GDZ5V1LP3 - GDZ8V2LP3 Datasheet by Diodes Incorporated

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ms ® GD22V7LP3 - GD224LP3 Lead «m Greer ew xx 9)
GDZ2V7LP3 - GDZ24LP3
ULTRA-SMALL LEADLESS
SURFACE MOUNT ZENER DIODE
Features
Ultra-Small Leadless Surface Mount Package (0.6 x 0.3mm)
Ultra-Low Profile Package (0.3mm)
Ideally Suited for Automated Assembly Processes
Low Leakage Current, Suitable for Battery-Powered Applications
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: X3-DFN0603-2
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: Cathode Bar
Terminals: FinishMatte Tin over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.2 mg (Approximate)
Ordering Information (Note 4)
Part Number
Case
Packaging
(Type Number)-7*
X3-DFN0603-2
10,000/Tape & Reel
*Add “-7” to the appropriate type number in Electrical Characteristics Table. Example: 6.2V Zener = GDZ6V2LP3-7.
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.
2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and
Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
xx = Product Type Marking Code
(See Electrical Characteristics Table)
Line Denotes Cathode Side
Top View
X3-DFN0603-2
1
Cathode
2
Anode
Pin 1
GDZ2V7LP3 - GDZ24LP3
Document number: DS35065 Rev. 19 – 2
1 of 5
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© Diodes Incorporated
ms GD22V7LP3 - GD224LP3
GDZ2V7LP3 - GDZ24LP3
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Power Dissipation (Note 5) TA = +25°C
PD
250 mW
Thermal Resistance, Junction to Ambient Air (Note 5) TA = +25°C
RϴJA
500 °
C/W
Operating and Storage Temperature Range
TJ, TSTG
-55 to +150 °
C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Type
Number Marking
Code
Zener Voltage Range
(Note 6)
Reverse Current
(Note 6)
VZ @ IZT
IZT
IR
@ VR
Nom (V)
Min (V)
Max (V)
mA
Typical (µA)
Max (µA)
V
GDZ2V7LP3
JB
2.7
2.57
2.84
5
20
1.0
GDZ3V0LP3
JC
3.0
2.85
3.15
5
10
1.0
GDZ3V3LP3
JD
3.3
3.14
3.47
5
10
1.0
GDZ3V6LP3
KU
3.6
3.41
3.79
5
10
1.0
GDZ3V9LP3
KJ
3.9
3.740
4.160
5
5
1.0
GDZ4V1LP3
KY
4.1
3.93
4.37
5
5.0
1.0
GDZ4V3LP3
KK
4.3
4.08
4.53
5
5.0
1.0
GDZ4V7LP3
KL
4.7
4.420
4.900
5
2.0
1.0
GDZ5V1LP3
KM
5.1
4.840
5.370
5
0.2
2.0
GDZ5V6LP3 KN 5.6 5.310 5.920 5
90
1.0
175
2.5
4.75
GDZ6V0LP3
KW
6.0
5.676
6.324
5
1.0
2.8
GDZ6V2LP3
KO
6.2
5.860
6.530
5
1.0
3.0
GDZ6V8LP3
KT
6.8
6.470
7.140
5
0.5
3.5
GDZ7V5LP3
KQ
7.5
7.060
7.840
5
0.5
4.0
GDZ8V2LP3
KX
8.2
7.760
8.640
5
0.5
5.0
GDZ9V1LP3 JE 9.1 8.65 9.56 5 0.5 6.0
GDZ10LP3 JF 10 9.50 10.50 5 0.2 7.0
GDZ11LP3 JG 11 10.45 11.55 5 0.1 8.0
GDZ12LP3 JH 12 11.40 12.60 5 0.1 8.0
GDZ13LP3
JI
13
12.35
13.65
5
0.1
8.0
GDZ15LP3
JJ
15
14.25
15.75
5
0.1
10.5
GDZ16LP3
JK
16
15.20
16.80
5
0.1
11.2
GDZ18LP3
JL
18
17.10
18.90
5
0.1
12.6
GDZ20LP3
JM
20
19.00
21.00
5
0.1
14.0
GDZ22LP3
JN
22
20.90
23.10
5
0.1
15.4
GDZ24LP3
JO
24
22.80
25.20
5
0.1
16.8
Notes: 5. Device mounted on FR-4 PCB with minimum recommended pad layout, as shown in Diodes Incorporated’s Suggested Pad Layout document, which can
be found on our website at http://www.diodes.com.
6. Short duration pulse test used to minimize self-heating effect.
GDZ2V7LP3 - GDZ24LP3
Document number: DS35065 Rev. 19 – 2
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© Diodes Incorporated
WES“ GDzzv7LP3-GDzz4LP3 fifiifl!” ‘;::-———:: II 11/ #1 TH!!! I __IIIIII Iw‘ ._ I I I II ”I“ 3!, “IIIII J J III—I I A!!! I I I 4!!! [III IIII
GDZ2V7LP3 - GDZ24LP3
0
0.05
0.10
0.15
0.20
0.25
0.30
025 50 75 100 125 150
T , AMBIENT TEMPERATURE (°C)
Figure 1 Power Derating Curve
A
P , POWER DISSIPATION (W)
D
Note 5
0.2 0.4 0.6 0.8 1.0 1.2
I , INSTANTANEOUS FORWARD CURRENT (mA)
F
0.01
0.1
1
10
100
1,000
V , INSTANTANEOUS FORWARD VOLTAGE (V)
Figure 2 Typical Forward Characteristics
F
T = 25°C
A
T = -5C
A
T = 50°C
A
T = 85°C
A
T = 125°C
A
T = 150°C
A
Figure 3 Typical Zener Breakdown Characteristics,
GDZ2V7LP3 – GDZ5V1LP3
0
5
10
15
20
0123456
Vz, ZENER VOLTAGE (V)
Iz, ZENER CURRENT (mA)
GDZ3V9LP3-7
GDZ2V7LP3-7
GDZ3V0LP3-7
GDZ3V6LP3-7
GDZ4V1LP3-7
GDZ4V3LP3-7
GDZ4V7LP3-7
GDZ5V1LP3-7
Figure 4 Typical Zener Breakdown Characteristics,
GDZ6V2LP3 – GDZ24LP3
0
5
10
15
20
510 15 20 25 30
Vz, ZENER VOLTAGE (V)
Iz, ZENER CURRENT (mA)
GDZ8V2LP3-7
GDZ6V2LP3-7
GDZ6V8LP3-7
GDZ7V5LP3-7
GDZ12LP3-7
GDZ15LP3-7
GDZ16LP3-7
GDZ22LP3-7
GDZ24LP3-7
1
10
100
1.5 22.5
V, INSTANTANEOUS REVERSE VOLTAGE (V)
R
Figure 5 Typical Reverse Characteristics - GDZ5V1LP3
I , INSTANTANEOUS REVERSE CURRENT (nA)
R
T = 25°C
A
T = 50°C
A
0
5
10
15
20
0 1 2 3 4 5
V, REVERSE VOLTAGE (V)
R
Figure 6 Typical Total Capacitance – GDZ5V1LP3
C , TOTAL CAPACITANCE (pF)
T
f = 1MHz
GDZ2V7LP3 - GDZ24LP3
Document number: DS35065 Rev. 19 – 2
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© Diodes Incorporated
GD22V7LP3 - GD224LP3
GDZ2V7LP3 - GDZ24LP3
-0.1
-0.08
-0.06
-0.04
-0.02
0
0.02
0.04
0.06
0.08
0.1
0510 15 20 25
V, ZENER VOLTAGE (V)
Z
Figure 7 Typical Temperature Coefficient of
Zener Voltage vs. Zener Voltage
TC OF V , TEMPERATURE COEFFICIENT OF
Z
ZENER VOLTAGE (%/°C)
TC
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
X3-DFN0603-2
L (2x)
Eb (2x)
D
A1 (2x)
A
e
X3-DFN0603-2
Dim
Min
Max
Typ
A
0.27
0.35
0.30
A1
0.00
0.03
0.02
b
0.19
0.29
0.24
D
0.595
0.645
0.62
E
0.295
0.345
0.32
e
-
-
0.355
L
0.14
0.24
0.19
All Dimensions in mm
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
X3-DFN0603-2
X1
Y
X
C
Dimensions
Value
(in mm)
C
0.380
X
0.230
X1
0.610
Y
0.300
GDZ2V7LP3 - GDZ24LP3
Document number: DS35065 Rev. 19 – 2
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© Diodes Incorporated
ms GD22V7LP3 - GD224LP3
GDZ2V7LP3 - GDZ24LP3
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2018, Diodes Incorporated
www.diodes.com
GDZ2V7LP3 - GDZ24LP3
Document number: DS35065 Rev. 19 – 2
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© Diodes Incorporated

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