LD-1 Manual Datasheet by Global Specialties

80701-0207 4/90 LD-1 PENCILBOXN LOGIC DESIGNER INSTRUCTION MANUAL ® E&L Instruments An lm‘erplex Electronics Company 1486 Highland Avenue, Unit 2 Cheshire, CT 06410 (203)272-3285 FAX: (203)272-4330

B0-01

-0207

4/90

LD-I

PENCILBOf

LOGIC

DESIGNER

INSTRUCTION

MA}.II'AL

fleal lnstruments

An lnterplex

Elecironics

Compony

1486 Highland

Avenue, Unit 2

Cheshire, CT 06410

(203)272-328s

FAX,

(203)272-4330

All rights reserved. No Fan of this book shall be reproduced, stored in a retrieval system, or transmitted by any means. electronic. mechanical, photocopying recording, or othenivise, without written permission from the publisher. No patent liability is assumed with respect to the use of the infor- mation contained herein. While every precaution has been taken in the preparation of this book, the publisher assumes no responsibility for errors or omissions. Neither is any liability assumed for damages resulting from the use of the information contained herein. BY ® E&L Instruments An Interplex Electronics Company 1486 Highland Avenue. Unit 2 Cheshire. CT 06410 (203)272-3285 FAX: (203)272-4330 Printed in the United States at America

of this

book shall

reproduced,

stored

retrieval

system, or transmitted

by any means,

electronic, mechanical,

photocopying

recording,

otherwise,

without

written

permission

from

the

publisher.

patent

liability is

assumed with

respect

to the use

the infor-

mation contained herein. While

every

precaution

has been

taken

in the

preparation

of this book, the

publisher

assumes

responsibility

for

errors

or omissions.

Neither

any

liability

assumed for

damages

resulting from

the

use of

the information

contained herein.

E&L Instruments

An Interplex

Electronlcs

Compony

1486 Highland

Avenue,

Unit

Cheshire,

CT 06410

(203)27

2-3285 FAX:

(203)27

2-4330

Printed in the United States

ol America

WARNING FEDERAL REGULATION (PART 15 OF FCC RULES) PROHIBITS THE USE OF COMPUTING EQUIPMENT WHICH CREATES RADIO OR TV INTERFERENCE Interplex Electronics speciﬁcally warns the user oi this instrument that it is intended for use in a classroom or laboratory environment tor the purpose ol learning and experimentation When building experimental circuits. it may emit Interference that will effect radlo and television reception and the user may be requlred to stop operation until the interierence problem is corrected. Home use oi this equipment is discouraged since the likelihood of interference is increased by the close proximity oi neighbors, CORRECTIVE MEASURES: Interlerence can be reduced by the tollowing practices. 1) Install a commercially built RFI powerfilter inthe power line at the point wherethe cord enters the unit. 2) Avoid long wires. They act as antennas. 3) If long Wires must be used, use ShleIded cables or twisted pairs which are properly grounded and terminated.

T'T'ARNING

FEDERAL

REGUIATTON

(PART

ls OF

FCC

RULES)

PROHIBITS

THE

USE

COMPUTING

EQUIPMENT

WHICH

CREATES

RADIO

Tv INTERFERENCE

Interplex

Electronics

specifically warns

the user

this instrument

that

is intended

for

use

classroom or

laboratory

environment for the

purpose

learning

and

experimentation.

When

building

experimental

circuits,

may

emit

interference

that will

effect radio

and television

reception

and the

user

may

required

to stop

operation

until the interference

problem

is corrected. Home

use of this

equipment

discouraged

since the

likelihood

of interference

is increased

by the

proximity

neighbors.

CORRECTIVE MEASURES:

lnterference

can

be reduced

by the following

practices.

1) lnstall a

commercially

built RFI

power

filter in

the

power

line

at the

point

where

the

cord enters

the

unit.

2) Avoid long

wires.

They act

as antennas.

3) lf long

wires

must

be used, use

shielded cables

twisted

pairs

which

are

properly

grounded

and

terminated.

TABLE OF CONTENTS Introduction ................ . ..................... ..page Specifications ........page Schematic Diagram.. ........................ ‘.. ...... page General Assembly Practi ces ..... ... ............... page Component Identification Diagrams ................... page Construction ................................... .....page Checkout,‘ .......................................... page Bill of Materials ................................... page Application Note .................................... page Construction Diagrams ............................... page 10 12 14 16 17

TABLE OF CONTENTS

Introduction.. ...page 1

Specifications ...page 2

Schematic

Diagran .....page 4

General Assembly

Practi

ces ....page 5

Component ldentification

Diagrams ....page I

Construction.. ...page LO

Checkout. ...page ),2

Bi I'l of Materi al s. . . . .

page t4

Application

Note. .....page ),6

Construction Diagrams .page L7

INTRODUCTION The E 81 L Instruments Pencil Box Logic Designer is a complete digital circuit design instrument. It can fullfill modest requirements for the design and study of gates, counters, multiplexers and can even interface directly to a microprocessor. The unit contains 8 LED logic indicators, 8 logic switches, a clock and two debounced pushbuttons. The logic indicators are a "trans— parent latch" and thus serve the dual function of 8 independent logic probes or two four bit output ports which can be connected to a microcomputer. Similarly, the eight logic switches can serve the dual function of logic switches or two four bit input ports for inter— facing to a microcomputer. The clock is fixed at approximately lKHZ but can be varied by adding an external capacitor. *See Application notes All of these functions are internally connected to a solderless interconnect socket with 5 tie points for each signal, In addition, an E & L instrument "SK-l0 Solderless Breadboarding Socket" is permanently attached to the unit, thus providing a convenient work area for the circuitry being designed or studied. Both sockets allow insertion of components or wires up to 20 gauge. For components with larger diameter leads use E & L's BPZ4 adapter pins which can accept wire leads up to 16 gauge. Power is supplied either internally by batteries, externally by an optional battery eliminator, or by an external 5 volt regulated supply. The unit is housed in a durable and attractive plastic box with a hinged protective cover thus making it portable and stackable for storage purposes.

I NTRODUCTION

The E &

L Instruments Penci'l

Box

Logic Designer is a complete

digital

circuit design

instrument. It can

fu'llfill modest requirements

for

the design

and

study

of gates,

counters,

multiplexers

and

can even

interface directly to a microprocessor.

The

unit contains B LED logic indicators,8

logic

switches, a clock

and two

debounced

pushbuttons.

The

logic indicators

are a "trans-

parent

'latch"

and

thus serve

the dual function

of 8 independent

logic

probes

or two

four bit output

ports which can be

connected to a

microcomputer.

Similarly, the

eight logic switches

can

serve the

dual

function

of logic switches or tvlo

four bit input ports for inter-

facing to a microcomputer.

The

c'lock

is fixed at approximately

lKHZ

but can be varied by

adding an external

capacitor.

*See

Application

notes

Al'l of these

functions

are interna'lly connected

to a solder'less

interconnect

socket

with 5 tie points

for each signa'|, In addition,

an E &

L instrument

"SK-'|0

So'lderless

Breadboard'ing

Socket" is

permanently

attached

to the unit, thus providing

a convenlent

work

area

for the circu'itry being

designed

or studied. Both

sockets

allow insertion of components

or wires up to 20

gauge. For

components

with larger

diameter leads

use E

& L's BP24 adapter

pins

which can

wire leads up to 16

gauge.

Power

is supplied either internally

an optional

battery

eliminator, or

supply.

by batteries, external'ly by

by an

external 5 volt regu'lated

The unit is housed in a durable

and attractive plastic box

with

a hinged

protective

cover thus making it portable

and

stackable

for

storage

purposes.

SPECIFICATIONS A. POWER (1) 4 "C” batteries (not included) (2) Optional 6VDC battery adapter, 300ma, unregulated (3) User supplied SVDC regulated supply, t 5%, 300na B. CLOCK l khz : 50% user variable with external capacitor Logic "1” output current1.2 ma @ 3.25V Logic “0" output current1.2 ma @ O-ZSV c, PULSERS Two fully debounced pushbuttons with logic true and complementary outputs Logic "1" output current 400 microamps @ 2.4V min Logic ”0” output current 16 ma max @ 0.4V max D. LOGIC SWITCHES (INPUT PORTS) Dual function: 8 switches buffered by two 4 bit tri—state buffers with separate enables Logic ”l” output current 2.6 ma max @ 2.4V min Logic "0” output current 24 ma max @ 0.5V max Enables Logic ”l” input current 400 microamps @ 5 volts Logic "0” input current 20 microamps @ 0.2 volts E. LOGIC INDICATORS ‘ (OUTPUT PORTS) Dual function: 8 LEDs driven by two 4 bit latches (LAMP MONITORS) with separate enables Logic “1” input current 50 microamps @ 5 volts Logic ”0” input current none required F. CONNECTORS All functions are permanently connected to a solderless tie point connector. Each tie point has five solderless connection points. Power and ground have 15 connection points each. All tie points are labeled.

SPECI

CATI ONS

A. P0WER

) 4 "C"

batteries

(not

included)

(2) Optional 6VDC

battery adapter,

300ma,

unregulated

(3) User supplied 5VDC

regulated

supply,

1 5%,

300na

B. CL0CK 'l khz

! SOf, user variable with external capacitor

Logic

"1" output current1.2ma

3.25V

Logic

"0" output

current1.2ma

0 0.25V

C. PULSERS

Two

fully debounced

pushbuttons

with logic true and complementary

outputs

Logic

"'1"

output current

400

microamps

2.4V min

Logic

"0" output current 16 ma max

@ 0.4V

max

D. LOGIC SWITCHES

(INpUT

pSRTS1

Dua'l

function: 8 switches buffered

by two 4 bit tri-state

buffers

with separate

enables

Logic

"1" output current

2.6 ma max

2.4V

min

Logic

"0" output

current 24 na

max

0.5V max

Enabl es

Logic

"'1"

input current

400 microamps

@ 5 volts

Logic

"0" input

current 20 microamps

@ 0.2

volts

E. LOGIC INDICATORS

(SUTpUT

pSRTS; Dua'l

function: 8 LEDs driven

by two 4 bit latches

(LAMP

M0NIT0RS) with separate

enables

Logic

"1" input

current

microamps

@ 5 volts

Logic

"0" input current none required

F. CONNECT0RS

All functions

are permanently

connected

to a solderless

tie

point connector.

Each

tie point has

five solderless connection

points. Power and

ground

have

l5 connection

points

each. Al'l

tie points

are

labeled.

G. BREADBOARDING One E&L Instruments SK-lO so1derless breadboarding socket is permanentIy attached to the unit. The SK-lO can accommodate up to eight 14 pin DIP [£5 with 4 tie points per pin plus 8 power ra11s with 25 tie points each. H‘ PHYSICAL Length 10 in 25.4 cm width 7.5 in 19.05 cm Height 2.562 in 6.51 cm 1. Height (1ess batteries and adapter) 1 1b 6 oz

G. BREADBOARDING

One

E&L

Instruments

SK-10

solderless

breadboarding

..., socket

is permanent'ly

attached

to the unit. The

SK-10

can

accommodate

up to eight 14

pin DIP ICs with

4 tie points

per

pin plus

8 power

rails with 25

tie points

each.

H' PHYSICAL Length lo in ZS.4

l.li

dth 7 .5 in 19.05 cm

Height 2.562

in 6.51

I. tleight

(less

batteries

and

adaptor) I lb 6 oz

LOGIC SWLTCHES {mm/v mm '5 “awn“..w mm D "ta‘a‘amv M 7 T .‘ W, 1 m, 3 5w. .‘ sum \ 1 , r I , l M, 1 52m ‘ LOGIC INDICATORS ‘ s: m muwuvvuivsl , Auw Mommas) sum mum :a .s W ALL. m W W. .v *4.“ ”“3? 54” um , V». 3 :79 g4” m, | m u ; a ,, Q // 1 I .. ,, um , H e— ; INTERCONNECT SOCKET mm ‘ swan/m3: um) g: 4' mm H ’I m ; PULSERS u m 1,3.; mm H ' .5 mi 4 m 1 m 1 v7 1 m r CLOCK Tm, % m POWER SUPPLY 6- VOLTAGE REGULATOR mmmmmum.....w...mw m5». i "if” .1." m m (mmcn .w LD'l SCHEMA'VIC w um rsumlmmcarniilul Mulmmco) m _ “m- my.” a W m - m 4

LOGrC SWTTCHES

(INPUT

POR1S)

PULSERS

POWER

SUPPLY

& VOLTAGE REGULATOR

ti6tatL JwFtl rt ultto EttEtilr lt6uLltE0 lvolt

tFPLtlstlDltloil a lc|@ alttclr€3

LOGIC INDICATORS

(OUTPUT

PORTS)

(LAMP

MONITORS)

loor

CLOCK

L2(C)

(8)

LO(A)

eL6EiT

FEZ

-L

PBz J

FE-i

-r-

EXT

CAP

EXT

CAP

+5V

+5v (LOGIC

+5V

Gro

6ilO (LOG|C O)

ilD

LD.I

SCHEMATIC

LO.I PET{CILEO( LOGIC DESIGNER

.. Tr.t .. +:zo .rOb-OBr O

GENERAL ASSEMBLY PRACTICES Most of your kit items have been packed in plastic bags. Check the contents of the bags against the BILL OF MATERIAL LISTING to insure that all of the correct parts are in your kit. Inspect packing material for any loose parts before discarding. Please bring all shortages or discrepancies to the immediate attention of E & L Instruments as this helps us correct errors and make a better kit for the next person. Excessive heat can damage solid state devices. Avoid soldering with guns or irons which exceed 35 watts. Use only rosin core solder. The use of corrosive solders such as acid core or pastes or fluxes voids any and all warranties on your kit. We recommend that you use a yellow high-lighter pen on the CONSTRUCTION FIGURES to mark off items as you assemble the kit. This simple bookkeeping method allows you to put the kit aside and pickup where you left off at another time in an orderly fashion. Electronic devices of similar function often come in different fonn. Please study the COMPONENT IDENTIFICATION DIAGRAMS to become familiar with the various types of devices which are apt to be supplied in your kit before actual construction. Some integrated Circuits (ICs) are easily damaged by STATIC ELECTRICITY! These [Cs are packed on black conductive foam. Use the following precautions when handling such ICs. 1) Do NOT remove the IC from the conductive foam until you are actually ready—to install it into the circuit. 2) Avoid carpeting or other furnishings that promote static build up. 3) Ground soldering tips and test equipment before contacting such ICs. 807-0020

GENERAL ASSEMBLY

PRACTICES

l.lost

of your

kit iterns

have

been

packed

in plastic bags.

check the

contents

of the bags

against

the

BILL

0F HATERIAL

LISTING

to insure that all of the correct

parts

are in your

kit. Inspect

pack'ing

material for any

loose

parts

before

discardi

ng.

Please

bring

all shortages

or discrepancies

to the inmediate

attention

of E

L Instruments

as this helps

correct

errors

and make a better kit for the

person.

Excessive heat

can

damage

solid state devices. Avoid

soldering

with guns

or irons

which

exceed

35 watts.

C. Use only

rosin

core

solder. The use

of corrosive so]ders

such

as acid

core or pastes

or fluxes

voids

any and all warranties

on your

kit.

!9 rgcpnrnend

that_you

use

a yellow high-lighter pen

on the

C0NSTRUCTI0N

FIGURES

to mark:off

itemi as

lou assembte

the kit.

Thi.s

simple bookkeeping

method

allows

you lo put the kit iside

and

pickup

where

you left off at anoth-er

time in an oraeriy'iastrion.

Electronic

devices

of similar function

often

come in different form.

Please

study the C0MP0NENT

IDENTIFICATI0N

DIAGRAMS

to become

familiar

with the various

types of devices

which are

apt to be

suppiied

in your

kit before actual

construction.

Sorne

Integrated

Circuits (ICs)

are easily damaged

STATIC

ELECTRICITY!

These

ICs are

packed

on b'lack

conductive foam. Use

the following

precautions

when

hand'li ng

such ICs.

1) Do NOT

remove

the IC from

the conductive

foam

until you

are actua'lly

ready

to install it into the circuit.

2\ Avoid

carpeting or other furnishings

that promote

static bui'ld

up.

3) Ground

soldering

tips and

test equipment

before contacting

such

ICs.

807-0020

SOLDERING TIPS The quality of your unit is going to depend on the quality of your assembly and soldering techniques. we have outlined, be— low, some standard practices that you should adhere to. 1 There is more to a soldered connection than two or more pieces of metal held together by a “blob” of solder. When molten solder is applied to a metal, the solder actually disolves some of the metal's surface. Thus, metals which have been soldered together are bonded by a solidified solution of solder and parts of the metals which were joined. Soldering is an easy task, but it is a task that must be done correctly. If your solder- ing techniques are poor you will have a great deal of trouble with the kit that you are about to assemble. 2 In order for molten solder to perform its function of joining metals together, the oxides on the surfaces of the metals must be removed. The oxides are removed by a FLUX. A flux is a material which, when heated, disv solves surface oxides and suspends them away from the surface of the metal. with the surface oxides removed, the molten solder can dissolve some of the surface metal and bond itself tightly to the metal. we recommend the use of Rosin flux core solder with a mixture of 63% tin and 37% lead. This is the only mix- ture that goes directly from liquid state to solid state thus, bypassing the plastic state which causes cold solder joints. 3 A good solder connection is made in two steps: The first step is to make the mechanical connection. Then the molt- en solder is applied to the connection. After you have stripped a wire, always check to see that the wire is clean and free from heavy oxidation, grease or oil. Oxi— dation can be scraped off, and oil or grease can be re> moved with a rag. Steel wool or sandpaper is excellent for cleaning badly oxidized wires. Stranded wire should be tinned (covered with solder) to prevent the bare ends from fraying and possibly causing a short circuit. 807—0021—1

SOLDIR]NG TIPS

The

quality

of your

unit is going

to depend

the

quafity

your

assembly

and

soldering techniques.

have outlined,

be-

low,

some

standard

practices

that you

should

adhere

to.

I There

is more

to a soldered

connection

than

two or more

pieces

of metal

held

together

by a "blob"

of solder.

When molten

solder

is applied

to a metal,

the solder

actual'ly disolves

some

of the

metal's

surface. Thus,

metals

which

have

been

soldered

together

are bonded

a solidified

solution

of solder

and

parts

of the metals

whjch

were

joined. Soldering

is an

easy task,

but

is a task that must

done

correctly. If your

solder-

ing techniques

are poor you

will have

a great

deal

trouble

wjth the kit that you

are

about

to assemble.

2 In order

for molten

solder

to perform

its function

joining

metals

together,

the oxides

on the surfaces

the metals

must

be removed.

The

oxjdes are removed

a FLUX.

A flux is a material

which,

when

heated, dis-

solves

surface

oxides and

suspends

them away from

the

surface

of the

metal. With

the surface ox.ides

removed,

the molten

solder can dissolve

some of the surface metal

and

bond

'itself tightly to the

metal.

We recommend

the use

of Rosin

flux core

solder with a

mixture

ot 63% tin and

37% 1ead.

This is the only mix-

ture that goes

d'irectly

from

I iqu'id

state

to sol id state

thus,

bypassing

the

p'lastic

state which

causes cold

solder

joints.

3 A good

solder

connect'ion

is made

in two steps: The first

step

is to make

the mechanical

connection.

Then

the molt-

solder is applied

to the connection.

After you

have

stripped

a wire, a'lways

check

to see

that the wire is

clean and

free from

heavy

oxidation,

grease

or oil. 0xi-

dation

can

scraped

off, and oil or grease

can

re-

moved

with a rag. Steel

urool or sandpaper

is excellent

for cleaning

badly

oxidized

wires. Stranded

wire should

tinned

(covered

with solder)

to prevent

the bare

ends

from

fraying

and

possibly

causing

a short

c.ircuit.

807-002

1- 1

The next step in making a solder connection is to secure the wire or wires to the terminal or lug. The wire should make sufficient contact with the terminal or lug, but should not be tightly fastened. The solder will provide both mechanical strength and a low resistance junction. ﬁx After the mechanical connections are complete, the next step is to apply the solder. First heat the mechanical connection, with the iron, to allow the solder to flow on the hot metal. Apply the solder to the point where the iron meets the contact to be soldered. The flux should melt and flow freely over the contact, dissolv— ing all oxides, and aiding heat transfer from tip to connection. The solder should then melt and flow freely. covering the area to be soldered. Make sure you apply enough solder to cover the contact. To prepare p.c. boards for soldering, clean the area to be soldered on the printed wiring by rubbing with a pencil eraser, and clean the component leads with a piece of steel wool. Place the component on the board, on the side with the nomenclature printed on it, with the leads extending through the holes indicated for the component. Flip the board over and solder the leads. The same general rule for soldering conventional circuit- ry should be adhered to. SOLDER JOINT CLIP EXCESS LEAD FLUSH WITH SOLDER JOINT. PC BOARD 807-0021-2

The

step

in mak'ing

a solder

connection

is to secure

the

wire

or wires

to the

terminal

or'lug. The

wire

should

make

suffjcient contact

with the term'inal

or 1ug, but

should

not be

tight'ly

fastened. The

solder wil I provide

both

mechanical

strength

and a low

resistance

iunct'ion.

After the

mechanical connections

are complete, the next

step

is to app'ly

the

solder. First heat

the

mechanical

connection, with

the

iron, to allow the

solder

to flow

the hot

metal. Apply

the solder to the point

where

the iron

meets the

contact to be soldered. The

flux

should

melt and

flow freely over the

contact,

djssolv-

ing a1l

oxides, and aiding

heat transfer

from tip to

connection.

The solder should then

melt

and

flow freely,

covering

the area to be soldered.

Make

sure

you

apply

enough solder

to cover the contact.

prepare p.c. boards

for soldering,

clean the area

be soldered

on the printed

wiring

rubbing with a

pencil

eraser,

and

clean the

component leads

with

piece

of steel wool. Place

the component

on the board,

on the s'ide

wjth the nomenclature

printed

it, with

the leads extending

through the holes

indjcated

for the

component.

Flip the board

over and

solder the leads.

The

same

genera'l

rule for soldering

conventional

circujt-

ry should

adhered

to.

SOLDER JOINT CLIP EXCESS

LEAD

FLUSH

WITH

SOLDER JOINT.

PC BOARD

PRINTED WIRING

807

-002r-2

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RESISTOR

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CONSTRUCTION Note: A. For convenience of construction remove figures 1 thru 12 from manual. Assemble PC board as per figures 1 thru 6 as follows: 1. 2. 11. 12. l3. 14. Install all resistors; solder; clip leads flush to board. Install LEDs. Leave 1/8" space between the bottom of the LED and the top of board to prevent damage to LED when soldering. Note polarity; solder; clip. Install remaining diodes; note polarity; solder; clip. Install IC's one at a time; note orientation; solder; clip. Install 8 position DIP switch; note "open" position; solder; clip. Install transistor Q3 (see Fig. 2); solder; clip. Install remaining transistors one at a time; note orientation; solder; clip. Install pushbuttons (PBl & P82); solder; clip. Install all capacitors; solder; clip. Install SK—50/1F33 socket carefully. Be certain that Ag; pins protrude through the PC board. Secure as shown in Fig. 3; solder; clip. Attach self stick I/o label to SK—SO/IF33 as shown in Fig. 4. Carefully align signal names with tie points of SK—SO/IF33. Secure SK—lo socket and nylon flex clip as shown in Fig. 5. Make sure clip is perpendicular to front edge of PC board. Install power switch. Install and wire power jack (see Fig. 6). Final Assembly 1. 2. 3. 4. 5. Install 4 rubber feet in plastic housing (see Fig. 7). Install battery holder (see Fig. 8’. Attach battery holder wires (see Fig. 9). Attach PC board (see Fig. 10). Affix self stick labels to the top of the plastic housing (see Fig. ll & 12). Hinge Operation The front edge of the PC board can be swung up as much as 6 inches for access to batteries and spare parts bag. 1. 2. Raise PC board by pulling it up at the front right corner. Lock PC board by guiding nylon clip under lip of plastic housing with finger. 10

CONSTRUCTION

Note: For convenience of construction remove figures 1 thru i,2

from manual.

Assemble PC board as per figures 1 thru 6 as follows:

1. Install all resistors; soldert clip leads flush to board.

2. Install LEDs. Leave L/8" space between the bottom of

the LED and the top of board to prevent damage to LED

when soldering. Note polarity; solder; c1ip.

3. Install remaining diodes; note polarity; solder; c1ip.

4. Install ICrs one at a time; note orientation; solder; clip.

5. Install 8 position DIP switch; note "open" position; solder;

cIip.

6. Install transistor Q3 (see Fig. 2li solder; clip.

7. Install remaining transistors one at a timei note orientation;

solder; clip.

8. InstaLl pushbuttons (PB1

& PB2); solder; clip.

9. Install all capacitors; solder; clip.

10. Install SK-50/TF33 socket carefully. Be certain that ALL pins

protrude through the PC board. Secure as shown in Fig. 3;

solder; cIip.

11. Attach self stick I/O label to SK-50/IF33 as shown in Fig. 4.

Carefully align signal names with tie points of SK-50

/IF33.

12. Secure SK-10 socket and nylon flex clip as shown in Fig. 5.

Make sure clip is perpendicular to front edge of PC board.

13 . InstaII power swit.ch .

14. Install and wire power jack (see Fig. 6).

B. Final Assemblv

Install 4 rubber feet in plastic housing (see Fig. 7l .

Install battery holder (see Fig. B).

Attach battery holder wires (see Fiq. 9).

Attach PC

board (see Fig. 10).

Affix self stick labels to the top of the plastic housj-ng

(see Fig. 1-1

& I2l .

c. Hinge Operation

The front edge of the PC board can

inches for access to batteries and be swung up as much as 6

spare parts bag.

1. Raise PC board by pulling it up at the front right corner.

2. Lock PC board by guiding nylon clip under lip of plastic

housing with finger.

Component Container Locate the vinyl ziplock bag and the 1x3" piece of conductive foam. Use the ziplock bag to store components for experiments and use the conductive foam to store static sensitive IC‘s. Place the foam in the bag {so it doesn't get lost) and place the bag in the box under the P.C. board for convenient storage. 11

D. Component Container

Locate the vinyl ziplock bag and the 1x3" piece of conductive

foam. Use the ziplock bag to store components for experiments

and use the conductive foam to store static sensitive ICrs.

Place the foam in the bag (so it doesnrt get lost) and place

the bag in the box under the P.C. board for convenient storage.

CHECKOUT Inspect the unit for missing parts, improper part orienta— tion, cold solder joints etc.. Correct any obvious pro- blems before proceeding. Power Section - Battery Operation Install four fresh ”C" cells in accordance with orientation shown on the battery holder. Turn POWER switch to On and check for +5VDC between "+5” and "GNU“ on intmwonnect socket. This voltage may vary with the condition of the batteries but should be in the range of 4.5 to 5.5 volts. OPTIONAL - Battery Adaptor Operation Plug battery adaptor into JI then in wall outlet. Turn POWER switch to On and check for +5VDC between “+5” and "8ND” on interconnect socket. Voltage should be in the range of 4.5 to 5.5 volts. OPTIONAL - User Supplied +5 Remove batteries and battery adaptor. Install jumper be- tween J3 and J2. Connect user power supply to a l/8" phone plug with +(positive) at tip of plug. User supply should be +5VDC plus or minus 5% (4.75 to 5.25 Volts). Plug user supply into Jl. Turn POWER switch to ”ON" and check for user voltage between "+5" and "GND" on interconnect SOCket. Scope CLOCK OUT on interconnect socket. Frequency 500 to 1500 HZ Amplitude 4 to 5.5 volts Duty cycle 40 to 60% LOGIC INDICATORS a) All 8 LEDs should be off. b) Jumper L0(A) to LOGIC l on interconnect sockeL :3) "DO" should lite up, all others should be off. d) Move jumper to L1(B). e) D1 should lite up, all others should be off. f) Test remaining signals - L2(C) thru L7(G) - in like fashion. PULSERS a) Jumper L0(A) to P81 b) "DO" should ligﬂwhen P81 is depressed. c) Move jumper to PM. d) "DO” should go out when PBI is depressed. e) Checkout PBZ, PBZ in like fashion. 12

CHECKOUT

I nspect

the

uni t for mi ssi ng

parts,

improper

part

ori enta-

tion, cold solder

joints etc.. Correct

any

obvious

pro-

bl ems before

proceedi

ng.

2, Power

Section

- Battery

0peration

Insta'l

'l four fresh "C"

cells in accordance

with orientation

shown

on the battery holder. Turn

P0l,lER

switch to 0n and

check

for +5VDC

between

rt+5rr

and "GND"

On interconnect

socket,

This voltage

may vary

with the condition of the batteries

but should

be in the

range of 4.5 to 5.5

volts.

0PTI0NAL

- Battery Adaptor

0peration

FIug

Sattery adaptor

into JI then in wall outl

POhlER switch to 0n and check

for +5VDC

between

"GND"

on i nterconnect

socket. Vol tage

shou'ld

of 4.5

to 5.5 volts.

et. Turn

rr+5'r

and

in the

range

0PII0NAL

- User

Suppl

R-ernove

6atteries and battery adaptor. Install jumper

be-

tween J3 and

J2. Connect user

power

supply to a l/8" phone

plug

with

+(positive)

at tip of plug. User supply

should

+5VDC plus

or minus 5%

(q.15

to 5.25

Vo'l ts). Plug

user

supply into J1. Turn

P0WER

switch to .'0N',

and check

for

user

vol tage between

'r+5rr

and

"GND"

on i nterconnect socket.

Scope

CL0CK 0UT on i nterconnect socket.3.

Frequenc.y

AnrPl

i tude

Duty cycl e

LOGIC INDICATORS

PULSERS

500 to I 500

4 to 5.5

volts

40 to 60%

l 8 LEDs shou'l

d be of

Jumper

L0(A)

to L0GI

1 on i nterconnect

socket.

'.D0''

should lite up, all others

should

be off .

Move

jumper

to L1(B).

D1 shoul

d I i

te up, a'l

I others

shoul

d be of

Test

remai

ni ng

signal s - L2(C) thru L7(G)

- i n

like fashion.

Jumper L0(A) to PB1

rrD0'r

should

light when

l4ove

umper

to PB

1 .

'.00,'

should gA__A_ut

when

Checkout

PBz;

TBZ in li

PB1

s depressed.

PB1

is depressed.

ke fashion.

6. LOGIC SWITCHES (Note: Do not use GRAPHITE PENCIL TO MOVE SWITCHES!!!) Jumper LO(A) to SO(A). Set switch “0” so that ”D0" is lit. This is defined as the OPEN position. Set all 8 switches to OPEN. Jumper all 8 indicators, LO(A) thru L7(H) to corres— ponding switches SO(A) thru 57(H). Each LED should light up when it is connected. Move each switch to not OPEN then to OPEN, noting that only the corresponding LED went out. Leave wires connected. 7. LATCH TEST a) b) C) Jumper CLOCK X to P81. Jumper CLOCK V to PBZ. All LEDs should be lit. Set switch "0” thru 3 to not OPEN. All LEDs should be lit. Press and release PBl; "DO" thru D3 should go out. Set switch 4 thru 7 to not OPEN. D4 thru D7 should still be lit. Press and release PBZ; D4 thru D7 should go out. Renove CLOCK jumpers. 8. INPUT PORT TEST a) 17) Jumper ENABLE X to PBl. Jumper ENABLE Y to PBZ. All LEDs should be out. Set all 8 switches to OPEN. All LEDs should still be out. Press and hold PBl: “DO" thru D3 should light. Release P81: “00” thru D3 should go out. Press and hold PBZ: D4 thru D7 should light. Release PBZ: 04 thru D7 should go out. 9. Turn POWER switch OFF: Unit should not function. CHECKOUT COMPLETED 13

6. LOGIC

SWITCHES

(Note: Do not

use

GRAPHITE

PENCIL

M0VE

SWITCHES!!!)

a) Jumper L0(A) to S0(A).

b) Set

switch

"0" so that "D0"

is lit. This is defined

as the OPEN

position.

c) Set all B

switches to 0PEN.

d) Jumper

a'll 8 indicators,

L0(A) thru L7(H) to corres-

ponding

switches S0(A) thru 57(H). Each

LED should

light up

when it is connected.

e) Move

each switch to not 0PEN then to 0PEN, noting that

on]y the corresponding

LED

went out.

f) Ieave

wires connected.

7. LATCH TEST

a) Jumper

CLO-CR

X to PBl

Jumper

CL0CK

Y to PB2.

All LEDs

should

be lit.

b) Set

switch

"0" thru 3 to not

OPEN.

A11

LEDs

shou'ld be lit.

Press

and

release

PB'l;

"D0"

thru D3

should

out.

c) Set switch 4 thru 7 to not 0PEN.

thru D7 s houl d sti'l I be I i t.

Press

and release PB2;

thru D7 should

out.

Remove

CL0CK

jumpers.

8. INPUT

PORT

TEST

a) Jumper ENABLE

X to PBl.

Jumper

ENABLE

Y to PBZ.

All LEDs

should

out.

b) Set all 8 switches to 0PEN.

A]1

LEDs

should still be

out.

Press

and

hold

PBI' ''D0''

thru D3 should light.

Release

PBI: "D0"

thru D3 should

out.

Press

and hol d PBz: D4 thru D7 should

'light.

Release

PB2: D4 thru D7 should

out.

9. Turn POWER

switch

0FF: Unit

should

not function.

CHECKOUT

COMPLETED

10/05/84 30M ﬂ LINE 0 v m N o V‘b m N u 325-4301 COMPONENT 17-01-0005 02-05-0330 05-03-0211 Lk-01-0059 6b-01-0148 40-01-0130 bL-01-0097 33-01-513b 30-01-000k 10-01-4148 10-01-0751 96-03-0067 15-01-0049 66-00-0131 95-01-0203 10-02-0015 02-05-0322 37-01-68k5 37-01-2245 37-01-1045 37-01-6835 37-01-4735 37-01-1035 37-01-4725 37-01-1055 37-01-1015 37-08-0001 37-08-0003 08-04-3103 08-04-0102 02-05-0325 60-09-0001 k0-03-0025 .k0-0k-0025 20-03-3119 02-03-0018 02-03-0001 88-02-000A 77-01-0162 66-00-0134 84-01-0001 SL-Ob-DOUZ Bk-OS-JBOB 85-DZ-000k 85-02-0013 85-01-0033 INTERPLEX ELECTRONICS: INC. BILL OF MATERIAL LISTING LD-1'K PENCIL BOX KT DESCRIPTION 30! REV G SOLID STATE BAG LD-1 PCIBD ASSV RCA CDLJBZAE ICH75551PA SN7574' 7kL5367 ZNSISE XSTR-NPN Tl??? XSTR HINDU IN4148 DIDDE 1N751A 5.2V 51 LDOHH CDH’ONEVI CONTAINER ANTI-STA? FOAM 1.5 X 3 FOAM IN BAG LD-1 PC‘iD RIJ HINI RED LED 100 CENT" RESISY AND CAP BAG CERES 174‘ 680K OHM SZ CERES 1IAH 220K OHH 51 CERES 1I4H 100K OH! 51 CCRES 1I6N 63K OHM 51 CCRES 1V60 £7K OHM 51 CERES 1ILU 10K OHM 51 CERES 1/6! 4.7K OH! 51 CERES 1ILH 1HEG OH" 51 CERES 11LU 100 OHM 51 1K SERIES SIP ARES 100K C0! SIP 9 RES CER CAP .01xHFD. 50V CER CAP .001 MED 50V MISCELLANEOUS BAG 8 POSN DIP SHIYCH SPDT PC SLIDE CUST l SPST PC HUI HOM PB HDP MINI-JACK (RSZ7L-297) SK-SO IF-SS HF SKY RI- SK10-PLIUNIV SKY NEH NYL FLX ELP LD-1‘SDCKEI LABEL LBR NDUR BG LD-1IK RI- 6-32X5/165LFTD BLK 6-40 X 5/8" FL HD.-SC k-LD X 1IL" PAN HD. SC b-‘D HEX NUT 8L SPLIT LU 1/32 ”A FLATUASHER 14 01' m ¢ 4 d a a a N N a N N d w N N 4 a N N N a u N A “aﬂ-JDNJJQAAHN—h.‘ PAGE LVL N N N N N N a N va N va NIU uvvuv va N N N N N va N N auv N N va N N N N N N N N N a _ 1

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10/05/64 BOH U 325-k301 LINE COIPONENT 47 02-05-0378 68 05-03-0207 49 96r03-0088 5D 86-05-0001 51 45-01-0005 52 15-01-0051 53 92-01-0009 56 77'01-0161 55 77'01-0163 56 80-01-0162 5? 83-01-0207 INIERPLEK ELECTRONICS; INC. BILL OF MATERIAL LISTING LD-1’K PENCIL BOX KT DESCRIPTION NOUSING BAG LD-1 HOUSING ASSY HSNG AIRHLD RN 2 3/8 YINRMN FAST C1309D-6A BATT HLDR‘PLAS DOUBLE SIDE TAPE-INLH RBBR BHPRS SMITH 12‘51 LD-1 ’ACKAGE LABEL Rll LD-1 BLK DGRH LBL RIE HARRINY' B REPAIR INFO LD-1 MANUAL RIF GYY a A a A L 5 a N a PAGE m w w w m w w w m N a < r="" ,="">

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APPLICATION NOTE For Capacitor C4 InstalTed External ca acitor 100 icofarad .001 m cro arad .01 micro ara .1 microfara 1.0 microfarad micr f d For itor 04 Removed 10 icofarad .00 ' f r d .0 m‘ r f rad .1 microfarad 1.0 microfarad 10 microfarad 16

APPLICATION

NOTE

For Capaci tor Ot I

nsta'l I

External capacitor Frequency

(HZ)

100 oicofarad 917

.001

microfarad 505

.01 mlcrofarad 9?

microfarad 10

1.0

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FIG.I

% FIG.2 4-40 X3/8 PN HD SCREW BEND LEADS ©‘—#4 LOCKWASHER @z’ 4— 4o NUT FIG.3 ‘—4-40 FL HD SCREWS—F? SK—SO/IF 33 i) J>1r_i,____.__n $TOP OF BOARD 4——#4 LOCKWASHERS —-—-V' 4—4-40 NUTS—r- FIGA SK /50/|F 33 5 TIE POINTS DECIDE] 00000 1 LABEL 18

4-4ox3/8 PN

HD ScREw-

BEND

LEADS

FIG.2

6p'<-*+ LocKwASHER

@k- 4-4o NUr

FIG.3

TOP OF BOARD

# #4 LOCKWASHERS F-

<- 4-4O ilUTS

sK-30/tF 33

FIG.4

/5 oltF 3l

sK-

FIG.5

LOCKWASHER

NYLON FLEX CLIP

T4 LARGE

FLAT

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UPPER

LEFT @RT{ER

SOLDER

SIDE

FIG.6

HOLES

IN BOX

RUBSER

FOOT

FOR

PtACEffilIT: ROTATE BOTTOM

OF FOOT WHILE GENTLY

SEATED

PULLING

UP ON

i{ECK

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