DSC2311 Datasheet by Microchip Technology

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‘ MIC§CHIP DSC2311
2016 Microchip Technology Inc. DS20005611A-page 1
DSC2311
Features
• Two Simultaneous CMOS Outputs
- Output 1 Range: 2.3 MHz to 170 MHz
- Output 2 Range: 2.3 MHz to 170 MHz
• Low RMS Phase Jitter: <1 ps (typ.)
• High Stability: ±25 ppm, ±50 ppm
• Wide Temperature Range
- Automotive: –40°C to +125°C
- Ext. Industrial –40°C to +105°C
- Industrial –40°C to +85°C
- Ext. Commercial –20°C to +70°C
• High Supply Noise Rejection: –50 dBc
• High Shock and Vibration Immunity
- Qualified to MIL-STD-883
• High Reliability
- 20x higher MTBF than crystal-based clock
generator designs
• Supply Range of 2.25V to 3.6V
• Lead Free and RoHS-Compliant
Applications
• Consumer Electronics
• Camera and Imaging Modules
• Home Automation
• Industrial and Power Conversion
• Mobile Communications, Internet, and Sensor
Devices
• Solid State, Hard Drive, and Flash Drive Storage
General Description
The DSC2311 is a crystal-less™ clock generator that is
factory-configurable to simultaneously output two
separate frequencies from 2.3 MHz to 170 MHz. The
clock generator uses proven silicon MEMS technology
to provide low jitter and high frequency stability across
a wide range of supply voltages and temperatures. By
eliminating the external quartz crystal, crystal-less
clock generators significantly enhance reliability and
accelerate product development, while meeting
stringent clock performance criteria for a variety of
consumer electronics, communications, and storage
applications.
DSC2311 has an Output Enable/Disable feature that
allows it to disable the outputs when OE is low. The
device is available in a space-saving 6-pin 2.5 mm x
2.0 mm crystal-less VDFN package that uses only a
single external bypass capacitor. This requires a PCB
footprint equivalent to that of a 1.0 mm x 1.0 mm
crystal-based clock generator.
Block Diagram
Control Circuitry
MEMS PLL Output
Control
and
Divider
FOUT2
FOUT1
OE
Crystal-less™ Configurable Two-Output Clock Generator
x VDD DD DD
DSC2311
DS20005611A-page 2 2016 Microchip Technology Inc.
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage .......................................................................................................................................... –0.3V to +4.0V
Input Voltage .......................................................................................................................................–0.3V to VDD+0.3V
ESD Protection (HBM) ...............................................................................................................................................4 kV
ESD Protection (CDM) ............................................................................................................................................1.5 kV
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
Specifications: VDD = 3.3V; TA = +25°C unless otherwise specified.
Parameters Sym. Min. Typ. Max. Units Conditions
Supply Voltage (Note 1)V
DD 2.25 — 3.6 V —
Supply Current (Note 2)I
DD —2123mA
EN pin low. All outputs
disabled.
Frequency Stability (Note 3)∆f
——±25
ppm
Includes frequency
variations due to initial
tolerance, temperature, and
power supply voltage.
——±50
Aging ∆f — — ±5 ppm One year at +25°C
Start-up Time (Note 4)t
SU — — 5 ms T = +25°C
Input Logic Levels VIH 0.75 x VDD —— VInput logic high
VIL — — 0.25 x VDD Input logic low
Output Disable Time tDA ——5 ns—
Output Enable Time tEN ——20ns—
Pull-Up Resistor (Note 2)——40—kΩPull-up exists on all digital
IO
Output Logic Levels VOH 0.9 x VDD —— VOutput logic high, I = ±6 mA
VOL — — 0.1 x VDD Output logic low, I = ±6 mA
Output Transition Time
tR—1.12.0
ns
Rise time. 20% to 80%;
CL = 15 pF
tF—1.42.0 Fall time. 20% to 80%;
CL = 15 pF
Frequency f0
2.3 — 170
MHz
Commercial/Industrial temp.
range
3.3 — 100 Automotive temp. range
3.3 — 170 Extended Industrial temp.
range
Note 1: Pin 4 VDD should be filtered with a 0.01 µF capacitor.
2: Output is enabled if Enable pad is floated or not connected. Operating current = disabled current + ∆IDD
from FOUT1 + ∆IDD from FOUT2. See Current Consumption graph for more information.
3: For other ppm stabilities, please contact the factory.
4: tSU is time to 100 ppm stable output frequency after VDD is applied and outputs are enabled.
5: Period jitter includes crosstalk from adjacent output.
DD
2016 Microchip Technology Inc. DS20005611A-page 3
DSC2311
Output Duty Cycle SYM 45 — 55 % —
Period Jitter (Note 5)J
PER —3—ps
RMS FO1 = FO2 = 25 MHz
Integrated Phase Noise JCC
—0.3—
psRMS
200 kHz to 20 MHz @
25 MHz
—0.38— 100 kHz to 20 MHz @
25 MHz
—1.72 12 kHz to 20 MHz @
25 MHz
ELECTRICAL CHARACTERISTICS (CONTINUED)
Specifications: VDD = 3.3V; TA = +25°C unless otherwise specified.
Parameters Sym. Min. Typ. Max. Units Conditions
Note 1: Pin 4 VDD should be filtered with a 0.01 µF capacitor.
2: Output is enabled if Enable pad is floated or not connected. Operating current = disabled current + ∆IDD
from FOUT1 + ∆IDD from FOUT2. See Current Consumption graph for more information.
3: For other ppm stabilities, please contact the factory.
4: tSU is time to 100 ppm stable output frequency after VDD is applied and outputs are enabled.
5: Period jitter includes crosstalk from adjacent output.
DSC2311
DS20005611A-page 4 2016 Microchip Technology Inc.
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Operating Temperature Range (T)
TA–20 — +70 °C Ordering Option E
TA–40 — +85 °C Ordering Option I
TA–40 — +105 °C Ordering Option L
TA–40 — +125 °C Ordering Option M
Junction Temperature TJ— — +150 °C —
Storage Temperature Range TS–40 — +150 °C —
Soldering Temperature Range — — — +260 °C 40 sec. max.
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature, and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
2016 Microchip Technology Inc. DS20005611A-page 5
DSC2311
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1: PIN FUNCTION TABLE
Pin Number Pin Name Description
1 ENABLE Output Enable for both CLK0 and CLK1.
2 N/C Do not connect.
3 GROUND Ground.
4 CLK0 Clock Output 0 (CMOS).
5 CLK1 Clock Output 1 (CMOS).
6 VDD Supply Voltage.
DSC2311
DS20005611A-page 6 2016 Microchip Technology Inc.
3.0 OUTPUT WAVEFORM
FIGURE 3-1: OE Function and Output Waveform: LVCMOS.
VOH
VOL
VIL
1/f
o
Output
Enable
t
DA
t
F
t
R
VIH
Al / Output vs. Frequency and Load @ 3.3V V
2016 Microchip Technology Inc. DS20005611A-page 7
DSC2311
4.0 CURRENT CONSUMPTION
Total Current = Disabled Current + ∆IDD FOUT1 + ∆IDD FOUT2
FIGURE 4-1: ∆IDD / Output vs. Frequency and Load @ 3.3V VDD
3 pF
5 pF
10 pF
15 pF
F
OUT
(MHz)
ΔI
DD
(mA)
0 20 40 60 80 100 120 140
18
16
14
12
10
8
6
4
2
0
DSC2311
DS20005611A-page 8 2016 Microchip Technology Inc.
5.0 SOLDER REFLOW PROFILE
260°C
217°C
200°C
150°C
25°C
TEMPERATURE (°C)
8 MINUTES MAX.
3°C/SEC. MAX.
3°C/SEC. MAX.
PRE-HEAT
REFLOW
COOL
TIME
60-180
SECONDS
60-150
SECONDS
20-40
SECONDS
6°C/SEC. MAX.
6-PIN QFN MSL 1 @ 260°C refer to JSTD-020C
Ramp-Up Rate (200°C to Peak Temp) 3°C/sec. max.
Preheat Time 150°C to 200°C 60-180 sec.
Time Maintained above 217°C 60-150 sec.
Peak Temperature 255°C to 260°C
Time within 5°C of Actual Peak 20-40 sec.
Ramp-Down Rate 6°C/sec. max.
Time 25°C to Peak Temperature 8 minutes max.
SEATING PLANE SIDE VIEW i t “'1 -
2016 Microchip Technology Inc. DS20005611A-page 9
DSC2311
6.0 PACKAGE MARKING INFORMATION
6-Lead VDFN 2.5 mm x 2.0 mm Package Outline and Recommended Land Pattern
B
A
0.05 C
0.05 C
(DATUM B)
(DATUM A)
C
SEATING
PLANE
1
N
2X TOP VIEW
SIDE VIEW
NOTE 1
0.10 C
0.08 C
Microchip Technology Drawing C04-1005A Sheet 1 of 2
2X
6X
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN]
D
E
A
A1
0.10 C A B
0.05 C
BOTTOM VIEW
12
N
2X b2
4X b1
5X L1
L2
e
2
DSC2311
DS20005611A-page 10 2016 Microchip Technology Inc.
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
2.
3.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package is saw singulated
Dimensioning and tolerancing per ASME Y14.5M
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Microchip Technology Drawing C04-1005A Sheet 2 of 2
6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN]
Number of Terminals
Overall Height
Terminal Width
Overall Width
Terminal Length
Pitch
Standoff
Units
Dimension Limits
A1
A
b1
e
L2
E
N
0.825 BSC
0.665
0.60
0.80
0.00
0.65
0.765
0.85
0.02
2.00 BSC
MILLIMETERS
MIN NOM
6
0.865
0.70
0.90
0.05
MAX
Overall Length D 2.50 BSC
Terminal Length L1 0.60 0.70 0.80
Terminal Width b2 0.20 0.25 0.30
2016 Microchip Technology Inc. DS20005611A-page 11
DSC2311
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C
Contact Pad Width (X4)
Contact Pad Spacing
Contact Pad Width (X2)
Contact Pitch
X2
X1
0.25
0.65
MILLIMETERS
0.825 BSC
MIN
E
MAX
1.45
Space Between Contacts (X3)
Space Between Contacts (X4)
G2
G1
0.60
0.38
Microchip Technology Drawing C04-3005A
NOM
6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN]
12
6
YContact Pad Length (X6) 0.85
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
C
E
X1
X2
Y
G1
G2
SILK SCREEN
DSC2311
DS20005611A-page 12 2016 Microchip Technology Inc.
NOTES:
2016 Microchip Technology Inc. DS20005611A-page 13
DSC2311
APPENDIX A: REVISION HISTORY
Revision A (September 2016)
• Converted Micrel data sheet DSC2311 to Micro-
chip DS20005611A.
• Minor text changes throughout.
• Package name updated to VDFN.
DSC2311
DS20005611A-page 14 2016 Microchip Technology Inc.
NOTES:
PART NO. X X X ~RXXXX X T T ‘ O 0 cusmme a der limr Faun OUTZ
2016 Microchip Technology Inc. DS20005611A-page 15
DSC2311
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
a) DSC2311KE1-RxxxxT: Crystal-less Configurable
Two-Output Clock Genera-
tor, 6-LD VDFN, Extended
Commercial Temp. Range,
±50 ppm Stability, Custom
Frequency (FOUT1 and
FOUT2), Tape & Reel
b) DSC2311KM2-Rxxxx: Crystal-less Configurable
Two-Output Clock Genera-
tor, 6-LD VDFN, Automotive
Temp. Range, ±25 ppm Sta-
bility, Custom Frequency
(FOUT1 and FOUT2), Tube
PART NO.
X
X
Package
Stability
Device
Device: DSC2311: Crystal-less Configurable Two-Output Clock
Generator
Package: K = 6-LEAD 2.5 mm x 2.0 mm VDFN
Temperature
Range: E = –20C to +70C (Extended Commercial)
I = –40C to +85C (Industrial)
L = –40C to +105C (Extended Industrial)
M= –40C to +125C (Automotive)
Stability: 1=±50 ppm
2=±25 ppm
Frequency: Rxxxx = Custom Frequency Code
Packing Option: Blank = Tube
T=Tape & Reel
X
Package
X
Temperature
Range
-Rxxxx
Frequency
Output Clock Frequencies
Output frequencies are factory-configured to individual customer
and product requirements, subject to output control and divider lim-
itations. Contact sales with your custom frequency needs.
Frequency Code FOUT1 (MHz) FOUT2 (MHz)
R0001 127 127
R0002 25 125
DSC2311
DS20005611A-page 16 2016 Microchip Technology Inc.
NOTES:
YSTEM
2016 Microchip Technology Inc. DS20005611A-page 17
Information contained in this publication regarding device
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and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
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The Microchip name and logo, the Microchip logo, AnyRate,
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KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST,
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are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company,
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IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut,
BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
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EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip
Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
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SQTP is a service mark of Microchip Technology Incorporated
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All other trademarks mentioned herein are property of their
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© 2016, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0986-1
Note the following details of the code protection feature on Microchip devices:
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• Microchip is willing to work with the customer who is concerned about the integrity of their code.
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QUALITYMANAGEMENTS
YSTEM
CERTIFIEDBYDNV
== ISO/TS16949==
6‘ ‘MICRDCHIP
DS20005611A-page 18 2016 Microchip Technology Inc.
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MEMS OSC XO 2.25V-3.6V 6VDFN
MEMS OSC XO 2.25V-3.6V 6VDFN
MEMS OSC XO 2.25V-3.6V 6VDFN
MEMS OSC XO 2.25V-3.6V 6VDFN
MEMS OSC XO 2.25V-3.6V 6VDFN
MEMS OSC XO 2.25V-3.6V 6VDFN
MEMS OSC XO 2.25V-3.6V 6VDFN
MEMS OSC XO 2.25V-3.6V 6VDFN
MEMS OSC XO 2.25V-3.6V 6VDFN
MEMS OSC XO 2.25V-3.6V 6VDFN