Kintex-7 FPGAs Brief Datasheet by AMD

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INDUSTRY’S BEST PRICEPERFORMANCE

FPGAS WITH LOWER POWER

Industry’s Best Price-Performance

With the introduction of the world’s first 28nm FPGAs, Xilinx gives designers the broadest range of

programmable platforms including the versatility of a new class of devices. Doubling the price-

performance and cutting power consumption and cost in half makes the Xilinx Kintex™-7 FPGAs

the clear choice for today’s fast-growth applications such as wireless communications. Designers

can take advantage of a family of devices with exceptional performance and connectivity, at price

points previously limited to only the highest-volume applications.

Highly Integrated, High-Speed Connectivity

Kintex-7 FPGAs let designers build in superior bandwidth and 12-bit digitally programmable analog

while meeting cost and power requirements. Unprecedented 144GMACS digital signal processor

(DSP) power makes the versatile Kintex-7 devices an excellent option for applications such as

portable ultrasound equipment and next-generation communications. Kintex-7 FPGAs deliver peak

serial bandwidth (full duplex) of 800Gbps and include CPRI/OBSAI IP cores (9.8Gbps) optimized

for today’s distributed baseband architectures. The programmable Kintex-7 devices can also be

easily reconfigured to support multiple air interfaces such as LTE, WiMAX, and WCDMA. For

interfacing to host systems, the Kintex-7 FPGA family provides built-in support for eight-channels of

PCI Express (Gen1/Gen2).

The highly efficient and affordable devices also enable designers to address connectivity and

throughput requirements while minimizing part counts. The 72-bit, 1,833Mbps Kintex-7 memory

interface supports single-memory-buffer designs instead of the two- or four-buffer designs required

with other devices. Similarly, a single Kintex-7 device can process video at rates that enable a

single-chip implementation of a video over IP gateway that can support 12 3G channels over a

4-channel 10 Gigabit Ethernet bridge.

The Strength of a Unified Architecture

All 7 series FPGA families leverage the Xilinx unified architecture to protect IP investments and

make it easy to migrate 6 series designs. With common elements including logic fabric, Block RAM,

DSP, clocking, Analog Mixed Signal (AMS), and more, the unified architecture also facilitates rapid

retargeting within the 7 series. For migrations and new projects alike, the Kintex-7 architecture

dramatically reduces development times and lets designers focus on product differentiation.

Market Challenges

• Stringent demands for higher performance

• Power is also paramount (as much as 40% of

operating expenses)

• System complexity calls for more highly

integrated silicon devices

• Only highly differentiated products can stand out

in today’s market

• Increasing competition requires lowering costs

• Pressures to speed time to production make

ASSPs and ASICs less practical

The Solution: Xilinx Kintex-7

FPGAs

• A new class of device, with twice the price-

performance at a lower price point

• 28nm high- metal gate (HKMG) process

technology and a High-Performance, Low-

Power (HPL) approach that drive up power

efficiency

• A balanced design, optimized and packaged for

performance, power, cost, and time to market for

high-growth applications

• The flexibility and time-savings of

programmability and Targeted Design Platforms,

for lower development time and costs

• Unified architecture with AMBA® Advanced

extensible Interface 4 (AXI4) for plug-and-play IP

that facilitates reuse and portability

• Part of the industry’s most versatile series for

fast, easy retargeting to higher-density or lower-

cost devices

KINTEX7 FPGASFPGA FAMILY

INTRODUCING A NEW CLASS OF FPGAS:

AN IDEAL BALANCE OF INTEGRATION,

PRICE, PERFORMANCE, AND POWER



DOMAIN IP, DOMAIN TOOLS, FMC DAUGHTER CARDS

®

BASE IP, ISE® DESIGN SUITE, BASE BOARDS



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







        

KINTEX7 FPGASFPGA FAMILY

Key Capabilities Overview

Twice the Price-Performance, Lower Cost

• Many performance-boosting innovations including industry-leading

1,866Mbps memory interface; 639MHz DSP48E1 slices with high-

performance filtering capabilities; six-input look-up table

• 1833Mbps memory interfaces

• LVDS connectivity at 1.6G

• Up to 1,920 DSP slices

• Package optimized to line rate performance

Memory Controller Innovations

• Dedicated hard IP implementation of the memory Phy, for simplified

interfacing to external DDR memory

• A flexible, soft controller enabled by high-performance logic for calibration,

access methods, and system interfaces

• High-speed PCI Express hard and soft IP

• Integrated hard IP for PCI Express, with full support for PCI Express

endpoint and root port configurations

• Hard IP support for up to eight PCI Express Gen1 and Gen2 channels

• Soft IP support for up to eight PCI Express Gen3 channels

Maximize Connectivity and Stay Within Budget

• Kintex-7 FPGAs let designers choose a package with the right

combination of price and performance for the application

• Family price points each maximize throughput (6.6Gbps and 12.5Gbps

transceivers)

• Maximize performance with regular flip-chip BGA packaging offering

highest signal integrity and up to 32 high-speed GTX transceivers

(12.5Gbps line rates)

• Minimize costs with bare-die flip-chip BGA packaging that delivers high

signal integrity and robust thermal characteristics (up to 6.6Gbps line

rates)

Half the Power Consumption

• HPL process cuts power in half compared to alternative 28nm High-

Performance (HP) process

• Low 1.0V core voltage (optional 0.9V core voltage option for some

devices) translates into lower system power, lower cooling required, and

more “green” designs

• Additional power reductions from intelligent clock gating and fifth-

generation partial reconfiguration

Maximizing Productivity with Targeted Design Platforms

Xilinx Targeted Design Platforms are the industry’s most comprehensive development kits, complete with boards, tools, IP cores, reference designs and

FPGA Mezzanine Card (FMC) support. The kits enable designers to begin application development immediately and boost productivity while accelerating

access to advanced functionality with pre-verified reference designs. Combined with a full-featured evaluation board and Xilinx ISE Design Suite

software, the reference designs also facilitate the integration of solutions from an ecosystem of readily available third-party add-on hardware and IP.

Our base kit, the Kintex-7 FPGA KC705 Evaluation Kit, provides a flexible framework for designing higher-level systems that require DDR3, Gigabit

Ethernet, PCI Express, and other serial connectivity. Our first domain kit, the Kintex-7 FPGA DSP Kit , includes an integrated high-speed analog FPGA

mezzanine card (FMC) to interface to real-world signals.

FOCUS ON DIFFERENTIATION

KINTEX7 FPGASFPGA FAMILY

Kintex-7 FPGAs offer the best price-performance so designers can meet stringent latency requirements for LTE baseband processing in a common platform.

• Programmability enables a cost-effective common platform supporting multiple air interfaces such as LTE, WiMAX, and WCDMA

• Reduce total cost of ownership with the ability to scale and reuse designs from picocell to macrocell

• 3x capacity at the same cost of previous-generation FPGAs while consuming 40% less power

• Support for 9.8Gbps CPRI/OBSAI for high throughput

• Support for 6.144Gbps CPRI/OBSAI in a low-cost package option

Support for 6.144Gbps CPRI/OBSAI in a low-cost package optionHigh I/O bandwidth and 144GMACS DSP processing power in chip-scale packaging

make the Kintex-7 70T FPGA highly effective for both front- and back-end ultrasound processing. Designers can deploy a fully programmable 128-channel

ultrasound implementation that scales up to 196 or 256 channels for high-end cart solutions or down to 64 or 32 channels for hand-held solutions.

• 128-channel implementation in a modular set of five Kintex-7 70T FPGAs offers 44% lower power, 45% lower cost, and 57% smaller form factor

compared to previous-generation FPGAs

• Kintex-7 70T FPGAs offer 144GMACS from 240 DSP slices (288GMACS for symmetric filters)

• Built-in support for eight PCI Express Gen1/Gen2 channels enables high-bandwidth interface to host system

• Chip-scale packaging for small form factor

Network

Processor

(eg Winpath-3)

Kintex-7 FPGA

32 bit, 533MHz

64MB

DDR3

64MB

DDR3

System Control

MAC

Acceleration

Channel

Encoding

QAM

Mod MIMO OFDM

Channel

Decoding

QAM

Demod MIMO OFDM

Downlink

Uplink

Layer 1

L1/L2 Interface

OBSAI/CPRI Interface

Layer 2/3

System configuration: 20MHz, 4x4 (MU-MIMO), FDD

DL/UL HARQ

Buffer, MB

Sub-frame

Buffer

GTX

Digital

Front

End

GTX

GbE/

PCIe

Control

Data

ECG Sync

RX 64 Beamformed Channels

FGG484 23mm x 23mm Artix-7 XC7A100T

RX 64 Beamformed Channels

FGG484 23mm x 23mm Artix-7 XC7A100T

16 BIT DAC

TX/RX

ADC 128

Channels

Deserializer

800 Slices

Doppler

1250 Slices, 8 DSP48, 8 BRAM

Head Control

400 Slices, 4 DSP48, 4 BRAM

TX Beamformer + TGA

1600 Slices

4 DSP48

4 BRAM

24 I/O

RX Handler

800 Slices

4DSP48

4 BRAM

PCIe

Control

1800 Slices

8 DSP48

4 BRAM

Q/I

Motor

Driver

Kintex7 XC7K70T FPGA

FBG484 23MM X 23MM

Ultrasound

128 Channels

Transducer

Optical Encoder for

Position Feedback

Motor for 3D

Head Movement

128 Differential

Channels as

ADC and

Control Signals

COMMUNICATIONS: SINGLECHIP LTE BASEBAND 2 X 4 MIMO

MEDICAL: PORTABLE ULTRASOUND

Enabling Next-Generation Systems

III III III III wwww (I X|L|NX®

Corporate Headquarters

Xilinx, Inc.

2100 Logic Drive

San Jose, CA 95124

USA

Tel: 408-559-7778

www.xilinx.com

Europe

Xilinx Europe

One Logic Drive

Citywest Business Campus

Saggart, County Dublin

Ireland

Tel: +353-1-464-0311

www.xilinx.com

Japan

Xilinx K.K.

Art Village Osaki Central Tower 4F

1-2-2 Osaki, Shinagawa-ku

Tokyo 141-0032 Japan

Tel: +81-3-6744-7777

japan.xilinx.com

Asia Pacific Pte. Ltd.

Xilinx, Asia Pacific

5 Changi Business Park

Singapore 486040

Tel: +65-6407-3000

www.xilinx.com

Xilinx in the United States and other countries. All other trademarks are the property of their respective owners.

Printed in the U.S.A. PN 2483-3

KINTEX7 FPGASFPGA FAMILY

Take the NEXT STEP

Download the latest version of ISE Design Suite tools: www.xilinx.com/ise

For more information visit: www.xilinx.com/kintex7

Kintex-7 FPGAs enable cost-effective, low-power bridging of the serial digital interface (SDI) protocol onto IP technology for long-distance WAN

transport to link local studios/live events, broadcast facilities, and satellite uplink stations using standard IP networks.

• Reduce power by 64% and reduce cost by 85% with a single XC7K160T FPGA implementation of a 12x 3G-SDI over 4x10GbE bridge

compared to the equivalent function implemented in two Virtex-6 XC6L130T devices

• Reduce cost further with high-bandwidth interfaces that shrink BOM: 72-bit x 1,600Mbps DDR3 memory interface capability enables a single

memory buffer that would require two or four memory buffers in previous-generation FPGAs

Kintex-7 FPGA

SFP+

XFP

10Gbps

10GbE

SFP+

XFP

10Gbps

10GbE

SFP+

XFP

10Gbps

10GbE

*Bi-directional supported by additional cable drivers

SFP+

XFP

10Gbps

10GbE

GTX

SMPTE

2022

Bridge

10GE

MAC/PHY

SMPTE

2022

Bridge

10GE

MAC/PHY

SMPTE

2022

Bridge

10GE

MAC/PHY

SMPTE

2022

Bridge

10GE

MAC/PHY

Cable Eq*

GTX

SD/HD/3G-SDI In 2.97Gbps

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Kintex-7 FPGAs Brief Datasheet by AMD

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