VnVDD- 15 v - 5v, Iov, Ind 15-v mmmlcnflnos l Mm: all "quit-mum «CJEDEG Tannin I slam-m Nu. m "sum-m swan an: In! Dewviptioll of '3' SC t was Dulcu" MAXIMUM RATqus, Anselm—Mum Vllun: nc SUPPLY-VOLIAGE RANGE. (van) vouwsmmnm Io v55 Tqmlml) INPUT VOLTAGE RANGE Au. INPUIs Dc INPUT CURRENT.ANV ONE INPUT POWER DIBSIPAYION PER PACKAGE (Pay Voluvssqnouoovc FOII‘A- mm m “2sz nEVIcE mssnrlon PER OUTPUT TRANSISTOR FOR TA - FULL gums-TEMPERATURE RANGE (All Rule-q. YypuL OPERATINGA‘IEMPERA'llRE RANGE (TA). sroRABE TEMPERATuRE RANGE (I...) LEAD TEMPERATURE (DURING BOLDERING)! Mdkhm I/Io : use Incl-41.59: DJDmmHmm under 1m max .. nomrmu Fly. 1— Loin diagram of Megan/mam” o! I «elm 3-231 mm m- mow-nu ”n. —.a nu: use-L: —' Functional Dilyam Applicatfans: I Mum-line decodm I AID mum" m— we. mu— 0- m— «:9 m— a n— - m — a n— .I vu— to RI VII —-Il- TERMINAL Mama" 5 n Mun-versus“: mvmlmw Fi'. 2 — mum new low rem! burn-m Munmhfick -n.5V In +zov -o.5v u: v“ «15v I 2100“ .. .. .soomw nem- Linn-my n Izmwpcbzoomw COMMERCIAL W05 Illfll VOLTAGE lCl
Copyright © 2003, Texas Instruments Incorporated
Data sheet acquired from Harris Semiconductor
SCHS066C− Revised October 2003
The CD4099B types are supplied in 16-lead
hermetic ceramic dual-in-line packages
(F3A suffix), 16-lead plastic dual-in-line
packages (E suffix), 16-lead small-outline
packages (M, M96, MT, and NSR suffixes),
and 16-lead thin shrink small-outline
packages (PW and PWR suffixes).
, CD40998 Types REMENDED OPERATING CONDITIONS It 7A = 25° C (Lin/08 0W muffled] MODE SELECTION For maximum Idilblllty, nominl/ spouting mm thou/Ii bl .Illlcfld to flu! opmv'on ADDRESSED UNADDRESSED Isa/my: mm: m rummm wn n urcu um CHARACTERIS‘I'IC 3“ v90 ”m“ umrs o 0 Follow: Du. Holds Pmious FIGV 15' MIN‘ MAX. (V) Sme 0 I Follows Dlu Ram to '0' 5 IV Vulu Rm : ”7:! TA = all Pic’hw 3 18 V (Activa High Bl-Chunnel Dtmultl- uaxen Tmpumun Rum) 1 0 Holds vainu: scale Minimum Pulse Width, tw s » zoo - 1 I React to W | Run! m '0~ Dm (D ID IUD — wD=WRITE DISABLE nxasszr 15 BO 5 400 ‘ - m Adams lo 200 ~— 7 w. 1 6 I25 — “’ 3d“— 5 'so - .. 3221‘; Rem G) 10 75 — u f— 15 50 _ In —t——k7 m Semp Tim, [5 5 1m — — — On: In WRITE DISABLE 10 50 _ uzu-u-n " w—' ‘5 35 _ m Fl]; 3 — Dlflm'fion of WHITE DISAHLEON film. Hnid Tima, (H 5 159 — Dun to WRITE DISABLE (D 10 75 - M l5 so — ' Civcted numnm rm: x. mm; mam-m1 on mash! mum «gum. Nm: In mum: m n. awn mac-alum: WRITE DIsAaLE 0N limo um «in». ma: WRITE DISABLE In . mm In." mm a. chum-1 nu an mm: chug lor «to mm um mu m uumd um:— “an A0, AL Ind A2... “mu“: m - mu. luv-1. m m: - "mail from hang-amuse (a. Fl'. 3). www.mu W mm Fly. 4 - Minimum ouamlow kink! mmrmlmnm' mmmsnm: mm: ‘vggl—v .5 Mm: Fig. 5—, nut-I avvut My" (scum; Fla. 5 — 4/0 comm-r Ina-mu mmrM-ncmtsm 3-232
$040995 Types rune ELEcYRIcAL CHARACTERISTICS commons 1.11.1113 AT 01ch1:5 15140511410555 1%) l cmumw A 19110 on 011115 5 V0 V1» V00 - (v) Iv) w, .55 .40 105 +125 M111. 1y... uh... ‘ 5 0111mm Devin: — 0,5 5 5 5 150 150 - 0.04 5 E 01mm, - 0,10 10 10 10 300 r 0.04 10 A § ‘39 M“ _ 0,15 15 20 20 500 — 0.04 211 " i - 0,20 20 100 100 3000 — 0,00 100 5 on...“ Low. 0.4 05 5 0.04 0.51 0.35 1 - g 150-1031102111 0.5 0,10 10 L6 1.5 0.9 2.5 — '01. in. _ m. 1...... 1,5 0,15 15 4.2 4 1.4 6.0 111A m, _ mum”, WW! W. I 0111mm High 4.0 0.5 5 -054 .051 4138 -1 — m,m,,,m 19mm) 2.5 05 5 2 -15 -1.15 -12 - Gamma“ 9.5 0.10 10 71.5 41.5 —0.9 -211 — "m °” _ 13.5 0,15 15 -4.2 —1 —2.4 -5 a — 01115111 Venue: - 05 5 0,05 - 0 0.05 LV'L‘E'; - 0.10 10 0.05 — o 0.05 m ' - 11.15 15 0,05 - n 0.05 1/ 11.11.1111 Vollap: - 0,5 5 1.95 4.95 s , - ”WW“: — 0.10 10 9.95 9.95 10 —‘ § V0“ "'"‘ — 0,15 15 14.95 14.95 15 — u, 11.11.11 Law 0545 _ 5 1,5 - — L5 3‘ g ““9” 1,9 - 10 :1 — — 3 _ .1 1. a n _. 5' v.._ Max. , 1.5 ”‘5 _ '5 . _ _ 4 autumn-“Inga! “ n > . . v "- x 1mm mgr. 0.5, 4.5 — 5 3.5 3.5 F,‘ ._ Typhl a!” 11m- § g Valium. 1,9 - 10 7 7 - - lawmmlnludmchm VI" ’4‘" 1.5.13.5 — 15 11 11 — — |npm oumm 7 . _ -5 Im “a. 0.18 18 50.1 20.1 .1 21 :10 ml MA 1' E a ‘. .1... mu“... .1. nus- Typlndwumonllmlvnlald mm mm mama". 1.1m. u... nut-nun 11.1...» RI” .. . “a, \\ N ix 1 004090511 .1 1 1 . DIMENSIONS AND PAD LAYOUT “,1 nz' “ 1x ' “ nu... mu «1.1—1. 0mm. in NM,” III in millimm Ind , . - - an 11-er m m m m 4W." . Fnlfl—Twrfllwmfvwmnluflann . Indiana. emu-mummy. mm 1117" mm. . 9”” ‘W' "'" 3-233
CD40993 Types DYNAMIC ELECTRICAL CHARACTERISTICS" TA ' 25° 5, CL ' 50M mun, 2,- 20!!» NL - 200m man's cmnmrzms‘nc :25" ”'15:: ‘Ll “5““: ”'55 uun-s FIGJS‘ tvl rvn MAX, Plopmion mm: «pm. 5 zoo 4m ‘PNL ® 10 75 ISO on. «1 0mm, 15 so we wan: mums 5 200 «on m Dumut. may @ m an can m 5,“ L I5 so no 5 I75 350 Run to 0mm, ® 10 an 150 A Wm, 15 55 no Mar-s: m Output 5 :25 :50 In", (D m lo!) 200 { I?" L 15 75 150 Tar-mien 7m. 'mL- 5 not: 200 (Anv mm) rm. :0 so mo m '5 an an Minimum mu. 5 mu m mam. xw (D In 50 ‘00 n5 um 15 no so 5 200 “70 Address no mo zoo m '5 55 125 5 75 754) Rm ® ID 50 75 m I 5 25 50 Minimum SGIVD 5 50 ‘00 Timz, ‘5 ® m 25 50 ru nan mwm'rs DISABLE I5 20 35 Minimum Hold 5 75 150 Tim. 5" (D ID an 75 m DantoWRIYE DISABLE 15 25 so Inc-n (Jemima. Cm Any Inpm 5 7.5 pF 'cmw mm m an... ins-mau- mum tin-inn any-n. m .7,“ F ,® W, a mu as.“ I \ ) (9 3-234 m 1an VIE .mn v‘. mm... ,_ Fin. n — anus-manum. Mt circuit. Vw IIIPIIV! ? gurus » .4? ; war! 5,, murmur-mum of mu «4...... Fig, 12— Inpulmm minimum 'nu um um Mum mm: mun‘uv. vo mu v... mm. mm mun-.5 mm “1 mm J, 5mm, ’3 uu-l u H; [3 —lnpu::umtuncirwll. . VII) ~49— Va HHF‘ no u: u ‘ 5. n ’ n u ' n mum ' Mn mm Fl]. 16— wmmmm—cu WMIMKW,
I TEXAS INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 14-Oct-2022
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
CD4099BE ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -55 to 125 CD4099BE Samples
CD4099BF ACTIVE CDIP J 16 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 CD4099BF Samples
CD4099BF3A ACTIVE CDIP J 16 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 CD4099BF3A Samples
CD4099BM ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4099BM Samples
CD4099BM96 ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4099BM Samples
CD4099BNSR ACTIVE SO NS 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4099B Samples
CD4099BPWR ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CM099B Samples
JM38510/17601BEA ACTIVE CDIP J 16 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 JM38510/
17601BEA Samples
M38510/17601BEA ACTIVE CDIP J 16 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 JM38510/
17601BEA Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 1
TEXAS INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 14-Oct-2022
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD4099B, CD4099B-MIL :
•Catalog : CD4099B
•Military : CD4099B-MIL
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Military - QML certified for Military and Defense Applications
Addendum-Page 2
I TEXAS INSTRUMENTS ‘3‘ V.'
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Aug-2022
TAPE AND REEL INFORMATION
Reel Width (W1)
REEL DIMENSIONS
A0
B0
K0
W
Dimension designed to accommodate the component length
Dimension designed to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers
Dimension designed to accommodate the component width
TAPE DIMENSIONS
K0 P1
B0 W
A0
Cavity
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Pocket Quadrants
Sprocket Holes
Q1 Q1Q2 Q2
Q3 Q3Q4 Q4 User Direction of Feed
P1
Reel
Diameter
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
CD4099BM96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
CD4099BNSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD4099BPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Aug-2022
W
L
H
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD4099BM96 SOIC D 16 2500 340.5 336.1 32.0
CD4099BNSR SO NS 16 2000 356.0 356.0 35.0
CD4099BPWR TSSOP PW 16 2000 356.0 356.0 35.0
Pack Materials-Page 2
I TEXAS INSTRUMENTS
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Aug-2022
TUBE
L - Tube length
T - Tube
height
W - Tube
width
B - Alignment groove width
*All dimensions are nominal
Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
CD4099BE N PDIP 16 25 506 13.97 11230 4.32
CD4099BE N PDIP 16 25 506 13.97 11230 4.32
CD4099BM D SOIC 16 40 507 8 3940 4.32
Pack Materials-Page 3
www.ti.com
PACKAGE OUTLINE
C
8.2
7.4 TYP
14X 1.27
16X 0.51
0.35
2X
8.89
0.15 TYP
0 - 10
0.3
0.1
2.00 MAX
(1.25)
0.25
GAGE PLANE
1.05
0.55
A
10.4
10.0
NOTE 3
B5.4
5.2
NOTE 4
4220735/A 12/2021
SOP - 2.00 mm max heightNS0016A
SOP
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm, per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side.
116
0.25 C A B
9
8
PIN 1 ID
AREA
SEATING PLANE
0.1 C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 1.500
£353 RE Vi“““‘ ““““““ WEECE = Era ,MQL 1"
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ALL AROUND 0.07 MIN
ALL AROUND
14X (1.27)
(R0.05) TYP
(7)
16X (1.85)
16X (0.6)
4220735/A 12/2021
SOP - 2.00 mm max heightNS0016A
SOP
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
OPENING
SOLDER MASK METAL
SOLDER MASK
DEFINED
LAND PATTERN EXAMPLE
SCALE:7X
SYMM
1
89
16
SEE
DETAILS
SYMM
Efimfifij v¢\‘\‘\‘\
www.ti.com
EXAMPLE STENCIL DESIGN
(7)
(R0.05) TYP
16X (1.85)
16X (0.6)
14X (1.27)
4220735/A 12/2021
SOP - 2.00 mm max heightNS0016A
SOP
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:7X
SYMM
SYMM
1
89
16
MECHANICAL DATA D ( *"ifi O G if” )LASHC SMALL 0U ¥N¥ 4040047 S/M 06/1‘ NO'ES, A AH Hnec' dimensmrs c'e m 'mc'ves ['nflhmeter5> B Th5 drawer ‘5 subje», ,0 change mm: Home, A Body \cngth docs rm mac mod Hoar, p'omswons, (xv gmc bms Mom mm warmers, or gm buns sha‘ nm exceed 3005 (015) eam swce @ Body mm does 101 meme 11mm fish. E Rdererce JEDEC MS 012 mam Ac, nter‘ec: flash sfu‘ not exceed 0017 (043) each swde {if TEXAS INSTRUMENTS www.1i.com
LAND PATTERN DATA D (RiPDSOiGiB) PLASTiC SMALL OUTLINE stencil Openings Example Pod Geometry (See Note c) Non Soidermosk Detirled Pad alir 4x1, 27 i 16X0'55ai ‘+l4xi 27 mwannnaia— i6x}v5°--4Er~Eifl{iEr-Hfl-T @E-HnH-a-a— {downgrade r, Example Snider Mask 0 erlin l /l/ i a i 0 07 It (See Note E) All Around ,' 421i233e4/E oa/iz AH linear dimensions are in millimeters This drawing is subject ta anange without notice. Publication che7351 is recommended tar alternate designs. Laser cutting apertures with trapezoidal wail: and also rounding corners will otter better paste release contact tneir board assembly site ror stencil design recommendations, Rerer to ch—7525 tor otner stencil recommendations Customers shouid contact their board lubrication site tor solder musk toierances between and around Signal pods NOTES: Customers should POE”? r" {I} Tums INSTRUMENTS www.li.com
www.ti.com
PACKAGE OUTLINE
C
14X 0.65
2X
4.55
16X 0.30
0.19
TYP
6.6
6.2
1.2 MAX
0.15
0.05
0.25
GAGE PLANE
-80
B
NOTE 4
4.5
4.3
A
NOTE 3
5.1
4.9
0.75
0.50
(0.15) TYP
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
4220204/A 02/2017
1
89
16
0.1 C A B
PIN 1 INDEX AREA
SEE DETAIL A
0.1 C
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
SEATING
PLANE
A 20
DETAIL A
TYPICAL
SCALE 2.500
v¢\‘\‘\‘\+““‘ gimm—LE—urmm M i
www.ti.com
EXAMPLE BOARD LAYOUT
0.05 MAX
ALL AROUND 0.05 MIN
ALL AROUND
16X (1.5)
16X (0.45)
14X (0.65)
(5.8)
(R0.05) TYP
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
4220204/A 02/2017
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SYMM
SYMM
1
89
16
15.000
METAL
SOLDER MASK
OPENING METAL UNDER
SOLDER MASK SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
SOLDER MASK DETAILS
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
YL““‘+““‘ fimmamfl J
www.ti.com
EXAMPLE STENCIL DESIGN
16X (1.5)
16X (0.45)
14X (0.65)
(5.8)
(R0.05) TYP
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
4220204/A 02/2017
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
SYMM
SYMM
1
89
16
MECHANICAL DATA NS (R-PDSO-G") PLASTIC SMALL—OUTLINE PACKAGE 14-PINS SHOWN HHFHHFH j j t t H H j, A jfi/—\ % lgLLLLLiLLL/fiif A MAX 1060 1060 1290 1530 A MW 990 9,90 1230 14‘70 4040062/0 03/03 VOTES: A. AH Hneur dimenswons are m mHHmetevs a, Tm: druwmg 5 subject to change wmom name. 0 Body dwmenswons do not mamas mom flash 0v pmtmswom not to exceed 0,15 INSTRUMEN'IS www.li.m
MECHANICAL DATA N (R—PDlP-T“) PLASTIC DUAL—IN—LINE PACKAGE 16 P15 SHOWN PWS " A L . [NM 15 a 20 16 9 0 775 U 777 0 SZU '1 USE 3 , 1H HH HH r% r’H r"—1 r’H H1 1 A VAX “9‘69? (191591 (23,37) (25,92) 0 250 (6,50‘ A MN [1145‘ 0142‘ 0.350 new 3 O 240 (6.10), 15 92/ (1832/ (2 .59) (23,58) MSiUO‘ (A AA AA Ari AA AA AA R1 &. VAR1AT1CN M RR AC AD 1 B 0070( (17s) 0015 (111) A 0045 (1,111 g n > , ‘ -) 3.020 (0,51) MW w o 5 (0 35) 0200( 38) MAX f, ), Gnu E Home 1 1‘ 9 fix—1%)” 1 0125’ 1/111 4% 0010 (v.37 ) NOM 31a) U L»- J 0450 (13,92) MAX L 202‘ (0,53) » e c 015 (0,35) / \ a; 00‘s (0,Zb)® / \ 1 1 \\¥,// 11/18 Pm (My > @ 20 Pm vendor upho'v mom/r 17/7037 NO'FS A AH Mnec' mmensmr‘fi: B 1m: drawmq 1s sume m muss (m1111mevem) 0 change mm): nofice /c\ FuHs wumn JEDEC M57001, except 15 an: 20 p171 'r1111mLm body 1mm (01m A) A The 70 p171 and 15m} shmflder Md” 15 a ve'vdnr 0311071, eher NIH Dr 111 wkflh INSI'RUMENTS www.1i.com
J (R76D1P7TM) CERAVVHC DUAL 1N7L1NE PACKAGE )4 LEADS SHOWN PWS u . W 14 e 18 20 0300 0300 0300 0300 E (7.52) (7.52) (7.62) (7.62) w 5 Est ass ass ass fl fl m m m m m E MAX 0.755 540 0.950 1.060 (19.94) (21.34) (24.35) (25.92) I ..15,,, 1 0 500 0,300 0,310 0.300 U U U U U U U C W (7.52) (7.52) (7.57) (7.52) 0.245 0.245 0.220 0.245 0.005 (1.65) 0 MW 0045 (1.14) (6.22) (6.22) (5.50) (6.22) 0000 ( . ) a «0005(0.13)MN m r ~ 0200 (5.05) MAX 7 ; Seatmg Pmne , 0 (3.30) MN 4 0 020 (0. 66) 0014 (0.36) 0715' 0100 (.)254 0.014 (0.36) 0,000 (0.20) 4040083/F 03/03 VOTES: A. AH Hneur d1mens1ons are 1’1 1mm (muhmeters) a, This druwmg '3 subject m change w'thout nnt'ce. 0, 1m package 15 hermehcoHy sewed mm a cemm 11a usmg q1ass mt. D. 11an pom 1’s prowded on cap fo' 1mm) 1den1111ca0an umy on press cemrmc 9055 m sea) 00W. E FaHs thin ML 513 1035 0011417114. 001141416. GDPPTTB 0'10 001017120
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