MP34DT02 Datasheet by STMicroelectronics

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This is information on a product in full production.
September 2014 DocID026560 Rev 2 1/16
MP34DT02
MEMS audio sensor omnidirectional digital microphone
Datasheet
-
production data
Features
•Single supply voltage
•Low power consumption
•120 dBSPL acoustic overload point
•60 dB signal-to-noise ratio
•Omnidirectional sensitivity
•–26 dBFS sensitivity
•PDM output
•HCLGA package
– Top-port design
– SMD-compliant
– EMI-shielded
– ECOPACK
®
,
RoHS, and “Green” compliant
Applications
•Mobile terminals
•Laptop and notebook computers
•Portable media players
•VoIP
•Speech recognition
•A/V eLearning devices
•Gaming and virtual reality input devices
•Digital still and video cameras
•Antitheft systems
Description
The MP34DT02 is an ultra-compact, low-power,
omnidirectional, digital MEMS microphone built
with a capacitive sensing element and an IC
interface.
The sensing element, capable of detecting
acoustic waves, is manufactured using a
specialized silicon micromachining process
dedicated to produce audio sensors.
The IC interface is manufactured using a CMOS
process that allows designing a dedicated circuit
able to provide a digital signal externally in PDM
format.
The MP34DT02 has an acoustic overload point of
120 dBSPL with a 60 dB signal-to-noise ratio and
–26 dBFS sensitivity.
The MP34DT02 is available in a top-port, SMD-
compliant, EMI-shielded package and is
guaranteed to operate over an extended
temperature range from -40 °C to +85 °C.
HCLGA (3 x 4 x 1.06) mm 4LD
Table 1. Device summary
Order codes Temperature range [°C] Package Packing
MP34DT02 -40 to +85 HCLGA (3 x 4 x 1.06) mm 4LD Tray
MP34DT02TR -40 to +85 HCLGA (3 x 4 x 1.06) mm 4LD Tape and reel
www.st.com
Contents MP34DT02
2/16 DocID026560 Rev 2
Contents
1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Acoustic and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Acoustic and electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2 Frequency response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3 Application recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.1 Timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4 Sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
6 Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
6.1 L/R channel selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
7 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
8 Carrier tape mechanical specifications . . . . . . . . . . . . . . . . . . . . . . . . . 13
9 Process recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
emszansmussu (BOTTOM VIEW)
DocID026560 Rev 2 3/16
MP34DT02 Pin description
16
1 Pin description
Figure 1. Pin connections
Table 2. Pin description
Pin n° Pin name Function
1 Vdd Power supply
2 LR Left/Right channel selection
3 CLK Synchronization input clock
4 DOUT Left/Right PDM data output
5 (ground ring) GND 0 V supply
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Acoustic and electrical specifications MP34DT02
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2 Acoustic and electrical specifications
2.1 Acoustic and electrical characteristics
The values listed in the table below are specified for Vdd = 1.8 V, Clock = 2.4 MHz,
T = 25 °C, unless otherwise noted.
Table 3. Acoustic and electrical characteristics
Symbol Parameter Test condition Min. Typ.
(1)
1. Typical specifications are not guaranteed.
Max. Unit
Vdd Supply voltage 1.64 1.8 3.6 V
Idd Current consumption in
normal mode Mean value 0.6 mA
IddPdn Current consumption in
power-down mode
(2)
2. Input clock in static mode.
20 µA
Scc Short-circuit current 1 10 mA
AOP Acoustic overload point 120 dBSPL
So Sensitivity -29 -26 -23 dBFS
SNR Signal-to-noise ratio A-weighted at 1 kHz,
1 Pa 60 dB
PSR Power supply rejection Guaranteed by
design -70 dBFS
Clock Input clock frequency
(3)
3. Duty cycle: min = 40% max = 60%.
1 2.4 3.25 MHz
Ton Turn-on time
(4)
4. Time from the first clock edge to valid output data.
Guaranteed by
design 10 ms
Top Operating temperature
range -40 +85 °C
V
IOL
Low level logic
input/output voltage I
out
= 1 mA -0.3 0.35xVdd V
V
IOH
High level logic
input/output voltage I
out
= 1 mA 0.65xVdd Vdd+0.3 V
Table 4. Distortion specifications
Parameter Test condition Value
Distortion 100 dBSPL (1 kHz) < 1% THD+N
Distortion 115 dBSPL (1 kHz) < 2% THD+N
Distortion 120 dBSPL (1 kHz) < 10% THD+N
+30 ‘25 +20 .‘5 +10 *5 .0 Sen 6 20 50 100 200 500 1k 2k 5k 10k Frequencv (Hz)
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MP34DT02 Acoustic and electrical specifications
16
2.2 Frequency response
Figure 2. Typical frequency response normalized at 1 kHz
Application recommendations MP34DT02
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3 Application recommendations
Figure 3. MP34DT02 electrical connections (Top view)
Figure 4. MP34DT02 electrical connections for stereo configuration (Top view)
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DocID026560 Rev 2 7/16
MP34DT02 Application recommendations
16
Power supply decoupling capacitors (100 nF ceramic, 10 µF ceramic) should be placed as
near as possible to pin 1 of the device (common design practice).
The L/R pin must be connected to Vdd or GND (refer to Table 5).
3.1 Timing characteristics
Figure 5. Timing waveforms
Table 5. Timing characteristics
Parameter Description Min Max Unit
f
CLK
Clock frequency for normal mode 1 3.25 MHz
f
PD
Clock frequency for power-down mode 0.23 MHz
T
CLK
Clock period for normal mode 308 1000 ns
T
R,EN
Data enabled on DATA line, L/R pin = 1 18
(1)
1. From design simulations
ns
T
R,DIS
Data disabled on DATA line, L/R pin = 1 16
(1)
ns
T
L,EN
Data enabled on DATA line, L/R pin = 0 18
(1)
ns
T
L,DIS
Data disabled on DATA line, L/R pin = 0 16
(1)
ns
High Z High Z
High Z High Z
TL,EN
R,DIS
R,EN
T
L,DIS
T
T
TCLK
AM045165v1
CLK
PDM R
PDM L
Sensing element MP34DT02
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4 Sensing element
The sensing element shall mean the acoustic sensor consisting of a conductive movable
plate and a fixed plate placed in a tiny silicon chip. This sensor transducers the sound
pressure into the changes of coupled capacity between those two plates.
Omron Corporation supplies this element for STMicroelectronics.
DocID026560 Rev 2 9/16
MP34DT02 Absolute maximum ratings
16
5 Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Table 6. Absolute maximum ratings
Symbol Ratings Maximum value Unit
Vdd Supply voltage -0.3 to 6 V
Vin Input voltage on any control pin -0.3 to Vdd +0.3 V
T
STG
Storage temperature range -40 to +125 °C
ESD
Electrostatic discharge protection 2 (HBM) kV
3 discharges at ± 8 kV direct contact to lid when unit
is grounded (IEC 61000-4-2) and 3 discharges at ±
2 kV direct contact to I/O pins. (MIL 883E, Method
3015.7)
± 8 kV
This device is sensitive to mechanical shock, improper handling can cause
permanent damage to the part.
This device is ESD-sensitive, improper handling can cause permanent damage to the
part.
Functionality MP34DT02
10/16 DocID026560 Rev 2
6 Functionality
6.1 L/R channel selection
The L/R digital pad lets the user select the DOUT signal pattern as shown in Table 7. The
L/R pin must be connected to Vdd or GND.
Table 7. L/R channel selection
L/R CLK low CLK high
GND Data valid High impedance
Vdd High impedance Data valid
DocID026560 Rev 2 11/16
MP34DT02 Package mechanical data
16
7 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
Soldering information
The HCLGA 3x4 4LD package is also compliant with the RoHS and “Green” standards and
is qualified for soldering heat resistance according to JEDEC J-STD-020.
Landing pattern and soldering recommendations are available at www.st.com.
Figure 6. Recommended soldering profile limits
Table 8. Recommended soldering profile limits
Description Parameter Pb free
Average ramp rate T
L
to T
P
3 °C/sec max
Preheat
Minimum temperature
Maximum temperature
Time (T
SMIN
to T
SMAX
)
T
SMIN
T
SMAX
t
S
150 °C
200 °C
60 sec to 120 sec
Ramp-up rate T
SMAX
to T
L
Time maintained above liquidus temperature
Liquidus temperature t
L
T
L
60 sec to 150 sec
217 °C
Peak temperature T
P
260 °C max
Time within 5 °C of actual peak temperature 20 sec to 40 sec
Ramp-down rate 6 °C/sec max
Time 25 °C (t25 °C) to peak temperature 8 minutes max
T25°C to PEAK
RAMP-DOWN
RAMP-UP
ts
PREHEAT
tL
tp
CRITICAL ZONE
TLto TP
TSMAX
TSMIN
TIME
TP
TL
TEMPERATURE
30 60 90 120 150 180 210 240 270 300 330 360 390 AM045166v1
272 372 POAjSMOGLA
Package mechanical data MP34DT02
12/16 DocID026560 Rev 2
Figure 7. HCLGA (3 x 4 x 1.06 mm) 4-lead package outline
Note: The MEMS microphone metal cap can exhibit some level of variation in color when the
device is subjected to thermal process.
Dimensions are in millimeter unless otherwise specified. General tolerance is ± 0.15 mm
unless otherwise specified.
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Table 9. HCLGA (3 x 4 x 1.06 mm) mechanical data
Item Dimension (mm) Tolerance (mm)
Length [L] 4 ± 0.1
Width [W] 3 ± 0.1
Height [H] 1.06 ± 0.1
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DocID026560 Rev 2 13/16
MP34DT02 Carrier tape mechanical specifications
16
8 Carrier tape mechanical specifications
Figure 8. Carrier tape without microphone-top view
Figure 9. Carrier tape with microphone-top view
xx xi
Process recommendations MP34DT02
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9 Process recommendations
To ensure a consistent manufacturing process it is strongly advised to comply with following
recommendations:
– The recommended pick-up area for the MP34DT02 package must be defined
using the worst case (ie. no device alignment during picking process). This area
has been defined considering all the tolerances of the components involved (reel,
package, sound inlet). Picker tolerance shall be considered as well.
– To prevent damage to the MEMS membrane or incorrect pick-up and placement,
do not pick up the component on the inlet area
– For the package outline please refer to Figure 10. Nozzle shape, size, and
placement accuracy are the other key factors to consider when deciding on the
coordinates for the picking.
– Device alignment before picking is highly recommended.
– A vacuum force greater than 7 psi must be avoided
– 1 kPa = 0.145 psi (lb/in2) = 0.0102 kgf/cm² = 0.0098 atm
– All the recommended dimensions (device safe pick area) do not include the pick
and place equipment tolerances
– According to Figure 10, standard picker tool can be used to handle this device
Figure 10. Recommended picking area
GAMS3107141420SG
2.27 Pocket Size Clearance
Sound Port Positional Tolerance
Safe Pick Area
Pocket Positional Tolerance
Package Size Tolerance
1.245
0.58
1.99
Radius of package
corner (0.25 mm)
0.285
1.49
0.23
0.96
DocID026560 Rev 2 15/16
MP34DT02 Revision history
16
10 Revision history
Table 10. Document revision history
Date Revision Changes
19-Jun-2014 1 Initial release
03-Sep-2014 2
Updated sensitivity values parameter Table 3 on page 4
Added:
–Table 4: Distortion specifications on page 4 and Figure 2:
Typical frequency response normalized at 1 kHz on
page 5
–Section 3: Application recommendations on page 6
–Section 9: Process recommendations on page 14
MP34DT02
16/16 DocID026560 Rev 2

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