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Product Overview
Digi-Key Part Number BER166-ND
Quantity Available 2,892
Can ship immediately
Manufacturer

Manufacturer Part Number

HF115AC-0.0055-AC-05

Description THERM PAD TO-3 W/ADH HI-FLOW
Expanded Description Thermal Pad Gray 41.91mm x 28.95mm Rhombus Adhesive - One Side
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 2 Weeks
Documents & Media
Datasheets Hi-Flow 115-AC
RoHS Information Hi-Flow 115-AC Material Report
PCN Packaging Henkel/Berquist Revised Brands 10/May/2016
Catalog Page 2416 (SG2011-EN PDF)
Product Attributes Select All
Categories
Manufacturer

Bergquist

Series Hi-Flow® 115-AC
Part Status Active
Usage TO-3
Shape Rhombus
Outline 41.91mm x 28.95mm
Thickness 0.0055" (0.140mm)
Material Phase Change Compound
Adhesive Adhesive - One Side
Backing, Carrier Fiberglass
Color Gray
Thermal Resistivity 0.35°C/W
Thermal Conductivity 0.8 W/m-K
 
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Additional Resources
Standard Package ? 100
Other Names BER166
HF115AC-05
HF115AC00055AC05
HF115TAAC-05

12:01:43 3/30/2017

Price & Procurement
 

Quantity
All prices are in SGD.
Price Break Unit Price Extended Price
1 0.43000 0.43
10 0.38300 3.83
50 0.34280 17.14
100 0.30320 30.32
500 0.26368 131.84
1,000 0.19775 197.75
5,000 0.17139 856.93

Submit a request for quotation on quantities greater than those displayed.

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