HSMF-C 143
Side View 5
Data Sheet
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Pan Number Color Package
HSMF7C143 AHnGaP AmberIClHAHnGaPGreen Watercrear
Parameter AIInGaP Unit
Forward current 30 mA
Ppwerdrssrpatron 72 mW
Operating temperature 730 to 85 ’C
Storage temperature 740 to 85 ’C
Reverse vortage Not recommended V
HSMF-C143
Side View SMT ChipLED
Data Sheet
Caution: This LED is class 1A ESD sensitive. Please observe appropriate precautions during handling and processing.
Package Dimensions
• All dimensions are in mm.
• Tolerance ±0.1mm unless otherwise specified.
Device Selection Guide
Part Number
Color
Package
HSMF-C143
AlInGaP Amber (C1) / AlInGaP Green
(C2)
Water Clear
Absolute Maximum Value at TA = 25°C
Parameter
AlInGaP
Unit
Forward current
30
mA
Power dissipation
72
mW
Operating temperature
-30 to 85
°C
Storage temperature
-40 to 85
°C
Reverse voltage
Not recommended
V
Luminous inhensiMnch) Dominant
Viewing Forward voliageiV)
Min Typ Typ Typ Typ Min Max
AiinGaP 18 33 570 571 120 1.6 24
AiinGaP 285 103 589 591 120 1.6 24
Optical/Electrical Characteristics at TA = 25°C, If=20mA
Color
Luminous intensity(mcd)
Dominant
wavelength(nm)
Peak
wavelength(nm)
Viewing
angle(°)
Forward voltage(V)
Min
Typ
Typ
Typ
Typ
Min
Max
AlInGaP
Green
18
33
570
571
120
1.6
2.4
AlInGaP
Amber
28.5
103
589
591
120
1.6
2.4
• Forward voltage tolerance is ±0.1V.
Relative intensity vs Wavelength
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
380 430 480 530 580 630 680 730 780
RELATIVE INTENSITY
WAVELENGTH - nm
Amber Green
Forward current vs Forward voltage
Relative intensity vs Forward current
0
5
10
15
20
25
30
35
0 1 2 3 4
FORWARD CURRENT - mA
FORWARD VOLTAGE - V
0
0.2
0.4
0.6
0.8
1
1.2
1.4
0 5 10 15 20 25 30
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
FORWARD CURRENT - mA
Relative intensity vs Angle
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-90 -60 -30 0 30 60 90
NORMALIZED INTENSITY
ANGULAR DISPLACEMENT - DEGREES
C1 C2
Ill-303K.
zss - m’( ——
3mm m \
“HIEIITUIE
TIME
(mm-mum)
Maximum forward current vs Ambient temperature
Recommended Pb free reflow solder profile
0
5
10
15
20
25
30
35
0 10 20 30 40 50 60 70 80 90
Forward Current-mA
Ambient Temperature-°C
1
500 zoo nan _ ‘ Luminous Direclion
L "\¥c2
Anode
I
, 7 2mm 0
__ (2 35: rm) (7 01 DE)
m 1
( 511)TYP'
( 57; w
Recommended soldering pad pattern
Unit:mm
Reel dimensions
Unit:mm
u um m
(mummy
2 00:0 as ‘ mum
.1572 Gu4
(‘57; um) (.nsunauz)
fl nae-n 36
4m
,0 315+ mm
4 004/
(4382.002)
K .
mg? g
a} ,
—.
Usnr Feed Direcnan
Luminous Intensity Bin
Bin Min (mm!) Max (mm)
M 18.0 28.5
N 28.5 45.0
P 45.0 71.5
0 71.5 112.5
R 1125 180.0
T
AIInGaP G reen Color Bin
Bin Min (nm) Max (nm)
A 561.5 564.5
B 564.5 567.5
C 567.5 570.5
D 570.5 573.5
E 5735 576.5
Tape dimensions
Unit:mm(inches)
Storage condition:
5 to 30°C at 60% RH max.
Baking is required before mounting if:
(1) Humidity indicator card is >10% when read at 23±5°C.
(2) Device expose to factory conditions <30°C/60%RH more than 672 hours.
Baking recommended condition: 60±5°C for 20 hours.
Luminous Intensity Bin
Bin
Min (mcd)
Max (mcd)
M
18.0
28.5
N
28.5
45.0
P
45.0
71.5
Q
71.5
112.5
R
112.5
180.0
Tolerance for each bin limit is ±15%
AlInGaP Green Color Bin
Bin
Min (nm)
Max (nm)
A
561.5
564.5
B
564.5
567.5
C
567.5
570.5
D
570.5
573.5
E
573.5
576.5
Tolerance for each bin limit is ± 0.5nm
AIInGaP AmberColnr Bin
Bin Min (nm) Max (nm)
A 582 0 584.5
E 584 5 587.0
C 587 0 589.5
D 589 5 592.0
E 592 0 594.5
F 594 5 597.0
AlInGaP Amber Color Bin
Bin
Min (nm)
Max (nm)
A
582.0
584.5
B
584.5
587.0
C
587.0
589.5
D
589.5
592.0
E
592.0
594.5
F
594.5
597.0
Tolerance for each bin limit is ± 1nm
DISCLAIMER
AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR
SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT
OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS
SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL
LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.