MC10H016 Datasheet by ON Semiconductor

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Semiconductor Components Industries, LLC, 2016
August, 2016 − Rev. 9
1Publication Order Number:
MC10H016/D
MC10H016
4‐Bit Binary Counter
Description
The MC10H016 is a high-speed synchronous, pre-settable,
cascadable 4-bit binary counter. It is useful for a large number of
conversion, counting and digital integration applications.
Features
•Counting Frequency, 200 MHz Minimum
•Improved Noise Margin 150 mV
(Over Operating Voltage and Temperature Range)
•Voltage Compensated
•MECL 10K − Compatible
•Positive Edge Triggered
•These Devices are Pb-Free, Halogen Free and are RoHS Compliant
Figure 1. Pin Assignment
VCC1
Q1
Q0
TC
PE
CE
PO
VEE
VCC2
Q2
Q3
CP
MR
P3
P2
P1
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
Pin assignment is for Dual-in-Line Package
Table 1. TRUTH TABLE
CE PE MR CP Function
L
H
L
H
X
X
L
L
H
H
X
X
L
L
L
L
L
H
Z
Z
Z
Z
ZZ
X
Load Parallel (Pn to Qn)
Load Parallel (Pn to Qn)
Count
Hold
Masters Respond; Slaves Hold
Reset (Qn = LOW, TC = HIGH)
Z = Clock Pulse (Low to High); ZZ = Clock Pulse (High to Low)
Features include assertion inputs and outputs on each of the four master/
slave counting flip-flops. Terminal count is generated internally in a manner
that allows synchronous loading at nearly the speed of the basic counter.
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10H016G
AWLYYWW
120
16
1
MC10H016P
AWLYYWWG
MARKING DIAGRAMS*
PDIP−16
P SUFFIX
CASE 648−08
16
1
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G = Pb-Fee Package
PLLC−20
FN SUFFIX
CASE 775−02
20 1
*For additional marking information, refer to
Application Note AND8002/D.
†For information on tape and reel specifications, in-
cluding part orientation and tape sizes, please refer
to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
ORDERING INFORMATION
Device Package Shipping†
MC10H016FNR2G PLCC−20
(Pb-Free)
500/Tape & Reel
MC10H016PG PDIP−16
(Pb-Free)
25 Units/Tube
Propagation D Clock :9 O Clock :9 TC Setup Time P" :9 Glue CE or PE He‘d Tme Clock :9 P" Clock :9 CE or PE
MC10H016
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2
Table 2. MAXIMUM RATINGS
Symbol Characteristic Rating Unit
VEE Power Supply (VCC = 0) −8.0 to 0 Vdc
VIInput Voltage (VCC = 0) 0 to VEE Vdc
Iout Output Current
Continuous
Surge
50
100
mA
TAOperating Temperature Range 0 to +75 °C
Tstg Storage Temperature Range
Plastic
Ceramic
−55 to +150
−55 to +165
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
Table 3. ELECTRICAL CHARACTERISTICS (VEE = −5.2 V ±5%) (Note 1)
0°25°75°
Symbol Characteristic Min Max Min Max Min Max Unit
IEPower Supply Current −126 −115 −126 mA
IinH Input Current High
All Except MR
Pin 12 MR
−
−
450
1190
−
−
265
700
−
−
265
700
mA
IinL Input Current Low 0.5 −0.5 −0.3 −mA
VOH High Output Voltage −1.02 −0.84 −0.98 −0.81 −0.92 −0.735 Vdc
VOL Low Output Voltage −1.95 −1.63 −1.95 −1.63 −1.95 −1.60 Vdc
VIH High Input Voltage −1.17 −0.84 −1.13 −0.81 −1.07 −0.735 Vdc
VIL Low Input Voltage −1.95 −1.48 −1.95 −1.48 −1.95 −1.45 Vdc
1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Ifpm is maintained.
Outputs are terminated through a 50 W resistor to −2.0 V.
Table 4. AC CHARACTERISTICS
0°25°75°
Symbol Characteristic Min Max Min Max Min Max Unit
tpd Propagation Delay
Clock to Q
Clock to TC
MR to Q
1.0
0.7
0.7
2.4
2.4
2.4
1.0
0.7
0.7
2.5
2.5
2.5
1.0
0.7
0.7
2.7
2.6
2.6
ns
tset Set-up Time
Pn to Clock
CE or PE to Clock
2.0
2.5
−
−
2.0
2.5
−
−
2.0
2.5
−
−
ns
thold Hold Time
Clock to Pn
Clock to CE or PE
1.0
0.5
−
−
1.0
0.5
−
−
1.0
0.5
−
−
ns
fcount Counting Frequency 200 −200 −200 −MHz
trRise Time 0.5 2.0 0.5 2.1 0.5 2.2 ns
tfFall Time 0.5 2.0 0.5 2.1 0.5 2.2 ns
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
, :: :: :: :: :: Lw rw 1% rw w 0 U mm W mm. W mm M0 k I: k I: :: ____ ____
MC10H016
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3
PECE
CTc
MR
MSB
Q0−Q3
P0−P3
1/2 10H1091/2 10H1091/2 10H109
PECE
CTc
MR
Q0−Q3
P0−P3
PECE
CTc
MR
Q0−Q3
P0−P3
PECE
CTc
MR
Q0−Q3
P0−P3
PECE
CTc
MR
Q0−Q3
P0−P3
LSB
1/2 10H109
CLOCK
PN Counter 1 to 16 5
MC10H016 Cascaded for 5 Stage Presettable Counter
Max freq. is only OR gate delay below max when counting alone.
Note that this diagram is provided for understanding of logic operation only. It should not be used for evaluation of
propagation delays as many gate functions are achieved internally without incurring a full gate delay.
FO
TC
Q
Q
Q
Q
MASTER SLAVE
Q
Q
Q
MASTER SLAVE
Q
Q
Q
MASTER SLAVE
Q0 Q1 Q2 Q3
P0
P1 P2 P3
PE
MR
CE
CP
Figure 2. 4-Bit Binary Counter Logic Diagram
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MC10H016
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4
PACKAGE DIMENSIONS
20 LEAD PLLC
CASE 775−02
ISSUE F
−M−
−N−
−L−
Y BRK
W
V
D
D
S
L-M
M
0.007 (0.180) N S
T
S
L-M
M
0.007 (0.180) N S
T
S
L-M
S
0.010 (0.250) N S
T
XG1
B
U
Z
VIEW D−D
20 1
S
L-M
M
0.007 (0.180) N S
T
S
L-M
M
0.007 (0.180) N S
T
S
L-M
S
0.010 (0.250) N S
T
C
G
VIEW S
E
J
R
Z
A
0.004 (0.100)
−T−SEATING
PLANE
S
L-M
M
0.007 (0.180) N S
T
S
L-M
M
0.007 (0.180) N S
T
H
VIEW S
K
K1
F
G1
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
2. DIMENSIONS IN INCHES.
3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM −T−, SEATING PLANE.
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.385 0.395 9.78 10.03
B0.385 0.395 9.78 10.03
C0.165 0.180 4.20 4.57
E0.090 0.110 2.29 2.79
F0.013 0.021 0.33 0.53
G0.050 BSC 1.27 BSC
H0.026 0.032 0.66 0.81
J0.020 −−− 0.51 −−−
K0.025 −−− 0.64 −−−
R0.350 0.356 8.89 9.04
U0.350 0.356 8.89 9.04
V0.042 0.048 1.07 1.21
W0.042 0.048 1.07 1.21
X0.042 0.056 1.07 1.42
Y−−− 0.020 −−− 0.50
Z2 10 2 10
G1 0.310 0.330 7.88 8.38
K1 0.040 −−− 1.02 −−−
____
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MC10H016
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5
PACKAGE DIMENSIONS
PDIP−16
CASE 648−08
ISSUE V
STYLE 1:
PIN 1. CATHODE
2. CATHODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
7. CATHODE
8. CATHODE
9. ANODE
10. ANODE
11. ANODE
12. ANODE
13. ANODE
14. ANODE
15. ANODE
16. ANODE
STYLE 2:
PIN 1. COMMON DRAIN
2. COMMON DRAIN
3. COMMON DRAIN
4. COMMON DRAIN
5. COMMON DRAIN
6. COMMON DRAIN
7. COMMON DRAIN
8. COMMON DRAIN
9. GATE
10. SOURCE
11. GATE
12. SOURCE
13. GATE
14. SOURCE
15. GATE
16. SOURCE
18
16 9
b2
NOTE 8
DA
TOP VIEW
E1
B
b
L
A1
A
CSEATING
PLANE
0.010 CA
SIDE VIEW M
16X
D1
e
A2
NOTE 3
MBM
eB
E
END VIEW
END VIEW
WITH LEADS CONSTRAINED
DIM MIN MAX
INCHES
A−−−− 0.210
A1 0.015 −−−−
b0.014 0.022
C0.008 0.014
D0.735 0.775
D1 0.005 −−−−
e0.100 BSC
E0.300 0.325
M−−−− 10
−−− 5.33
0.38 −−−
0.35 0.56
0.20 0.36
18.67 19.69
0.13 −−−
2.54 BSC
7.62 8.26
−−− 10
MIN MAX
MILLIMETERS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-
AGE SEATED IN JEDEC SEATING PLANE GAUGE GS−3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE
NOT TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION eB IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
E1 0.240 0.280 6.10 7.11
b2
eB −−−− 0.430 −−− 10.92
0.060 TYP 1.52 TYP
c
A2 0.115 0.195 2.92 4.95
L0.115 0.150 2.92 3.81
°°
H
NOTE 5
NOTE 6
M
e/2
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