MAX 10 FPGA Device Datasheet by Intel

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Contents

Intel® MAX® 10 FPGA Device Datasheet..................................................................................................................................... 3

Electrical Characteristics...................................................................................................................................................... 3

Operating Conditions..................................................................................................................................................4

Switching Characteristics....................................................................................................................................................25

Core Performance Specifications.................................................................................................................................26

Periphery Performance Specifications..........................................................................................................................35

Configuration Specifications................................................................................................................................................57

JTAG Timing Parameters........................................................................................................................................... 58

Remote System Upgrade Circuitry Timing Specifications................................................................................................ 59

User Watchdog Internal Circuitry Timing Specifications..................................................................................................59

Uncompressed Raw Binary File (.rbf) Sizes.................................................................................................................. 59

Internal Configuration Time....................................................................................................................................... 60

Internal Configuration Timing Parameter..................................................................................................................... 61

I/O Timing....................................................................................................................................................................... 61

Programmable IOE Delay................................................................................................................................................... 62

Programmable IOE Delay On Row Pins........................................................................................................................ 62

Programmable IOE Delay for Column Pins....................................................................................................................63

Glossary.......................................................................................................................................................................... 64

Document Revision History for the Intel MAX 10 FPGA Device Datasheet...................................................................................67

Contents

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Intel® MAX® 10 FPGA Device Datasheet

This datasheet describes the electrical characteristics, switching characteristics, configuration specifications, and timing for

Intel MAX® 10 devices.

Table 1. Intel MAX 10 Device Grades and Speed Grades Supported

Device Grade Speed Grade Supported

Commercial • –C7

• –C8 (slowest)

Industrial • –I6 (fastest)

• –I7

Automotive • –A6

• –A7

Note: The –I6 and –A6 speed grades of the Intel MAX 10 FPGA devices are not available by default in the Intel Quartus® Prime

software. Contact your local Intel sales representatives for support.

Related Information

Device Ordering Information, Intel MAX 10 FPGA Device Overview

Provides more information about the densities and packages of devices in the Intel MAX 10.

Electrical Characteristics

The following sections describe the operating conditions and power consumption of Intel MAX 10 devices.

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of Intel Corporation or its subsidiaries in the U.S. and/or other countries. Intel warrants performance of its FPGA and semiconductor products to current

specifications in accordance with Intel's standard warranty, but reserves the right to make changes to any products and services at any time without notice. Intel

assumes no responsibility or liability arising out of the application or use of any information, product, or service described herein except as expressly agreed to in

writing by Intel. Intel customers are advised to obtain the latest version of device specifications before relying on any published information and before placing

orders for products or services.

*Other names and brands may be claimed as the property of others.

ISO

9001:2015

Registered

Operating Conditions

Intel MAX 10 devices are rated according to a set of defined parameters. To maintain the highest possible performance and

reliability of the Intel MAX 10 devices, you must consider the operating requirements described in this section.

Absolute Maximum Ratings

This section defines the maximum operating conditions for Intel MAX 10 devices. The values are based on experiments

conducted with the devices and theoretical modeling of breakdown and damage mechanisms. The functional operation of the

device is not implied for these conditions.

Caution: Conditions outside the range listed in the absolute maximum ratings tables may cause permanent damage to the device.

Additionally, device operation at the absolute maximum ratings for extended periods of time may have adverse effects on the

device.

Single Supply Devices Absolute Maximum Ratings

Table 2. Absolute Maximum Ratings for Intel MAX 10 Single Supply Devices

Symbol Parameter Min Max Unit

VCC_ONE Supply voltage for core and periphery through on-die voltage

regulator

–0.5 3.9 V

VCCIO Supply voltage for input and output buffers –0.5 3.9 V

VCCA Supply voltage for phase-locked loop (PLL) regulator and analog-to-

digital converter (ADC) block (analog)

–0.5 3.9 V

Dual Supply Devices Absolute Maximum Ratings

Table 3. Absolute Maximum Ratings for Intel MAX 10 Dual Supply Devices

Symbol Parameter Min Max Unit

VCC Supply voltage for core and periphery –0.5 1.63 V

VCCIO Supply voltage for input and output buffers –0.5 3.9 V

VCCA Supply voltage for PLL regulator (analog) –0.5 3.41 V

continued...

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Symbol Parameter Min Max Unit

VCCD_PLL Supply voltage for PLL regulator (digital) –0.5 1.63 V

VCCA_ADC Supply voltage for ADC analog block –0.5 3.41 V

VCCINT Supply voltage for ADC digital block –0.5 1.63 V

Absolute Maximum Ratings

Table 4. Absolute Maximum Ratings for Intel MAX 10 Devices

Symbol Parameter Min Max Unit

VIDC input voltage –0.5 4.12 V

IOUT DC output current per pin –25 25 mA

TSTG Storage temperature –65 150 °C

TJOperating junction temperature –40 125 °C

Maximum Allowed Overshoot During Transitions over a 11.4-Year Time Frame

During transitions, input signals may overshoot to the voltage listed in the following table and undershoot to –2.0 V for input

currents less than 100 mA and periods shorter than 20 ns.

The maximum allowed overshoot duration is specified as a percentage of high time over the lifetime of the device. A DC signal

is equivalent to 100% duty cycle.

For example, a signal that overshoots to 4.17 V can only be at 4.17 V for ~11.7% over the lifetime of the device; for a device

lifetime of 11.4 years, this amounts to 1.33 years.

Table 5. Maximum Allowed Overshoot During Transitions over a 11.4-Year Time Frame for Intel MAX 10 Devices

Condition (V) Overshoot Duration as % of High Time Unit

4.12 100.0 %

4.17 11.7 %

4.22 7.1 %

4.27 4.3 %

continued...

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Condition (V) Overshoot Duration as % of High Time Unit

4.32 2.6 %

4.37 1.6 %

4.42 1.0 %

4.47 0.6 %

4.52 0.3 %

4.57 0.2 %

Recommended Operating Conditions

This section lists the functional operation limits for the AC and DC parameters for Intel MAX 10 devices. The tables list the

steady-state voltage values expected from Intel MAX 10 devices. Power supply ramps must all be strictly monotonic, without

plateaus.

Single Supply Devices Power Supplies Recommended Operating Conditions

Table 6. Power Supplies Recommended Operating Conditions for Intel MAX 10 Single Supply Devices

Symbol Parameter Condition Min Typ Max Unit

VCC_ONE(1)Supply voltage for core and periphery through on-

die voltage regulator

— 2.85/3.135 3.0/3.3 3.15/3.465 V

VCCIO(2) Supply voltage for input and output buffers 3.3 V 3.135 3.3 3.465 V

3.0 V 2.85 3 3.15 V

2.5 V 2.375 2.5 2.625 V

1.8 V 1.71 1.8 1.89 V

1.5 V 1.425 1.5 1.575 V

1.35 V 1.2825 1.35 1.4175 V

continued...

(1) VCCA must be connected to VCC_ONE through a filter.

(2) VCCIO for all I/O banks must be powered up during user mode because VCCIO I/O banks are used for the ADC and I/O functionalities.

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Symbol Parameter Condition Min Typ Max Unit

1.2 V 1.14 1.2 1.26 V

1.0 V 0.95 1.0 1.05 V

VCCA (1)Supply voltage for PLL regulator and ADC block

(analog)

— 2.85/3.135 3.0/3.3 3.15/3.465 V

Dual Supply Devices Power Supplies Recommended Operating Conditions

Table 7. Power Supplies Recommended Operating Conditions for Intel MAX 10 Dual Supply Devices

Symbol Parameter Condition Min Typ Max Unit

VCC Supply voltage for core and periphery — 1.15 1.2 1.25 V

VCCIO (3) Supply voltage for input and output buffers 3.3 V 3.135 3.3 3.465 V

3.0 V 2.85 3 3.15 V

2.5 V 2.375 2.5 2.625 V

1.8 V 1.71 1.8 1.89 V

1.5 V 1.425 1.5 1.575 V

1.35 V 1.2825 1.35 1.4175 V

1.2 V 1.14 1.2 1.26 V

1.0 V 0.95 1.0 1.05 V

VCCA(4) Supply voltage for PLL regulator (analog) — 2.375 2.5 2.625 V

VCCD_PLL(5) Supply voltage for PLL regulator (digital) — 1.15 1.2 1.25 V

VCCA_ADC Supply voltage for ADC analog block — 2.375 2.5 2.625 V

VCCINT Supply voltage for ADC digital block — 1.15 1.2 1.25 V

(3) VCCIO for all I/O banks must be powered up during user mode because VCCIO I/O banks are used for the ADC and I/O functionalities.

(4) All VCCA pins must be powered to 2.5 V (even when PLLs are not used), and must be powered up and powered down at the same

time.

(5) VCCD_PLL must always be connected to VCC through a decoupling capacitor and ferrite bead.

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Recommended Operating Conditions

Table 8. Recommended Operating Conditions for Intel MAX 10 Devices

Symbol Parameter Condition Min Max Unit

VIDC input voltage — –0.5 3.6 V

VOOutput voltage for I/O pins — 0 VCCIO V

TJOperating junction temperature Commercial 0 85 °C

Industrial –40(6)100 °C

Automotive –40(6)125 °C

tRAMP Power supply ramp time — (7) 10 ms

IDiode Magnitude of DC current across PCI* clamp diode when

enabled

— — 10 mA

Programming/Erasure Specifications

Table 9. Programming/Erasure Specifications for Intel MAX 10 Devices

This table shows the programming cycles and data retention duration of the user flash memory (UFM) and configuration flash memory (CFM) blocks.

For more information about data retention duration with 10,000 programming cycles for automotive temperature devices, contact your Intel quality

representative.

Erase and reprogram cycles (E/P) (8) (Cycles/

page)

Temperature (°C) Data retention duration (Years)

10,000 85 20

10,000 100 10

(6) –40°C is only applicable to Start of Test, when the device is powered-on. The device does not stay at the minimum junction

temperature for a long time.

(7) There is no absolute minimum value for the ramp time requirement. Intel characterized the minimum ramp time at 200 μs.

(8) The number of E/P cycles applies to the smallest possible flash block that can be erased or programmed in each Intel MAX 10 device.

Each Intel MAX 10 device has multiple flash pages per device.

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DC Characteristics

Supply Current and Power Consumption

Intel offers two ways to estimate power for your design—the Excel-based Early Power Estimator (EPE) and the Intel Quartus

Prime Power Analyzer feature.

Use the Excel-based EPE before you start your design to estimate the supply current for your design. The EPE provides a

magnitude estimate of the device power because these currents vary greatly with the usage of the resources.

The Intel Quartus Prime Power Analyzer provides better quality estimates based on the specifics of the design after you

complete place-and-route. The Power Analyzer can apply a combination of user-entered, simulation-derived, and estimated

signal activities that, when combined with detailed circuit models, yield very accurate power estimates.

Related Information

•Early Power Estimator User Guide

Provides more information about power estimation tools.

•Power Analysis chapter, Intel Quartus Prime Handbook

Provides more information about power estimation tools.

I/O Pin Leakage Current

The values in the table are specified for normal device operation. The values vary during device power-up. This applies for all

VCCIO settings (3.3, 3.0, 2.5, 1.8, 1.5, 1.35, and 1.2 V).

10 µA I/O leakage current limit is applicable when the internal clamping diode is off. A higher current can be the observed

when the diode is on.

Input channel leakage of ADC I/O pins due to hot socket is up to maximum of 1.8 mA. The input channel leakage occurs when

the ADC IP core is enabled or disabled. This is applicable to all Intel MAX 10 devices with ADC IP core, which are 10M04,

10M08, 10M16, 10M25, 10M40, and 10M50 devices. The ADC I/O pins are in Bank 1A.

Table 10. I/O Pin Leakage Current for Intel MAX 10 Devices

Symbol Parameter Condition Min Max Unit

IIInput pin leakage current VI = 0 V to VCCIOMAX –10 10 µA

IOZ Tristated I/O pin leakage current VO = 0 V to VCCIOMAX –10 10 µA

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Table 11. ADC_VREF Pin Leakage Current for Intel MAX 10 Devices

Symbol Parameter Condition Min Max Unit

Iadc_vref ADC_VREF pin leakage current Single supply mode — 10 µA

Dual supply mode — 20 µA

Bus Hold Parameters

Bus hold retains the last valid logic state after the source driving it either enters the high impedance state or is removed.

Each I/O pin has an option to enable bus hold in user mode. Bus hold is always disabled in configuration mode.

Table 12. Bus Hold Parameters for Intel MAX 10 Devices

Parameter Condition VCCIO (V) Unit

1.2 1.5 1.8 2.5 3.0 3.3

Min Max Min Max Min Max Min Max Min Max Min Max

Bus-hold low, sustaining

current

VIN > VIL

(maximum)

8 — 12 — 30 — 50 — 70 — 70 — µA

Bus-hold high, sustaining

current

VIN < VIH

(minimum)

–8 — –12 — –30 — –50 — –70 — –70 — µA

Bus-hold low, overdrive

current

0 V < VIN <

VCCIO

— 125 — 175 — 200 — 300 — 500 — 500 µA

Bus-hold high, overdrive

current

0 V < VIN <

VCCIO

— –125 — –175 — –200 — –300 — –500 — –500 µA

Bus-hold trip point — 0.3 0.9 0.375 1.125 0.68 1.07 0.7 1.7 0.8 2 0.8 2 V

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Series OCT without Calibration Specifications

Table 13. Series OCT without Calibration Specifications for Intel MAX 10 Devices

This table shows the variation of on-chip termination (OCT) without calibration across process, voltage, and temperature (PVT).

Description VCCIO (V) Resistance Tolerance Unit

–C7, –I6, –I7, –A6, –A7 –C8

Series OCT without calibration 3.00 ±35 ±30 %

2.50 ±35 ±30 %

1.80 ±40 ±35 %

1.50 ±40 ±40 %

1.35 ±40 ±50 %

1.20 ±45 ±60 %

Series OCT with Calibration at Device Power-Up Specifications

Table 14. Series OCT with Calibration at Device Power-Up Specifications for Intel MAX 10 Devices

OCT calibration is automatically performed at device power-up for OCT enabled I/Os.

Description VCCIO (V) Calibration Accuracy Unit

Series OCT with calibration at device power-up 3.00 ±12 %

2.50 ±12 %

1.80 ±12 %

1.50 ±12 %

1.35 ±12 %

1.20 ±12 %

OCT Variation after Calibration at Device Power-Up

The OCT resistance may vary with the variation of temperature and voltage after calibration at device power-up.

Use the following table and equation to determine the final OCT resistance considering the variations after calibration at

device power-up.

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ARV : (V2 — V1) x 1000 >< dr/dv="" art="" :="" (tz="" —="" t1)="" x="" dr/dt="" arx="">< o;mfx="1/(I" ara/100="" +="" 1)="" arx=""> 0; MFX = ARx/100 + 1 MF = MFV x MFT Rfmal : letial X MF

Table 15. OCT Variation after Calibration at Device Power-Up for Intel MAX 10 Devices

This table lists the change percentage of the OCT resistance with voltage and temperature.

Description Nominal Voltage dR/dT (%/°C) dR/dV (%/mV)

OCT variation after calibration at device power-up 3.00 0.25 –0.027

2.50 0.245 –0.04

1.80 0.242 –0.079

1.50 0.235 –0.125

1.35 0.229 –0.16

1.20 0.197 –0.208

Figure 1. Equation for OCT Resistance after Calibration at Device Power-Up

For

The definitions for equation are as follows:

• T1 is the initial temperature.

• T2 is the final temperature.

• MF is multiplication factor.

• Rinitial is initial resistance.

• Rfinal is final resistance.

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ARV = (3.15 7 3) X 1000 X 70.027 = 74.05 ART = (85 7 25) X 0.25 = 15 Because ARV is negative, MFV = 1/(4.05/100 + 1): 0.96 Because ART is positive, MFT = 15/100 + 1 = 1.15 MF : 0.961 x 1.15 : 1.105 Rm“, = 50 x 1.105 = 55.2511 a. ‘1

• Subscript x refers to both V and T.

• ∆RV is variation of resistance with voltage.

• ∆RT is variation of resistance with temperature.

• dR/dT is the change percentage of resistance with temperature after calibration at device power-up.

• dR/dV is the change percentage of resistance with voltage after calibration at device power-up.

• V1 is the initial voltage.

• V2 is final voltage.

The following figure shows the example to calculate the change of 50 Ω I/O impedance from 25°C at 3.0 V to 85°C at 3.15 V.

Figure 2. Example for OCT Resistance Calculation after Calibration at Device Power-Up

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Pin Capacitance

Table 16. Pin Capacitance for Intel MAX 10 Devices

Symbol Parameter Maximum Unit

CIOB Input capacitance on bottom I/O pins 8 pF

CIOLRT Input capacitance on left/right/top I/O pins 7 pF

CLVDSB Input capacitance on bottom I/O pins with dedicated LVDS output (9) 8 pF

CADCL Input capacitance on left I/O pins with ADC input (10) 9 pF

CVREFLRT Input capacitance on left/right/top dual purpose VREF pin when used as VREF or user

I/O pin (11)

48 pF

CVREFB Input capacitance on bottom dual purpose VREF pin when used as VREF or user I/O pin 50 pF

CCLKB Input capacitance on bottom dual purpose clock input pins (12)7 pF

CCLKLRT Input capacitance on left/right/top dual purpose clock input pins (12)6 pF

Internal Weak Pull-Up Resistor

All I/O pins, except configuration, test, and JTAG pins, have an option to enable weak pull-up.

(9) Dedicated LVDS output buffer is only available at bottom I/O banks.

(10) ADC pins are only available at left I/O banks.

(11) When VREF pin is used as regular input or output, Fmax performance is reduced due to higher pin capacitance. Using the VREF pin

capacitance specification from device datasheet, perform SI analysis on your board setup to determine the Fmax of your system.

(12) 10M40 and 10M50 devices have dual purpose clock input pins at top/bottom I/O banks.

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Table 17. Internal Weak Pull-Up Resistor for Intel MAX 10 Devices

Pin pull-up resistance values may be lower if an external source drives the pin higher than VCCIO.

Symbol Parameter Condition Min Typ Max Unit

R_PU Value of I/O pin (dedicated and dual-purpose)

pull-up resistor before and during configuration,

as well as user mode if the programmable pull-up

resistor option is enabled

VCCIO = 3.3 V ± 5% 7 12 34 kΩ

VCCIO = 3.0 V ± 5% 8 13 37 kΩ

VCCIO = 2.5 V ± 5% 10 15 46 kΩ

VCCIO = 1.8 V ± 5% 16 25 75 kΩ

VCCIO = 1.5 V ± 5% 20 36 106 kΩ

VCCIO = 1.2 V ± 5% 33 82 179 kΩ

Hot-Socketing Specifications

Table 18. Hot-Socketing Specifications for Intel MAX 10 Devices

Symbol Parameter Maximum

IIOPIN(DC) DC current per I/O pin 300 µA

IIOPIN(AC) AC current per I/O pin 8 mA (13)

Hysteresis Specifications for Schmitt Trigger Input

Intel MAX 10 devices support Schmitt trigger input on all I/O pins. A Schmitt trigger feature introduces hysteresis to the input

signal for improved noise immunity, especially for signal with slow edge rate.

(13) The I/O ramp rate is 10 ns or more. For ramp rates faster than 10 ns, |IIOPIN| = C dv/dt, in which C is I/O pin capacitance and dv/dt

is the slew rate.

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Table 19. Hysteresis Specifications for Schmitt Trigger Input for Intel MAX 10 Devices

Symbol Parameter Condition Minimum Unit

VHYS Hysteresis for Schmitt trigger input VCCIO = 3.3 V 180 mV

VCCIO = 2.5 V 150 mV

VCCIO = 1.8 V 120 mV

VCCIO = 1.5 V 110 mV

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Logic Wlthout Schmltt Trigger 1 —)— A ( Input 0 v“ (Mn) v.“ (Min) Voltage

Figure 3. LVTTL/LVCMOS Input Standard Voltage Diagram

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a. ‘1 Logic Wlth Schmlﬂ Trlgser —> v.. (Mn) v». (Min) Input Voltage

Figure 4. Schmitt Trigger Input Standard Voltage Diagram

VHYS

I/O Standards Specifications

Tables in this section list input voltage (VIH and VIL), output voltage (VOH and VOL), and current drive characteristics (IOH and

IOL) for various I/O standards supported by Intel MAX 10 devices.

For minimum voltage values, use the minimum VCCIO values. For maximum voltage values, use the maximum VCCIO values.

You must perform timing closure analysis to determine the maximum achievable frequency for general purpose I/O standards.

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Single-Ended I/O Standards Specifications

Table 20. Single-Ended I/O Standards Specifications for Intel MAX 10 Devices

To meet the IOL and IOH specifications, you must set the current strength settings accordingly. For example, to meet the 3.3-V LVTTL specification (4 mA), you

should set the current strength settings to 4 mA. Setting at lower current strength may not meet the IOL and IOH specifications in the datasheet.

I/O Standard VCCIO (V) VIL (V) VIH (V) VOL (V) VOH (V) IOL (mA) IOH (mA)

Min Typ Max Min Max Min Max Max Min

3.3 V LVTTL 3.135 3.3 3.465 –0.3 0.8 1.7 3.6 0.45 2.4 4 –4

3.3 V LVCMOS 3.135 3.3 3.465 –0.3 0.8 1.7 3.6 0.2 VCCIO – 0.2 2 –2

3.0 V LVTTL 2.85 3 3.15 –0.3 0.8 1.7 VCCIO +

0.3

0.45 2.4 4 –4

3.0 V LVCMOS 2.85 3 3.15 –0.3 0.8 1.7 VCCIO +

0.3

0.2 VCCIO – 0.2 0.1 –0.1

2.5 V LVTTL and

LVCMOS

2.375 2.5 2.625 –0.3 0.7 1.7 VCCIO +

0.3

0.4 2 1 –1

1.8 V LVTTL and

LVCMOS

1.71 1.8 1.89 –0.3 0.35 ×

VCCIO

0.65 ×

VCCIO

2.25 0.45 VCCIO –

0.45

2 –2

1.5 V LVCMOS 1.425 1.5 1.575 –0.3 0.35 ×

VCCIO

0.65 ×

VCCIO

VCCIO +

0.3

0.25 ×

VCCIO

0.75 ×

VCCIO

2 –2

1.2 V LVCMOS 1.14 1.2 1.26 –0.3 0.35 ×

VCCIO

0.65 ×

VCCIO

VCCIO +

0.3

0.25 ×

VCCIO

0.75 ×

VCCIO

2 –2

1.0 V LVCMOS (14) 0.95 1.0 1.05 –0.3 0.35 ×

VCCIO

0.65 ×

VCCIO

VCCIO +

0.3

0.25 ×

VCCIO

0.75 ×

VCCIO

4 –4

3.3 V Schmitt Trigger 3.135 3.3 3.465 –0.3 0.8 1.7 VCCIO +

0.3

— — — —

2.5 V Schmitt Trigger 2.375 2.5 2.625 –0.3 0.7 1.7 VCCIO +

0.3

— — — —

continued...

(14) The 1.0 V LVCMOS I/O standard is only supported on the following devices: 10M02SCU324C8G, 10M04SCU324C8G,

10M08SCU324C8G, 10M16SCU324C8G, 10M16SCU169C8G, 10M16SAU169C8G, 10M16DCF484C8G, 10M16DAF484C8G,

10M25DCF484C8G, 10M25DAF484C8G, 10M40DCF484C8G, 10M40DAF484C8G, 10M50DCF484C8G, 10M50DAF484C8G.

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I/O Standard VCCIO (V) VIL (V) VIH (V) VOL (V) VOH (V) IOL (mA) IOH (mA)

Min Typ Max Min Max Min Max Max Min

1.8 V Schmitt Trigger 1.71 1.8 1.89 –0.3 0.35 ×

VCCIO

0.65 ×

VCCIO

VCCIO +

0.3

— — — —

1.5 V Schmitt Trigger 1.425 1.5 1.575 –0.3 0.35 ×

VCCIO

0.65 ×

VCCIO

VCCIO +

0.3

— — — —

3.0 V PCI 2.85 3 3.15 — 0.3 ×

VCCIO

0.5 ×

VCCIO

VCCIO +

0.3

0.1 ×

VCCIO

0.9 ×

VCCIO

1.5 –0.5

Single-Ended SSTL, HSTL, and HSUL I/O Reference Voltage Specifications

Table 21. Single-Ended SSTL, HSTL, and HSUL I/O Reference Voltage Specifications for Intel MAX 10 Devices

I/O Standard VCCIO (V) VREF (V) VTT (V) (15)

Min Typ Max Min Typ Max Min Typ Max

SSTL-2 Class I, II 2.375 2.5 2.625 1.19 1.25 1.31 VREF – 0.04 VREF VREF + 0.04

SSTL-18 Class I, II 1.7 1.8 1.9 0.833 0.9 0.969 VREF – 0.04 VREF VREF + 0.04

SSTL-15 Class I, II 1.425 1.5 1.575 0.49 × VCCIO 0.5 × VCCIO 0.51 × VCCIO 0.49 × VCCIO 0.5 × VCCIO 0.51 × VCCIO

SSTL-135 Class I, II 1.283 1.35 1.45 0.49 × VCCIO 0.5 × VCCIO 0.51 × VCCIO 0.49 × VCCIO 0.5 × VCCIO 0.51 × VCCIO

HSTL-18 Class I, II 1.71 1.8 1.89 0.85 0.9 0.95 0.85 0.9 0.95

HSTL-15 Class I, II 1.425 1.5 1.575 0.71 0.75 0.79 0.71 0.75 0.79

HSTL-12 Class I, II 1.14 1.2 1.26 0.48 × VCCIO

(16)

0.5 × VCCIO (16)0.52 × VCCIO

(16)

— 0.5 × VCCIO —

0.47 × VCCIO

(17)

0.5 × VCCIO (17)0.53 × VCCIO

(17)

HSUL-12 1.14 1.2 1.3 0.49 × VCCIO 0.5 × VCCIO 0.51 × VCCIO — — —

(15) VTT of transmitting device must track VREF of the receiving device.

(16) Value shown refers to DC input reference voltage, VREF(DC).

(17) Value shown refers to AC input reference voltage, VREF(AC).

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Single-Ended SSTL, HSTL, and HSUL I/O Standards Signal Specifications

Table 22. Single-Ended SSTL, HSTL, and HSUL I/O Standards Signal Specifications for Intel MAX 10 Devices

To meet the IOL and IOH specifications, you must set the current strength settings accordingly. For example, to meet the SSTL-15 Class I specification (8 mA), you

should set the current strength settings to 8 mA. Setting at lower current strength may not meet the IOL and IOH specifications in the datasheet.

I/O Standard VIL(DC) (V) VIH(DC) (V) VIL(AC) (V) VIH(AC) (V) VOL (V) VOH (V) IOL (mA) IOH (mA)

Min Max Min Max Min Max Min Max Max Min

SSTL-2 Class I — VREF –

0.18

VREF +

0.18

— — VREF –

0.31

VREF +

0.31

— VTT – 0.57 VTT + 0.57 8.1 –8.1

SSTL-2 Class II — VREF –

0.18

VREF +

0.18

— — VREF –

0.31

VREF +

0.31

— VTT – 0.76 VTT + 0.76 16.4 –16.4

SSTL-18 Class I — VREF –

0.125

VREF +

0.125

— — VREF –

0.25

VREF +

0.25

— VTT –

0.475

VTT +

0.475

6.7 –6.7

SSTL-18 Class II — VREF –

0.125

VREF +

0.125

— — VREF –

0.25

VREF +

0.25

— 0.28 VCCIO –

0.28

13.4 –13.4

SSTL-15 Class I — VREF – 0.1 VREF + 0.1 — — VREF –

0.175

VREF +

0.175

— 0.2 ×

VCCIO

0.8 ×

VCCIO

8 –8

SSTL-15 Class II — VREF – 0.1 VREF + 0.1 — — VREF –

0.175

VREF +

0.175

— 0.2 ×

VCCIO

0.8 ×

VCCIO

16 –16

SSTL-135 — VREF –

0.09

VREF +

0.09

— — VREF –

0.16

VREF +

0.16

— 0.2 ×

VCCIO

0.8 ×

VCCIO

— —

HSTL-18 Class I — VREF – 0.1 VREF + 0.1 — — VREF – 0.2 VREF + 0.2 — 0.4 VCCIO –

0.4

8 –8

HSTL-18 Class II — VREF – 0.1 VREF + 0.1 — — VREF – 0.2 VREF + 0.2 — 0.4 VCCIO –

0.4

16 –16

HSTL-15 Class I — VREF – 0.1 VREF + 0.1 — — VREF – 0.2 VREF + 0.2 — 0.4 VCCIO –

0.4

8 –8

HSTL-15 Class II — VREF – 0.1 VREF + 0.1 — — VREF – 0.2 VREF + 0.2 — 0.4 VCCIO –

0.4

16 –16

continued...

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I/O Standard VIL(DC) (V) VIH(DC) (V) VIL(AC) (V) VIH(AC) (V) VOL (V) VOH (V) IOL (mA) IOH (mA)

Min Max Min Max Min Max Min Max Max Min

HSTL-12 Class I –0.15 VREF –

0.08

VREF +

0.08

VCCIO +

0.15

–0.24 VREF –

0.15

VREF +

0.15

VCCIO +

0.24

0.25 ×

VCCIO

0.75 ×

VCCIO

8 –8

HSTL-12 Class II –0.15 VREF –

0.08

VREF +

0.08

VCCIO +

0.15

–0.24 VREF –

0.15

VREF +

0.15

VCCIO +

0.24

0.25 ×

VCCIO

0.75 ×

VCCIO

14 –14

HSUL-12 — VREF –

0.13

VREF +

0.13

— — VREF –

0.22

VREF +

0.22

— 0.1 ×

VCCIO

0.9 ×

VCCIO

— —

Differential SSTL I/O Standards Specifications

Differential SSTL requires a VREF input.

Table 23. Differential SSTL I/O Standards Specifications for Intel MAX 10 Devices

I/O Standard VCCIO (V) VSwing(DC) (V) VX(AC) (V) VSwing(AC) (V)

Min Typ Max Min Max(18) Min Typ Max Min Max

SSTL-2 Class I, II 2.375 2.5 2.625 0.36 VCCIO VCCIO/2 –

0.2

— VCCIO/2+

0.2

0.7 VCCIO

SSTL-18 Class I, II 1.7 1.8 1.9 0.25 VCCIO VCCIO/2 –

0.175

— VCCIO/2+

0.175

0.5 VCCIO

SSTL-15 Class I, II 1.425 1.5 1.575 0.2 — VCCIO/2 –

0.15

— VCCIO/2 +

0.15

2(VIH(AC) –

VREF)

2(VIL(AC) –

VREF)

SSTL-135 1.283 1.35 1.45 0.18 — VREF –

0.135

0.5 × VCCIO VREF +

0.135

2(VIH(AC) –

VREF)

2(VIL(AC) –

VREF)

Differential HSTL and HSUL I/O Standards Specifications

Differential HSTL requires a VREF input.

(18) The maximum value for VSWING(DC) is not defined. However, each single-ended signal needs to be within the respective single-ended

limits (VIH(DC) and VIL(DC)).

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Table 24. Differential HSTL and HSUL I/O Standards Specifications for Intel MAX 10 Devices

I/O Standard VCCIO (V) VDIF(DC) (V) VX(AC) (V) VCM(DC) (V) VDIF(AC)

(V)

Min Typ Max Min Max Min Typ Max Min Typ Max Min

HSTL-18 Class I, II 1.71 1.8 1.89 0.2 — 0.85 — 0.95 0.85 — 0.95 0.4

HSTL-15 Class I, II 1.425 1.5 1.575 0.2 — 0.71 — 0.79 0.71 — 0.79 0.4

HSTL-12 Class I, II 1.14 1.2 1.26 0.16 VCCIO 0.48 ×

VCCIO

0.5 ×

VCCIO

0.52 ×

VCCIO

0.48 ×

VCCIO

0.5 ×

VCCIO

0.52 ×

VCCIO

0.3

HSUL-12 1.14 1.2 1.3 0.26 — 0.5 ×

VCCIO –

0.12

0.5 ×

VCCIO

0.5 ×

VCCIO +

0.12

0.4 ×

VCCIO

0.5 ×

VCCIO

0.6 ×

VCCIO

0.44

Differential I/O Standards Specifications

Table 25. Differential I/O Standards Specifications for Intel MAX 10 Devices

I/O Standard VCCIO (V) VID (mV) VICM (V) (19) VOD (mV) (20)(21) VOS (V) (20)

Min Typ Max Min Max Min Condition Max Min Typ Max Min Typ Max

LVPECL (22) 2.375 2.5 2.625 100 — 0.05 DMAX ≤ 500 Mbps 1.8 — — — — — —

0.55 500 Mbps ≤ DMAX ≤

700 Mbps

1.8

1.05 DMAX > 700 Mbps 1.55

LVDS 2.375 2.5 2.625 100 — 0.05 DMAX ≤ 500 Mbps 1.8 247 — 600 1.125 1.25 1.375

0.55 500 Mbps ≤ DMAX ≤

700 Mbps

1.8

continued...

(19) VIN range: 0 V ≤ VIN ≤ 1.85 V.

(20) RL range: 90 ≤ RL ≤ 110 Ω.

(21) Low VOD setting is only supported for RSDS standard.

(22) LVPECL input standard is only supported at clock input. Output standard is not supported.

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I/O Standard VCCIO (V) VID (mV) VICM (V) (19) VOD (mV) (20)(21) VOS (V) (20)

Min Typ Max Min Max Min Condition Max Min Typ Max Min Typ Max

1.05 DMAX > 700 Mbps 1.55

BLVDS (23) 2.375 2.5 2.625 100 — — — — — — — — — —

mini-LVDS (24)2.375 2.5 2.625 — — — — — 300 — 600 1 1.2 1.4

RSDS (24)2.375 2.5 2.625 — — — — — 100 200 600 0.5 1.2 1.5

PPDS (Row I/Os)

(24)

2.375 2.5 2.625 — — — — — 100 200 600 0.5 1.2 1.4

TMDS(25) 2.375 2.5 2.625 100 — 0.05 DMAX ≤ 500 Mbps 1.8 — — — — — —

0.55 500 Mbps ≤ DMAX ≤

700 Mbps

1.8

1.05 DMAX > 700 Mbps 1.55

Sub-LVDS (26) 1.71 1.8 1.89 100 — 0.55 — 1.25 (27)0.8 0.9 1

SLVS 2.375 2.5 2.625 100 — 0.05 — 1.1 (27) (28)

continued...

(19) VIN range: 0 V ≤ VIN ≤ 1.85 V.

(20) RL range: 90 ≤ RL ≤ 110 Ω.

(21) Low VOD setting is only supported for RSDS standard.

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I/O Standard VCCIO (V) VID (mV) VICM (V) (19) VOD (mV) (20)(21) VOS (V) (20)

Min Typ Max Min Max Min Condition Max Min Typ Max Min Typ Max

HiSpi 2.375 2.5 2.625 100 — 0.05 DMAX ≤ 500 Mbps 1.8 — — — — — —

0.55 500 Mbps ≤ DMAX ≤

700 Mbps

1.8

1.05 DMAX > 700 Mbps 1.55

Related Information

Intel MAX 10 LVDS SERDES I/O Standards Support, Intel MAX 10 High-Speed LVDS I/O User Guide

Provides the list of I/O standards supported in single supply and dual supply devices.

Switching Characteristics

This section provides the performance characteristics of Intel MAX 10 core and periphery blocks.

(19) VIN range: 0 V ≤ VIN ≤ 1.85 V.

(20) RL range: 90 ≤ RL ≤ 110 Ω.

(21) Low VOD setting is only supported for RSDS standard.

(23) No fixed VIN , VOD , and VOS specifications for Bus LVDS (BLVDS). They are dependent on the system topology.

(24) Mini-LVDS, RSDS, and Point-to-Point Differential Signaling (PPDS) standards are only supported at the output pins for Intel MAX 10

devices.

(25) Supported with requirement of an external level shift

(26) Sub-LVDS input buffer is using 2.5 V differential buffer.

(27) Differential output depends on the values of the external termination resistors.

(28) Differential output offset voltage depends on the values of the external termination resistors.

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Core Performance Specifications

Clock Tree Specifications

Table 26. Clock Tree Specifications for Intel MAX 10 Devices

Device Performance Unit

–I6 –A6, –C7 –I7 –A7 –C8

10M02 450 416 416 382 402 MHz

10M04 450 416 416 382 402 MHz

10M08 450 416 416 382 402 MHz

10M16 450 416 416 382 402 MHz

10M25 450 416 416 382 402 MHz

10M40 450 416 416 382 402 MHz

10M50 450 416 416 382 402 MHz

PLL Specifications

Table 27. PLL Specifications for Intel MAX 10 Devices

VCCD_PLL should always be connected to VCCINT through decoupling capacitor and ferrite bead.

Symbol Parameter Condition Min Typ Max Unit

fIN (29)Input clock frequency — 5 — 472.5 MHz

fINPFD Phase frequency detector (PFD) input frequency — 5 — 325 MHz

continued...

(29) This parameter is limited in the Intel Quartus Prime software by the I/O maximum frequency. The maximum I/O frequency is

different for each I/O standard.

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Symbol Parameter Condition Min Typ Max Unit

fVCO (30) PLL internal voltage-controlled oscillator (VCO)

operating range

— 600 — 1300 MHz

fINDUTY Input clock duty cycle — 40 — 60 %

tINJITTER_CCJ (31) Input clock cycle-to-cycle jitter FINPFD ≥ 100 MHz — — 0.15 UI

FINPFD < 100 MHz — — ±750 ps

fOUT_EXT (29)PLL output frequency for external clock output — — — 472.5 MHz

fOUT PLL output frequency to global clock –6 speed grade — — 472.5 MHz

–7 speed grade — — 450 MHz

–8 speed grade — — 402.5 MHz

tOUTDUTY Duty cycle for external clock output Duty cycle set to 50% 45 50 55 %

tLOCK Time required to lock from end of device

configuration

— — — 1 ms

tDLOCK Time required to lock dynamically After switchover, reconfiguring

any non-post-scale counters or

delays, or when areset is

deasserted

— — 1 ms

tOUTJITTER_PERIOD_IO

(32)

Regular I/O period jitter FOUT ≥ 100 MHz — — 650 ps

FOUT < 100 MHz — — 75 mUI

tOUTJITTER_CCJ_IO (32)Regular I/O cycle-to-cycle jitter FOUT ≥ 100 MHz — — 650 ps

FOUT < 100 MHz — — 75 mUI

continued...

(30) The VCO frequency reported by the Intel Quartus Prime software in the PLL summary section of the compilation report takes into

consideration the VCO post-scale counter K value. Therefore, if the counter K has a value of 2, the frequency reported can be lower

than the fVCO specification.

(31) A high input jitter directly affects the PLL output jitter. To have low PLL output clock jitter, you must provide a clean clock source,

which is less than 200 ps.

(32) Peak-to-peak jitter with a probability level of 10–12 (14 sigma, 99.99999999974404% confidence level). The output jitter specification

applies to the intrinsic jitter of the PLL, when an input jitter of 30 ps is applied.

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Symbol Parameter Condition Min Typ Max Unit

tPLL_PSERR Accuracy of PLL phase shift — — — ±50 ps

tARESET Minimum pulse width on areset signal. — 10 — — ns

tCONFIGPLL Time required to reconfigure scan chains for

PLLs

— — 3.5 (33) —SCANCLK

cycles

fSCANCLK scanclk frequency — — — 100 MHz

Table 28. PLL Specifications for Intel MAX 10 Single Supply Devices

For V36 package, the PLL specification is based on single supply devices.

Symbol Parameter Condition Max Unit

tOUTJITTER_PERIOD_DEDCLK (32)

Dedicated clock output period jitter FOUT ≥ 100 MHz 660 ps

FOUT < 100 MHz 66 mUI

tOUTJITTER_CCJ_DEDCLK (32) Dedicated clock output cycle-to-cycle jitter FOUT ≥ 100 MHz 660 ps

FOUT < 100 MHz 66 mUI

Table 29. PLL Specifications for Intel MAX 10 Dual Supply Devices

Symbol Parameter Condition Max Unit

tOUTJITTER_PERIOD_DEDCLK (32)Dedicated clock output period jitter FOUT ≥ 100 MHz 300 ps

FOUT < 100 MHz 30 mUI

tOUTJITTER_CCJ_DEDCLK (32)Dedicated clock output cycle-to-cycle jitter FOUT ≥ 100 MHz 300 ps

FOUT < 100 MHz 30 mUI

(33) With 100 MHz scanclk frequency.

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Embedded Multiplier Specifications

Table 30. Embedded Multiplier Specifications for Intel MAX 10 Devices

Mode Number of Multipliers Power Supply Mode Performance Unit

–I6 –A6, –C7, –I7,

–A7

–C8

9 × 9-bit multiplier 1 Single supply mode 198 183 160 MHz

Dual supply mode 310 260 210 MHz

18 × 18-bit multiplier 1 Single supply mode 198 183 160 MHz

Dual supply mode 265 240 190 MHz

Memory Block Performance Specifications

Table 31. Memory Block Performance Specifications for Intel MAX 10 Devices

Memory Mode Resources Used Power Supply Mode Performance Unit

LEs M9K

Memory

–I6 –A6, –C7, –I7,

–A7

–C8

M9K Block FIFO 256 × 36 47 1 Single supply mode 232 219 204 MHz

Dual supply mode 330 300 250 MHz

Single-port 256 × 36 0 1 Single supply mode 232 219 204 MHz

Dual supply mode 330 300 250 MHz

Simple dual-port 256 × 36

CLK

0 1 Single supply mode 232 219 204 MHz

Dual supply mode 330 300 250 MHz

True dual port 512 × 18

single CLK

0 1 Single supply mode 232 219 204 MHz

Dual supply mode 330 300 250 MHz

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Internal Oscillator Specifications

Table 32. Internal Oscillator Frequencies for Intel MAX 10 Devices

You can access to the internal oscillator frequencies in this table. The duty cycle of internal oscillator is approximately 45%–55%.

Device Frequency Unit

Minimum Typical Maximum

10M02 55 82 116 MHz

10M04

10M08

10M16

10M25

10M40 35 52 77 MHz

10M50

UFM Performance Specifications

Table 33. UFM Performance Specifications for Intel MAX 10 Devices

Block Mode Interface Device Frequency Unit

Minimum Maximum

UFM Avalon®-MM slave Parallel (34) 10M02 (35)3.43 7.25 MHz

10M04, 10M08, 10M16, 10M25, 10M40,

10M50

5 116 MHz

Serial (35)10M02, 10M04, 10M08, 10M16, 10M25 3.43 7.25 MHz

10M40, 10M50 2.18 4.81 MHz

(34) Clock source is derived from user, except for 10M02 device.

(35) Clock source is derived from 1/16 of the frequency of the internal oscillator.

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ADC Performance Specifications

Single Supply Devices ADC Performance Specifications

Table 34. ADC Performance Specifications for Intel MAX 10 Single Supply Devices

Parameter Symbol Condition Min Typ Max Unit

ADC resolution — — — — 12 bits

ADC supply voltage VCC_ONE — 2.85 3.0/3.3 3.465 V

External reference voltage VREF — VCC_ONE –

0.5

— VCC_ONE V

Sampling rate FSAccumulative sampling rate — — 1 MSPS

Operating junction temperature range TJ— –40 25 125 °C

Analog input voltage VIN Prescalar disabled 0 — VREF V

Prescalar enabled (36) 0 — 3.6 V

Input resistance RIN — — (37)— —

Input capacitance CIN — — (37)— —

DC Accuracy Offset error and drift Eoffset Prescalar disabled –0.2 — 0.2 %FS

Prescalar enabled –0.5 — 0.5 %FS

Gain error and drift Egain Prescalar disabled –0.5 — 0.5 %FS

Prescalar enabled –0.75 — 0.75 %FS

Differential non linearity DNL External VREF, no missing

code

–0.9 — 0.9 LSB

Internal VREF, no missing

code

–1 — 1.7 LSB

continued...

(36) Prescalar function divides the analog input voltage by half. The analog input handles up to 3.6 V for the Intel MAX 10 single supply

devices.

(37) Download the SPICE models for simulation.

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Parameter Symbol Condition Min Typ Max Unit

Integral non linearity INL — –2 — 2 LSB

AC Accuracy Total harmonic distortion THD FIN = 50 kHz, FS = 1 MHz,

PLL

–65 (38) — — dB

Signal-to-noise ratio SNR FIN = 50 kHz, FS = 1 MHz,

PLL

54 (39) — — dB

Signal-to-noise and distortion SINAD FIN = 50 kHz, FS = 1 MHz,

PLL

53 (40) — — dB

On-Chip Temperature

Sensor

Temperature sampling rate TS— — — 50 kSPS

Absolute accuracy — –40 to 125°C,

with 64 samples averaging

(41)

— — ±10 °C

Conversion Rate (42) Conversion time — Single measurement — — 1 Cycle

Continuous measurement — — 1 Cycle

Temperature measurement — — 1 Cycle

Related Information

SPICE Models for Intel FPGAs

(38) THD with prescalar enabled is 6dB less than the specification.

(39) SNR with prescalar enabled is 6dB less than the specification.

(40) SINAD with prescalar enabled is 6dB less than the specification.

(41) For the Intel Quartus Prime software version 15.0 and later, Modular ADC Core Intel FPGA IP and Modular Dual ADC Core Intel FPGA

IP cores handle the 64 samples averaging. For the Intel Quartus Prime software versions prior to 14.1, you need to implement your

own averaging calculation.

(42) For more detailed description, refer to the Timing section in the Intel MAX 10 Analog-to-Digital Converter User Guide.

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Dual Supply Devices ADC Performance Specifications

Table 35. ADC Performance Specifications for Intel MAX 10 Dual Supply Devices

Parameter Symbol Condition Min Typ Max Unit

ADC resolution — — — — 12 bits

Analog supply voltage VCCA_ADC — 2.375 2.5 2.625 V

Digital supply voltage VCCINT — 1.15 1.2 1.25 V

External reference voltage VREF — VCCA_ADC –

0.5

— VCCA_ADC V

Sampling rate FSAccumulative sampling rate — — 1 MSPS

Operating junction temperature range TJ— –40 25 125 °C

Analog input voltage VIN Prescalar disabled 0 — VREF V

Prescalar enabled (43) 0 — 3 V

Analog supply current (DC) IACC_ADC Average current — 275 450 µA

Digital supply current (DC) ICCINT Average current — 65 150 µA

Input resistance RIN — — (44)— —

Input capacitance CIN — — (44)— —

DC Accuracy Offset error and drift Eoffset Prescalar disabled –0.2 — 0.2 %FS

Prescalar enabled –0.5 — 0.5 %FS

Gain error and drift Egain Prescalar disabled –0.5 — 0.5 %FS

Prescalar enabled –0.75 — 0.75 %FS

Differential non linearity DNL External VREF, no missing

code

–0.9 — 0.9 LSB

continued...

(43) Prescalar function divides the analog input voltage by half. The analog input handles up to 3 V input for the Intel MAX 10 dual supply

devices.

(44) Download the SPICE models for simulation.

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Parameter Symbol Condition Min Typ Max Unit

Internal VREF, no missing

code

–1 — 1.7 LSB

Integral non linearity INL — –2 — 2 LSB

AC Accuracy Total harmonic distortion THD FIN = 50 kHz, FS = 1 MHz,

PLL

–70 (45)(46)

(47)

— — dB

Signal-to-noise ratio SNR FIN = 50 kHz, FS = 1 MHz,

PLL

62 (48)(49)(47)— — dB

Signal-to-noise and distortion SINAD FIN = 50 kHz, FS = 1 MHz,

PLL

61.5 (50)

(51)(47)

— — dB

On-Chip Temperature

Sensor

Temperature sampling rate TS— — — 50 kSPS

Absolute accuracy — –40 to 125°C,

with 64 samples averaging

(52)

— — ±5 °C

continued...

(45) Total harmonic distortion is –65 dB for dual function pin.

(46) THD with prescalar enabled is 6dB less than the specification.

(47) When using internal VREF, THD = 66 dB, SNR = 58 dB and SINAD = 57.5 dB for dedicated ADC input channels.

(48) Signal-to-noise ratio is 54 dB for dual function pin.

(49) SNR with prescalar enabled is 6dB less than the specification.

(50) Signal-to-noise and distortion is 53 dB for dual function pin.

(51) SINAD with prescalar enabled is 6dB less than the specification.

(52) For the Intel Quartus Prime software version 15.0 and later, Modular ADC Core and Modular Dual ADC Core IP cores handle the 64

samples averaging. For the Intel Quartus Prime software versions prior to 14.1, you need to implement your own averaging

calculation.

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Parameter Symbol Condition Min Typ Max Unit

Conversion Rate (53) Conversion time — Single measurement — — 1 Cycle

Continuous measurement — — 1 Cycle

Temperature measurement — — 1 Cycle

Related Information

SPICE Models for Intel FPGAs

Periphery Performance Specifications

This section describes the periphery performance, high-speed I/O, and external memory interface.

Actual achievable frequency depends on design and system specific factors. Ensure proper timing closure in your design and

perform HSPICE/IBIS simulations based on your specific design and system setup to determine the maximum achievable

frequency in your system.

High-Speed I/O Specifications

For more information about the high-speed and low-speed I/O performance pins, refer to the respective device pin-out files.

Related Information

Documentation: Pin-Out Files for Intel FPGAs

(53) For more detailed description, refer to the Timing section in the Intel MAX 10 Analog-to-Digital Converter User Guide.

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True PPDS and Emulated PPDS_E_3R Transmitter Timing Specifications

Table 36. True PPDS and Emulated PPDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices

True PPDS transmitter is only supported at bottom I/O banks. Emulated PPDS transmitter is supported at the output pin of all I/O banks.

Symbol Parameter Mode –I6, –A6, –C7, –I7 –A7 –C8 Unit

Min Typ Max Min Typ Max Min Typ Max

fHSCLK Input clock frequency

(high-speed I/O

performance pin)

×10 5 — 155 5 — 155 5 — 155 MHz

×8 5 — 155 5 — 155 5 — 155 MHz

×7 5 — 155 5 — 155 5 — 155 MHz

×4 5 — 155 5 — 155 5 — 155 MHz

×2 5 — 155 5 — 155 5 — 155 MHz

×1 5 — 310 5 — 310 5 — 310 MHz

HSIODR Data rate (high-speed

I/O performance pin)

×10 100 — 310 100 — 310 100 — 310 Mbps

×8 80 — 310 80 — 310 80 — 310 Mbps

×7 70 — 310 70 — 310 70 — 310 Mbps

×4 40 — 310 40 — 310 40 — 310 Mbps

×2 20 — 310 20 — 310 20 — 310 Mbps

×1 10 — 310 10 — 310 10 — 310 Mbps

fHSCLK Input clock frequency

(low-speed I/O

performance pin)

×10 5 — 150 5 — 150 5 — 150 MHz

×8 5 — 150 5 — 150 5 — 150 MHz

×7 5 — 150 5 — 150 5 — 150 MHz

×4 5 — 150 5 — 150 5 — 150 MHz

×2 5 — 150 5 — 150 5 — 150 MHz

×1 5 — 300 5 — 300 5 — 300 MHz

HSIODR Data rate (low-speed

I/O performance pin)

×10 100 — 300 100 — 300 100 — 300 Mbps

×8 80 — 300 80 — 300 80 — 300 Mbps

×7 70 — 300 70 — 300 70 — 300 Mbps

continued...

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Symbol Parameter Mode –I6, –A6, –C7, –I7 –A7 –C8 Unit

Min Typ Max Min Typ Max Min Typ Max

×4 40 — 300 40 — 300 40 — 300 Mbps

×2 20 — 300 20 — 300 20 — 300 Mbps

×1 10 — 300 10 — 300 10 — 300 Mbps

tDUTY Duty cycle on

transmitter output

clock

— 45 — 55 45 — 55 45 — 55 %

TCCS(54) Transmitter channel-

to-channel skew

— — — 300 — — 300 — — 300 ps

tx Jitter(55) Output jitter (high-

speed I/O

performance pin)

— — — 425 — — 425 — — 425 ps

Output jitter (low-

speed I/O

performance pin)

— — — 470 — — 470 — — 470 ps

tRISE Rise time 20 – 80%, CLOAD

= 5 pF

— 500 — — 500 — — 500 — ps

tFALL Fall time 20 – 80%, CLOAD

= 5 pF

— 500 — — 500 — — 500 — ps

tLOCK Time required for the

PLL to lock, after

CONF_DONE signal

goes high, indicating

the completion of

device configuration

— — — 1 — — 1 — — 1 ms

(54) TCCS specifications apply to I/O banks from the same side only.

(55) TX jitter is the jitter induced from core noise and I/O switching noise.

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True RSDS and Emulated RSDS_E_3R Transmitter Timing Specifications

Single Supply Devices True RSDS and Emulated RSDS_E_3R Transmitter Timing Specifications

Table 37. True RSDS and Emulated RSDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Single Supply Devices

True RSDS transmitter is only supported at bottom I/O banks. Emulated RSDS transmitter is supported at the output pin of all I/O banks.

Symbol Parameter Mode –I6, –A6, –C7, –I7 –A7 –C8 Unit

Min Typ Max Min Typ Max Min Typ Max

fHSCLK Input clock frequency

(high-speed I/O

performance pin)

×10 5 — 50 5 — 50 5 — 50 MHz

×8 5 — 50 5 — 50 5 — 50 MHz

×7 5 — 50 5 — 50 5 — 50 MHz

×4 5 — 50 5 — 50 5 — 50 MHz

×2 5 — 50 5 — 50 5 — 50 MHz

×1 5 — 100 5 — 100 5 — 100 MHz

HSIODR Data rate (high-speed

I/O performance pin)

×10 100 — 100 100 — 100 100 — 100 Mbps

×8 80 — 100 80 — 100 80 — 100 Mbps

×7 70 — 100 70 — 100 70 — 100 Mbps

×4 40 — 100 40 — 100 40 — 100 Mbps

×2 20 — 100 20 — 100 20 — 100 Mbps

×1 10 — 100 10 — 100 10 — 100 Mbps

fHSCLK Input clock frequency

(low-speed I/O

performance pin)

×10 5 — 50 5 — 50 5 — 50 MHz

×8 5 — 50 5 — 50 5 — 50 MHz

×7 5 — 50 5 — 50 5 — 50 MHz

×4 5 — 50 5 — 50 5 — 50 MHz

×2 5 — 50 5 — 50 5 — 50 MHz

×1 5 — 100 5 — 100 5 — 100 MHz

HSIODR Data rate (low-speed

I/O performance pin)

×10 100 — 100 100 — 100 100 — 100 Mbps

continued...

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Symbol Parameter Mode –I6, –A6, –C7, –I7 –A7 –C8 Unit

Min Typ Max Min Typ Max Min Typ Max

×8 80 — 100 80 — 100 80 — 100 Mbps

×7 70 — 100 70 — 100 70 — 100 Mbps

×4 40 — 100 40 — 100 40 — 100 Mbps

×2 20 — 100 20 — 100 20 — 100 Mbps

×1 10 — 100 10 — 100 10 — 100 Mbps

tDUTY Duty cycle on

transmitter output

clock

— 45 — 55 45 — 55 45 — 55 %

TCCS(56) Transmitter channel-

to-channel skew

— — — 300 — — 300 — — 300 ps

tx Jitter(57) Output jitter (high-

speed I/O

performance pin)

— — — 425 — — 425 — — 425 ps

Output jitter (low-

speed I/O

performance pin)

— — — 470 — — 470 — — 470 ps

tRISE Rise time 20 – 80%, CLOAD

= 5 pF

— 500 — — 500 — — 500 — ps

tFALL Fall time 20 – 80%, CLOAD

= 5 pF

— 500 — — 500 — — 500 — ps

tLOCK Time required for the

PLL to lock, after

CONF_DONE signal

goes high, indicating

the completion of

device configuration

— — — 1 — — 1 — — 1 ms

(56) TCCS specifications apply to I/O banks from the same side only.

(57) TX jitter is the jitter induced from core noise and I/O switching noise.

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Dual Supply Devices True RSDS and Emulated RSDS_E_3R Transmitter Timing Specifications

Table 38. True RSDS and Emulated RSDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices

True RSDS transmitter is only supported at bottom I/O banks. Emulated RSDS transmitter is supported at the output pin of all I/O banks.

Symbol Parameter Mode –I6, –A6, –C7, –I7 –A7 –C8 Unit

Min Typ Max Min Typ Max Min Typ Max

fHSCLK Input clock frequency

(high-speed I/O

performance pin)

×10 5 — 155 5 — 155 5 — 155 MHz

×8 5 — 155 5 — 155 5 — 155 MHz

×7 5 — 155 5 — 155 5 — 155 MHz

×4 5 — 155 5 — 155 5 — 155 MHz

×2 5 — 155 5 — 155 5 — 155 MHz

×1 5 — 310 5 — 310 5 — 310 MHz

HSIODR Data rate (high-speed

I/O performance pin)

×10 100 — 310 100 — 310 100 — 310 Mbps

×8 80 — 310 80 — 310 80 — 310 Mbps

×7 70 — 310 70 — 310 70 — 310 Mbps

×4 40 — 310 40 — 310 40 — 310 Mbps

×2 20 — 310 20 — 310 20 — 310 Mbps

×1 10 — 310 10 — 310 10 — 310 Mbps

fHSCLK Input clock frequency

(low-speed I/O

performance pin)

×10 5 — 150 5 — 150 5 — 150 MHz

×8 5 — 150 5 — 150 5 — 150 MHz

×7 5 — 150 5 — 150 5 — 150 MHz

×4 5 — 150 5 — 150 5 — 150 MHz

×2 5 — 150 5 — 150 5 — 150 MHz

×1 5 — 300 5 — 300 5 — 300 MHz

HSIODR Data rate (low-speed

I/O performance pin)

×10 100 — 300 100 — 300 100 — 300 Mbps

×8 80 — 300 80 — 300 80 — 300 Mbps

×7 70 — 300 70 — 300 70 — 300 Mbps

continued...

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Symbol Parameter Mode –I6, –A6, –C7, –I7 –A7 –C8 Unit

Min Typ Max Min Typ Max Min Typ Max

×4 40 — 300 40 — 300 40 — 300 Mbps

×2 20 — 300 20 — 300 20 — 300 Mbps

×1 10 — 300 10 — 300 10 — 300 Mbps

tDUTY Duty cycle on

transmitter output

clock

— 45 — 55 45 — 55 45 — 55 %

TCCS(58) Transmitter channel-

to-channel skew

— — — 300 — — 300 — — 300 ps

tx Jitter(59) Output jitter (high-

speed I/O

performance pin)

— — — 425 — — 425 — — 425 ps

Output jitter (low-

speed I/O

performance pin)

— — — 470 — — 470 — — 470 ps

tRISE Rise time 20 – 80%, CLOAD

= 5 pF

— 500 — — 500 — — 500 — ps

tFALL Fall time 20 – 80%, CLOAD

= 5 pF

— 500 — — 500 — — 500 — ps

tLOCK Time required for the

PLL to lock, after

CONF_DONE signal

goes high, indicating

the completion of

device configuration

— — — 1 — — 1 — — 1 ms

(58) TCCS specifications apply to I/O banks from the same side only.

(59) TX jitter is the jitter induced from core noise and I/O switching noise.

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Emulated RSDS_E_1R Transmitter Timing Specifications

Table 39. Emulated RSDS_E_1R Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices

Emulated RSDS_E_1R transmitter is supported at the output pin of all I/O banks.

Symbol Parameter Mode –I6, –A6, –C7, –I7 –A7 –C8 Unit

Min Typ Max Min Typ Max Min Typ Max

fHSCLK Input clock frequency

(high-speed I/O

performance pin)

×10 5 — 85 5 — 85 5 — 85 MHz

×8 5 — 85 5 — 85 5 — 85 MHz

×7 5 — 85 5 — 85 5 — 85 MHz

×4 5 — 85 5 — 85 5 — 85 MHz

×2 5 — 85 5 — 85 5 — 85 MHz

×1 5 — 170 5 — 170 5 — 170 MHz

HSIODR Data rate (high-speed

I/O performance pin)

×10 100 — 170 100 — 170 100 — 170 Mbps

×8 80 — 170 80 — 170 80 — 170 Mbps

×7 70 — 170 70 — 170 70 — 170 Mbps

×4 40 — 170 40 — 170 40 — 170 Mbps

×2 20 — 170 20 — 170 20 — 170 Mbps

×1 10 — 170 10 — 170 10 — 170 Mbps

fHSCLK Input clock frequency

(low-speed I/O

performance pin)

×10 5 — 85 5 — 85 5 — 85 MHz

×8 5 — 85 5 — 85 5 — 85 MHz

×7 5 — 85 5 — 85 5 — 85 MHz

×4 5 — 85 5 — 85 5 — 85 MHz

×2 5 — 85 5 — 85 5 — 85 MHz

×1 5 — 170 5 — 170 5 — 170 MHz

HSIODR Data rate (low-speed

I/O performance pin)

×10 100 — 170 100 — 170 100 — 170 Mbps

×8 80 — 170 80 — 170 80 — 170 Mbps

×7 70 — 170 70 — 170 70 — 170 Mbps

continued...

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Symbol Parameter Mode –I6, –A6, –C7, –I7 –A7 –C8 Unit

Min Typ Max Min Typ Max Min Typ Max

×4 40 — 170 40 — 170 40 — 170 Mbps

×2 20 — 170 20 — 170 20 — 170 Mbps

×1 10 — 170 10 — 170 10 — 170 Mbps

tDUTY Duty cycle on

transmitter output

clock

— 45 — 55 45 — 55 45 — 55 %

TCCS(60) Transmitter channel-

to-channel skew

— — — 300 — — 300 — — 300 ps

tx Jitter(61) Output jitter (high-

speed I/O

performance pin)

— — — 425 — — 425 — — 425 ps

Output jitter (low-

speed I/O

performance pin)

— — — 470 — — 470 — — 470 ps

tRISE Rise time 20 – 80%, CLOAD

= 5 pF

— 500 — — 500 — — 500 — ps

tFALL Fall time 20 – 80%, CLOAD

= 5 pF

— 500 — — 500 — — 500 — ps

tLOCK Time required for the

PLL to lock, after

CONF_DONE signal

goes high, indicating

the completion of

device configuration

— — — 1 — — 1 — — 1 ms

(60) TCCS specifications apply to I/O banks from the same side only.

(61) TX jitter is the jitter induced from core noise and I/O switching noise.

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True Mini-LVDS and Emulated Mini-LVDS_E_3R Transmitter Timing Specifications

Table 40. True Mini-LVDS and Emulated Mini-LVDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Dual Supply

Devices

True mini-LVDS transmitter is only supported at the bottom I/O banks. Emulated mini-LVDS_E_3R transmitter is supported at the output pin of all I/O banks.

Symbol Parameter Mode –I6, –A6, –C7, –I7 –A7 –C8 Unit

Min Typ Max Min Typ Max Min Typ Max

fHSCLK Input clock frequency

(high-speed I/O

performance pin)

×10 5 — 155 5 — 155 5 — 155 MHz

×8 5 — 155 5 — 155 5 — 155 MHz

×7 5 — 155 5 — 155 5 — 155 MHz

×4 5 — 155 5 — 155 5 — 155 MHz

×2 5 — 155 5 — 155 5 — 155 MHz

×1 5 — 310 5 — 310 5 — 310 MHz

HSIODR Data rate (high-speed

I/O performance pin)

×10 100 — 310 100 — 310 100 — 310 Mbps

×8 80 — 310 80 — 310 80 — 310 Mbps

×7 70 — 310 70 — 310 70 — 310 Mbps

×4 40 — 310 40 — 310 40 — 310 Mbps

×2 20 — 310 20 — 310 20 — 310 Mbps

×1 10 — 310 10 — 310 10 — 310 Mbps

fHSCLK Input clock frequency

(low-speed I/O

performance pin)

×10 5 — 150 5 — 150 5 — 150 MHz

×8 5 — 150 5 — 150 5 — 150 MHz

×7 5 — 150 5 — 150 5 — 150 MHz

×4 5 — 150 5 — 150 5 — 150 MHz

×2 5 — 150 5 — 150 5 — 150 MHz

×1 5 — 300 5 — 300 5 — 300 MHz

HSIODR Data rate (low-speed

I/O performance pin)

×10 100 — 300 100 — 300 100 — 300 Mbps

×8 80 — 300 80 — 300 80 — 300 Mbps

continued...

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Symbol Parameter Mode –I6, –A6, –C7, –I7 –A7 –C8 Unit

Min Typ Max Min Typ Max Min Typ Max

×7 70 — 300 70 — 300 70 — 300 Mbps

×4 40 — 300 40 — 300 40 — 300 Mbps

×2 20 — 300 20 — 300 20 — 300 Mbps

×1 10 — 300 10 — 300 10 — 300 Mbps

tDUTY Duty cycle on

transmitter output

clock

— 45 — 55 45 — 55 45 — 55 %

TCCS(62) Transmitter channel-

to-channel skew

— — — 300 — — 300 — — 300 ps

tx Jitter(63) Output jitter (high-

speed I/O

performance pin)

— — — 425 — — 425 — — 425 ps

Output jitter (low-

speed I/O

performance pin)

— — — 470 — — 470 — — 470 ps

tRISE Rise time 20 – 80%, CLOAD

= 5 pF

— 500 — — 500 — — 500 — ps

tFALL Fall time 20 – 80%, CLOAD

= 5 pF

— 500 — — 500 — — 500 — ps

tLOCK Time required for the

PLL to lock, after

CONF_DONE signal

goes high, indicating

the completion of

device configuration

— — — 1 — — 1 — — 1 ms

(62) TCCS specifications apply to I/O banks from the same side only.

(63) TX jitter is the jitter induced from core noise and I/O switching noise.

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True LVDS Transmitter Timing

Single Supply Devices True LVDS Transmitter Timing Specifications

Table 41. True LVDS Transmitter Timing Specifications for Intel MAX 10 Single Supply Devices

True LVDS transmitter is only supported at the bottom I/O banks.

Symbol Parameter Mode –C7, –I7 –A7 –C8 Unit

Min Typ Max Min Typ Max Min Typ Max

fHSCLK Input clock frequency ×10 5 — 145 5 — 100 5 — 100 MHz

×8 5 — 145 5 — 100 5 — 100 MHz

×7 5 — 145 5 — 100 5 — 100 MHz

×4 5 — 145 5 — 100 5 — 100 MHz

×2 5 — 145 5 — 100 5 — 100 MHz

×1 5 — 290 5 — 200 5 — 200 MHz

HSIODR Data rate ×10 100 — 290 100 — 200 100 — 200 Mbps

×8 80 — 290 80 — 200 80 — 200 Mbps

×7 70 — 290 70 — 200 70 — 200 Mbps

×4 40 — 290 40 — 200 40 — 200 Mbps

×2 20 — 290 20 — 200 20 — 200 Mbps

×1 10 — 290 10 — 200 10 — 200 Mbps

tDUTY Duty cycle on

transmitter output

clock

— 45 — 55 45 — 55 45 — 55 %

TCCS(64) Transmitter channel-

to-channel skew

— — — 300 — — 300 — — 300 ps

tx Jitter(65) Output jitter — — — 1,000 — — 1,000 — — 1,000 ps

continued...

(64) TCCS specifications apply to I/O banks from the same side only.

(65) TX jitter is the jitter induced from core noise and I/O switching noise.

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Symbol Parameter Mode –C7, –I7 –A7 –C8 Unit

Min Typ Max Min Typ Max Min Typ Max

tRISE Rise time 20 – 80%, CLOAD =

5 pF

— 500 — — 500 — — 500 — ps

tFALL Fall time 20 – 80%, CLOAD =

5 pF

— 500 — — 500 — — 500 — ps

tLOCK Time required for the

PLL to lock, after

CONF_DONE signal

goes high, indicating

the completion of

device configuration

— — — 1 — — 1 — — 1 ms

Dual Supply Devices True LVDS Transmitter Timing Specifications

Table 42. True LVDS Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices

True LVDS transmitter is only supported at the bottom I/O banks.

Symbol Parameter Mode –I6 –A6, –C7, –I7 –A7 –C8 Unit

Min Typ Max Min Typ Max Min Typ Max Min Typ Max

fHSCLK Input clock

frequency

×10 5 — 360 5 — 340 5 — 310 5 — 300 MHz

×8 5 — 360 5 — 360 5 — 320 5 — 320 MHz

×7 5 — 360 5 — 340 5 — 310 5 — 300 MHz

×4 5 — 360 5 — 350 5 — 320 5 — 320 MHz

×2 5 — 360 5 — 350 5 — 320 5 — 320 MHz

×1 5 — 360 5 — 350 5 — 320 5 — 320 MHz

HSIODR Data rate ×10 100 — 720 100 — 680 100 — 620 100 — 600 Mbps

×8 80 — 720 80 — 720 80 — 640 80 — 640 Mbps

×7 70 — 720 70 — 680 70 — 620 70 — 600 Mbps

×4 40 — 720 40 — 700 40 — 640 40 — 640 Mbps

×2 20 — 720 20 — 700 20 — 640 20 — 640 Mbps

continued...

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Symbol Parameter Mode –I6 –A6, –C7, –I7 –A7 –C8 Unit

Min Typ Max Min Typ Max Min Typ Max Min Typ Max

×1 10 — 360 10 — 350 10 — 320 10 — 320 Mbps

tDUTY Duty cycle on

transmitter output

clock

— 45 — 55 45 — 55 45 — 55 45 — 55 %

TCCS(66) Transmitter

channel-to-

channel skew

— — — 300 — — 300 — — 300 — — 300 ps

Jitter(67)

Output jitter — — — 380 — — 380 — — 380 — — 380 ps

tRISE Rise time 20 – 80%, CLOAD

= 5 pF

— 500 — — 500 — — 500 — — 500 — ps

tFALL Fall time 20 – 80%, CLOAD

= 5 pF

— 500 — — 500 — — 500 — — 500 — ps

tLOCK Time required for

the PLL to lock,

after CONF_DONE

signal goes high,

indicating the

completion of

device

configuration

— — — 1 — — 1 — — 1 — — 1 ms

(66) TCCS specifications apply to I/O banks from the same side only.

(67) TX jitter is the jitter induced from core noise and I/O switching noise.

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Emulated LVDS_E_3R, SLVS, and Sub-LVDS Transmitter Timing Specifications

Single Supply Devices Emulated LVDS_E_3R Transmitter Timing Specifications

Table 43. Emulated LVDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Single Supply Devices

Emulated LVDS_E_3R transmitters are supported at the output pin of all I/O banks.

Symbol Parameter Mode –C7, –I7 –A7 –C8 Unit

Min Typ Max Min Typ Max Min Typ Max

fHSCLK Input clock frequency

(high-speed I/O

performance pin)

×10 5 — 142.5 5 — 100 5 — 100 MHz

×8 5 — 142.5 5 — 100 5 — 100 MHz

×7 5 — 142.5 5 — 100 5 — 100 MHz

×4 5 — 142.5 5 — 100 5 — 100 MHz

×2 5 — 142.5 5 — 100 5 — 100 MHz

×1 5 — 285 5 — 200 5 — 200 MHz

HSIODR Data rate (high-speed

I/O performance pin)

×10 100 — 285 100 — 200 100 — 200 Mbps

×8 80 — 285 80 — 200 80 — 200 Mbps

×7 70 — 285 70 — 200 70 — 200 Mbps

×4 40 — 285 40 — 200 40 — 200 Mbps

×2 20 — 285 20 — 200 20 — 200 Mbps

×1 10 — 285 10 — 200 10 — 200 Mbps

fHSCLK Input clock frequency

(low-speed I/O

performance pin)

×10 5 — 100 5 — 100 5 — 100 MHz

×8 5 — 100 5 — 100 5 — 100 MHz

×7 5 — 100 5 — 100 5 — 100 MHz

×4 5 — 100 5 — 100 5 — 100 MHz

×2 5 — 100 5 — 100 5 — 100 MHz

×1 5 — 200 5 — 200 5 — 200 MHz

HSIODR Data rate (low-speed

I/O performance pin)

×10 100 — 200 100 — 200 100 — 200 Mbps

continued...

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Symbol Parameter Mode –C7, –I7 –A7 –C8 Unit

Min Typ Max Min Typ Max Min Typ Max

×8 80 — 200 80 — 200 80 — 200 Mbps

×7 70 — 200 70 — 200 70 — 200 Mbps

×4 40 — 200 40 — 200 40 — 200 Mbps

×2 20 — 200 20 — 200 20 — 200 Mbps

×1 10 — 200 10 — 200 10 — 200 Mbps

tDUTY Duty cycle on

transmitter output

clock

— 45 — 55 45 — 55 45 — 55 %

TCCS(68) Transmitter channel-

to-channel skew

— — — 300 — — 300 — — 300 ps

tx Jitter(69) Output jitter — — — 1,000 — — 1,000 — — 1,000 ps

tRISE Rise time 20 – 80%, CLOAD

= 5 pF

— 500 — — 500 — — 500 — ps

tFALL Fall time 20 – 80%, CLOAD

= 5 pF

— 500 — — 500 — — 500 — ps

tLOCK Time required for the

PLL to lock, after

CONF_DONE signal

goes high, indicating

the completion of

device configuration

— — — 1 — — 1 — — 1 ms

(68) TCCS specifications apply to I/O banks from the same side only.

(69) TX jitter is the jitter induced from core noise and I/O switching noise.

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Dual Supply Devices Emulated LVDS_E_3R, SLVS, and Sub-LVDS Transmitter Timing Specifications

Table 44. Emulated LVDS_E_3R, SLVS, and Sub-LVDS Transmitter Timing Specifications for Intel MAX 10 Dual Supply

Devices

Emulated LVDS_E_3R, SLVS, and Sub-LVDS transmitters are supported at the output pin of all I/O banks.

Symbol Parameter Mode –I6, –A6, –C7, –I7 –A7 –C8 Unit

Min Typ Max Min Typ Max Min Typ Max

fHSCLK Input clock frequency

(high-speed I/O

performance pin)

×10 5 — 300 5 — 275 5 — 275 MHz

×8 5 — 300 5 — 275 5 — 275 MHz

×7 5 — 300 5 — 275 5 — 275 MHz

×4 5 — 300 5 — 275 5 — 275 MHz

×2 5 — 300 5 — 275 5 — 275 MHz

×1 5 — 300 5 — 275 5 — 275 MHz

HSIODR Data rate (high-speed

I/O performance pin)

×10 100 — 600 100 — 550 100 — 550 Mbps

×8 80 — 600 80 — 550 80 — 550 Mbps

×7 70 — 600 70 — 550 70 — 550 Mbps

×4 40 — 600 40 — 550 40 — 550 Mbps

×2 20 — 600 20 — 550 20 — 550 Mbps

×1 10 — 300 10 — 275 10 — 275 Mbps

fHSCLK Input clock frequency

(low-speed I/O

performance pin)

×10 5 — 150 5 — 150 5 — 150 MHz

×8 5 — 150 5 — 150 5 — 150 MHz

×7 5 — 150 5 — 150 5 — 150 MHz

×4 5 — 150 5 — 150 5 — 150 MHz

×2 5 — 150 5 — 150 5 — 150 MHz

×1 5 — 300 5 — 300 5 — 300 MHz

HSIODR Data rate (low-speed

I/O performance pin)

×10 100 — 300 100 — 300 100 — 300 Mbps

×8 80 — 300 80 — 300 80 — 300 Mbps

continued...

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Symbol Parameter Mode –I6, –A6, –C7, –I7 –A7 –C8 Unit

Min Typ Max Min Typ Max Min Typ Max

×7 70 — 300 70 — 300 70 — 300 Mbps

×4 40 — 300 40 — 300 40 — 300 Mbps

×2 20 — 300 20 — 300 20 — 300 Mbps

×1 10 — 300 10 — 300 10 — 300 Mbps

tDUTY Duty cycle on

transmitter output

clock

— 45 — 55 45 — 55 45 — 55 %

TCCS(70) Transmitter channel-

to-channel skew

— — — 300 — — 300 — — 300 ps

tx Jitter(71) Output jitter (high-

speed I/O

performance pin)

— — — 425 — — 425 — — 425 ps

Output jitter (low-

speed I/O

performance pin)

— — — 470 — — 470 — — 470 ps

tRISE Rise time 20 – 80%, CLOAD

= 5 pF

— 500 — — 500 — — 500 — ps

tFALL Fall time 20 – 80%, CLOAD

= 5 pF

— 500 — — 500 — — 500 — ps

tLOCK Time required for the

PLL to lock, after

CONF_DONE signal

goes high, indicating

the completion of

device configuration

— — — 1 — — 1 — — 1 ms

(70) TCCS specifications apply to I/O banks from the same side only.

(71) TX jitter is the jitter induced from core noise and I/O switching noise.

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LVDS, TMDS, HiSpi, SLVS, and Sub-LVDS Receiver Timing Specifications

Single Supply Devices LVDS Receiver Timing Specifications

Table 45. LVDS Receiver Timing Specifications for Intel MAX 10 Single Supply Devices

LVDS receivers are supported at all banks.

Symbol Parameter Mode –C7, –I7 –A7 –C8 Unit

Min Max Min Max Min Max

fHSCLK Input clock frequency (high-

speed I/O performance pin)

×10 5 145 5 100 5 100 MHz

×8 5 145 5 100 5 100 MHz

×7 5 145 5 100 5 100 MHz

×4 5 145 5 100 5 100 MHz

×2 5 145 5 100 5 100 MHz

×1 5 290 5 200 5 200 MHz

HSIODR Data rate (high-speed I/O

performance pin)

×10 100 290 100 200 100 200 Mbps

×8 80 290 80 200 80 200 Mbps

×7 70 290 70 200 70 200 Mbps

×4 40 290 40 200 40 200 Mbps

×2 20 290 20 200 20 200 Mbps

×1 10 290 10 200 10 200 Mbps

fHSCLK Input clock frequency (low-

speed I/O performance pin)

×10 5 100 5 100 5 100 MHz

×8 5 100 5 100 5 100 MHz

×7 5 100 5 100 5 100 MHz

×4 5 100 5 100 5 100 MHz

×2 5 100 5 100 5 100 MHz

×1 5 200 5 200 5 200 MHz

HSIODR Data rate (low-speed I/O

performance pin)

×10 100 200 100 200 100 200 Mbps

continued...

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Symbol Parameter Mode –C7, –I7 –A7 –C8 Unit

Min Max Min Max Min Max

×8 80 200 80 200 80 200 Mbps

×7 70 200 70 200 70 200 Mbps

×4 40 200 40 200 40 200 Mbps

×2 20 200 20 200 20 200 Mbps

×1 10 200 10 200 10 200 Mbps

SW Sampling window (high-

speed I/O performance pin)

— — 910 — 910 — 910 ps

Sampling window (low-

speed I/O performance pin)

— — 1,110 — 1,110 — 1,110 ps

tx Jitter(72) Input jitter — — 1,000 — 1,000 — 1,000 ps

tLOCK Time required for the PLL to

lock, after CONF_DONE

signal goes high, indicating

the completion of device

configuration

— — 1 — 1 — 1 ms

Dual Supply Devices LVDS, TMDS, HiSpi, SLVS, and Sub-LVDS Receiver Timing Specifications

Table 46. LVDS, TMDS, HiSpi, SLVS, and Sub-LVDS Receiver Timing Specifications for Intel MAX 10 Dual Supply Devices

LVDS, TMDS, HiSpi, SLVS, and Sub-LVDS receivers are supported at all banks.

Symbol Parameter Mode –I6, –A6, –C7, –I7 –A7 –C8 Unit

Min Max Min Max Min Max

fHSCLK Input clock frequency (high-

speed I/O performance pin)

×10 5 350 5 320 5 320 MHz

×8 5 360 5 320 5 320 MHz

×7 5 350 5 320 5 320 MHz

×4 5 360 5 320 5 320 MHz

continued...

(72) TX jitter is the jitter induced from core noise and I/O switching noise.

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Symbol Parameter Mode –I6, –A6, –C7, –I7 –A7 –C8 Unit

Min Max Min Max Min Max

×2 5 360 5 320 5 320 MHz

×1 5 360 5 320 5 320 MHz

HSIODR Data rate (high-speed I/O

performance pin)

×10 100 700 100 640 100 640 Mbps

×8 80 720 80 640 80 640 Mbps

×7 70 700 70 640 70 640 Mbps

×4 40 720 40 640 40 640 Mbps

×2 20 720 20 640 20 640 Mbps

×1 10 360 10 320 10 320 Mbps

fHSCLK Input clock frequency (low-

speed I/O performance pin)

×10 5 150 5 150 5 150 MHz

×8 5 150 5 150 5 150 MHz

×7 5 150 5 150 5 150 MHz

×4 5 150 5 150 5 150 MHz

×2 5 150 5 150 5 150 MHz

×1 5 300 5 300 5 300 MHz

HSIODR Data rate (low-speed I/O

performance pin)

×10 100 300 100 300 100 300 Mbps

×8 80 300 80 300 80 300 Mbps

×7 70 300 70 300 70 300 Mbps

×4 40 300 40 300 40 300 Mbps

×2 20 300 20 300 20 300 Mbps

×1 10 300 10 300 10 300 Mbps

SW Sampling window (high-

speed I/O performance pin)

— — 510 — 510 — 510 ps

continued...

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Symbol Parameter Mode –I6, –A6, –C7, –I7 –A7 –C8 Unit

Min Max Min Max Min Max

Sampling window (low-

speed I/O performance pin)

— — 910 — 910 — 910 ps

tx Jitter(73) Input jitter — — 500 — 500 — 500 ps

tLOCK Time required for the PLL to

lock, after CONF_DONE

signal goes high, indicating

the completion of device

configuration

— — 1 — 1 — 1 ms

Memory Standards Supported by the Soft Memory Controller

Table 47. Memory Standards Supported by the Soft Memory Controller for Intel MAX 10 Devices

Contact your local sales representatives for access to the -I6 or -A6 speed grade devices in the Intel Quartus Prime software.

External Memory Interface

Standard

Rate Support Speed Grade Voltage (V) Max Frequency (MHz)

DDR3 SDRAM Half –I6 1.5 303

DDR3L SDRAM Half –I6 1.35 303

DDR2 SDRAM Half –I6 1.8 200

–I7 and –C7 167

LPDDR2(74) Half –I6 1.2 200(75)

Related Information

External Memory Interface Spec Estimator

Provides the specific details of the memory standards supported.

(73) TX jitter is the jitter induced from core noise and I/O switching noise.

(74) Intel MAX 10 devices support only single-die LPDDR2.

(75) To achieve the specified performance, constrain the memory device I/O and core power supply variation to within ±3%. By default,

the frequency is 167 MHz.

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Memory Output Clock Jitter Specifications

Intel MAX 10 devices support external memory interfaces up to 303 MHz. The external memory interfaces for Intel MAX 10

devices calibrate automatically.

The memory output clock jitter measurements are for 200 consecutive clock cycles.

The clock jitter specification applies to memory output clock pins generated using DDIO circuits clocked by a PLL output

routed on a PHY clock network.

DDR3 and LPDDR2 SDRAM memory interfaces are only supported on the fast speed grade device.

Table 48. Memory Output Clock Jitter Specifications for Intel MAX 10 Devices

Parameter Symbol –6 Speed Grade –7 Speed Grade Unit

Min Max Min Max

Clock period jitter tJIT(per) –127 127 –215 215 ps

Cycle-to-cycle period jitter tJIT(cc) — 242 — 360 ps

Related Information

Literature: External Memory Interfaces

Provides more information about external memory system performance specifications, board design guidelines, timing

analysis, simulation, and debugging information.

Configuration Specifications

This section provides configuration specifications and timing for Intel MAX 10 devices.

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JTAG Timing Parameters

Table 49. JTAG Timing Parameters for Intel MAX 10 Devices

The values are based on CL = 10 pF of TDO.

The affected Boundary Scan Test (BST) instructions are SAMPLE/PRELOAD, EXTEST, INTEST, and CHECK_STATUS.

Symbol Parameter Non-BST and non-CONFIG_IO Operation BST and CONFIG_IO Operation Unit

Minimum Maximum Minimum Maximum

tJCP TCK clock period 40 — 50 — ns

tJCH TCK clock high time 20 — 25 — ns

tJCL TCK clock low time 20 — 25 — ns

tJPSU_TDI JTAG port setup time 2 — 2 — ns

tJPSU_TMS JTAG port setup time 3 — 3 — ns

tJPH JTAG port hold time 10 — 10 — ns

tJPCO JTAG port clock to output — • 15 (for VCCIO = 3.3, 3.0,

and 2.5 V)

• 17 (for VCCIO = 1.8 and

1.5 V)

— • 18 (for VCCIO = 3.3, 3.0,

and 2.5 V)

• 20 (for VCCIO = 1.8 and

1.5 V)

tJPZX JTAG port high impedance to

valid output

— • 15 (for VCCIO = 3.3, 3.0,

and 2.5 V)

• 17 (for VCCIO = 1.8 and

1.5 V)

— • 15 (for VCCIO = 3.3, 3.0,

and 2.5 V)

• 17 (for VCCIO = 1.8 and

1.5 V)

tJPXZ JTAG port valid output to high

impedance

— • 15 (for VCCIO = 3.3, 3.0,

and 2.5 V)

• 17 (for VCCIO = 1.8 and

1.5 V)

— • 15 (for VCCIO = 3.3, 3.0,

and 2.5 V)

• 17 (for VCCIO = 1.8 and

1.5 V)

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Remote System Upgrade Circuitry Timing Specifications

Table 50. Remote System Upgrade Circuitry Timing Specifications for Intel MAX 10 Devices

Parameter Device Minimum Maximum Unit

tMAX_RU_CLK All — 40 MHz

tRU_nCONFIG 10M02, 10M04, 10M08, 10M16, 10M25 250 — ns

10M40, 10M50 350 — ns

tRU_nRSTIMER 10M02, 10M04, 10M08, 10M16, 10M25 300 — ns

10M40, 10M50 500 — ns

User Watchdog Internal Circuitry Timing Specifications

Table 51. User Watchdog Timer Specifications for Intel MAX 10 Devices

The specifications are subject to PVT changes.

Parameter Device Minimum Typical Maximum Unit

User watchdog frequency 10M02, 10M04, 10M08, 10M16,

10M25

3.4 5.1 7.3 MHz

10M40, 10M50 2.2 3.3 4.8 MHz

Uncompressed Raw Binary File (.rbf) Sizes

Table 52. Uncompressed .rbf Sizes for Intel MAX 10 Devices

Device CFM Data Size (bits)

Without Memory Initialization With Memory Initialization

10M02/10M02SCU324 554,000/1,540,000 —

10M04 1,540,000 1,880,000

10M08 1,540,000 1,880,000

10M16 2,800,000 3,430,000

continued...

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Device CFM Data Size (bits)

Without Memory Initialization With Memory Initialization

10M25 4,140,000 4,780,000

10M40 7,840,000 9,670,000

10M50 7,840,000 9,670,000

Internal Configuration Time

The internal configuration time measurement is from the rising edge of nSTATUS signal to the rising edge of CONF_DONE

signal.

Table 53. Internal Configuration Time for Intel MAX 10 Devices (Uncompressed .rbf)

Device Internal Configuration Time (ms)

Unencrypted Encrypted

Without Memory Initialization With Memory Initialization Without Memory Initialization With Memory Initialization

Min Max Min Max Min Max Min Max

10M02/

10M02SCU324

0.3/0.6 1.7/2.7 — — 1.7/5.0 5.4/15.0 — —

10M04 0.6 2.7 1.0 3.4 5.0 15.0 6.8 19.6

10M08 0.6 2.7 1.0 3.4 5.0 15.0 6.8 19.6

10M16 1.1 3.7 1.4 4.5 9.3 25.3 11.7 31.5

10M25 1.0 3.7 1.3 4.4 14.0 38.1 16.9 45.7

10M40 2.6 6.9 3.2 9.8 41.5 112.1 51.7 139.6

10M50 2.6 6.9 3.2 9.8 41.5 112.1 51.7 139.6

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Table 54. Internal Configuration Time for Intel MAX 10 Devices (Compressed .rbf)

Compression ratio depends on design complexity. The minimum value is based on the best case (25% of original .rbf sizes) and the maximum value is based on

the typical case (70% of original .rbf sizes).

Device Internal Configuration Time (ms)

Unencrypted/Encrypted

Without Memory Initialization With Memory Initialization

Min Max Min Max

10M02/10M02SCU324 0.3/0.6 5.2/10.7 — —

10M04 0.6 10.7 1.0 13.9

10M08 0.6 10.7 1.0 13.9

10M16 1.1 17.9 1.4 22.3

10M25 1.1 26.9 1.4 32.2

10M40 2.6 66.1 3.2 82.2

10M50 2.6 66.1 3.2 82.2

Internal Configuration Timing Parameter

Table 55. Internal Configuration Timing Parameter for Intel MAX 10 Devices

Symbol Parameter Device Minimum Maximum Unit

tCD2UM CONF_DONE high to

user mode

10M02, 10M04, 10M08, 10M16, 10M25 182.8 385.5 μs

10M40, 10M50 275.3 605.7 μs

I/O Timing

The data is typically used prior to designing the FPGA to get an estimate of the timing budget as part of the link timing

analysis.

The Intel Quartus Prime Timing Analyzer provides a more accurate and precise I/O timing data based on the specific device

and design after you complete place-and-route.

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Table 56. I/O Timing for Intel MAX 10 Devices

These I/O timing parameters are for the 3.3-V LVTTL I/O standard with the maximum drive strength and fast slew rate for 10M08DAF484 device.

Symbol Parameter –C7, –I7 –C8 Unit

Tsu Global clock setup time –0.750 –0.808 ns

ThGlobal clock hold time 1.180 1.215 ns

Tco Global clock to output delay 5.131 5.575 ns

Tpd Best case pin-to-pin propagation delay through one LUT 4.907 5.467 ns

Programmable IOE Delay

Programmable IOE Delay On Row Pins

Table 57. IOE Programmable Delay on Row Pins for Intel MAX 10 Devices

The incremental values for the settings are generally linear. For exact values of each setting, refer to the Assignment Name column in the latest version of the

Intel Quartus Prime software.

The minimum and maximum offset timing numbers are in reference to setting ‘0’ as available in the Intel Quartus Prime software.

Parameter Paths Affected Number of

Settings

Minimum

Offset

Maximum Offset Unit

Fast Corner Slow Corner

–I7 –C8 –A6 –C7 –C8 –I7 –A7

Input delay from

pin to internal

cells

Pad to I/O

dataout to core

7 0 0.815 0.873 1.831 1.811 1.874 1.871 1.922 ns

Input delay from

pin to input

Pad to I/O input

8 0 0.924 0.992 2.081 2.055 2.125 2.127 2.185 ns

Delay from

output register to

output pin

I/O output

2 0 0.479 0.514 1.069 1.070 1.117 1.105 1.134 ns

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Programmable IOE Delay for Column Pins

Table 58. IOE Programmable Delay on Column Pins for Intel MAX 10 Devices

The incremental values for the settings are generally linear. For exact values of each setting, refer to the Assignment Name column in the latest version of the

Intel Quartus Prime software.

The minimum and maximum offset timing numbers are in reference to setting ‘0’ as available in the Intel Quartus Prime software.

Parameter Paths Affected Number of

Settings

Minimum

Offset

Maximum Offset Unit

Fast Corner Slow Corner

–I7 –C8 –A6 –C7 –C8 –I7 –A7

Input delay from

pin to internal

cells

Pad to I/O

dataout to core

7 0 0.81 0.868 1.823 1.802 1.864 1.862 1.912 ns

Input delay from

pin to input

Pad to I/O input

8 0 0.914 0.981 2.06 2.032 2.101 2.102 2.161 ns

Delay from

output register to

output pin

I/O output

2 0 0.435 0.466 0.971 0.97 1.013 1.001 1.028 ns

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Glossary

Table 59. Glossary

Term Definition

JTAG Timing Specifications

TDO

TCK

tJPZX tJPCO

tJPH

tJPXZ

tJCP

tJPSU

t JCL

tJCH

TDI

TMS

RLReceiver differential input discrete resistor (external to Intel MAX 10 devices).

RSKM (Receiver input skew margin) HIGH-SPEED I/O block: The total margin left after accounting for the sampling window and TCCS. RSKM = (TUI – SW – TCCS) / 2.

Sampling window (SW) HIGH-SPEED I/O Block: The period of time during which the data must be valid to capture it correctly. The setup and hold times

determine the ideal strobe position in the sampling window.

Single-ended voltage referenced I/O

standard

The AC input signal values indicate the voltage levels at which the receiver must meet its timing specifications. The DC input signal

values indicate the voltage levels at which the final logic state of the receiver is unambiguously defined. After the receiver input

crosses the AC value, the receiver changes to the new logic state.

The new logic state is then maintained as long as the input stays beyond the DC threshold. This approach is intended to provide

predictable receiver timing in the presence of input waveform ringing.

tCHigh-speed receiver/transmitter input and output clock period.

TCCS (Channel-to- channel-skew) HIGH-SPEED I/O block: The timing difference between the fastest and slowest output edges, including tCO variation and clock skew.

The clock is included in the TCCS measurement.

tcin Delay from clock pad to I/O input register.

tCO Delay from clock pad to I/O output.

tcout Delay from clock pad to I/O output register.

continued...

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Term Definition

tDUTY HIGH-SPEED I/O Block: Duty cycle on high-speed transmitter output clock.

tFALL Signal high-to-low transition time (80–20%).

tHInput register hold time.

Timing Unit Interval (TUI) HIGH-SPEED I/O block: The timing budget allowed for skew, propagation delays, and data sampling window. (TUI = 1/(Receiver

Input Clock Frequency Multiplication Factor) = tC/w).

tINJITTER Period jitter on PLL clock input.

tOUTJITTER_DEDCLK Period jitter on dedicated clock output driven by a PLL.

tOUTJITTER_IO Period jitter on general purpose I/O driven by a PLL.

tpllcin Delay from PLL inclk pad to I/O input register.

tpllcout Delay from PLL inclk pad to I/O output register.

tRISE Signal low-to-high transition time (20–80%).

tSU Input register setup time.

VCM(DC) DC common mode input voltage.

VDIF(AC) AC differential input voltage: The minimum AC input differential voltage required for switching.

VDIF(DC) DC differential input voltage: The minimum DC input differential voltage required for switching.

VHYS Hysteresis for Schmitt trigger input.

VICM Input common mode voltage: The common mode of the differential signal at the receiver.

VID Input differential Voltage Swing: The difference in voltage between the positive and complementary conductors of a differential

transmission at the receiver.

VIH Voltage input high: The minimum positive voltage applied to the input which is accepted by the device as a logic high.

VIH(AC) High-level AC input voltage.

VIH(DC) High-level DC input voltage.

VIL Voltage input low: The maximum positive voltage applied to the input which is accepted by the device as a logic low.

VIL (AC) Low-level AC input voltage.

VIL (DC) Low-level DC input voltage.

VIN DC input voltage.

continued...

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Term Definition

VOCM Output common mode voltage: The common mode of the differential signal at the transmitter.

VOD Output differential voltage swing: The difference in voltage between the positive and complementary conductors of a differential

transmission line at the transmitter. VOD = VOH – VOL.

VOH Voltage output high: The maximum positive voltage from an output which the device considers is accepted as the minimum positive

high level.

VOL Voltage output low: The maximum positive voltage from an output which the device considers is accepted as the maximum positive

low level.

VOS Output offset voltage: VOS = (VOH + VOL) / 2.

VOX (AC) AC differential Output cross point voltage: The voltage at which the differential output signals must cross.

VREF Reference voltage for SSTL, HSTL, and HSUL I/O Standards.

VREF(AC) AC input reference voltage for SSTL, HSTL, and HSUL I/O Standards. VREF(AC) = VREF(DC) + noise. The peak-to-peak AC noise on

VREF should not exceed 2% of VREF(DC).

VREF(DC) DC input reference voltage for SSTL, HSTL, and HSUL I/O Standards.

VSWING (AC) AC differential input voltage: AC Input differential voltage required for switching.

VSWING (DC) DC differential input voltage: DC Input differential voltage required for switching.

VTT Termination voltage for SSTL, HSTL, and HSUL I/O Standards.

VX (AC) AC differential Input cross point voltage: The voltage at which the differential input signals must cross.

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Document Revision History for the Intel MAX 10 FPGA Device Datasheet

Document

Version

Changes

2020.06.30 • Added VCCIO specifications for 1.0 V in the following tables:

—Power Supplies Recommended Operating Conditions for Intel MAX 10 Single Supply Devices

—Power Supplies Recommended Operating Conditions for Intel MAX 10 Dual Supply Devices

• Added 1.0 V LVCMOS specifications in the Single-Ended I/O Standards Specifications for Intel MAX 10 Devices table.

• Added specifications for 10M02SCU324 device in the following tables:

—Uncompressed .rbf Sizes for Intel MAX 10 Devices

—Internal Configuration Time for Intel MAX 10 Devices (Uncompressed .rbf)

—Internal Configuration Time for Intel MAX 10 Devices (Compressed .rbf)

2018.06.29 • Removed links on instant-on feature.

• Added JTAG timing specifications term in Glossary.

• Renamed the following IP cores as per Intel rebranding:

— Renamed Altera Modular ADC IP core to Modular ADC core Intel FPGA IP core.

— Renamed Altera Modular Dual ADC IP core to Modular Dual ADC core Intel FPGA IP core.

Date Version Changes

December 2017 2017.12.15 • Removed the units for "Input resistance" and "Input capacitance" parameters in the following tables:

—ADC Performance Specifications for Intel MAX 10 Single Supply Devices

—ADC Performance Specifications for Intel MAX 10 Dual Supply Devices

• Removed the specification with memory initialization for 10M02 device in the Uncompressed .rbf Sizes for Intel MAX 10

Devices table.

June 2017 2017.06.16 • Added notes for TJ for Industrial and Automotive devices in Recommended Operating Conditions for Intel MAX 10 Devices

table.

• Updated the parameter in Internal Weak Pull-Up Resistor for Intel MAX 10 Devices table.

• Changed "Performance" to "Frequency" in UFM Performance Specifications for Intel MAX 10 Devices table.

• Removed PowerPlay text from tool name.

February 2017 2017.02.21 • Rebranded as Intel.

October 2016 2016.10.31 • Updated the note to the Intel MAX 10 Device Grades and Speed Grades Supported table.

• Updated the Memory Standards Supported by the Soft Memory Controller for Intel MAX 10 Devices table.

continued...

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Date Version Changes

May 2016 2016.05.02 • Updated tRAMP specifications in Recommended Operating Conditions for Intel MAX 10 Devices table.

— Removed standard POR and fast POR specifications.

— Updated maximum value from 3 ms to 10 ms and added a not for the minimum value.

• Added Supply Current and Power Consumption section.

• Added the following tables:

— Memory Standards Supported by the Soft Memory Controller for Intel MAX 10 Devices

— Internal Configuration Timing Parameter for Intel MAX 10 Devices

• Removed POR Delay Specifications for Intel MAX 10 Devices table.

• Updated the description in the Internal Configuration Time section.

• Updated the following tables:

—Internal Configuration Time for Intel MAX 10 Devices (Uncompressed .rbf)

—Internal Configuration Time for Intel MAX 10 Devices (Compressed .rbf)

January 2016 2016.01.22 • Added description about automotive temperature devices in the Programming/Erasure Specifications table.

• Changed the pin capacitance to maximum values.

• Updated maximum TCCS specifications from 410 ps to 300 ps in the following tables:

— True PPDS and Emulated PPDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices

— True RSDS and Emulated RSDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices

— Emulated RSDS_E_1R Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices

— True Mini-LVDS and Emulated Mini-LVDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices

— True LVDS Transmitter Timing Specifications for Intel MAX 10 Single Supply Devices

— True LVDS Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices

— Emulated LVDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Single Supply Devices

— Emulated LVDS_E_3R, SLVS, and Sub-LVDS Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices

• Added new table: True RSDS and Emulated RSDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Single Supply

Devices.

• Updated maximum fHSCLK and HSIODR specifications for –A6, –C7, and –I7 speed grades in True LVDS Transmitter Timing

Specifications for Intel MAX 10 Dual Supply Devices table.

• Updated SW specifications in the following tables:

— LVDS Receiver Timing Specifications for Intel MAX 10 Single Supply Devices

— LVDS, TMDS, HiSpi, SLVS, and Sub-LVDS Receiver Timing Specifications for Intel MAX 10 Dual Supply Devices

• Updated maximum fHSCLK and HSIODR (high-speed I/O performance pin) specifications for –I6, –A6, –C7, –I7 speed

grades in LVDS, TMDS, HiSpi, SLVS, and Sub-LVDS Receiver Timing Specifications for Intel MAX 10 Dual Supply Devices

table.

• Removed Internal Configuration Time information in the Uncompressed .rbf Sizes for Intel MAX 10 Devices table.

•Added Internal Configuration Time tables for uncompressed .rbf files and compressed .rbf files.

• Removed Preliminary tags for all tables.

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Date Version Changes

November 2015 2015.11.02 • Added description to Maximum Allowed Overshoot During Transitions over a 11.4-Year Time Frame topic.

•Added ADC_VREF Pin Leakage Current for Intel MAX 10 Devices table.

• Updated the condition for "Bus-hold high, sustaining current" parameter from "VIN < VIL (minimum)" to "VIN < VIH

(minimum)" in Bus Hold Parameters table.

• Added –A6 speed grade in the following tables:

— Intel MAX 10 Device Grades and Speed Grades Supported

— Series OCT without Calibration Specifications for Intel MAX 10 Devices

— Clock Tree Specifications for Intel MAX 10 Devices

— Embedded Multiplier Specifications for Intel MAX 10 Devices

— Memory Block Performance Specifications for Intel MAX 10 Devices

— True PPDS and Emulated PPDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices

— True RSDS and Emulated RSDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices

— Emulated RSDS_E_1R Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices

— True Mini-LVDS and Emulated Mini-LVDS_E_3R Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices

— True LVDS Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices

— Emulated LVDS_E_3R, SLVS, and Sub-LVDS Transmitter Timing Specifications for Intel MAX 10 Dual Supply Devices

— LVDS, TMDS, HiSpi, SLVS, and Sub-LVDS Receiver Timing Specifications for Intel MAX 10 Dual Supply Devices

— IOE Programmable Delay on Row Pins for Intel MAX 10 Devices

— IOE Programmable Delay on Column Pins for Intel MAX 10 Devices

• Updated the maximum value for input clock cycle-to-cycle jitter (tINJITTER_CCJ) with FINPFD < 100 MHz condition from 750 ps

to ±750 ps in PLL Specifications for Intel MAX 10 Devices table.

• Updated the dual supply mode performance in Embedded Multiplier Specifications for Intel MAX 10 Devices table.

• Updated the dual supply mode performance in Memory Block Performance Specifications for Intel MAX 10 Devices table.

• Added typical specifications in Internal Oscillator Frequencies for Intel MAX 10 Devices table.

• Updated specifications in UFM Performance Specifications for Intel MAX 10 Devices table.

• Updated sampling window specifications in LVDS, TMDS, HiSpi, SLVS, and Sub-LVDS Receiver Timing Specifications for

Intel MAX 10 Dual Supply Devices table.

• Updated IOE programmable delay for row and column pins.

• Changed instances of Quartus II to Quartus Prime.

June 2015 2015.06.12 • Updated the maximum values in Internal Weak Pull-Up Resistor for Intel MAX 10 Devices table.

• Removed Internal Weak Pull-Up Resistor equation.

• Updated the note for input resistance and input capacitance parameters in the ADC Performance Specifications table for

both single supply and dual supply devices. Note: Download the SPICE models for simulation.

• Added a note to AC Accuracy - THD, SNR, and SINAD parameters in the ADC Performance Specifications for Intel MAX 10

Dual Supply Devices table. Note: When using internal VREF, THD = 66 dB, SNR = 58 dB and SINAD = 57.5 dB for

dedicated ADC input channels.

• Updated clock period jitter and cycle-to-cycle period jitter parameters in the Memory Output Clock Jitter Specifications for

Intel MAX 10 Devices table.

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Date Version Changes

May 2015 2015.05.04 • Updated a note to VCCIO for both single supply and dual supply power supplies recommended operating conditions tables.

Note updated: VCCIO for all I/O banks must be powered up during user mode because VCCIO I/O banks are used for the

ADC and I/O functionalities.

• Updated Example for OCT Resistance Calculation after Calibration at Device Power-Up.

• Removed a note to BLVDS in Differential I/O Standards Specifications for Intel MAX 10 Devices table. BLVDS is now

supported in Intel MAX 10 single supply devices. Note removed: BLVDS TX is not supported in single supply devices.

• Updated ADC Performance Specifications for both single supply and dual supply devices.

— Changed the symbol for Operating junction temperature range parameter from TA to TJ.

— Edited sampling rate maximum value from 1000 kSPS to 1 MSPS.

— Added a note to analog input voltage parameter.

— Removed input frequency, fIN specification.

— Updated the condition for DNL specification: External VREF, no missing code. Added DNL specification for condition:

Internal VREF, no missing code.

— Added notes to AC accuracy specifications that the value with prescalar enabled is 6dB less than the specification.

— Added a note to On-Chip Temperature Sensor (absolute accuracy) parameter about the averaging calculation.

• Updated ADC Performance Specifications for Intel MAX 10 Single Supply Devices table.

— Added condition for On-Chip Temperature Sensor (absolute accuracy) parameter: with 64 samples averaging.

• Updated ADC Performance Specifications for Intel MAX 10 Dual Supply Devices table.

— Updated Digital Supply Voltage minimum value from 1.14 V to 1.15 V and maximum value from 1.26 V to 1.25 V.

• Updated fHSCLK and HSIODR specifications for –A7 speed grade in the following tables: