April 2006 Rev 3 1/22
1
M27C64A
64 Kbit (8Kb x8) UV EPROM and OTP EPROM
Feature summary
■5V ± 10% supply voltage in Read operation
■Access time: 100ns
■Low power “CMOS” consumption:
– Active Current 30mA
– Standby Current 100µA
■Programming voltage: 12.5V ± 0.25V
■High speed programming
(less than 1 minute)
■Electronic signature
– Manufacturer Code: 9Bh
– Device Code: 08h
■ECOPACK® packages available
1
28
FDIP28W (F)
PLCC32 (K)
www.st.com
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Contents M27C64A
2/22
Contents
1 Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1 Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2 Standby mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3 Two Line output control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.4 System considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.5 Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.6 High-speed programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.7 Program Inhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.8 Program Verify . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.9 Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.10 Erasure operation (applies to UV EPROMs) . . . . . . . . . . . . . . . . . . . . . . 10
3 Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4 DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
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M27C64A List of tables
3/22
List of tables
Table 1. Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 2. Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 3. Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 4. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 5. AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 6. Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 7. Read Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 8. Programming Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 9. Read Mode AC Characteristics 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 10. Read Mode AC Characteristics 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 11. Programming Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 12. FDIP28W - 28 pin Ceramic Frit-seal DIP, with window, Package Mechanical Data. . . . . . 18
Table 13. PLCC32 - 32 lead Plastic Leaded Chip Carrier, mechanical data . . . . . . . . . . . . . . . . . . . 19
Table 14. Ordering Information Scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 15. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
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List of figures M27C64A
4/22
List of figures
Figure 1. Logic Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 2. DIP Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 3. Pin Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 4. Programming Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 5. AC Testing Input Output Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 6. AC Testing Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 7. Read Mode AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 8. Programming and Verify Modes AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 9. FDIP28W - 28 pin Ceramic Frit-seal DIP, with window, Package Outline . . . . . . . . . . . . . 18
Figure 10. PLCC32 - 32 lead Plastic Leaded Chip Carrier, Package Outline . . . . . . . . . . . . . . . . . . . 19
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M27C64A Summary description
5/22
1 Summary description
The M27C64A is a 64Kbit EPROM offered in the two ranges UV (ultra violet erase) and OTP
(one time programmable). It is ideally suited for microprocessor systems requiring large
programs and is organized as 8,192 by 8 bits.
The FDIP28W (window ceramic frit-seal package) has transparent lid which allows the user
to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be
written to the device by following the programming procedure.
For applications where the content is programmed only on time and erasure is not required,
the M27C64A is offered in PLCC32 package.
In order to meet environmental requirements, ST offers the M27C64A in ECOPACK®
packages.
ECOPACK packages are Lead-free. The category of second Level Interconnect is marked
on the package and on the inner box label, in compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
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fi 3:
Summary description M27C64A
6/22
Figure 1. Logic Diagram
Table 1. Signal Names
A0-A12 Address Inputs
Q0-Q7 Data Outputs
EChip Enable
GOutput Enable
PProgram
VPP Program Supply
VCC Supply Voltage
VSS Ground
NC Not Connected Internally
DU Don’t Use
AI00834B
13
A0-A12
P
Q0-Q7
VPP
VCC
M27C64A
G
E
VSS
8
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M27C64A Summary description
7/22
Figure 2. DIP Connections
Figure 3. Pin Connections
Q2
VSS
A3
A0
Q0
Q1
A2
A1
G
Q5
A10
E
Q3
A11
Q7
Q6
Q4
NC
PA12
A4
VPP VCC
A7
AI00835
M27C64A
8
1
2
3
4
5
6
7
9
10
11
12
13
14
20
19
18
17
16
15
A6
A5 A9
A8
28
27
26
25
24
23
22
21
AI00836
NC
A8
A10
Q4
17
A0
NC
Q0
Q1
Q2
DU
Q3
A6
A3
A2
A1
A5
A4
9
P
A9
1
VPP
A11
Q6
A7
Q7
32
DU
VCC
M27C64A
A12
NC
Q5
G
E
25
VSS
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Device operation M27C64A
8/22
2 Device operation
The modes of operation of the M27C64A are listed in the Operating Modes table. A single
power supply is required in the read mode. All inputs are TTL levels except for VPP and 12V
on A9 for Electronic Signature.
2.1 Read mode
The M27C64A has two control functions, both of which must be logically active in order to
obtain data at the outputs. Chip Enable (E) is the power control and should be used for
device selection. Output Enable (G) is the output control and should be used to gate data to
the output pins, independent of device selection. Assuming that the addresses are stable,
the address access time (tAVQV) is equal to the delay from E to output (tELQV). Data is
available at the output after a delay of tGLQV from the falling edge of G, assuming that E has
been low and the addresses have been stable for at least tAVQV-tGLQV
.
2.2 Standby mode
The M27C64A has a standby mode which reduces the active current from 30mA to 100µA.
The M27C64A is placed in the standby mode by applying a CMOS high signal to the E input.
When in the standby mode, the outputs are in a high impedance state, independent of the G
input.
2.3 Two Line output control
Because EPROMs are usually used in larger memory arrays, this product features a 2 line
control function which accommodates the use of multiple memory connection. The two line
control function allows:
●The lowest possible memory power dissipation
●Complete assurance that output bus contention will not occur
For the most efficient use of these two control lines, E should be decoded and used as the
primary device selecting function, while G should be made a common connection to all
devices in the array and connected to the READ line from the system control bus. This
ensures that all deselected memory devices are in their low power standby mode and that
the output pins are only active when data is required from a particular memory device.
2.4 System considerations
The power switching characteristics of Advanced CMOS EPROMs require careful
decoupling of the devices. The supply current, ICC, has three segments that are of interest to
the system designer: the standby current level, the active current level, and transient current
peaks that are produced by the falling and rising edges of E. The magnitude of the transient
current peaks is dependent on the capacitive and inductive loading of the device at the
output. The associated transient voltage peaks can be suppressed by complying with the
two line output control and by properly selected decoupling capacitors. It is recommended
that a 0.1µF ceramic capacitor be used on every device between VCC and VSS. This should
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M27C64A Device operation
9/22
be a high frequency capacitor of low inherent inductance and should be placed as close to
the device as possible. In addition, a 4.7µF bulk electrolytic capacitor should be used
between VCC and VSS for every eight devices. The bulk capacitor should be located near the
power supply connection point. The purpose of the bulk capacitor is to overcome the voltage
drop caused by the inductive effects of PCB traces.
2.5 Programming
When delivered (and after each erasure for UV EPROM), all bits of the M27C64A are in the
"1" state. Data is introduced by selectively programming "0"s into the desired bit locations.
Although only "0"s will be programmed, both "1"s and "0"s can be present in the data word.
The only way to change a "0" to a "1" is by die exposition to ultraviolet light (UV EPROM).
The M27C64A is in the programming mode when VPP input is at 12.5V, E is at VIL and P is
pulsed to VIL. The data to be programmed is applied to 8 bits in parallel to the data output
pins. The levels required for the address and data inputs are TTL. VCC is specified to be 6V
± 0.25V.
2.6 High-speed programming
The high speed programming algorithm, described in Figure 4, rapidly programs the
M27C64A using an efficient and reliable method, particularly suited to the production
programming environment. An individual device will take around 1 minute to program.
Figure 4. Programming Flowchart
AI01167
n = 1
Last
Addr
VERIFY
P = 1ms Pulse
++n
> 25 ++ Addr
VCC = 6V, VPP = 12.5V
FAIL
CHECK ALL BYTES
1st: VCC = 6V
2nd: VCC = 4.2V
YES
NO
YES
NO
YES
NO
P = 3ms Pulse by n
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Device operation M27C64A
10/22
2.7 Program Inhibit
Programming of multiple M27C64A in parallel with different data is also easily
accomplished. Except for E, all like inputs including G of the parallel M27C64A may be
common. A TTL low level pulse applied to a M27C64A P input, with E low and VPP at 12.5V,
will program that M27C64A. A high level E input inhibits the other M27C64A from being
programmed.
2.8 Program Verify
A verify (read) should be performed on the programmed bits to determine that they were
correctly programmed. The verify is accomplished with E and G at VIL, P at VIH, VPP at
12.5V and VCC at 6V.
2.9 Electronic Signature
The Electronic Signature (ES) mode allows the reading out of a binary code from an
EPROM that will identify its manufacturer and type. This mode is intended for use by
programming equipment to automatically match the device to be programmed with its
corresponding programming algorithm. The ES mode is functional in the 25°C ± 5°C
ambient temperature range that is required when programming the M27C64A. To activate
the ES mode, the programming equipment must force 11.5V to 12.5V on address line A9 of
the M27C64A, with VPP = VCC = 5V. Two identifier bytes may then be sequenced from the
device outputs by toggling address line A0 from VIL to VIH. All other address lines must be
held at VIL during Electronic Signature mode.
Byte 0 (A0 = VIL) represents the manufacturer code and byte 1 (A0=VIH) the device identifier
code. For the STMicroelectronics M27C64A, these two identifier bytes are given in Table 3:
Electronic Signature and can be read-out on outputs Q7 to Q0.
2.10 Erasure operation (applies to UV EPROMs)
The erasure characteristics of the M27C64A is such that erasure begins when the cells are
exposed to light with wavelengths shorter than approximately 4000 Å. It should be noted
that sunlight and some type of fluorescent lamps have wavelengths in the 3000-4000 Å
range. Research shows that constant exposure to room level fluorescent lighting could
erase a typical M27C64A in about 3 years, while it would take approximately 1 week to
cause erasure when exposed to direct sunlight. If the M27C64A is to be exposed to these
types of lighting conditions for extended periods of time, it is suggested that opaque labels
be put over the M27C64A window to prevent unintentional erasure. The recommended
erasure procedure for the M27C64A is exposure to short wave ultraviolet light which has a
wavelength of 2537 Å. The integrated dose (i.e. UV intensity x exposure time) for erasure
should be a minimum of 15 W-sec/cm2. The erasure time with this dosage is approximately
15 to 20 minutes using an ultraviolet lamp with 12000 µW/cm2 power rating. The M27C64A
should be placed within 2.5 cm (1 inch) of the lamp tubes during the erasure. Some lamps
have a filter on their tubes which should be removed before erasure.
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M27C64A Device operation
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Table 2. Operating Modes(1)
1. X = VIH or VIL, VID = 12V ± 0.5V.
Mode E G P A9 VPP Q70-Q0
Read VIL VIL VIH XV
CC Data Out
Output Disable VIL VIH VIH XV
CC Hi-Z
Program VIL XV
IL Pulse X VPP Data Input
Verify VIL VIL VIH XV
PP Data Output
Program Inhibit VIH XXXV
PP Hi-Z
Standby VIH XXXV
CC Hi-Z
Electronic Signature VIL VIL VIH VID VCC Codes
Table 3. Electronic Signature
Identifier A0 Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 Hex Data
Manufacturer’s
Code VIL 10011011 9Bh
Device Code VIH 00001000 08h
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Maximum rating M27C64A
12/22
3 Maximum rating
Stressing the device above the rating listed in the Absolute Maximum Ratings table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Table 4. Absolute Maximum Ratings(1)
1. Minimum DC voltage on Input or Output is –0.5V with possible undershoot to –2.0V for a period less than
20ns. Maximum DC voltage on Output is VCC +0.5V with possible overshoot to VCC +2V for a period less
than 20ns.
Symbol Parameter Value Unit
TAAmbient Operating Temperature (3) –40 to 125 °C
TBIAS Temperature Under Bias –50 to 125 °C
TSTG Storage Temperature –65 to 150 °C
VIO(2)
2. Depends on range.
Input or Output Voltage (except A9) –2 to 7 V
VCC Supply Voltage –2 to 7 V
VA9(2) A9 Voltage –2 to 13.5 V
VPP Program Supply Voltage –2 to 14 V
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M27C64A DC and AC parameters
13/22
4 DC and AC parameters
This section summarizes the operating and measurement conditions, and the DC and AC
characteristics of the device. The parameters in the DC and AC Characteristic tables that
follow are derived from tests performed under the Measurement Conditions summarized in
the relevant tables. Designers should check that the operating conditions in their circuit
match the measurement conditions when relying on the quoted parameters.
Figure 5. AC Testing Input Output Waveform
Figure 6. AC Testing Load Circuit
Table 5. AC Measurement Conditions(1)
1. Note that Output Hi-Z is defined as the point where data is no longer driven.
Input Rise and Fall Times ≤ 20ns
Input Pulse Voltages 0.4V to 2.4V
Input and Output Timing Ref. Voltages 0.8 to 2.0V
Table 6. Capacitance(1)(2)
1. Sampled only, not 100% tested.
2. TA = 25 °C, f = 1 MHz.
Symbol Parameter Test Condition Min Max Unit
CIN Input Capacitance VIN = 0V 6 pF
COUT Output Capacitance VOUT = 0V 12 pF
AI00826
2.4V
0.4V
2.0V
0.8V
AI00828
1.3V
OUT
CL = 100pF
CL includes JIG capacitance
3.3kΩ
1N914
DEVICE
UNDER
TEST
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DC and AC parameters M27C64A
14/22
Table 7. Read Mode DC Characteristics(1)(2)
1. TA = 0 to 70 °C or –40 to 85 °C: VCC = 5V ± 10%; VPP = VCC.
2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
Symbol Parameter Test Condition Min Max Unit
ILI Input Leakage Current 0V ≤
VIN ≤ VCC ±10 µA
ILO Output Leakage Current 0V ≤ VOUT ≤ VCC ±10 µA
ICC Supply Current E = VIL, G = VIL,
IOUT = 0mA, f = 5MHz 30 mA
ICC1 Supply Current (Standby) TTL E = VIH 1mA
ICC2 Supply Current (Standby)
CMOS E > VCC – 0.2V 100 µA
IPP Program Current VPP = VCC 100 µA
VIL Input Low Voltage –0.3 0.8 V
VIH(3)
3. Maximum DC voltage on Output is VCC +0.5V.
Input High Voltage 2 VCC + 1 V
VOL Output Low Voltage IOL = 2.1mA 0.4 V
VOH
Output High Voltage TTL IOH = –400µA 2.4 V
Output High Voltage CMOS IOH = –100µA VCC –
0.7V
Table 8. Programming Mode DC Characteristics(1)(2)
1. TA = 25 °C; VCC = 6V ± 0.25V; VPP = 12.5V ± 0.25V.
2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
Symbol Parameter Test Condition Min Max Unit
ILI Input Leakage Current VIL ≤
VIN ≤ VIH ±10 µA
ICC Supply Current 30 mA
IPP Program Current E = VIL 30 mA
VIL Input Low Voltage –0.3 0.8 V
VIH Input High Voltage 2 VCC + 0.5 V
VOL Output Low Voltage IOL = 2.1mA 0.4 V
VOH Output High Voltage TTL IOH = –400µA 2.4 V
VID A9 Voltage 11.5 12.5 V
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M27C64A DC and AC parameters
15/22
Table 9. Read Mode AC Characteristics 1(1)(2)
Symbol Alt Parameter Test Condition
M27C64A
Unit-10 -15 -20
Min Max Min Max Min Max
tAVQV tACC Address Valid to Output
Valid E = VIL, G = VIL 100 150 200 ns
tELQV tCE Chip Enable Low to
Output Valid G = VIL 100 150 200 ns
tGLQV tOE Output Enable Low to
Output Valid E = VIL 50 75 80 ns
tEHQZ(3) tDF Chip Enable High to
Output Hi-Z G = VIL 050050050ns
tGHQZ(3) tDF Output Enable High to
Output Hi-Z E = VIL 050050050ns
tAXQX tOH Address Transition to
Output Transition E = VIL, G = VIL 000ns
1. TA = 0 to 70 °C or –40 to 85 °C: VCC = 5V ± 10%; VPP = VCC.
2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
3. Sampled only, not 100% tested.
Table 10. Read Mode AC Characteristics 2(1)(2)
Symbol Alt Parameter Test Condition
M27C64A
Unit-25 -30
Min Max Min Max
tAVQV tACC Address Valid to Output
Valid E = VIL, G = VIL 250 300 ns
tELQV tCE Chip Enable Low to
Output Valid G = VIL 250 300 ns
tGLQV tOE Output Enable Low to
Output Valid E = VIL 100 120 ns
tEHQZ(3) tDF Chip Enable High to
Output Hi-Z G = VIL 0 60 0 105 ns
tGHQZ(3) tDF Output Enable High to
Output Hi-Z E = VIL 0 60 0 105 ns
tAXQX tOH Address Transition to
Output Transition E = VIL, G = VIL 00ns
1. TA = 0 to 70 °C or –40 to 85 °C: VCC = 5V ± 10%; VPP = VCC.
2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
3. Sampled only, not 100% tested.
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DC and AC parameters M27C64A
16/22
Figure 7. Read Mode AC Waveforms
AI00778B
tAXQX
tEHQZ
A0-A12
E
G
Q0-Q7
tAVQV
tGHQZ
tGLQV
tELQV
VALID
Hi-Z
VALID
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M27C64A DC and AC parameters
17/22
Figure 8. Programming and Verify Modes AC Waveforms
Table 11. Programming Mode AC Characteristics(1)(2)
Symbol Alt Parameter Test Condition Min Max Unit
tAVPL tAS Address Valid to Program Low 2 µs
tQVPL tDS Input Valid to Program Low 2 µs
tVPHPL tVPS VPP High to Program Low 2 µs
tVCHPL tVCS VCC High to Program Low 2 µs
tELPL tCES Chip Enable Low to Program Low 2 µs
tPLPH tPW
Program Pulse Width (Initial) 0.95 1.05 ms
Program Pulse Width (Over Program) 2.85 78.75 ms
tPHQX tDH Program High to Input Transition 2 µs
tQXGL tOES Input Transition to Output Enable Low 2 µs
tGLQV tOE Output Enable Low to Output Valid 100 ns
tGHQZ(3) tDFP Output Enable High to Output Hi-Z 0 130 ns
tGHAX tAH Output Enable High to Address
Transition 0ns
1. TA = 25 °C; VCC = 6V ± 0.25V; VPP = 12.5V ± 0.25V.
2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
3. Sampled only, not 100% tested.
tAVPL
VALID
AI00779
A0-A12
Q0-Q7
VPP
VCC
P
G
DATA IN DATA OUT
E
tQVPL
tVPHPL
tVCHPL
tPHQX
tPLPH
tGLQV
tQXGL
tELPL
tGHQZ
tGHAX
PROGRAM VERIFY
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Package mechanical data M27C64A
18/22
5 Package mechanical data
Figure 9. FDIP28W - 28 pin Ceramic Frit-seal DIP, with window, Package Outline
1. Drawing is not to scale.
FDIPW-a
A3
A1
A
L
B1 B e
D
S
E1 E
N
1
C
α
eA
D2
∅
eB
A2
Table 12. FDIP28W - 28 pin Ceramic Frit-seal DIP, with window, Package Mechanical Data
Symbol millimeters inches
Typ Min Max Typ Min Max
A 5.72 0.225
A1 0.51 1.40 0.020 0.055
A2 3.91 4.57 0.154 0.180
A3 3.89 4.50 0.153 0.177
B 0.41 0.56 0.016 0.022
B1 1.45 – – 0.057 – –
C 0.23 0.30 0.009 0.012
D 36.50 37.34 1.437 1.470
D233.02– –1.300– –
E 15.24 – – 0.600 – –
E1 13.06 13.36 0.514 0.526
e2.54– –0.100– –
eA14.99– –0.590– –
eB 16.18 18.03 0.637 0.710
L 3.18 4.10 0.125 0.161
S 1.52 2.49 0.060 0.098
∅7.11 – – 0.280 – –
α4° 11° 4° 11°
N28 28
Obsolete Product(s) - Obsolete Product(s)
M27C64A Package mechanical data
19/22
Figure 10. PLCC32 - 32 lead Plastic Leaded Chip Carrier, Package Outline
1. Drawing is not to scale.
PLCC-A
D
E3 E1 E
1 N
D1
D3
CP
B
E2
e
B1
A1
A
R
0.51 (.020)
1.14 (.045)
F
A2
E2
D2 D2
Table 13. PLCC32 - 32 lead Plastic Leaded Chip Carrier, mechanical data
Symbol millimeters inches
Typ Min Max Typ Min Max
A 3.18 3.56 0.125 0.140
A1 1.53 2.41 0.060 0.095
A2 0.38 – 0.015 –
B 0.33 0.53 0.013 0.021
B1 0.66 0.81 0.026 0.032
CP 0.10 0.004
D 12.32 12.57 0.485 0.495
D1 11.35 11.51 0.447 0.453
D2 4.78 5.66 0.188 0.223
D3 7.62 – – 0.300 – –
E 14.86 15.11 0.585 0.595
E1 13.89 14.05 0.547 0.553
E2 6.05 6.93 0.238 0.273
E3 10.16 – – 0.400 – –
e 1.27 – – 0.050 – –
F 0.00 0.13 0.000 0.005
R 0.89 – – 0.035 – –
N32 32
Obsolete Product(s) - Obsolete Product(s)
Part numbering M27C64A
20/22
6 Part numbering
For a list of available options (Speed, Package, etc...) or for further information on any
aspect of this device, please contact the STMicroelectronics Sales Office nearest to you.
Table 14. Ordering Information Scheme
Example: M27C64A -10 K 1
Device Type
M27
Supply Voltage
C = 5V ±10%
Device Function
64A = 64 Kbit (8Kb x8)
Speed
-10 = 100 ns
-15 = 150 ns
-20 = 200 ns
-25 = 250 ns
-30 = 300 ns
Package
F = FDIP28W
K = PLCC32
Temperature Range
1 = 0 to 70 °C
6 = –40 to 85 °C
Obsolete Product(s) - Obsolete Product(s)
M27C64A Revision history
21/22
7 Revision history
Table 15. Document revision history
Date Revision Changes
March 1998 1.0 First Issue
25-Sep-2000 2.0 AN620 Reference removed
29-Oct-2002 2.1
100ns speed class added
FDIP28W mechanical data clarified (Table 12)
PLCC32 mechanical data and drawing clarified (Table 13, Figure 10)
06-Apr-2006 3
Datasheet converted to new corporate template.
Packages are ECOPACK® compliant.
Tape & Reel and Additional Burn-in options removed from Table 14 :
Ordering Information Scheme.
Obsolete Product(s) - Obsolete Product(s)
M27C64A
22/22
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