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Product Overview
Digi-Key Part Number BER168-ND
Quantity Available 14,448
Can ship immediately
Manufacturer

Manufacturer Part Number

HF115AC-0.0055-AC-58

Description Thermal Pad Gray 19.05mm x 12.70mm Rectangle Adhesive - One Side
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 2 Weeks
Documents & Media
Datasheets Hi-Flow 115-AC
Other Related Documents Sil-Pad Metric Configurations
RoHS Information Hi-Flow 115-AC Material Report
PCN Packaging Henkel/Berquist Revised Brands 10/May/2016
Catalog Page 2416 (SG2011-EN PDF)
Product Attributes Select All
Category

Fans, Thermal Management

Family

Thermal - Pads, Sheets

Manufacturer

Bergquist

Series Hi-Flow® 115-AC
Part Status Active
Usage TO-220
Shape Rectangle
Outline 19.05mm x 12.70mm
Thickness 0.0055" (0.140mm)
Material Phase Change Compound
Adhesive Adhesive - One Side
Backing, Carrier Fiberglass
Color Gray
Thermal Resistivity 0.35°C/W
Thermal Conductivity 0.8 W/m-K
 
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Additional Resources
Standard Package ? 100
Other Names BER168
BG426642
HF115AC-58
HF115AC00055AC58
HF115TAAC-58

13:01:56 12/7/2016

Price & Procurement
 

Quantity
All prices are in SGD.
Price Break Unit Price Extended Price
1 0.16000 0.16
10 0.13400 1.34
50 0.12020 6.01
100 0.10630 10.63
500 0.09250 46.25
1,000 0.06937 69.37
5,000 0.06012 300.60

Submit a request for quotation on quantities greater than those displayed.

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