TC835 Datasheet by Microchip Technology

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Q ‘MICROCHIP TC835
© 2007 Microchip Technology Inc. DS21478C-page 1
TC835
Features
Upgrade of Pin-Compatible TC7135, ICL7135
200 kHz Operation
Single 5V Operation With TC7660
Multiplexed BCD Data Output
UART and Microprocessor Interface
Control Outputs for Auto-Ranging
Input Sensitivity: 100 µV
No Sample and Hold Required
Applications
Personal Computer Data Acquisition
Scales, Panel Meters, Process Controls
HP-IL Bus Instrumentation
General Description
The TC835 is a low power, 4-1/2 digit (0.005%
resolution), BCD analog-to-digital converter (ADC) that
has been characterized for 200 kHz clock rate
operation. The five conversions per second rate is
nearly twice as fast as the ICL7135 or TC7135. The
TC835, like the TC7135, does not use the external
diode resistor rollover error compensation circuits
required by the ICL7135.
The multiplexed BCD data output is perfect for interfac-
ing to personal computers. The low cost, greater than
14-bit high-resolution and 100 µV sensitivity makes the
TC835 exceptionally cost-effective.
Microprocessor-based data acquisition systems are
supported by the BUSY and STROBE outputs, along
with the RUN/HOLD input of the TC835. The
OVERRANGE, UNDERRANGE, BUSY and RUN/
HOLD control functions, plus multiplexed BCD data
outputs, make the TC835 the ideal converter for micro-
processor-based scales, measurement systems and
intelligent panel meters.
The TC835 interfaces with full function LCD and LED
display decoder/drivers. The UNDERRANGE and
OVERRANGE outputs may be used to implement an
auto-ranging scheme or special display functions.
Typical Application
Channel 1
Channel 2
Channel 3
Channel 4
Data Bus
Control
Address Bus
R 6522 P
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
CA1
CA2
PB0 PB3PB2PB1
Channel Selection
1Y
2Y
3Y
1B
2B
3B
S
1A
2A
3A
HCTS157 POL
OR
UR
D5
B8
B4
B2
B1
D1
D2
D3
D4
STB
R/H
V+ REF CAP
BUF
AZ
INT
INPUT+
VR
Input
Analog
Common
DGND
-5V
REF Voltage
+15V -15V
Differential
Multiplexer
DG529
DA
DB
WR
A1A0EN
5V
+
FIN
TC835
FIN
Personal Computer Data Acquisition A/D Converter
K c 5 3 a c T jEjjjjjjjjjjjj EEECCCCECECCCC flmflflflflflflflflflflflflflfl Ejjjjjijjjjijj UUUUUUUUUUUUUUUU IDDDDDDDDEDDDDEE
TC835
DS21478C-page 2 © 2007 Microchip Technology Inc.
Package Type
64-Pin MQFP
63
4
3
2
1
16
15
14
10
9
8
7
6
5
12
11
40
41
42
43
44
45
46
34
35
36
37
38
39
48
33
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31
61 60 59 58 57 56 55 54 53 52 51 50 4964
TC835CBU
INT OUT
NC
AZ IN
V+
NC
+INPUT
NC
BUFF OUT
BUF CAP–
NC
SUB
BUF CAP+
NC
–INPUT
NC
NC
NC
NC
NC
NC
D1
DGND
POL
SUB
CLK IN
BUSY
D2
32
NC
62
NC
13
47
NC
NC
NC
NC
NC
NC
NC
NC
NC
OVERRANGE
UNDERRANGE
SUB
V–
REF IN
ANALOG COM
NC
NC
D3
NC
NC
NC
NC
D4
B3
B4
B2
SUB
B1
D5
NC
NC NC
NC
STROBE
RUN/HOLD
TC835CPI
28-Pin PDIP
1
2
3
4RUN/HOLD
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
STROBE
OVERRANGE
B4
D3
D2
D1 (LSD)
BUSY
CLOCK IN
POLARITY
DIGTAL GND
UNDERRANGE
B2
(LSB) B1
(MSD) D5
V+
+INPUT
–INPUT
CREF+
CREF-
BUFF OUT
AZ IN
INT OUT
ANALOG
COM
REF IN
V-
D4
B8 (MSD)
27
28
29
30
31
32
33
7
4
3
2
1
TC835CKW
12 13 14 15 17 18
44 43 42 41 39 3840
16
37 36 35 34
19 20 21 22
26
8
25
9
24
10
23
11
5
6
NC
NC
NC
ANALOG
REF IN
V–
UR
OR
NC
NC
NC
NC
DGND
POLARITY
D2
NC
NC
CLK IN
NC
INT OUT
AZ IN
BUFF OUT
REF CAP–
–INPUT
+INPUT
V+
NC
NC
REF CAP+
NC
NC
(MSD) D5
(LSB) B1
B2
B4
(MSB) B8
D4
D3
NC
NC
D1 (LSD)
BUSY
RUN/HOLD
STROBE
44-Pin MQFP
COMMON
Note 1: NC = No internal connection.
2: Pins 9, 25, 40, and 56 are connected to the die substrate. The poteltial at these pins is approximately
V+. No external connections should be made.
© 2007 Microchip Technology Inc. DS21478C-page 3
TC835
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings†
Positive Supply Voltage.....................................................+6V
Negative Supply Voltage....................................................-9V
Analog Input Voltage (Pin 9 or 10) ..............V+ to V– (Note 2)
Reference Input Voltage (Pin 2)................................ V+ to V–
Clock Input Voltage....................................................0V to V+
Operating Temperature Range ..........................0°C to +70°C
Storage Temperature Range.........................-65°C to +150°C
Package Power Dissipation (TA 70°C)
28-Pin Plastic DIP ..................................................... 1.14Ω
44-Pin MQFP............................................................. 1.00Ω
64-Pin MQFP............................................................. 1.14Ω
† Stresses above those listed under "Absolute Maximum Rat-
ings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at
these or any other conditions above those indicated in the
operation sections of the specifications is not implied. Expo-
sure to Absolute Maximum Rating conditions for extended
periods may affect device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, TA = +25°C, FCLOCK = 200 kHz, V+ = +5V, V- = -5V.
Parameter Sym Min Typ Max Unit Conditions
Analog
Display Reading with Zero Volt Input -0.0000 ±0.0000 +0.0000 Display
Reading Note 3, Note 4
Zero Reading Temperature Coefficient TCZ 0.5 2 µV/°C VIN = 0V, (Note 5)
Full-Scale Temperature Coefficient TCFS 5 ppm/°C VIN = 2V;
(Note 5, Note 6
Nonlinearity Error NL 0.5 1 Count Note 7
Differential Linearity Error DNL 0.01 LSB Note 7
Display Reading in Ratiometric Operation +0.9995 +0.9998 +1.0000 Display
Reading VIN = VREF, (Note 3)
± Full Scale Symmetry Error (Rollover Error) ±FSE 0.5 1 Count –VIN = +VIN, (Note 8)
Input Leakage Current IIN 1 10 pA Note 4
Noise eN—15μVP-P Peak-to-Peak Value not
Exceeded 95% of Time
Digital
Input Low Current IIL 10 100 μAV
IN = 0V
Input High Current IIH —0.08 10 μAV
IN = +5V
Output Low Voltage VOL 0.2 0.4 V IOL = 1.6 mA
Output High Voltage;
B1, B2, B4, B8, D1 –D5
Busy, Polarity, Overrange,
Underrange, Strobe
VOH 2.4 4.4 5 V IOH = 1 mA
4.9 4.99 5 V IOH = 10 µA
Clock Frequency fCLK 0 200 1200 kHz Note 10
Note 1: Functional operation is not implied.
2: Limit input current to under 100 µA if input voltages exceed supply voltage.
3: Full scale voltage = 2V.
4: VIN = 0V.
5: 0°C TA +70°C.
6: External reference temperature coefficient less than 0.01ppm/°C.
7: -2V VIN +2V. Error of reading from best fit straight line.
8: |VIN| = 1.9959.
9: Test circuit shown in Figure 6-7.
10: Specification related to clock frequency range over which the TC835 correctly performs its various functions. Increased
errors result at higher operating frequencies.
TC835
DS21478C-page 4 © 2007 Microchip Technology Inc.
Power Supply
Positive Supply Voltage V+ 4 5 6 V
Negative Supply Voltage V– -3 -5 -8 V
Positive Supply Current I+ 1 3 mA fCLK = 0Hz
Negative Supply Current I– 0.7 3 mA fCLK = 0Hz
Power Dissipation PD 8.5 30 mΩfCLK = 0Hz
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise specified, TA = +25°C, FCLOCK = 200 kHz, V+ = +5V, V- = -5V.
Parameter Sym Min Typ Max Unit Conditions
Note 1: Functional operation is not implied.
2: Limit input current to under 100 µA if input voltages exceed supply voltage.
3: Full scale voltage = 2V.
4: VIN = 0V.
5: 0°C TA +70°C.
6: External reference temperature coefficient less than 0.01ppm/°C.
7: -2V VIN +2V. Error of reading from best fit straight line.
8: |VIN| = 1.9959.
9: Test circuit shown in Figure 6-7.
10: Specification related to clock frequency range over which the TC835 correctly performs its various functions. Increased
errors result at higher operating frequencies.
© 2007 Microchip Technology Inc. DS21478C-page 5
TC835
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1: PIN FUNCTION TABLE
Pin Number
28-Pin PDIP Symbol Description
1 V- Negative power supply input.
2 REF IN External reference input.
3 ANALOG COMMON Reference point for REF IN.
4 INT OUT Integrator output. Integrator capacitor connection.
5 AZ IN Auto zero input. Auto zero capacitor connection.
6 BUFF OUT Analog input buffer output. Integrator resistor connection.
7C
REF- Reference capacitor input. Reference capacitor negative connection.
8C
REF+ Reference capacitor input. Reference capacitor positive connection.
9 -INPUT Analog input. Analog input negative connection.
10 +INPUT Analog input. Analog input positive connection.
11 V+ Positive power supply input.
12 D5 Digit drive output. Most Significant Digit (MSD)
13 B1 Binary Coded Decimal (BCD) output. Least Significant Bit (LSB)
14 B2 BCD output.
15 B4 BCD output.
16 B8 BCD output. Most Significant Bit (MSB)
17 D4 Digit drive output.
18 D3 Digit drive output.
19 D2 Digit drive output.
20 D1 Digit drive output. Least Significant Digit (LSD)
21 BUSY Busy output. At the beginning of the signal-integration phase, BUSY goes High and
remains High until the first clock pulse after the integrator zero crossing.
22 CLOCK IN Clock input. Conversion clock connection.
23 POLARITY Polarity output. A positive input is indicated by a logic High output. The polarity output is
valid at the beginning of the reference integrate phase and remains valid until determined
during the next conversion.
24 DGND Digital logic reference input.
25 RUN/HOLD Run / Hold input. When at a logic High, conversions are performed continuously. A logic
Low holds the current data as long as the Low condition exists.
26 STROBE Strobe output. The STROBE output pulses low in the center of the digit drive outputs.
27 OVERRANGE Over range output. A logic High indicates that the analog input exceeds the full scale input
range.
28 UNDERRANGE Under range output. A logic High indicates that the analog input is less than 9% of the full
scale input range.
TC835
DS21478C-page 6 © 2007 Microchip Technology Inc.
3.0 DETAILED DESCRIPTION
(All Pin Designations Refer to 28-Pin DIP)
3.1 Dual Slope Conversion Principles
The TC835 is a dual slope, integrating analog-to-digital
converter. An understanding of the dual slope
conversion technique will aid in following the detailed
TC835 operational theory.
The conventional dual slope converter measurement
cycle has two distinct phases:
1. Input signal integration.
2. Reference voltage integration (de-integration).
The input signal being converted is integrated for a
fixed time period, with time being measured by
counting clock pulses. An opposite polarity constant
reference voltage is then integrated until the integrator
output voltage returns to zero. The reference
integration time is directly proportional to the input
signal.
In a simple dual slope converter, a complete
conversion requires the integrator output to "ramp-up"
and "ramp-down."
A simple mathematical equation relates the input sig-
nal, reference voltage and integration time:
EQUATION 3-1:
For a constant VIN:
EQUATION 3-1:
The dual slope converter accuracy is unrelated to the
integrating resistor and capacitor values, as long as
they are stable during a measurement cycle. An
inherent benefit is noise immunity. Noise spikes are
integrated, or averaged, to zero during the integration
periods. Integrating ADCs are immune to the large
conversion errors that plague successive approxima-
tion converters in high noise environments (see
Figure 3-1).
FIGURE 3-1: Basic Dual Slope Converter.
3.2 Operational Theory
The TC835 incorporates a system zero phase and
integrator output voltage zero phase to the normal two
phase dual slope measurement cycle. Reduced
system errors, fewer calibration steps and a shorter
overrange recovery time result.
The TC835 measurement cycle contains four phases:
1. System zero.
2. Analog input signal integration.
3. Reference voltage integration.
4. Integrator output zero.
Internal analog gate status for each phase is shown in
Table 3-6.
3.2.1 SYSTEM ZERO
During this phase, errors due to buffer, integrator and
comparator offset voltages are compensated for by
charging CAZ (auto zero capacitor) with a compensat-
ing error voltage. With a zero input voltage the
integrator output will remain at zero.
The external input signal is disconnected from the
internal circuitry by opening the two SWI switches. The
internal input points connect to ANALOG COMMON.
The reference capacitor charges to the reference
voltage potential through SWR. A feedback loop,
closed around the integrator and comparator, charges
the CAZ capacitor with a voltage to compensate for
buffer amplifier, integrator and comparator offset
voltages (see Figure 3-2).
Where:
VREF = Reference voltage
TINT = Signal integration time (fixed)
TDEINT = Reference voltage integration
time (variable)
1
RINTCINT
------------------------VIN T()DT
0
TINT
VREFTDEINT
RINTCINT
--------------------------------=
VIN
VREFTDEINT
tINT
--------------------------------=
+
-
REF
Voltage
Analog Input
Signal
+
-
Display
Switch
Drive
Control
Logic
Integrator
Output
Clock
Counter
Polarity Control
Phase
Control
VIN VREF
Variable
Reference
Integrate
Time
Fixed
Signal
Integrate
Time
Integrator Comparator
VIN 1/2 VREF
Egg g? W5 }§:§f W
© 2007 Microchip Technology Inc. DS21478C-page 7
TC835
FIGURE 3-2: System Zero Phase.
3.2.2 ANALOG INPUT SIGNAL
INTEGRATION
The TC835 integrates the differential voltage between
the +INPUT and -INPUT pins. The differential voltage
must be within the device Common mode range (-1V
from either supply rail, typically). The input signal polar-
ity is determined at the end of this phase (see
Figure 3-3).
FIGURE 3-3: Input Signal Integration
Phase.
3.2.3 REFERENCE VOLTAGE
INTEGRATION
The previously charged reference capacitor is con-
nected with the proper polarity to ramp the integrator
output back to zero (see Figure 3-4). The digital read-
ing displayed is:
FIGURE 3-4: Reference Voltage
Integration Cycle.
3.2.4 INTEGRATOR OUTPUT ZERO
This phase guarantees the integrator output is at 0V
when the system zero phase is entered and that the
true system offset voltages are compensated for. This
phase normally lasts 100 to 200 clock cycles. If an
overrange condition exists, the phase is extended to
6200 clock cycles (see Figure 3-5).
FIGURE 3-5: Integrator Output Zero
Phase.
TABLE 3-6: INTERNAL ANALOG GATE STATUS
+
-
+
-
+IN
REF
IN
Analog
Common
IN
SWRSWIZ SWZ
SWZIntegrator
Switch Closed
Switch Open
SWRI+
Comparator
To
Section
Analog
Input Buffer
RINT CINT
CREF
CSZ
SWRI-
SWI
SWZ
SWRI+
SWRI-
SWISW1
+
-
Digital
+
+
+IN
REF
IN
Analog
Common
IN
SWR
SWIZ SWZ
SWZIntegrator
Switch Closed
Switch Open
SWRI+
Comparator
To
Section
Analog
Input Buffer RINT CINT
CREF
CSZ
SWRI-
SWI
SWZ
SWRI+
SWRI-
SWISW1
+
Digital
Reading = 10,000
[Differential Input]
VREF
+
+
+IN
REF
IN
Analog
Common
IN
SWR
SWIZ SWZ
SWZIntegrator
Switch Closed
Switch Open
SWRI+
Comparator
To
Section
Analog
Input Buffer
RINT CINT
CREF
CSZ
SWRI-
SWI
SWZ
SWRI+
SWRI-
SWISW1
+
Digital
+
+
+IN
REF
IN
Analog
Common
IN
SWR
SWIZ SWZ
SWZIntegrator
Switch Closed
Switch Open
SWRI+
Comparator
To
Section
Analog
Input BufferRINT CINT
CREF
CSZ
SWRI-
SWI
SWZ
SWRI+
SWRI-
SWISW1
+
Digital
Conversion Cycle Phase SWISWRI+SW
RI-SW
ZSWRSW1 SWIZ Reference Figures
System Zero Closed Closed Closed Figure 3-2
Input Signal Integration Closed Figure 3-3
Reference Voltage Integration Closed* Closed Figure 3-4
Integrator Output Zero Closed Closed Figure 3-5
*Note: Assumes a positive polarity input signal. SWRI would be closed for a negative input signal.
i K?
TC835
DS21478C-page 8 © 2007 Microchip Technology Inc.
4.0 ANALOG SECTION
FUNCTIONAL DESCRIPTION
4.1 Differential Inputs
The TC835 operates with differential voltages within
the input amplifier Common mode range. The input
amplifier Common mode range extends from 0.5V
below the positive supply to 1V above the negative
supply. Within this Common mode voltage range, an
86dB Common mode rejection ratio is typical.
The integrator output also follows the Common mode
voltage. The integrator output must not be allowed to
saturate. An example of a worst case condition would
be when a large positive Common mode voltage with a
near full scale negative differential input voltage is
applied. The negative input signal drives the integrator
positive when most of its swing has been used up by
the positive Common mode voltage. For these critical
applications, the integrator swing can be reduced to
less than the recommended 4V full scale swing, with
the effect of reduced accuracy. The integrator output
can swing within 0.3V of either supply without loss of
linearity.
4.2 Analog Common Input
ANALOG COMMON is used as the -INPUT return dur-
ing auto zero and de-integrate. If -INPUT is different
from ANALOG COMMON, a Common mode voltage
exists in the system. This signal is rejected by the
excellent CMRR of the converter. In most applications,
-INPUT will be set at a fixed, known voltage (power
supply common, for instance). In this application,
ANALOG COMMON should be tied to the same point,
thus removing the common-mode voltage from the
converter. The reference voltage is referenced to
ANALOG COMMON.
4.3 Reference Voltage Input
The REF IN input must be a positive voltage with
respect to ANALOG COMMON. A reference voltage
circuit is shown in Figure 4-1.
FIGURE 4-1: Using An External
Reference.
MCP1525
2.5 VREF
V+ 10 kΩ
10 kΩ
V+
REF
IN
ANALOG
COMMON
Analog Ground
TC835
F
RUN/
© 2007 Microchip Technology Inc. DS21478C-page 9
TC835
5.0 DIGITAL SECTION
FUNCTIONAL DESCRIPTION
The major digital subsystems within the TC835 are
illustrated in Figure 5-1, with timing relationships
shown in Figure 5-2. The multiplexed BCD output data
can be displayed on LCD or LED. The digital section is
best described through a discussion of the control sig-
nals and data outputs.
FIGURE 5-1: Digital Section Functional Diagram.
Latch Latch Latch Latch Latch
Counters
Control Logic
Multiplexer
Polarity D5 D4 D3 D2 D1
13 B1
14 B2
15 B4
16 B8
Polarity
FF
MSB Digit Drive Signal LSB
Data
Output
24 22 25 27 28 26 21
DGND Clock
In RUN/
HOLD Overrange STROBE BusyUnderrange
Zero
Cross
Detect
From
Analog
Section
TC835
DS21478C-page 10 © 2007 Microchip Technology Inc.
FIGURE 5-2: Timing Diagrams for
Outputs.
5.1 RUN/HOLD Input
When left open, this pin assumes a logic "1" level. With
a RUN/HOLD = 1, the TC835 performs conversions
continuously, with a new measurement cycle beginning
every 40,002 clock pulses.
When RUN/HOLD changes to a logic "0," the measure-
ment cycle in progress will be completed, and data held
and displayed as long as the logic "0" condition exists.
A positive pulse (> 300 ns) at RUN/HOLD initiates a
new measurement cycle. The measurement cycle in
progress when RUN/HOLD initially assumed the logic
"0" state must be completed before the positive pulse
can be recognized as a single conversion run
command.
The new measurement cycle begins with a
10,001-count auto zero phase. At the end of this phase,
the busy signal goes high.
5.2 STROBE Output
During the measurement cycle, the STROBE control
line is pulsed low five times. The five low pulses occur
in the center of the digit drive signals (D1, D2, D3, D5)
(see Figure 5-3).
D5 (MSD) goes high for 201 counts when the measure-
ment cycles end. In the center of the D5 pulse, 101
clock pulses after the end of the measurement cycle,
the first STROBE occurs for one-half clock pulse. After
the D5 digit strobe, D4 goes high for 200 clock pulses.
The STROBE goes low 100 clock pulses after D4 goes
high. This continues through the D1 digit drive pulse.
The digit drive signals will continue to permit display
scanning. STROBE pulses are not repeated until a new
measurement is completed. The digit drive signals will
not continue if the previous signal resulted in an
overrange condition.
The active low STROBE pulses aid BCD data transfer
to UARTs, processors and external latches.
FIGURE 5-3: Strobe Signal Low Five
Times Per Conversion.
5.3 BUSY Output
At the beginning of the signal integration phase, BUSY
goes high and remains high until the first clock pulse
after the integrator zero crossing. BUSY returns to the
logic "0" state after the measurement cycle ends in an
overrange condition. The internal display latches are
loaded during the first clock pulse after BUSY and are
latched at the clock pulse end. The BUSY signal does
not go high at the beginning of the measurement cycle,
which starts with the auto zero cycle.
End of Conversion
(MSD)
Data
Busy
B1 B8
STROBE
D5
D4
D3
D2
D1
D4
Data D3
Data D2
Data (LSD)
Data D5
Data
Note Absence
of STROBE
201
Counts
200
Counts
200
Counts
200
Counts
200
Counts
200
Counts
200
Counts
*
*Delay between Busy going Low and First STROBE pulse is
dependent on Analog Input.
TC835
Outputs
D5 D1
© 2007 Microchip Technology Inc. DS21478C-page 11
TC835
5.4 OVERRANGE Output
If the input signal causes the reference voltage integra-
tion time to exceed 20,000 clock pulses, the
OVERRANGE output is set to a logic "1." The
overrange output register is set when BUSY goes low,
and is reset at the beginning of the next reference
integration phase.
5.5 UNDERRANGE Output
If the output count is 9% of full scale or less (-1800
counts), the underrange register bit is set at the end of
BUSY. The bit is set low at the next signal integration
phase.
5.6 POLARITY Output
A positive input is registered by a logic "1" polarity
signal. The POLARITY bit is valid at the beginning of
Reference Integrate and remains valid until determined
during the next conversion.
The POLARITY bit is valid even for a zero reading.
Signals less than the converter's LSB will have the
signal polarity determined correctly. This is useful in
null applications.
5.7 Digit Drive Outputs
Digit drive signals are positive going signals. The scan
sequence is D5 to D1. All positive pulses are 200 clock
pulses wide, except D5, which is 201 clock pulses wide.
All five digits are scanned continuously, unless an over-
range condition occurs. In an overrange condition, all
digit drives are held low from the final STROBE pulse
until the beginning of the next reference integrate
phase. The scanning sequence is then repeated. This
provides a blinking visual display indication.
5.8 BCD Data Outputs
The binary coded decimal (BCD) bits B8, B4, B2, B1 are
positive-true logic signals. The data bits become active
simultaneously with the digit drive signals. In an
overrange condition, all data bits are at a logic "0" state.
TC835
DS21478C-page 12 © 2007 Microchip Technology Inc.
6.0 TYPICAL APPLICATIONS
6.1 Component Value Selection
The integrating resistor is determined by the full-scale
input voltage and the output current of the buffer used
to charge the integrator capacitor. Both the buffer
amplifier and the integrator have a class A output
stage, with 100 µA of quiescent current. A 20 µA drive
current gives negligible linearity errors. Values of 5 µA
to 40 µA give good results. The exact value of an
integrating resistor for a 20 µA current is easily
calculated.
EQUATION 6-1:
6.1.1 INTEGRATING CAPACITOR
The product of integrating resistor and capacitor should
be selected to give the maximum voltage swing that
ensures the tolerance buildup will not saturate the
integrator swing (approximately 0.3V from either
supply). For ±5V supplies and ANALOG COMMON tied
to supply ground, a ±3.5V to ±4V full-scale integrator
swing is adequate. A 0.10 µF to 0.47 µF is
recommended. In general, the value of CINT is given
by:
EQUATION 6-2:
A very important characteristic of the integrating
capacitor is that it has low dielectric absorption to
prevent rollover or ratiometric errors. A good test for
dielectric absorption would be to use the capacitor with
the input tied to the reference. This ratiometric
condition should read half scale 0.9999, with any
deviation probably due to dielectric absorption.
Polypropylene capacitors give undetectable errors at
reasonable cost. Polystyrene and polycarbonate
capacitors may also be used in less critical
applications.
6.1.2 AUTO ZERO AND REFERENCE
CAPACITORS
The size of the auto zero capacitor has some influence
on the noise of the system. A large capacitor reduces
the noise. The reference capacitor should be large
enough such that stray capacitance to ground from its
nodes is negligible.
The dielectric absorption of the reference capacitor and
auto zero capacitor are only important at power-on or
when the circuit is recovering from an overload.
Smaller or cheaper capacitors can be used if accurate
readings are not required for the first few seconds of
recovery.
6.1.3 REFERENCE VOLTAGE
The analog input required to generate a full scale
output is VIN = 2VREF.
The stability of the reference voltage is a major factor in
the overall absolute accuracy of the converter. For this
reason, it is recommended that a high-quality reference
be used where high-accuracy absolute measurements
are being made.
6.2 Conversion Timing
6.2.1 LINE FREQUENCY REJECTION
A signal integration period at a multiple of the 60Hz line
frequency will maximize 60Hz "line noise" rejection. A
200 kHz clock frequency will reject 60Hz and 400Hz
noise. This corresponds to five readings per second
(see Table 6-1 and Table 6-2).
TABLE 6-1: CONVERSION RATE VS.
CLOCK FREQUENCY
RINT = Full scale voltage
20µA
CINT = [10,000 x clock period] x IINT
Integrator output voltage swing
= (10,000) (clock period) (20
μ
A)
Integrator output voltage swing
Oscillator Frequency
(kHz) Conversion Rate
(Conv./Sec.)
100 2.5
120 3
200 5
300 7.5
400 10
800 20
1200 30
© 2007 Microchip Technology Inc. DS21478C-page 13
TC835
TABLE 6-2: LINE FREQUENCY VS.
CLOCK FREQUENCY
The conversion rate is easily calculated:
EQUATION 6-3:
6.3 Power Supplies and Grounds
6.3.1 POWER SUPPLIES
The TC835 is designed to work from ±5V supplies. For
single +5V operation, a ICL7135 can provide a –5V
supply.
6.3.2 GROUNDING
Systems should use separate digital and analog
ground systems to avoid loss of accuracy.
6.4 High-Speed Operation
The maximum conversion rate of most dual-slope A/D
converters is limited by the frequency response of the
comparator. The comparator in this circuit follows the
integrator ramp with a 3 µs delay, and at a clock
frequency of 200 kHz (5 µs period), half of the first
reference integrate clock period is lost in delay. This
means that the meter reading will change from 0 to 1
with a 50 µV input, 1 to 2 with 150 µV, 2 to 3 at 250 µV,
etc. This transition at midpoint is considered desirable
by most users, however, if the clock frequency is
increased appreciably above 200 kHz, the instrument
will flash "1" on noise peaks even when the input is
shorted.
For many dedicated applications where the input signal
is always of one polarity, the delay of the comparator
need not be a limitation. Since the nonlinearity and
noise do not increase substantially with frequency,
clock rates of up to ~1 MHz may be used. For a fixed
clock frequency, the extra count or counts caused by
comparator delay will be a constant and can be
subtracted out digitally.
The clock frequency may be extended above 200 kHz
without this error, however, by using a low-value
resistor in series with the integrating capacitor. The
effect of the resistor is to introduce a small pedestal
voltage onto the integrator output at the beginning of
the reference integrate phase. By careful selection of
the ratio between this resistor and the integrating
resistor (a few tens of ohms in the recommended
circuit), the comparator delay can be compensated and
the maximum clock frequency extended by approxi-
mately a factor of 3. At higher frequencies, ringing and
second-order breaks will cause significant nonlineari-
ties in the first few counts of the instrument.
The minimum clock frequency is established by leak-
age on the auto zero and reference capacitors. With
most devices, measurement cycles as long as 10 sec-
onds give no measurable leakage error.
The clock used should be free from significant phase or
frequency jitter. Several suitable low-cost oscillators
are shown in Section 6.0 “Typical Applications”,
Typical Applications. The multiplexed output means
that if the display takes significant current from the logic
supply, the clock should have good PSRR.
6.5 Zero Crossing Flip-Flop
The flip flop interrogates the data once every clock
pulse after the transients of the previous clock pulse
and half-clock pulse have died down. False zero cross-
ings caused by clock pulses are not recognized. Of
course, the flip flop delays the true zero crossing by up
to one count in every instance. If a correction were not
made, the display would always be one count too high.
Therefore, the counter is disabled for one clock pulse
at the beginning of the reference integrate (de-inte-
grate) phase. This one-count delay compensates for
the delay of the zero crossing flip flop and allows the
correct number to be latched into the display. Similarly,
a one-count delay at the beginning of auto zero gives
an overload display of 0000 instead of 0001. No delay
occurs during signal integrate, so that true ratiometric
readings result.
Oscillator Frequency
(kHz)
Line Frequency Rejection
60Hz 50Hz 400Hz
50.000 • •
53.333 — —
66.667 • —
80.000 — —
83.333 — •
100.000 • •
125.000 — •
133.333 — —
166.667 — —
200.000 • —
250.000
Reading 1/sec = Clock Frequency (Hz)
4000
TC835
DS21478C-page 14 © 2007 Microchip Technology Inc.
FIGURE 6-3: 4-1/2 Digit ADC Multiplexed Common Anode LED Display.
FIGURE 6-4: RC Oscillator Circuit.
FIGURE 6-5: Comparator Clock Circuits.
20 19 18 17 12
23
7
8
16
15
14
13
11
21
3
9
10
22
6
5
4
6
2
1
7
59 15
16
bc 7777
DM7447A
Blank MSD On Zero
D1 D2 D3 D4 D5
INT OUT
AZ IN
BUFF
OUT
FIN
+INPUT
–INPUT
ANALOG
COMMON
V– REF
IN
POL
CREF
B8
B4
B2
B1
+5V
+5V
X7
0.33 µF
200 kHz
+
Analog
Input F
100 kΩ
F
4.7 kΩ
F
F
5V
100 kΩ
100 kΩ
D
B
C
A
RBI
V+
V+
CREF+
TC835
MCP1525
a. If R1 = R2 = R1, F0.55/RC
a. F = 120 kHz, C = 420 pF
R1 = 8.93 kΩ
R1 = 27.3 kΩ
R2R1
FO
Gates are 74C04
C
FO1
2C0.41RP0.7R1
+()
--------------------------------------------------=,RP
R1R2
R1R2
+
------------------=
1.
b. If R2 >> R1, F 0.45/R1C
c. If R2 << R1, F 0.72/R1C
2. Examples:
R1 = R2 10.9 kΩ
b. F = 120 kHz, C = 420pF, R2 = 50 kΩ
c. F = 120 kHz, C = 220 pF, R2 = 5 kΩ
+5V
VOUT
390 pF
30 kΩ
7
8
2
3
16 kΩ
0.22 µF
16 kΩ
4
1kΩ
1
+5V
VOUT
2
3
1
4
7
6
R2
100 kΩ
R2
100 kΩR3
50 kΩ
C2
10 pF
R4
2kΩ
C1
0.1 µF
+
LM311
+
LM311
56 kΩ
UR REF \N OR ANALOGi GND STHDEE \NT ‘7 OUT RUN HOLD AZ w DGND EUFF OUT POLAR‘TV CREF+ CLK IN BUSY Maw
© 2007 Microchip Technology Inc. DS21478C-page 15
TC835
FIGURE 6-6: 4-1/2 Digit ADC with Multiplexed Common Cathode LED Display.
FIGURE 6-7: Test Circuit.
28
27
26
25
24
23
22
21
9
8
7
6
5
4
3
2
1
REF IN
ANALOG
GND
INT
OUT
AZ IN
BUFF
OUT
CREF+
+5V
5V
UR
DGND
POLARITY
OR
STROBE
RUN/HOLD
CLK IN
BUSY
1
2
3
4
5
6
7
8
9
SET VREF = 1V
100
kΩ
Analog
GND
0.33 µF
100 kΩ
F
F
47
kΩ
150Ω
+5V
150Ω
10
11
12
13
14
15
16
17
18
+5V
MC14513
F
20
19
18
17
16
15
–INPUT
+INPUT
V+
D5 (MSD)
B1 (LSB)
B2
(LSD) D1
D2
D3
D4
B4
(MSB) B8
10
11
12
13
14
100
kΩ
SIG
IN
+
0.1
µF
+5V
FOSC = 200 kHz
CREF
V– TC835
MCP1525
TC835
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
100 kΩ
Analog GND
100 kΩ
Signal
Input
0.1 µF
SET VREF = 1V
V-
REF IN
ANALOG
COMMON
INT OUT
AZ IN
BUFF OUT
CREF-
CREF+
-INPUT
+INPUT
D5 (MSD)
B1 (LSB)
B2
V+
UNDERRANGE
OVERRANGE
STROBE
RUN/HOLD
DIGTAL GND
POLARITY
CLOCK IN
BUSY
(LSD) D1
D2
D4
(MSB) B8
B4
D3
+5V
F
100 kΩ
F
0.47 µF
VREF IN
Clock Input
120 kHz
5V
H‘Vf‘vf‘vf‘lf‘lfl‘wf‘wf‘lf‘lf‘lf‘lf‘vf‘lf‘l H‘WH‘WH‘NH‘IH‘IH‘NH‘NH‘IH‘IH‘WH‘WH‘VH‘IH‘N CPI O O U U U U U U U U U U U U U U HJHJU U U U U U U U U U U U HHHHHHHHHHH HHHHHHHHHHH HHHHHHHHHHH UHUHUUUHUHU HHHHHHHHHHH UUHUUUUUUUU O UUUUUUUUHUU m HHHHHHHHHHHHHH Mucaump XXXXXXXXXX XXXXXXXXXX XXXXXXXXXX YYWWXXX Mlcfincmv TCBBSCBU HHHHHHHHHHHHHH NMN alor ( ,)
TC835
DS21478C-page 16 © 2007 Microchip Technology Inc.
7.0 PACKAGING INFORMATION
7.1 Package Marking Information
28-Pin PDIP (Wide)
*h
XXXXXXXXXXXXXXX
XXXXXXXXXXXXXXX
XXXXXXXXXXXXXXX
YYWWNNN
Example:
*h
TC835CPI^^
0741256
44-Pin MQFP
Example:
64-Pin MQFP Example:
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
M
XXXXXXXXXX
TC835CKW
^^0741256
M
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
M
XXXXXXXXXX
TC835CBU
0741256
M
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
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0ROG'UDIW$QJOH7RS  ± 
0ROG'UDIW$QJOH%RWWRP  ± 
D
D1
E
E1
NOTE 2
e
b
N
NOTE 1
c
123
A
A1 L1 A2
φ
β
α
L
0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &%
‘ 01 ‘ UUUUUUUUUUUUUUU ‘ -7, Le . 9% 874 E C) <3 c)="" q="" g="" (:=""> (3 C) <3 (2=""><:) 02="" (:=""> C) C) <3 (2="" c)="" (:=""> C) C): SILK SCREEN {3: (:> f C) (3 t: W UUUUUUUUUUUUUUUH—-—- _. ._ x1 _.‘ ._ E RECOMMENDED LAND PATTERN U its M1LL|METERS Dimensmn Limits MIN \ NOM | MAX Conlact Pmch E a 50 BSC Conlam Pad Spacing c1 16.10 Conlac1Pad Spacing 02 16.10 Conlac1Pad wmm (X64) x1 0 55 Conlact Pad Lengm (x234) v1 1 so D1s1ence Belween Pads G 0.25 Notes 1.D1mensiomng and Iolerancmg perASME Y14.5M BSC' Baswc Dnnensiun Tneoreucany exact va‘ue shown without tolerances Mmmemp Teennmogy Drawing No cm-zozzA
TC835
DS21478C-page 20 © 2007 Microchip Technology Inc.
/HDG3ODVWLF0HWULF4XDG)ODWSDFN%8±[[PP%RG\PP>04)3@
1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW
KWWSZZZPLFURFKLSFRPSDFNDJLQJ
© 2007 Microchip Technology Inc. DS21478C-page 21
TC835
APPENDIX A: REVISION HISTORY
Revision C (November 2007)
The following is the list of modifications:
1. DC Characteristics: ChangedDisplay Reading in
Ratiometric Operation” from +0.9996 to +0.9995.
2. Updates package marking information for pb-
free markings.
3. Updated package outline drawings and added
landing pattern to applicable package outline
drawing.
Revision B (May 2002)
The following is the list of modifications:
1. Undocumented changes
Revision A (April 2002)
Original Release of this Document.
TC835
DS21478C-page 22 © 2007 Microchip Technology Inc.
NOTES:
PART NO. IXX
© 2007 Microchip Technology Inc. DS21478C-page 23
TC835
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Device TC835: 4-1/2 Digit BCD A/D for PC Data Acq.
Temperature Range C = 0°C to +70°C
Package PI = Plastic DIP, (600 mil Body), 28-lead
KW = Plastic Metric Quad Flatpack, (MQFP), 44-lead
BU = Plastic Metric Quad Flatpack, (MQFP), 64-lead
PART NO. X/XX
PackageTemperature
Range
Device
Examples:
a) TC835CBU: 4-1/2 Digit BCD A/D,
64LD MQFP package.
b) TC835CKW: 4-1/2 Digit BCD A/D,
44LD MQFP package.
c) TC835CPI: 4-1/2 Digit BCD A/D,
28LD PDIP package.
TC835
DS21478C-page 24 © 2007 Microchip Technology Inc.
NOTES:
QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV = ISO/TS 1694922002 =
© 2007 Microchip Technology Inc. DS21478C-page 25
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,
PICmicro, PICSTART, PRO MATE, rfPIC and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Linear Active Thermistor, Migratable
Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The
Embedded Control Solutions Company are registered
trademarks of Microchip Technology Incorporated in the
U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,
MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select
Mode, Smart Serial, SmartTel, Total Endurance, UNI/O,
WiperLock and ZENA are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2007, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
Q ‘MICROCHIP
DS21478C-page 26 © 2007 Microchip Technology Inc.
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WORLDWIDE SALES AND SERVICE
10/05/07

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