ANALOG
DEVICES
Digital Output, High Precision
Angular Rate Sensor
Data Sheet ADIS16130
Rev. C
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
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Tel: 781.329.4700 www.analog.com
Fax: 781.461.3113 ©2008–2011 Analog Devices, Inc. All rights reserved.
FEATURES
Low noise density: 0.0125o/sec/√Hz
Industry-standard serial peripheral interface (SPI)
24-bit digital resolution
Dynamic range: ±250o/sec
Z-axis, yaw rate response
Bandwidth, adjustable: 300 Hz
Turn-on time: 35 ms
Digital self-test
High vibration rejection
High shock survivability
Embedded temperature sensor output
Precision voltage reference output
5 V single-supply operation
−40°C to +85°C
APPLICATIONS
Guidance and control
Instrumentation
Inertial measurement units (IMU)
Platform stabilization
Navigation
GENERAL DESCRIPTION
The ADIS16130 is a low noise, digital output angular rate sensor
(gyroscope) that provides an output response over the complete
dynamic range of ±250o/sec.
Its industry-standard serial interface and register structure provide
a simple interface that is supported by most MCU, DSP, and FPGA
platforms.
By implementing a unique design, the device provides superior
stability over variations in temperature, voltage, linear acceleration,
vibration, and next-level assembly. In addition, the surface-micro-
machining technology used to manufacture the device is the
same high volume BiMOS process used by Analog Devices, Inc.,
for its high reliability automotive sensor products.
Features include a temperature output that provides critical
information for system-level calibrations and a digital self-test
feature that exercises the mechanical structure of the sensor and
enables system-level diagnostics.
The package configuration is a 36 mm × 44 mm × 16 mm
module with a standard 24-lead connector interface.
FUNCTIONAL BLOCK DIAGRAM
TEMPERATURE
SENSOR
REFERENCE SYNC
SYNC
24-BIT
Σ-∆ ADC
SERIAL
INTERFACE
MEMS
ANGULAR
RATE
SENSOR
2:1
MUX
SELF-TEST
CS
SCLK
SDI
SDO
RDY
ST ROA1 ROA2 VCC GND
07238-001
ADIS16130
Figure 1.
OBSOLETE
ADIS16130 Data Sheet
Rev. C | Page 2 of 16
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications....................................................................................... 1
General Description......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Timing Specifications .................................................................. 4
Absolute Maximum Ratings............................................................ 6
Thermal Resistance ...................................................................... 6
ESD Caution.................................................................................. 6
Pin Configuration and Function Descriptions............................. 7
Typical Performance Characteristics ............................................. 8
Basic Operation .................................................................................9
Quick Start .....................................................................................9
Data Format ................................................................................ 10
Configuration Options .............................................................. 10
Control Registers............................................................................ 11
Control Register Details ............................................................ 11
Applications Information.............................................................. 12
Achieving Optimal Noise Performance .................................. 12
Second-Level Assembly............................................................. 12
Outline Dimensions ....................................................................... 13
Ordering Guide .......................................................................... 13
REVISION HISTORY
9/11—Rev. B to Rev. C
Changes to Ordering Guide .......................................................... 13
8/10—Rev. A to Rev. B
Changes to Table 1............................................................................ 3
Changes to Configuration Sequence Section................................ 9
Added Data Format Section, Table 7, and Table 8 ..................... 10
3/08—Rev. 0 to Rev. A
Changes to Figure 15...................................................................... 10
Changes to Ordering Guide .......................................................... 13
1/08—Revision 0: Initial Version
OBSOLETE
Data Sheet ADIS16130
Rev. C | Page 3 of 16
SPECIFICATIONS
TA = 25°C, VCC = 5 V, angular rate = 0°/sec, COUT = 0 μF, ±1 g, unless otherwise noted.
Table 1.
Parameter Conditions Min1 Typ Max1 Unit
SENSITIVITY Clockwise rotation is positive output (see Figure 5)
Dynamic Range2 Full-scale range over specified operating conditions ±250 °/sec
Initial MODE[1] = 0, 16-bit RATEDATA 88 91.75 96 LSB/°/sec
MODE[1] = 1, 24-bit RATEDATA 22,548 23,488 24,428 LSB/°/sec
Nonlinearity Best-fit straight line 0.04 % of FS
NULL
Zero Rotation Rate Output MODE[1] = 0, 16-bit RATEDATA 32,768 LSB
MODE[1] = 1, 24-bit RATEDATA 8,388,608 LSB
Initial Null ±1σ ±3 °/sec
In-Run Bias Stability 1σ 0.0016 °/sec
Angle Random Walk 1σ 0.56 °/√Hr
Turn-On Time Power on to ±0.5°/sec of final value, 80 Hz bandwidth 35 ms
Linear Acceleration Effect Any axis 0.05 °/sec/g
Voltage Sensitivity VCC = 4.75 V to 5.25 V 0.2 °/sec/V
NOISE PERFORMANCE
Rate Noise Density3 0.0125 °/sec/√Hz
FREQUENCY RESPONSE
Bandwidth −3 dB frequency with no external capacitance 300 Hz
Sensor Resonant Frequency 14 kHz
SELF-TEST INPUTS
ST RATEOUT Response4 ST pins from Logic 0 to Logic 1 45 75 105 °/sec
Logic 1 Input Voltage Standard high logic level definition 3.3 V
Logic 0 Input Voltage Standard low logic level definition 1.7 V
Input Impedance To GND 3.13 kΩ
TEMPERATURE SENSOR
Output at 298 K (25°C) 8,388,608 LSB
Scale Factor 14,093 LSB/°C
DIGITAL OUTPUTS
Output Low Voltage (VOL) 0.4 V
Output High Voltage (VOH) 4 V
DIGITAL INPUTS
Input Current CS 10 μA
All others 1 μA
Input Capacitance 5 pF
VT+ 1.4 2 V
VT− 0.8 1.4 V
(VT+) – (VT−) 0.3 0.85 V
POWER SUPPLY
Operating Voltage Range 4.75 5.00 5.25 V
Quiescent Supply Current IOUT = 0 mA, 5 V 73 85 mA
TEMPERATURE RANGE
Operating Range –40 +85 °C
1 All minimum and maximum specifications are guaranteed. Typical specifications are not tested or guaranteed.
2 Dynamic range is the maximum full-scale measurement range possible, including output swing range, initial offset, sensitivity, offset drift, and sensitivity drift at 4.75 V
to 5.25 V supplies.
3 Resulting bias stability is <0.01°/sec.
4 Self-test response varies with temperature; see Figure 12.
OBSOLETE
me
ADIS16130 Data Sheet
Rev. C | Page 4 of 16
TIMING SPECIFICATIONS
All input signals are specified with 10% to 90% rise and fall times of less than 5 ns.
Table 2.
Parameter Min Typ Max Unit Test Conditions/Comments
t1 50 ns SYNC pulse width
Read Operation
t4 0 ns CS falling edge to SCLK falling edge setup time
t51 SCLK falling edge to data valid delay
0 60 ns DVDD of 4.75 V to 5.25 V
t5A1, 2
CS falling edge to data valid delay
0 60 ns DVDD of 4.75 V to 5.25 V
t6 50 ns SCLK high pulse width
t7 50 ns SCLK low pulse width
t8 0 ns CS rising edge after SCLK rising edge hold time
t93 10 80 ns Bus relinquish time after SCLK rising edge
Write Operation
t11 0 ns CS falling edge to SCLK falling edge setup
t12 30 ns Data valid to SCLK rising edge setup time
t13 25 ns Data valid after SCLK rising edge hold time
t14 50 ns SCLK high pulse width
t15 50 ns SCLK low pulse width
t16 0 ns CS rising edge after SCLK rising edge hold time
1 These numbers are measured with the load circuit shown in Figure 4 and defined as the time required for the output to cross the VOL or VOH limits.
2 This specification is relevant only if CS goes low while SCLK is low.
3 These numbers are derived from the measured time taken by the data output to change 0.5 V when loaded with the circuit shown in Figure 4. The measured number
is then extrapolated back to remove effects of charging or discharging the 50 pF capacitor. Therefore, the times quoted are the true bus relinquish times of the part
and as such are independent of external bus loading capacitances.
OBSOLETE
4H
Data Sheet ADIS16130
Rev. C | Page 5 of 16
t
11
t
14
t
16
t
15
t
12
t
13
SDI MSB LSB
SCLK
CS
07238-002
Figure 2. Input Timing for Write Operation
t
4
t
6
t
7
t
5
t
5A
t
8
t
9
SDO
S
CL
K
MSB LSB
CS
07238-003
Figure 3. Output Timing for Read Operation
I
SOURCE
(200µA AT DV
DD
= 5V
100µA AT DV
DD
= 3V)
I
SINK
(800µA AT DV
DD
= 5V
100µA AT DV
DD
= 3V)
1.6V
TO OUTPUT
PIN
50pF
07328-024
Figure 4. Load Circuit for Access Time and Bus Relinquish Time
OBSOLETE
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ADIS16130 Data Sheet
Rev. C | Page 6 of 16
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 3.
Parameter Rating
Acceleration (Any Axis, Unpowered, 0.5 ms) 2000 g
Acceleration (Any Axis, Powered, 0.5 ms) 2000 g
+VS −0.3 V to +6.0 V
Output Short-Circuit Duration
(Any Pin to Common)
Indefinite
Operating Temperature Range −40°C to +85°C
Storage Temperature Range −65°C to +150°C
The ADIS16130 provides a temperature output that is
representative of the junction temperature. This can be used
for system-level monitoring and power management/thermal
characterization.
Table 4. Thermal Characteristics
Package Type1 θ
JA θ
JC Unit
24-Lead Module 15.7 1.48 °C/W
1 Weight = 28.5 g typical.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
RATE
AXIS
POSITIVE
ROTATION
DIRECTION
+
07238-026
Dropping the device onto a hard surface may cause a shock of
greater than 2000 g and exceed the absolute maximum rating of
the device. Care should be exercised when handling the device
to avoid damage.
Figure 5. Rotational Measurement Orientation
ESD CAUTION
OBSOLETE
smc
a."
\u E
Data Sheet ADIS16130
Rev. C | Page 7 of 16
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
ST
ST
ST
ST
ST
VCC
VCC
VCC
GND
GND
GND
ROA1
ST
ST
ST
CS
RDY
SDO
SDI
SCLK
SYNC
GND
GND
ROA2
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
ADIS16130
TOP VIEW
(Not to Scale)
07328-004
Figure 6. Pin Configuration
Table 5. Pin Function Descriptions
Pin No. Mnemonic Description
1 to 7, 9 ST Self-Test (see the Self-Test Function section)
8 CS Chip Select of the SPI
10 RDY Data Ready
11, 13, 15 VCC Power Supply
12 SDO Data Output of the SPI
14 SDI Data Input of the SPI
16 SCLK Serial Clock of the SPI
17, 19 to 22 GND Power Supply Ground
18 SYNC Synchronization Input
23 ROA1 Analog Filter Node 1
24 ROA2 Analog Filter Node 2
OBSOLETE
ADIS16130 Data Sheet
Rev. C | Page 8 of 16
TYPICAL PERFORMANCE CHARACTERISTICS
2.5
2.0
1.5
1.0
0.5
0
–0.5
–1.0
–1.5
–2.0
–2.5
–60 –40 –20 0 20 40 60 80 100 120
07328-018
BIAS SHIFT (°/sec)
TEMPERATURE (°C)
σ
σ
µ
Figure 7. Bias Shift vs. Temperature, VCC = 5 V
1.00
0.75
0.50
0.25
0
–0.25
–0.50
–0.75
–1.00
–60 –40 –20 0 20 40 60 80 100 120
07328-019
SENSITIVITY ERROR (%)
TEMPERATURE (°C)
Figure 8. Sensitivity Error vs. Temperature, VCC = 5 V
0.05
0
–0.05
–0.10
–0.15 4.75 5.0 5.25
07328-020
SENSITIVITY ERROR (%)
POWER SUPPLY (V)
Figure 9. Sensitivity Error vs. Power Supply, 25°C
0.01
0.001
1 10010 1000
07328-021
ROOT ALLEN VARIANCE (°/sec)
INTEGRATION TIME, (sec)
µ – σ
µ
µ+ σ
Figure 10. Root Allen Variance, VCC = 5 V, 25°C
2
1
0
–1
–2 0 50 100 150 200 250 300 350 400
07328-022
SENSITIVITY ERROR (%)
ANGULAR RATE (°/sec)
Figure 11. Sensitivity Error vs. Angular Rate, VCC = 5 V, 25°C
90
85
80
75
70
65
60
–60 –40 –20 0 20 40 80
60 100 120
07328-023
SELF-TEST RESPONSE (°/sec)
TEMPERATURE (°C)
Figure 12. Self-Test Response vs. Temperature, VCC = 5 V
OBSOLETE
Data Sheet ADIS16130
Rev. C | Page 9 of 16
BASIC OPERATION
The ADIS16130 produces digital angular rate (RATE) and
temperature (TEMP) data. The digital communication employs
a simple 4-wire SPI that provides access to output data and
several configuration features. A set of communication and
configuration registers govern the operation in the ADIS16130.
See Table 10 for a summary of these registers.
QUICK START
The ADIS16130 SPI operates in 8-bit segments. The first byte of
a SPI sequence goes into the COM register, which contains the
read/write control bit and the address of the target register. When
writing information into control registers, the next byte contains
the configuration information. When reading output data, the
next one to three bytes contain the contents of the register selected.
Configuration Sequence
The sequence in Table 6 provides the recommended configuration
sequence. Table 2 and Figure 2 provide the timing information
for each segment of this configuration sequence.
For additional information on design and optimization with the
ADIS16130, see the AN-1042 Application Note.
Table 6. Configuration Sequence
Step SDI1 Register Purpose
1 0x01 COM Start a write sequence for IOP.
2 0x38 IOP Configure the data-ready signal to
pulse low when the RATEDATA and
TEMPDATA output registers
contain new data. The data-ready
signal goes high after reading
either of these registers.
3 0x28 COM Start a write sequence for the
RATECS register.
4 0x0A RATECS Enable and configure the
gyroscope data channel.
5 0x30 COM Start a write sequence for
RATECONV register.
6 0x05 RATECONV Initialize the RATE conversion.
7 0x2A COM Start a write sequence for the
TEMPCS register.
8 0x0A TEMPCS Enable and configure the
temperature data channel.
9 0x32 COM Start a write sequence for
TEMPCONV.
10 0x05 TEMPCONV Initialize the TEMP conversion.
11 0x38 COM Start a write sequence for the
MODE register.
12 0x22 MODE Establish the data output
resolution to 24 bits and start the
conversion process with the
RATEDATA channel.
1 The SDI column lists the hexadecimal code representation of the SDI bit
input sequence.
Reading RATE Output Data
After the configuration sequence in Table 6 is complete, reading
the output data is very simple. The ADIS16130 converts the
RATE and TEMP data continuously. To better understand this
process, Figure 13 provides an example read sequence, and Table 2
and Figure 3 provide critical timing details for the output signal.
The first byte of the sequence uses SDI to establish a read of the
RATE output register. This is accomplished by writing 0x48 to the
COM register. The most significant byte is first in the SDO
sequence, followed by the next significant, and then the least
significant. When 16-bit resolution is in use, only two bytes are
output from the SDO during the read sequence.
0x48
DATA
CS
SCL
K
SDO
SDI
RDY
DATA DATA
07328-005
Figure 13. Read Sequence Example
The data-ready signal, RDY, indicates that unread data is
available on both RATE and TEMP output registers. After the
RATE or TEMP channel is read, the signal returns high, as
shown in . The RATE and TEMP channels update
sequentially, and each has a sample rate of 5.7 kSPS. The
internal sample rate is not dependent on the SPI signals or read
rates. Using the data-ready signal to drive data collection helps
avoid losing data due to data collision, which is when a user-
driven read cycle coincides with the internal update time. In
this case, the old data remains and the new data is lost.
Figure 13
If a lower sample rate meets system-level requirements, the
data-ready signal can still be useful in facilitating SPI read
sequences. In this case, the data-ready signal pulses high for
approximately 26 μs before returning low and then repeats this
pattern at two times the internal sample rate. This signal can
feed a counter circuit (or firmware), which drives a processor
interrupt routine at a reduced sample rate.
Reading TEMP Output Data
Reading TEMP data requires a sequence that is very similar to
that of Figure 13, except that the initial SDI sequence must be
changed from 0x48 to 0x4A. If the TEMP data is not used, Step 7
to Step 10 of the configuration sequence are not required.
OBSOLETE
ADIS16130 Data Sheet
Rev. C | Page 10 of 16
DATA FORMAT
The ADIS16130 uses the offset binary data format.
⎥
⎦
⎤
⎢
⎣
⎡°+
−
=
⎥
⎦
⎤
⎢
⎣
⎡−
=C25
093,14
2
488,23
22323 Codes
TEMP
Codes
RATE
Table 7. Gyroscope Rate Output Data Format
24-Bit (Codes) 16-Bit (Codes) Rate Output
14,260,608 55,706 +250°/sec
8,623,488 33,686 +10°/sec
8.388,612 32,769 +0.00017030°/sec
8,388,609 +0.000042575°/sec
8,388,608 32,768 0
8,388,607 −0.000042575°/sec
8,388,604 32,767 −0.00017030°/sec
8,153,728 31,850 −10°/sec
2,516,608 9,830 −250°/sec
Table 8. Gyroscope Temperature Output Data Format
24-Bit (Codes) 16-Bit (Codes) Rate Output
9,516,048 37,172 +105°C
9,234,188 36,071 +85°C
8,402,701 32,823 +26°C
8,388,608 32,768 +25°C
8,036,283 31,392 +0°C
7,472,563 29,189 −40°C
CONFIGURATION OPTIONS
Synchronization Input
The SYNC pin can be used to synchronize the ADIS16130 with
other devices in the system. When the SYNC bit in the I/O port
register (IOP) is set and the SYNC pin is low, the ADIS16130
does not process any conversions. Instead, it waits until the
SYNC pin goes high, and then starts the operation. This allows
the conversion to start from a known point in time (for example,
the rising edge of the SYNC pin).
Self-Test Function
The self-test function enables system-level diagnostic checks for the
entire ADIS16130 sensor/signal conditioning circuit. To activate
the self-test function, there must be a logic high signal on all
ST pins (see Table 5). When activated, the self-test function results
in a rate measurement shift. By comparing the observed shift
with the limits specified in this data sheet, users can determine
the pass/fail criteria for system-level diagnostic routines. For
normal gyroscope operation, place a logic low input on
all ST pins. For systems that do not require this feature, tie all
ST pins to GND.
Analog Bandwidth
The typical −3 dB cutoff frequency for the ADIS16130 is
300 Hz, which is the combined response of two single-pole
filters, as shown in Figure 14. Pin ROA1 and Pin ROA2 provide
the opportunity for further bandwidth reduction in the first
filter stage, as shown in the following relationship:
()
ext
dB CCR
f+××π×
=
−2
1
3
where:
R = 25 kΩ.
C = 6800 pF.
Cext is as defined in Figure 15 and Table 9.
The relationship between the −3 dB cutoff frequency and the
external capacitance of the ADIS16130 is shown in Figure 15 and
Tabl e 9.
327Hz 1kHz
ADC
07328-006
Figure 14. Frequency Response Block Diagram
1 10 100 1k 10k
FREQUENCY (Hz)
0
–1
–2
–3
–4
–5
–6
–7
–8
–9
–10
AMPLITUDE (dB)
07328-007
C
ext
= 0µF
C
ext
= 0.15µF
Figure 15. Frequency Response: Cext = 0 μF vs. Cext = 0.15 μF
Table 9. Nominal Bandwidth for Standard Capacitor Values
Cext (pF) BW (Hz) Cext (pF) BW (Hz) Cext (pF) BW (Hz)
1000 276.8 10,000 198.9 100,000 52.2
1200 274.4 12,000 187.2 120,000 44.8
1500 270.9 15,000 172.1 150,000
37.0
1800 267.5 18,000 159.2 180,000
31.5
2200 263.1 22,000 144.7 220,000 26.3
2700 257.7 27,000 129.9 270,000
21.8
3300 251.6 33,000 115.7 330,000 18.1
3900 245.8 39,000 104.4 390,000
15.5
4300 242.1 43,000 97.9 430,000 14.1
4700 238.4 47,000 92.3 470,000
12.9
5100 234.9 51,000 87.2 510,000 12.0
5600 230.7 56,000 81.6 560,000
10.9
6200 225.8 62,000 75.8 620,000 9.9
7500 215.8 75,000 65.6 750,000
8.2
8200 210.8 82,000 61.2 820,000 7.6
9100 204.7 91,000 56.3 910,000 6.8
OBSOLETE
Data Sheet ADIS16130
Rev. C | Page 11 of 16
CONTROL REGISTERS
Table 10. Register Descriptions
Name Address Type Purpose
COM 0x00 W Facilitate communications in the SPI port (see Table 11)
IOP 0x01 R/W Data-ready and synchronization controls (see Table 12)
0x02 to 0x07 Reserved
RATEDATA 0x08 R Gyroscope output, rate of rotation
TEMPDATA 0x0A R Temperature output
0x10 to 0x22 Reserved
RATECS 0x28 R/W Gyroscope channel setup (see Table 13)
TEMPCS 0x2A R/W Temperature channel setup (see Table 14)
RATECONV 0x30 R/W Gyroscope conversion time control (see Table 15)
TEMPCONV 0x32 R/W Temperature conversion time control (see Table 15)
0x33 to 0x37 Reserved
MODE 0x38 R/W Resolution mode control (see Table 16)
CONTROL REGISTER DETAILS
Table 11. COM Register Bit Assignments
Bit Description
[7] 0
[6] 1 = read;
0 = write
[5:0] Register address
Table 12. IOP Register Bit Assignments
Bit Description
[7:4] 0011
[3] 1 = data-ready signal low when unread data on all channels;
0 = data-ready signal low when unread data on one channel
[2:1] 00
[0] 0 = synchronization disabled;
1 = synchronization enabled
Table 13. RATECS Register Bit Assignments
Bit Description
[7:4] 0000
[3] 1 = channel enable;
0 = channel disable
[2:0] 010
Table 14. TEMPCS Register Bit Assignments
Bit Description
[7:4] 0000
[3] 1 = channel enable;
0 = channel disable
[2:0] 010
Table 15. RATECONV/TEMPCONV Bit Assignments
Bit Description
[7:0] 00000101
Table 16. MODE Register Bit Assignments
Bit Description
[7:2] 001000
[1] 1 = 24-bit resolution;
0 = 16-bit resolution
[0] 0
OBSOLETE
ADIS16130 Data Sheet
Rev. C | Page 12 of 16
APPLICATIONS INFORMATION
ACHIEVING OPTIMAL NOISE PERFORMANCE
Several system-level considerations can have an impact on the
noise and accuracy of the ADIS16130. Understanding and
managing these factors can influence the behavior of any high
performance system.
Supply and Common Considerations
The ADIS16130 provides approximately 1.8 μF of decoupling
capacitance. This capacitance is distributed throughout the
device and should be taken into account when considering
potential noise threats on the power supply lines.
Bandwidth Setting
If COUT is applied to reduce the bandwidth of the ADIS16130
response, it should be placed close to the device. Long cable
leads and PCB traces increase the risk of introducing noise into
the system.
SECOND-LEVEL ASSEMBLY
The ADIS16130 package supports two mounting approaches:
a bulkhead mount, where the interface is separate from the
attachment surface, and a PCB mount that provides the
mechanical and electrical connections on the same surface.
Figure 16 provides a suggested design for the ADIS16130’s
mechanical attachment. The hole pattern shown in Figure 16
can support either mounting approach and enables the integration
of the mating socket layout that is illustrated in Figure 17.
The mating socket layout uses the Samtec CLM-112-02 family of
connectors. The 24 holes that are inside the pad accommodate the
pins on the ADIS16130, which can extend beyond the package
body. The stress relief provided by these holes is important for
maintaining reliability and optimal bias stability performance.
07238-025
5.00 BSC
39.60 BSC
19.800 BSC
31.200 BS
C
15.600 BSC
5.00 BSC
2x 0.560 BSC
ALIGNMENT HOLES
FOR MATING SOCKET
4x 2.500 BSC
2.280
17.520
Figure 16. Suggested Hole Pattern for Mounting
0.4334 [11.0]
0.0240 [0.610]
0.019685
[0.5000]
(TYP)
0
.054 [1.37]
0.0394 [1.00]
0.0394 [1.00] 0.1800
[4.57]
NONPLATED
THRU HOLE 2×
0.022± DIA (TYP)
0.022 DIA THRU HOLE (TYP)
NONPLATED THRU HOLE
0
7328-017
Figure 17. Mating Socket Recommended Pad Layout with
Dimensions Shown in Inches and (Millimeters)
OBSOLETE
14054
Data Sheet ADIS16130
Rev. C | Page 13 of 16
OUTLINE DIMENSIONS
010908-A
TOP VIEW
END VIEW
35.854
35.600
35.346 31.350
31.200
31.050
15.700
15.600
15.500
44.254
44.000
43.746
39.750
39.600
39.450
1.00 BSC
(LEAD PITCH)
0.30 BSC SQ
(PIN SIZE)
2.200 TYP
2.200
TYP
2.400 THRU HOLE
(4 PLACES)
5.50 BSC
3.27
3.07
2.87
14.054
13.800
13.546
19.900
19.800
19.700
17.670
17.520
17.370
Figure 18. PCB Module with Connector Interface
(ML-24-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model1 Notes Temperature Range Package Description Package Option
ADIS16130AMLZ −40°C to +85°C PCB Module with Connector Interface ML-24-3
ADIS16130AMLZ-P 2 −40°C to +85°C PCB Module with Connector Interface ML-24-3
1 Z = RoHS Compliant Part.
2 Contact factory for more information.
OBSOLETE
ADIS16130 Data Sheet
Rev. C | Page 14 of 16
NOTES
OBSOLETE
Data Sheet ADIS16130
Rev. C | Page 15 of 16
NOTES
OBSOLETE
ANALOG
DEVICES
www.ana|ng.nnm
ADIS16130 Data Sheet
Rev. C | Page 16 of 16
NOTES
©2008–2011 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D07238-0-9/11(C)
OBSOLETE
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