USB5434B Datasheet by Microchip Technology

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SMSC USB5434B Revision 1.0 (09-06-12)

DATASHEET

Datasheet

PRODUCT FEATURES

General Description

The SMSC USB5434B hub is a 4-port SuperSpeed/Hi-

Speed, low-power, configurable hub controller family

fully compliant with the USB 3.0 Specification. The

USB5434B supports 5 Gbps SuperSpeed (SS),

480 Mbps Hi-Speed (HS), 12 Mbps Full-Speed (FS) and

1.5 Mbps Low-Speed (LS) USB signalling for complete

coverage of all defined USB operating speeds.

The USB5434B supports legacy USB speeds through its

USB 2.0 hub controller. The new SuperSpeed hub

controller operates in parallel with the USB 2.0

controller, so the 5 Gbps SuperSpeed data transfers are

not affected by the slower USB 2.0 traffic.

The USB5434B is configured for operation through

internal default settings.

Features

USB 3.0 compliant 5 Gbps, 480 Mbps, 12 Mbps and

1.5 Mbps operation, USB pins are 5 V tolerant

— Integrated termination and pull-up/pull-down resistors

Four downstream USB 3.0 ports

Optimized for low-power operation and low thermal

dissipation

Single 25 MHz XTAL or clock input for all on-chip PLL

and clocking requirements

Supports JTAG boundary scan

IETF RFC 4122 compliant 128-bit UUID

Software Features

Compatible with Microsoft Windows 7, Vista, XP,

Mac OSX10.4+, and Linux Hub Drivers

USB5434B

4-Port SS/HS USB Hub Controller

Order Numbers:

* Add “TR” to the end of any order number to order tape and reel. Reel size is 3000 pieces.

This product meets the halogen maximum concentration values per IEC61249-2-21

For RoHS compliance and environmental information, please visit www.smsc.com/rohs

Please contact your SMSC sales representative for additional documentation related to this product

such as application notes, anomaly sheets, and design guidelines.

ORDER NUMBERS*DESCRIPTION

LEAD-FREE ROHS

COMPLIANT

PACKAGE

TEMPERATURE

RANGE

USB5434B-JZX USB 3.0 4-Port Hub

64QFN

9 x 9mm

6.0 mm exposed pad

0ºC to 70ºC

4-Port SS/HS USB Hub Controller

Datasheet

Revision 1.0 (09-06-12) 2 SMSC USB5434B

DATASHEET

Circuit diagrams and other information relating to SMSC products are included as a means of illustrating typical applications. Consequently, complete information sufficient for

construction purposes is not necessarily given. Although the information has been checked and is believed to be accurate, no responsibility is assumed for inaccuracies. SMSC

reserves the right to make changes to specifications and product descriptions at any time without notice. Contact your local SMSC sales office to obtain the latest specifications

before placing your product order. The provision of this information does not convey to the purchaser of the described semiconductor devices any licenses under any patent

rights or other intellectual property rights of SMSC or others. All sales are expressly conditional on your agreement to the terms and conditions of the most recently dated

version of SMSC's standard Terms of Sale Agreement dated before the date of your order (the "Terms of Sale Agreement"). The product may contain design defects or errors

known as anomalies which may cause the product's functions to deviate from published specifications. Anomaly sheets are available upon request. SMSC products are not

designed, intended, authorized or warranted for use in any life support or other application where product failure could cause or contribute to personal injury or severe property

damage. Any and all such uses without prior written approval of an Officer of SMSC and further testing and/or modification will be fully at the risk of the customer. Copies of

this document or other SMSC literature, as well as the Terms of Sale Agreement, may be obtained by visiting SMSC’s website at http://www.smsc.com. SMSC is a registered

trademark of Standard Microsystems Corporation (“SMSC”). Product names and company names are the trademarks of their respective holders.

The Microchip name and logo, and the Microchip logo are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

SMSC DISCLAIMS AND EXCLUDES ANY AND ALL WARRANTIES, INCLUDING WITHOUT LIMITATION ANY AND ALL IMPLIED WARRANTIES OF MERCHANTABILITY,

FITNESS FOR A PARTICULAR PURPOSE, TITLE, AND AGAINST INFRINGEMENT AND THE LIKE, AND ANY AND ALL WARRANTIES ARISING FROM ANY COURSE

OF DEALING OR USAGE OF TRADE. IN NO EVENT SHALL SMSC BE LIABLE FOR ANY DIRECT, INCIDENTAL, INDIRECT, SPECIAL, PUNITIVE, OR CONSEQUENTIAL

DAMAGES; OR FOR LOST DATA, PROFITS, SAVINGS OR REVENUES OF ANY KIND; REGARDLESS OF THE FORM OF ACTION, WHETHER BASED ON CONTRACT;

TORT; NEGLIGENCE OF SMSC OR OTHERS; STRICT LIABILITY; BREACH OF WARRANTY; OR OTHERWISE; WHETHER OR NOT ANY REMEDY OF BUYER IS HELD

TO HAVE FAILED OF ITS ESSENTIAL PURPOSE, AND WHETHER OR NOT SMSC HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

Conventions

Within this manual, the following abbreviations and symbols are used to improve readability.

Example Description

BIT Name of a single bit within a field

FIELD.BIT Name of a single bit (BIT) in FIELD

x…y Range from x to y, inclusive

BITS[m:n] Groups of bits from m to n, inclusive

PIN Pin Name

zzzzb Binary number (value zzzz)

0xzzz Hexadecimal number (value zzz)

zzh Hexadecimal number (value zz)

rsvd Reserved memory location. Must write 0, read value indeterminate

code Instruction code, or API function or parameter

Section Name Section or Document name

x Don’t care

<Parameter> <> indicate a Parameter is optional or is only used under some conditions

{,Parameter} Braces indicate Parameter(s) that repeat one or more times

[Parameter] Brackets indicate a nested Parameter. This Parameter is not real and actually decodes

into one or more real parameters.

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SMSC USB5434B 3 Revision 1.0 (09-06-12)

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4-Port SS/HS USB Hub Controller

Datasheet

Revision 1.0 (09-06-12) 4 SMSC USB5434B

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Table of Contents

Chapter 1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Chapter 2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Chapter 3 Pin Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.2 Pin Descriptions (Grouped by Function). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3.3 Buffer Type Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Chapter 4 DC Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

4.1 Maximum Guaranteed Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

4.2 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

4.3 DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

4.4 Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Chapter 5 AC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

5.1 Oscillator/Crystal. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

5.2 External Clock. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

5.2.1 USB 2.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Chapter 6 Package Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Chapter 7 Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Appendix A (Acronyms) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Appendix B (References) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

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List of Tables

Table 3.1 USB5434B Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Table 3.2 Buffer Type Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Table 4.1 DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Table 4.2 Pin Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Table 5.1 Crystal Circuit Legend . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Table 6.1 USB5434B 64-Pin QFN Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Table 7.1 Customer Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

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List of Figures

Figure 1.1 USB5434B Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Figure 3.1 USB5434B 64-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Figure 4.1 Supply Rise Time Model. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 5.1 Typical Crystal Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Figure 5.2 Formula to Find the Value of C1 and C2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Figure 6.1 USB5434B 64 Pin QFN Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Figure 6.2 Recommended PCB Land Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

HEW H H §ﬁr H H + H H H H H H

4-Port SS/HS USB Hub Controller

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SMSC USB5434B 7 Revision 1.0 (09-06-12)

DATASHEET

Chapter 1 Block Diagram

Figure 1.1 USB5434B Block Diagram

USB 3.0 Hub Controller

PHY

USB2.0

PHY

USB 2.0 Hub Controller

HS/FS/LS Routing Logic

Common

Block

& PLL

PHY

USB2.0

PHY

Buffer Buffer

PHY

USB2.0

PHY

Buffer Buffer

PHY

USB2.0

PHY

Buffer Buffer

PHY

USB2.0

PHY

Buffer Buffer

Upstream USB Port

Downstream USB Port 1 Downstream USB Port 2 Downstream USB Port 3 Downstream USB Port 4

Downstream RX SS bus

Downstream TX SS bus

Buffer Buffer

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Revision 1.0 (09-06-12) 8 SMSC USB5434B

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Chapter 2 Overview

The SMSC USB5434B hub is a 4-port, low-power Hub Controller fully compliant with the USB 3.0 Specification [2].

The USB5434B supports 5 Gbps SuperSpeed (SS), 480 Mbps Hi-Speed (HS), 12 Mbps Full-Speed (FS) and

1.5 Mbps Low-Speed (LS) USB signalling for complete coverage of all defined USB operating speeds.

All required resistors on the USB ports are integrated into the hub. This includes all series termination resistors and

all required pull-down and pull-up resistors on D+ and D- pins. The over-current sense inputs for the downstream

facing ports have internal pull-up resistors.

The USB5434B includes MultiTRAKTM technology, which implements a dedicated Transaction Translator (TT) for

each port. Dedicated TTs help maintain consistent full-speed data throughput regardless of the number of active

downstream connections.

The hub controller provides a default configuration, expediting implementation.

4-Port SS/HS USB Hub Controller

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SMSC USB5434B 9 Revision 1.0 (09-06-12)

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Chapter 3 Pin Information

This chapter outlines the pinning configurations for each chip. The detailed pin descriptions are listed by function in

Section 3.2: Pin Descriptions (Grouped by Function) on page 10.

3.1 Pin Configurations

Figure 3.1 USB5434B 64-Pin QFN

Ground Pad

(must be connected to VSS with a via field)

SMSC

USB5434B

(Top View QFN-64)

VDD33

USB2DM_DN2

USB2DP_DN2

USB3DM_RXDN2

USB3DP_RXDN2

VDD12

USB3DM_TXDN2

USB3DP_TXDN2

USB2DM_DN1

USB3DM_RXDN1

USB3DP_RXDN1

VDD12

USB3DM_TXDN1

USB3DP_TXDN1

VDD12

USB2DP_DN1

OCS1

PRT_CTL2

PRT_CTL1

TCFG6

TCFG1

TCFG2

TCFG3

TCFG4

VDD12

TCFG5

OCS3

OCS4

OCS2

VDD33

RBIAS

XTALIN/CLK_IN

XTALOUT

USB3DM_RXUP

USB3DP_RXUP

VDD12

USB3DM_TXUP

USB3DP_TXUP

USB2DM_UP

USB2DP_UP

VDD33

VBUS

ATEST

RESET_N

TEST

33 PRT_CTL3

VDD12

USB2DM_DN4

USB2DP_DN4

USB3DM_RXDN4

USB3DP_RXDN4

VDD12

USB3DM_TXDN4

USB3DP_TXDN4

USB2DP_DN3

USB3DM_RXDN3

USB3DP_RXDN3

VDD12

USB3DM_TXDN3

USB3DP_TXDN3

USB2DM_DN3

PRT_CTL4

Indicates pins on the bottom of the device.

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Revision 1.0 (09-06-12) 10 SMSC USB5434B

DATASHEET

3.2 Pin Descriptions (Grouped by Function)

An N at the end of a signal name indicates that the active (asserted) state occurs when the signal is at a low voltage

level. When the N is not present, the signal is asserted when it is at a high voltage level. The terms assertion and

negation are used exclusively in order to avoid confusion when working with a mixture of active low and active high

signals. The term assert, or assertion, indicates that a signal is active, independent of whether that level is

represented by a high or low voltage. The term negate, or negation, indicates that a signal is inactive.

Table 3.1 USB5434B Pin Descriptions

SYMBOL

BUFFER

TYPE DESCRIPTION

USB 3.0 INTERFACE

USB3DP_TXUP IO-U USB 3 Upstream

Upstream SuperSpeed transmit data plus

USB3DM_TXUP IO-U USB 3 Upstream

Upstream SuperSpeed transmit data minus

USB3DP_RXUP IO-U USB 3 Upstream

Upstream SuperSpeed receive data plus

USB3DM_RXUP IO-U USB 3 Upstream

Upstream SuperSpeed receive data minus

USB3DP_TXDN[4:1] IO-U USB 3 Downstream

Downstream SuperSpeed transmit data plus for ports 1 through 4.

USB3DM_TXDN[4:1] IO-U USB 3 Downstream

Downstream SuperSpeed transmit data minus for ports 1 through 4.

USB3DP_RXDN[4:1] IO-U USB 3 Downstream

Downstream SuperSpeed receive data plus for ports 1 through 4.

USB3DM_RXDN[4:1] IO-U USB 3 Downstream

Downstream SuperSpeed receive data minus for ports 1 through 4.

USB 2.0 INTERFACE

USB2DP_UP IO-U USB Bus Data

These pins connect to the upstream USB bus data signals.

USB2DM_UP IO-U USB Bus Data

These pins connect to the upstream USB bus data signals.

USB2DP_DN[4:1] IO-U USB Downstream

Downstream Hi-Speed data plus for ports 1 through 4.

USB2DM_DN[4:1] IO-U USB Downstream

Downstream Hi-Speed data minus for ports 1 through 4.

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SMSC USB5434B 11 Revision 1.0 (09-06-12)

DATASHEET

USB PORT CONTROL

PRT_PWR[4:1]/

PRT_CTL[4:1]

O12 USB Power Enable

Enables power to USB peripheral devices downstream.

VBUS I/O12 Upstream VBUS Power Detect

This pin can be used to detect the state of the upstream bus power.

OCS1 I/O12 Over-Current Sense 1

Input from external current monitor indicating an over-current condition.

OCS2 I/O12 Over-Current Sense 2

Input from external current monitor indicating an over-current condition.

OCS3 I/O12 Over-Current Sense 3

Input from external current monitor indicating an over-current condition.

OCS4 I/O12 Over-Current Sense 4

Input from external current monitor indicating an over-current condition.

MISC

RESET_N IS Reset Input

The system uses this active low signal to reset the chip. The active low

pulse should be at least 1 μs wide.

XTALIN

ICLKx

Crystal Input: 25 MHz crystal.

This pin connects to either one terminal of the crystal or to an external

25 MHz clock when a crystal is not used.

CLK_IN External Clock Input

This pin connects to either one terminal of the crystal or to an external

25 MHz clock when a crystal is not used.

XTALOUT OCLKx Crystal Output

The clock output, providing a crystal 25 MHz. When an external clock

source is used to drive XTALIN/CLK_IN, this pin becomes a no

connect.

TEST IPD Test Pin

Treat as a no connect pin or connect to ground. No trace or signal

should be routed or attached to this pin.

RBIAS I-R USB Transceiver Bias

A12.0 kΩ (+/- 1%) resistor is attached from ground to this pin to set

the transceiver’s internal bias settings.

ATEST A Analog Test Pin

This signal is used for testing the chip and must always be connected

to ground.

TCFG1 - Test Configuration 1

In the default configuration, this pin is tied to VDD33.

Table 3.1 USB5434B Pin Descriptions (continued)

SYMBOL

BUFFER

TYPE DESCRIPTION

4-Port SS/HS USB Hub Controller

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Revision 1.0 (09-06-12) 12 SMSC USB5434B

DATASHEET

TCFG2 - Test Configuration 2

In the default configuration, this pin is pulled-up to VDD33 through a

10 kΩ resistor.

TCFG3 - Test Configuration 3

In the default configuration, this pin is tied to VDD33.

TCFG4 - Test Configuration 4

In the default configuration, this pin is a no connect.

TCFG5 - Test Configuration 5

In the default configuration, this pin is pulled-down to VSS through a

10 kΩ resistor.

TCFG6 - Test Configuration 6

In the default configuration, this pin is pulled-up to VDD33 through a

10 kΩ resistor.

(1) NC - No connect pins

DIGITAL AND POWER

(4) VDD33 3.3 V Power

(8) VDD12 1.25 V Power

VSS Ground Pad

This exposed pad is the device’s only connection to VSS and the

primary thermal conduction path. Connect to an appropriate via field.

Table 3.1 USB5434B Pin Descriptions (continued)

SYMBOL

BUFFER

TYPE DESCRIPTION

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3.3 Buffer Type Descriptions

Table 3.2 Buffer Type Descriptions

BUFFER TYPE DESCRIPTION

I Input

I/O Input/output

IPD Input with internal weak pull-down resistor

IPU Input with internal weak pull-up resistor

IS Input with Schmitt trigger

O12 Output 12 mA

I/O12 Input/output buffer with 12 mA sink and 12 mA source

I/OSD12 Open drain with Schmitt trigger and 12 mA sink.

ICLKx XTAL clock input

OCLKx XTAL clock output

I-R RBIAS

I/O-U Analog input/output defined in USB specification

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Revision 1.0 (09-06-12) 14 SMSC USB5434B

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Chapter 4 DC Parameters

4.1 Maximum Guaranteed Ratings

Notes:

Stresses above the specified parameters could cause permanent damage to the device. This is a

stress rating only. Therefore, functional operation of the device at any condition above those

indicated in the operation sections of this specification are not implied.

When powering this device from laboratory or system power supplies, it is important that the

absolute maximum ratings not be exceeded or device failure can result. Some power supplies

exhibit voltage spikes on their outputs when the AC power is switched on or off. In addition, voltage

transients on the AC power line may appear on the DC output. When this possibility exists, it is

suggested that a clamp circuit be used.

PARAMETER SYMBOL MIN MAX UNITS COMMENTS

Storage Temperature TA-55 150 °C

Lead Temperature °C Refer to JEDEC Specification J-STD-

020D.

1.25 V supply voltage VDD12 -0.5 1.6 V

3.3 V supply voltage VDD33 -0.5 4.0 V

Voltage on USB+ and

USB- pins

-0.5 (3.3 V supply

voltage + 2) ≤ 6

Voltage on any signal

rail

-0.5 VDD33 + 0.3 V

Voltage on any signal

pin powered by the

VDD12

-0.5 VDD12 + 0.3 V

HBM ESD

Performance

2kV

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DATASHEET

4.2 Operating Conditions

Figure 4.1 Supply Rise Time Model

PARAMETER SYMBOL MIN MAX UNITS COMMENTS

USB5434Bi Operating

Temperature

TA-40 85 °C

USB5434B Operating

Temperature

TA070°C

1.25 V supply voltage VDD12 1.22 1.31 V

3.3 V supply voltage VDD33 3.0 3.6 V

1.25 V supply rise

time

tRT 0400μs(Figure 4.1)

3.3 V supply rise time tRT 0400μs(Figure 4.1)

Voltage on

USB+ and USB- pins

-0.3 5.5 V If any 3.3 V supply voltage drops

below 3.0 V, then the MAX

becomes:

(3.3 V supply voltage) + 0.5 ≤5.5

Voltage on any signal

rail

-0.3 VDD33 V

t10%

10%

90%

Voltage tRTxx

t90% Time

100%

3.3 V

VSS

VDD33

90%

100%

1.25 V

VDD12

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Revision 1.0 (09-06-12) 16 SMSC USB5434B

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4.3 DC Electrical Characteristics

Table 4.1 DC Electrical Characteristics

PARAMETER SYMBOL MIN TYP MAX UNITS COMMENTS

IS Type Input Buffer

Low Input Level VILI 0.8 V TTL Levels

High Input Level VIHI 2.0 V

Hysteresis (IS only) VHYSI 420 mV

I, IPU, IPD Type Input Buffer

Low Input Level VILI 0.8 V TTL Levels

High Input Level VIHI 2.0 V

Pull Down PD 72 μAV

IN = 0

Pull Up PU 58 μAV

IN = VDD33

ICLK Input Buffer

Low Input Level VILCK 0.3 V

High Input Level VIHCK 0.8 V

Input Leakage IIL -10 +10 μAV

IN = 0 to VDD33

Input Leakage

(All I and IS buffers)

Low Input Leakage IIL -10 +10 μAV

IN = 0

High Input Leakage IIH -10 +10 μAV

IN = VDD33

O12 Type Buffer

Low Output Level VOL 0.4 V IOL = 12 mA @

VDD33 = 3.3 V

High Output Level VOH VDD33

-0.4

OH = -12 mA @

VDD33 = 3.3 V

Output Leakage IOL -10 +10 μAV

IN = 0 to VDD33

(Note 4.1)

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DATASHEET

Note 4.1 Output leakage is measured with the current pins in high impedance.

Note 4.2 See USB 2.0 Specification [1] for USB DC electrical characteristics.

4.4 Capacitance

Note 4.3 Capacitance TA = 25°C; fc = 1 MHz; VDD33 = 3.3 V

I/O12, I/O12PU & I/O12PD

Type Buffer

Low Output Level VOL 0.4 V IOL = 12 mA @

VDD33 = 3.3 V

High Output Level VOH VDD33

-0.4

OH = -12 mA @

VDD33 = 3.3 V

Output Leakage IOL -10 +10 μAV

IN = 0 to VDD33

(Note 4.1)

Pull Down PD 72 μA

Pull Up PU 58 μA

IO-U

(Note 4.2)

Table 4.2 Pin Capacitance

LIMITS

PARAMETER SYMBOL MIN TYP MAX UNIT TEST CONDITION

Clock Input

Capacitance

CXTAL 2 pF All pins except USB pins and the pins

under the test tied to AC ground

Input Capacitance CIN 5pF

Output Capacitance COUT 10 pF

Table 4.1 DC Electrical Characteristics

PARAMETER SYMBOL MIN TYP MAX UNITS COMMENTS

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Revision 1.0 (09-06-12) 18 SMSC USB5434B

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Chapter 5 AC Specifications

5.1 Oscillator/Crystal

Crystal: Parallel resonant, fundamental mode, 25 MHz ±30 ppm

External Clock: 50% duty cycle ±10%, 25 MHz ±30 ppm, jitter < 100 ps rms

Figure 5.1 Typical Crystal Circuit

Figure 5.2 Formula to Find the Value of C1 and C2

Note 5.1 C0 is usually included (subtracted by the crystal manufacturer) in the specification for CL

and should be set to 0 for use in the calculation of the capacitance formulas in Figure 5.2.

However, the PCB itself may present a parasitic capacitance between XTALIN and

XTALOUT. For an accurate calculation of C1 and C2, take the parasitic capacitance

between traces XTALIN and XTALOUT into account.

Note 5.2 Consult crystal manufacturer documentation for recommended capacitance values.

Table 5.1 Crystal Circuit Legend

SYMBOL DESCRIPTION IN ACCORDANCE WITH

C0Crystal shunt capacitance Crystal manufacturer’s specification (Note 5.1)

CLCrystal load capacitance

CBTotal board or trace

capacitance

OEM board design

CSStray capacitance SMSC IC and OEM board design

CXTAL XTAL pin input capacitance SMSC IC

C1Load capacitors installed on

OEM board Calculated values based on Figure 5.2 (Note 5.2)

Crystal

XTAL2

(CS2 = CB2 + CXTAL2 )

XTAL1

(CS1 = CB1 + CXTAL1 )

C1 = 2 x (CL – C0) – CS1

C2 = 2 x (CL – C0) – CS2

4-Port SS/HS USB Hub Controller

Datasheet

SMSC USB5434B 19 Revision 1.0 (09-06-12)

DATASHEET

5.2 External Clock

50% duty cycle ±10%, 25 MHz ±30 ppm, jitter < 100 ps rms.

Note: The external clock is based upon 1.2 V CMOS Logic. XTALOUT should be treated as a no connect when

an external clock is supplied.

5.2.1 USB 2.0

The SMSC hub conforms to all voltage, power, and timing characteristics and specifications as set forth in the USB

2.0 Specification [1].

4x 45'XU.6MAX (OPTIONAL) TERMWALM IDENTWFIER AREA A TOP VIEW SIDE VIEW uu m ‘ uuuuuuumuuuuuuuu \ E BOTTOM V1 EW 3-D VIEWS TERMINAL «1 IDENT‘FIER AREA 10/: x 5/27 EXPOSED FAD mu

4-Port SS/HS USB Hub Controller

Datasheet

Revision 1.0 (09-06-12) 20 SMSC USB5434B

DATASHEET

Chapter 6 Package Drawing

Figure 6.1 USB5434B 64 Pin QFN Package

Notes:

1. All dimensions are in millimeters unless otherwise noted.

2. Dimension “b” applies to plated terminals and is measured between 0.15 and 0.30 mm from the terminal tip.

3. The pin 1 identifier may vary, but is always located within the zone indicated.

Table 6.1 USB5434B 64-Pin QFN Dimensions

MIN NOMINAL MAX REMARKS

A 0.80 0.85 1.00 Overall Package Height

A1 0 0.02 0.05 Standoff

A2 - 0.65 0.80 Mold Cap Thickness

D/E 8.90 9.00 9.10 X/Y Body Size

D1/E1 8.65 8.75 8.85 X/Y Mold Cap Size

D2/E2 5.90 6.00 6.10 X/Y Exposed Pad Size

L 0.30 0.40 0.50 Terminal Length

b 0.18 0.25 0.30 Terminal Width

K 0.90 - - Center Pad to Pin Clearance

e 0.50 BSC Terminal Pitch

'4 4 4 4 A ‘ —| l _| __52 |_ 32.23322. Jam 360mil

4-Port SS/HS USB Hub Controller

Datasheet

SMSC USB5434B 21 Revision 1.0 (09-06-12)

DATASHEET

Figure 6.2 Recommended PCB Land Pattern

4-Port SS/HS USB Hub Controller

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Revision 1.0 (09-06-12) 22 SMSC USB5434B

DATASHEET

Chapter 7 Revision History

Table 7.1 Customer Revision History

REVISION LEVEL & DATE SECTION/FIGURE/ENTRY CORRECTION

Rev. 1.0

(09-06-12)

All Initial revision.

4-Port SS/HS USB Hub Controller

Datasheet

SMSC USB5434B 23 Revision 1.0 (09-06-12)

DATASHEET

Appendix A (Acronyms)

I2C®: Inter-Integrated Circuit1

OCS: Over-Current Sense

PCB: Printed Circuit Board

PHY: Physical Layer

PLL: Phase-Locked Loop

QFN: Quad Flat No Leads

RoHS: Restriction of Hazardous Substances Directive

SCL: Serial Clock

SIE: Serial Interface Engine

SMBus: System Management Bus

TT: Transaction Translator

1.I2C is a registered trademark of Philips Corporation.

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DATASHEET

Appendix B (References)

[1] Universal Serial Bus Specification, Version 2.0, April 27, 2000 (12/7/2000 and 5/28/2002 Errata)

USB Implementers Forum, Inc. http://www.usb.org

[2] Universal Serial Bus Specification, Version 3.0, November 13, 2008

USB Implementers Forum, Inc. http://www.usb.org

[3] System Management Bus Specification, version 1.0

SMBus. http://smbus.org/specs/

[4] MicroChip 24AA02/24LC02B (Revision C)

Microchip Technology Inc. http://www.microchip.com/

USB5434B Datasheet by Microchip Technology

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